A kind of precise spindle is with the compound cooling energy-saving device of semiconductor refrigerating sheet cooperation fan

Abstract

This utility model discloses a composite cooling and energy-saving device for precision spindles using semiconductor refrigeration chips and a fan, comprising: a temperature controller; and several semiconductor refrigeration chips mounted on a motor and electrically connected to the temperature controller, with the cold end of the semiconductor refrigeration chips in contact with the motor and the hot end facing outwards from the motor, for heat dissipation; several integrated thermistors mounted on the motor and electrically connected to the semiconductor refrigeration chips and the temperature controller; an air duct positioned between the motor and an outer cover, surrounding the motor and the semiconductor refrigeration chips; and a ventilation component connected to one end of the outer cover, positioned between the outer cover and the motor, and electrically connected to the temperature controller, for generating airflow. The airflow flows along the air duct, contacts the hot end of the semiconductor refrigeration chips, and exits from the other end of the outer cover. This overcomes the technical problems of large space occupation, high energy consumption, high failure rate, and low heat dissipation and cooling efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of heat dissipation devices for precision machining equipment, specifically a composite cooling and energy-saving device for precision spindles using a semiconductor cooling chip in conjunction with a fan. Background Technology

[0002] Precision machining equipment is used to manufacture high-precision parts with complex shapes and sizes. It plays an important role in modern manufacturing, such as CNC machining centers, CNC lathes, CNC milling machines, CNC wire cutting machines, and CNC punching machines.

[0003] Among them, CNC machining centers are composite machine tools that integrate multiple functions such as CNC milling machines and CNC lathes. They can perform various machining operations such as drilling, milling, boring, and tapping, and are suitable for machining parts with high precision and complex shapes. During the machining process, the spindle generates high temperatures, which can cause thermal deformation of the spindle. The existing method is to use liquid cooling or air cooling to cool the spindle, but this has the following shortcomings:

[0004] 1. Liquid cooling, although it can reduce spindle temperature, relies on an external water chiller, which takes up a lot of space, consumes a lot of energy, has high maintenance costs, and the water channels inside the spindle are complex and prone to blockage, resulting in a high failure rate.

[0005] 2. Air cooling relies on an air compressor, takes up a lot of space, is noisy, has low heat dissipation efficiency, and causes severe thermal deformation of the spindle, making it difficult to maintain machining accuracy within 5μm. Utility Model Content

[0006] In view of the above-mentioned shortcomings in the related technologies, the purpose is to provide a composite cooling and energy-saving device for precision spindle semiconductor refrigeration chip and fan, so as to solve the technical problems of large space occupation, high energy consumption, high failure rate and low heat dissipation and cooling efficiency in the related technologies.

[0007] The technical solution to achieve the objective is: a precision spindle semiconductor refrigeration chip combined with a fan for composite cooling and energy saving, comprising: a temperature controller; and further comprising:

[0008] Several thermoelectric cooling chips are mounted on the motor and electrically connected to the temperature controller. The cold end of the thermoelectric cooling chip is attached to the motor, and the hot end faces the outside of the motor, for heat dissipation of the motor.

[0009] Several integrated thermistors are disposed on the motor and electrically connected to the semiconductor cooling chip and the temperature controller;

[0010] An air duct is disposed between the motor and the outer cover, surrounding the motor and the semiconductor cooling chip;

[0011] And a ventilation component, connected to one end of the outer cover, disposed between the outer cover and the motor, electrically connected to the thermostat, for generating airflow, the airflow flowing along the air duct, contacting the hot end on the semiconductor cooling chip, and flowing out from the other end of the outer cover.

[0012] Furthermore, the thermoelectric cooler is arranged in a spiral shape on the housing of the motor, and the thermoelectric cooler is located near the front bearing, near the stator, and near the rear bearing of the motor.

[0013] Furthermore, carbon fiber is disposed on the outer edge of the hot end of the semiconductor cooling chip.

[0014] Furthermore: the air duct includes an inlet end, which is close to the ventilation component;

[0015] A long, straight channel, with the aforementioned inlet end at one end;

[0016] The first turning passage is connected to the other end of the long straight passage;

[0017] A short, straight passage, one end of which is connected to the first turning passage;

[0018] The second turning passage is connected to the other end of the short straight passage;

[0019] And the exit end, which connects to the second turning channel.

[0020] Furthermore: the long straight channel is a circular annular channel.

