A workpiece turning device applied to an IC carrier plate marking machine

Abstract

This application relates to the field of laser marking technology and provides a workpiece flipping device for use in an IC carrier marking machine. The device includes: a horizontal driving mechanism, a first flipping lifting mechanism, a second flipping lifting mechanism, a first flipping extraction device, and a second flipping extraction device. The first and second flipping lifting mechanisms are connected to and can be driven by the horizontal driving mechanism. The first flipping extraction device is rotatably connected to the first flipping lifting mechanism via a first rotary driving mechanism, and the second flipping extraction device is rotatably connected to the second flipping lifting mechanism via a second rotary driving mechanism. The first rotary driving mechanism can drive the first flipping extraction device to rotate upwards by at least 90°, and the second rotary driving mechanism can drive the second flipping extraction device to rotate upwards by at least 90°. This workpiece flipping device can automatically complete the flipping operation of the IC carrier.

Description

Technical Field

[0001] This application relates to the field of laser marking technology, and more specifically, to a workpiece flipping device for use in an IC carrier marking machine. Background Technology

[0002] An IC package substrate, also known as a packaging substrate, is a core component in the semiconductor packaging process. Its main functions include: 1. Signal connection: Connecting the bare die (DIE) and the PCB through internal precision circuitry, acting as a bridge between them. 2. Physical support and protection: Providing mechanical support for the chip and protecting it from external environmental factors such as humidity and vibration. 3. Heat dissipation and modular design: Optimizing heat dissipation paths through special materials (such as metal layers) and structural design, while supporting modular integration of components.

[0003] In the IC substrate manufacturing process, laser marking technology is widely used to engrave permanent markings on the substrate surface, including key information such as product model, batch number, and QR code. Specifically, laser marking technology is one of the largest applications of laser processing. Laser marking is a marking method that uses a high-energy-density laser to locally irradiate the workpiece, causing the surface material to vaporize or undergo a chemical reaction that changes color, thereby leaving a permanent mark. Laser marking can produce various texts, symbols, and patterns, which is of particular significance for product anti-counterfeiting. The advantages of laser marking technology are mainly: 1. Wide adaptability: it can process various metal and non-metal materials (copper, aluminum, iron, stainless steel, leather, plastic, etc.); 2. Non-contact processing: it causes no stress or deformation to the product. Laser processing uses a non-mechanical "tool," which does not produce mechanical compression or stress on the material, has no "tool" wear, is non-toxic, and causes very little environmental pollution; 3. High processing precision: the laser beam is very fine, resulting in minimal material consumption; 4. Simple operation: using microcomputer numerical control technology, it can achieve automated processing, can be used for high-efficiency processing of parts on production lines, and can be used as part of a flexible processing system; 5. Environmentally friendly and pollution-free. However, existing IC carrier laser marking machines do not have an automatic IC carrier flipping function. For situations requiring IC carrier flipping (such as double-sided marking or flipping for material collection after laser marking), manual flipping is the only option, resulting in wasted manpower. Utility Model Content

[0004] In view of this, this application provides a workpiece flipping device for IC carrier marking machines, so as to solve the technical problems of waste of manpower and low degree of automation of IC carrier flipping caused by manual flipping of IC carriers in the prior art.

[0005] This application provides a workpiece flipping device for an IC carrier marking machine, wherein the workpiece flipping device for the IC carrier marking machine includes:

[0006] The system includes a horizontal drive mechanism, a first flipping and lifting mechanism, a second flipping and lifting mechanism, a first flipping and extraction device, and a second flipping and extraction device. The first and second flipping and lifting mechanisms are connected to and can be driven by the horizontal drive mechanism. The first flipping and extraction device is rotatably connected to the first flipping and lifting mechanism via a first rotary drive mechanism, and the second flipping and extraction device is rotatably connected to the second flipping and lifting mechanism via a second rotary drive mechanism. The first rotary drive mechanism can drive the first flipping and extraction device to rotate upwards by at least 90° toward the second flipping and extraction device, and the second rotary drive mechanism can drive the second flipping and extraction device to rotate upwards by at least 90° toward the first flipping and extraction device.

[0007] Furthermore, the first flipping and extraction device includes a first body and a suction cup disposed on the first body. The first body is rotatably connected to the first flipping and lifting mechanism via a first rotary drive mechanism. The second flipping and extraction device includes a second body and a suction cup disposed on the second body. The second body is rotatably connected to the second flipping and lifting mechanism via a second rotary drive mechanism.

[0008] Furthermore, the first rotary drive mechanism can drive the first flipping extraction device to rotate 180° counterclockwise and 180° clockwise, and / or the second rotary drive mechanism can drive the second flipping extraction device to rotate 180° counterclockwise and 180° clockwise.

[0009] Furthermore, both the first flipping extraction device and the second flipping extraction device include a flipping clamping frame and an automated gripper connected to the flipping clamping frame. The automated gripper can automatically release and clamp the IC carrier board. The flipping clamping frames of the first flipping extraction device and the second flipping extraction device are respectively connected to the first rotary drive mechanism or the second rotary drive mechanism.

[0010] Furthermore, the automated gripper includes an upper gripper and a lower gripper that can move closer to or further away from each other.

[0011] Furthermore, each end of the upper and lower clamping plates is connected to a thin, elastic insert, the thickness of which is less than the thickness of the upper and lower clamping plates.

[0012] Furthermore, the lower surface of the elastic thin insert connected to the upper clamping plate is flush with the lower surface of the upper clamping plate, and the upper surface of the elastic thin insert connected to the lower clamping plate is flush with the upper surface of the lower clamping plate.

[0013] Furthermore, the flipping clamp is connected to an air extraction pipe, the air extraction port of which leads to the area between the upper clamping plate and the lower clamping plate.

[0014] The beneficial effects of the workpiece flipping device for IC carrier marking machines provided by this utility model are as follows:

[0015] Compared to existing technologies, the workpiece flipping device for an IC carrier marking machine provided by this utility model allows the first rotary drive mechanism to drive the first flipping extraction device to rotate upwards by at least 90° toward the second flipping extraction device, and the second rotary drive mechanism to drive the second flipping extraction device to rotate upwards by at least 90° toward the first flipping extraction device. Therefore, the IC carrier that has completed one side marking on the laser machine can be extracted first by the first flipping extraction device. After the first flipping extraction device rotates upwards by 90° toward the second flipping extraction device, the original lower surface of the IC carrier extracted by the first flipping extraction device will be in an upright state. Then, the second flipping extraction device can rotate upwards by 90° toward the first flipping extraction device. When the second flipping extraction device is close to the first flipping extraction device and extracts the IC carrier, the original lower surface of the IC carrier can rotate another 90°, thus rotating a total of 180° to complete the flipping. This facilitates subsequent marking on the other side of the IC carrier (achieving double-sided marking) or flipping and collecting operations without the need for manual flipping, thereby saving labor costs.

[0016] Other beneficial effects of this invention will be detailed below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a partial perspective view of a workpiece flipping device for use in an IC substrate marking machine in cooperation with a laser machine, according to an embodiment of this application.

[0019] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0020] Figure 3 This is a simplified schematic diagram of a workpiece flipping device applied to an IC carrier marking machine according to another embodiment of this application;

[0021] Figure 4 for Figure 3Enlarged view of point B in the middle.

[0022] Explanation of reference numerals in the attached figures:

[0023] 4-Suction cup; 5-Three-axis flipping and extraction frame; 6-Flipping rotation mechanism; 7-Flipping clamping frame; 8-Upper clamping plate; 9-Lower clamping plate; 10-Elastic thin insert; 11-Evacuation pipe; 100-Laser machine; 303-First horizontal electric guide rail; 304-First flipping lifting mechanism; 305-Second flipping lifting mechanism; 306-First rotary drive mechanism; 307-Second rotary drive mechanism; 308-First body; 309-Second body; 310-Second horizontal electric guide rail. Detailed Implementation

[0024] To facilitate understanding of this application, a more comprehensive description will be provided below with reference to the accompanying drawings. One or at least three embodiments of this application are exemplarily shown in the drawings to provide a more accurate and thorough understanding of the technical solutions disclosed herein. However, it should be understood that this application can be implemented in many different forms and is not limited to the embodiments described below.

[0025] In the accompanying drawings of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0026] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously.

[0027] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0028] See Figures 1 to 4 This application provides a workpiece flipping device for an IC substrate marking machine, wherein the workpiece flipping device for the IC substrate marking machine includes:

[0029] The system includes a horizontal drive mechanism, a first flipping and lifting mechanism 304, a second flipping and lifting mechanism 305, a first flipping extraction device, and a second flipping extraction device. The first flipping and lifting mechanism 304 and the second flipping and lifting mechanism 305 are connected to the horizontal drive mechanism and can be driven by the horizontal drive mechanism. The first flipping extraction device is rotatably connected to the first flipping and lifting mechanism 304 via a first rotary drive mechanism 306, and the second flipping extraction device is rotatably connected to the second flipping and lifting mechanism 305 via a second rotary drive mechanism 307. The first rotary drive mechanism 306 can drive the first flipping extraction device to rotate upward 90° toward the second flipping extraction device, and the second rotary drive mechanism 307 can drive the second flipping extraction device to rotate upward 90° toward the first flipping extraction device.