[0021] Furthermore: the short straight channel is a circular annular channel.

[0022] Furthermore, the outer diameter A of the long straight channel is larger than the outer diameter B of the short straight channel.

[0023] Furthermore: After planar projection, the width C of the long straight channel is equal to the width D of the first turning channel, and equal to the width E of the short straight channel;

[0024] The width dimension E is greater than the width dimension F of the second turning channel;

[0025] The width dimension C is the spacing dimension between the outer cover and the carbon fiber;

[0026] The width dimension D is the spacing dimension between the outer cover and the carbon fiber;

[0027] The width dimension E is the spacing dimension between the outer cover and the carbon fiber;

[0028] The width dimension F is the spacing dimension between the outer cover and the outer shell.

[0029] Furthermore: the ventilation component is a centrifugal fan.

[0030] Furthermore: the air volume of the ventilation component is >300m³ / h.

[0031] The above technical solution has the following beneficial effects: A precision spindle semiconductor refrigeration chip and fan combined cooling energy-saving device is provided with a temperature controller, semiconductor refrigeration chip, integrated thermistor, air duct and ventilation components compared with related technologies;

[0032] A thermoelectric cooler and an integrated thermistor are mounted on the motor. The thermoelectric cooler is used to dissipate heat from the motor, and the integrated thermistor is used to monitor the temperature in real time and feed back the temperature signal to the temperature controller. The temperature controller intelligently adjusts the cooling power of the thermoelectric cooler and the speed of the ventilation component, thus realizing combined cooling through the thermoelectric cooler and the ventilation component.

[0033] This overcomes the technical problems of large space occupation, high energy consumption, high failure rate, and low heat dissipation and cooling efficiency, and achieves the technical effects of relatively small space occupation, reduced energy consumption, reduced failure rate, and relatively high heat dissipation and cooling efficiency, thus proving its practicality. Attached Figure Description

[0034] Figure 1 This is a sectional view of the final assembly.

[0035] Figure 2 for Figure 1 A magnified view of a portion of the image;

[0036] Figure 3 for Figure 2 A magnified view of a portion of the image;

[0037] In the diagram: 10. Semiconductor cooling chip, 20. Integrated thermistor, 30. Air duct, 30-1. Inlet end, 30-2. Long straight channel, 30-3. First turning channel, 30-4. Short straight channel, 30-5. Second turning channel, 30-6. Outlet end, 40. Ventilation component, 100. Motor, 101. Housing, 102. Front bearing, 103. Stator, 104. Rear bearing, 200. Outer cover. Detailed Implementation

[0038] To make the content easier to understand, the following detailed description is provided with reference to specific embodiments and accompanying drawings;

[0039] A composite cooling and energy-saving device for precision spindles, combining a semiconductor cooling chip with a fan, solves the technical problems of large footprint, high energy consumption, high failure rate, and low heat dissipation and cooling efficiency in related technologies. This device is manufacturable and usable, achieving the positive effects of relatively small footprint, reduced energy consumption, reduced failure rate, and relatively high heat dissipation and cooling efficiency. The overall concept is as follows:

[0040] Implementation

[0041] like Figure 1 , Figure 2 , Figure 3 As shown; a precision spindle semiconductor refrigeration chip combined with a fan for energy-saving cooling includes: a temperature controller; and further includes:

[0042] Several semiconductor cooling chips 10 are disposed on the motor 100 and electrically connected to the temperature controller. The cold end of the semiconductor cooling chip 10 is attached to the motor 100 (the cold end being attached to the motor 100 is beneficial for heat exchange, which is common knowledge), and the hot end is facing the outside of the motor 100, for the purpose of dissipating heat from the motor 100.

[0043] Several integrated thermistors 20 are disposed on the motor 100 and electrically connected to the semiconductor cooling chip 10 and the temperature controller;

[0044] Air duct 30 is disposed between the motor 100 and the outer cover 200, surrounding the motor 100 and the semiconductor cooling chip 10;

[0045] And a ventilation component 40, connected to one end of the outer cover 200, disposed between the outer cover 200 and the motor 100, electrically connected to the thermostat, for generating airflow, the airflow flowing along the air duct 30, contacting the hot end on the semiconductor cooling chip 10, and flowing out from the other end of the outer cover 200;

[0046] Specifically, in implementation, the thermoelectric cooler 10 and the integrated thermistor 20 are mounted on the motor 100. The thermoelectric cooler 10 is used to dissipate heat from the motor 100, and the integrated thermistor 20 is used to monitor the temperature in real time and feed back the temperature signal to the temperature controller. The temperature controller intelligently adjusts the cooling power of the thermoelectric cooler 10 and the rotation speed of the ventilation component 40, thus achieving combined cooling through the thermoelectric cooler 10 and the ventilation component 40. This results in a relatively small space occupation, reduced energy consumption, and a reduced failure rate (the failure rate is reduced by about 60%). The heat dissipation efficiency is relatively high, and the heat dissipation effect is improved by about 30%, which can meet the requirement of keeping the tool machining accuracy within 2μm.