[0030] Because the workpiece flipping device for IC carrier marking machine provided by this utility model has a first rotary drive mechanism 306 that can drive the first flipping extraction device to rotate upward 90° toward the second flipping extraction device, and a second rotary drive mechanism 307 that can drive the second flipping extraction device to rotate upward 90° toward the first flipping extraction device, the IC carrier board that has completed one side marking operation on the laser machine 100 can be extracted first by the first flipping extraction device. After the first flipping extraction device rotates upward 90° toward the second flipping extraction device, the original lower surface of the IC carrier board extracted by the first flipping extraction device will be in an upright state. Then the second flipping extraction device can rotate upward 90° toward the first flipping extraction device. When the second flipping extraction device is close to the first flipping extraction device and extracts the IC carrier board, the original lower surface of the IC carrier board can rotate another 90°, thus rotating a total of 180° to complete the flipping. This facilitates subsequent marking on the other side of the IC carrier board (achieving double-sided marking) or flipping and collecting operations without the need for manual flipping, thereby saving labor costs.

[0031] According to one embodiment of this application, the first flipping extraction device includes a first body 308 and a suction cup 4 disposed on the first body 308. The first body 308 is rotatably connected to the first flipping lifting mechanism 304 via a first rotary drive mechanism 306. The second flipping extraction device includes a second body 309 and a suction cup 4 disposed on the second body 309. The second body 309 is rotatably connected to the second flipping lifting mechanism 305 via a second rotary drive mechanism 307. First, the suction cup 4 of the first flipping extraction device adsorbs the original upper surface of the IC carrier. After the IC carrier rotates 90°, the suction cup 4 of the second flipping extraction device adsorbs the original lower surface of the IC carrier. After the second flipping extraction device rotates 90°, the original lower surface of the IC carrier becomes the new upper surface.

[0032] According to one embodiment of this application, the horizontal driving mechanism includes a first horizontal electric guide rail 303 and a second horizontal electric guide rail 310. A first flipping lifting mechanism 304 is mounted on the slider portion of the first horizontal electric guide rail 303, and a second flipping lifting mechanism 305 is mounted on the slider portion of the second horizontal electric guide rail 310. The first horizontal electric guide rail 303 can drive the first flipping lifting mechanism 304 to move between the discharge end of the laser machine 100 and a position adjacent to the second flipping lifting mechanism 305 (ensuring that when the first flipping lifting mechanism 304 is adjacent to the second flipping lifting mechanism 305, the second receiving and extraction device can extract the IC carrier plate rotated 90° on the first receiving and extraction device). The second horizontal electric guide rail 310 can drive the second flipping lifting mechanism 305 to move between above the receiving and transfer station and a position adjacent to the first flipping lifting mechanism 304 (ensuring that when the second flipping lifting mechanism 305 is adjacent to the first flipping lifting mechanism 304, the second receiving and extraction device can extract the IC carrier plate rotated 90° on the first receiving and extraction device).

[0033] According to one embodiment of this application, both the first rotary drive mechanism 306 and the second rotary drive mechanism 307 are electrically controlled rotary tables.

[0034] According to another embodiment of this application, the first rotary drive mechanism 306 can drive the first flipping extraction device to rotate 180° counterclockwise and 180° clockwise, and / or the second rotary drive mechanism 307 can drive the second flipping extraction device to rotate 180° counterclockwise and 180° clockwise.

[0035] According to a specific embodiment of this application, both the first flipping extraction device and the second flipping extraction device include a flipping clamping frame 7 and an automated gripper connected to the flipping clamping frame 7. The automated gripper can automatically release and clamp the IC carrier board. The flipping clamping frame 7 of each of the first and second flipping extraction devices is correspondingly connected to the first rotary drive mechanism 306 or the second rotary drive mechanism 307. After the flipping clamping frame 7 rotates 180°, the IC carrier board held by the automated gripper also rotates 180° (is flipped).

[0036] According to a specific embodiment of this application, the automated gripper includes an upper clamping plate 8 and a lower clamping plate 9 that can move closer to or further away from each other, and the IC carrier board can be clamped between the upper clamping plate 8 and the lower clamping plate 9.

[0037] According to a preferred embodiment of this application, each end of the upper clamping plate 8 and the lower clamping plate 9 is connected to an elastic thin insert 10. The thickness of the elastic thin insert 10 is less than the thickness of the upper clamping plate 8 and the lower clamping plate 9, so that it can be inserted between the lower surface of the IC carrier board and the support structure of the lower surface (e.g., the support structure of the discharge end of the laser machine 100).

[0038] According to a specific embodiment of this application, the lower surface of the elastic thin insert 10 connected to the upper clamping plate 8 is flush with the lower surface of the upper clamping plate 8, and the upper surface of the elastic thin insert 10 connected to the lower clamping plate 9 is flush with the upper surface of the lower clamping plate 9.

[0039] According to a preferred embodiment of this application, the flipping clamp 7 is connected to an air extraction pipe 11. The air extraction port of the air extraction pipe 11 leads to the area between the upper clamping plate 8 and the lower clamping plate 9. The air extraction pipe 11 is connected to an air extraction machine, which can form a suction airflow between the upper clamping plate 8 and the lower clamping plate 9, so as to draw the end of the IC carrier board supported on the discharge end of the laser machine 100 to the area between the upper clamping plate 8 and the lower clamping plate 9.

[0040] It should be noted that the above embodiments only illustrate preferred embodiments of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting this application. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of this application, such as combining different features in various embodiments, and these should all fall within the protection scope of this application.

Claims

1. A workpiece flipping device for use in an IC carrier marking machine, characterized in that, The workpiece flipping device applied to the IC carrier marking machine includes: The system includes a horizontal drive mechanism, a first flipping and lifting mechanism, a second flipping and lifting mechanism, a first flipping and extraction device, and a second flipping and extraction device. The first and second flipping and lifting mechanisms are connected to and can be driven by the horizontal drive mechanism. The first flipping and extraction device is rotatably connected to the first flipping and lifting mechanism via a first rotary drive mechanism, and the second flipping and extraction device is rotatably connected to the second flipping and lifting mechanism via a second rotary drive mechanism. The first rotary drive mechanism can drive the first flipping and extraction device to rotate upwards by at least 90° toward the second flipping and extraction device, and the second rotary drive mechanism can drive the second flipping and extraction device to rotate upwards by at least 90° toward the first flipping and extraction device.

2. The workpiece flipping device for an IC carrier marking machine according to claim 1, characterized in that, The first flipping and extraction device includes a first body and a suction cup disposed on the first body. The first body is rotatably connected to the first flipping and lifting mechanism via a first rotary drive mechanism. The second flipping and extraction device includes a second body and a suction cup disposed on the second body. The second body is rotatably connected to the second flipping and lifting mechanism via a second rotary drive mechanism.

3. The workpiece flipping device for an IC carrier marking machine according to claim 1, characterized in that, The first rotary drive mechanism can drive the first flipping extraction device to rotate 180° counterclockwise and 180° clockwise, and / or the second rotary drive mechanism can drive the second flipping extraction device to rotate 180° counterclockwise and 180° clockwise.

4. The workpiece flipping device for an IC carrier marking machine according to claim 1, characterized in that, Both the first flipping extraction device and the second flipping extraction device include a flipping clamping frame and an automated gripper connected to the flipping clamping frame. The automated gripper can automatically release and clamp the IC carrier board. The flipping clamping frame of each of the first flipping extraction device and the second flipping extraction device is correspondingly connected to the first rotary drive mechanism or the second rotary drive mechanism.

5. The workpiece flipping device for an IC carrier marking machine according to claim 4, characterized in that, The automated gripper includes an upper gripper and a lower gripper that can move closer to or further away from each other.

6. The workpiece flipping device for an IC carrier marking machine according to claim 5, characterized in that, The upper and lower clamping plates are each connected to an elastic thin insert at their ends, and the thickness of the elastic thin insert is less than the thickness of the upper and lower clamping plates.

7. The workpiece flipping device for an IC carrier marking machine according to claim 6, characterized in that, The lower surface of the elastic thin insert connected to the upper clamping plate is flush with the lower surface of the upper clamping plate, and the upper surface of the elastic thin insert connected to the lower clamping plate is flush with the upper surface of the lower clamping plate.

8. The workpiece flipping device for an IC carrier marking machine according to claim 6, characterized in that, The flipping clamp is connected to an air extraction pipe, and the air extraction port of the air extraction pipe leads to the area between the upper clamping plate and the lower clamping plate.

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