[0047] Another implementation method:

[0048] like Figure 1 , Figure 2 , Figure 3 As shown; in practice, the thermoelectric coolers 10 are arranged in a spiral shape on the housing 101 of the motor 100, and the thermoelectric coolers 10 are located near the front bearing 102, the stator 103, and the rear bearing 104 of the motor 100. For example, 2-3 thermoelectric coolers 10 are arranged near the front bearing 102, 2-3 thermoelectric coolers 10 are arranged near the rear bearing 104, and 6-8 thermoelectric coolers 10 are arranged near the stator 103. The arrangement in a spiral shape, with each thermoelectric cooler 10 spaced apart, is beneficial for heat dissipation of the front bearing 102, stator 103, and rear bearing 104 (these three positions are the main heat-generating positions), resulting in relatively good heat dissipation.

[0049] Carbon fiber (e.g., carbon fiber wrapped in a ring around the outer edge of the hot end on the semiconductor cooling chip 10) is provided on the outer edge of the hot end, which improves the reliability of the semiconductor cooling chip 10 connected to the outer casing 101 and does not affect heat dissipation.

[0050] The thermoelectric cooler 10, the integrated thermistor 20, and the temperature controller are common structures in the prior art. For example, the thermoelectric cooler 10 is a TEC cooler, the integrated thermistor 20 is an NTC integrated thermistor, and the temperature controller is a digital temperature controller. The integrated thermistor 20 is used to monitor the temperature at the thermoelectric cooler 10 in real time and feed back the temperature signal to the temperature controller. The temperature controller intelligently adjusts the cooling power of the thermoelectric cooler 10 and adjusts the rotation speed of the ventilation component 40. It occupies relatively little space, ensures heat dissipation, reduces energy consumption, and reduces the failure rate.

[0051] Another implementation method:

[0052] like Figure 1 , Figure 2 , Figure 3 As shown; in implementation, the air duct 30 includes: an inlet end 30-1, which is close to the ventilation component 40; a long straight channel 30-2, one end of which has the inlet end 30-1; a first turning channel 30-3, which is connected to the other end of the long straight channel 30-2; a short straight channel 30-4, one end of which is connected to the first turning channel 30-3; a second turning channel 30-5, which is connected to the other end of the short straight channel 30-4; and an outlet end 30-6, which is connected to the second turning channel 30-5.

[0053] The long straight channel 30-2 is an annular channel, the first turning channel 30-3 is a conical channel, the short straight channel 30-4 is an annular channel, and the second turning channel 30-5 is an annular channel. The outer diameter A of the long straight channel 30-2 is greater than the outer diameter B of the short straight channel 30-4. After planar projection, the width C of the long straight channel 30-2 is equal to the width D of the first turning channel 30-3, and equal to the width E of the short straight channel 30-4. The width E is greater than the width F of the second turning channel 30-5. The width C is the spacing between the outer cover 200 and the carbon fiber; the width D is the spacing between the outer cover 200 and the carbon fiber; the width E is the spacing between the outer cover 200 and the carbon fiber; and the width F is the spacing between the outer cover 200 and the outer shell 101.

[0054] The shape of the air duct 30 is relatively aesthetically pleasing and makes the airflow smoother, which helps to remove the heat from the hot end of the semiconductor cooling chip 10 and ensures the heat dissipation effect.

[0055] Another implementation method:

[0056] like Figure 1 , Figure 2 As shown; in practice, the ventilation component 40 is a centrifugal fan with an air volume > 300m³ / h, used to generate airflow. The airflow flows along the air duct 30, contacts the hot end on the semiconductor cooling chip 10, carries away the heat from the hot end on the semiconductor cooling chip 10, and flows out from the outlet end 30-6, thus improving the heat dissipation effect.

[0057] Structures in the prior art:

[0058] See Figure 1 , Figure 2 The motor 100, housing 101, front bearing 102, stator 103, rear bearing 104, and outer cover 200 are common structures in the prior art. The front bearing 102, stator 103, and rear bearing 104 are located inside the housing 101, and the motor 100 is located inside the outer cover 200. This is not the inventive point of this utility model, but is only used to better describe this utility model and facilitate understanding of the technical solution of this utility model. Those skilled in the art can directly and without doubt know how to set it up after seeing the disclosed content, without needing to make creative efforts or conduct excessive experiments.

[0059] In the description, it should be understood that the terms "up", "down", "left", "right", "front", "back", etc., indicate the orientation or positional relationship based on the positional relationship shown in the accompanying drawings, and are only for the convenience or simplification of the description, rather than indicating a specific orientation that must be present; the operation process described in the embodiments is not an absolute usage step, and corresponding adjustments can be made in actual use;

[0060] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art; the words “first,” “second,” and similar terms used in the specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components, and similarly, the words “a” or “a” and similar terms do not determine a quantity limitation, but rather indicate the presence of at least one, as determined by the content of the embodiments;

[0061] The above description is only a preferred embodiment, but the scope of protection is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the disclosed technology, based on the technical solution and inventive concept, should be included within the scope of protection.

Claims

1. A kind of energy-saving device of compound cooling of semiconductor refrigerating sheet coordination fan for precision spindle, comprising: Thermostat; characterized in that it further includes: Several thermoelectric cooling chips are mounted on the motor and electrically connected to the temperature controller. The cold end of the thermoelectric cooling chip is attached to the motor, and the hot end faces the outside of the motor, for heat dissipation of the motor. Several integrated thermistors are disposed on the motor and electrically connected to the semiconductor cooling chip and the temperature controller; An air duct is disposed between the motor and the outer cover, surrounding the motor and the semiconductor cooling chip; And a ventilation component, connected to one end of the outer cover, disposed between the outer cover and the motor, electrically connected to the thermostat, for generating airflow, the airflow flowing along the air duct, contacting the hot end on the semiconductor cooling chip, and flowing out from the other end of the outer cover.

2. The energy-saving device of claim 1, wherein the device is characterized in that: The thermoelectric cooler is arranged in a spiral pattern on the housing of the motor, and the thermoelectric cooler is located near the front bearing, near the stator, and near the rear bearing of the motor.

3. The energy-saving device of claim 2, wherein the device further comprises a fan. Carbon fiber is disposed on the outer edge of the hot end of the semiconductor cooling chip.

4. The energy-saving device of claim 3, wherein the device further comprises a fan. The air duct includes an inlet end, which is close to the ventilation component; A long, straight channel, with the aforementioned inlet end at one end; The first turning passage is connected to the other end of the long straight passage; A short, straight passage, one end of which is connected to the first turning passage; The second turning passage is connected to the other end of the short straight passage; And the exit end, which connects to the second turning channel.

5. The precision spindle semiconductor refrigeration chip and fan combined cooling energy-saving device according to claim 4, characterized in that: The long straight channel is a circular channel.

6. The precision spindle semiconductor refrigeration chip and fan combined cooling energy-saving device according to claim 5, characterized in that: The short straight channel is a circular channel.

7. The precision spindle semiconductor refrigeration chip and fan combined cooling energy-saving device according to claim 6, characterized in that: The outer diameter A of the long straight channel is larger than the outer diameter B of the short straight channel.

8. The precision spindle semiconductor refrigeration chip and fan combined cooling energy-saving device according to claim 7, characterized in that: After planar projection, the width C of the long straight channel is equal to the width D of the first turning channel and the width E of the short straight channel; The width dimension E is greater than the width dimension F of the second turning channel; The width dimension C is the spacing dimension between the outer cover and the carbon fiber; The width dimension D is the spacing dimension between the outer cover and the carbon fiber; The width dimension E is the spacing dimension between the outer cover and the carbon fiber; The width dimension F is the spacing dimension between the outer cover and the outer shell.

9. A precision spindle semiconductor refrigeration chip combined with a fan for composite cooling and energy saving, as described in claim 1 or 8, characterized in that: The ventilation component is a centrifugal fan.

10. The precision spindle semiconductor refrigeration chip and fan combined cooling energy-saving device according to claim 9, characterized in that: The air volume of the ventilation component is >300m³ / h.

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