Laser processing equipment

Abstract

This application belongs to the field of laser processing technology and provides a laser processing equipment, including: a worktable, a shifting device, a stage, a support frame, and multiple Bezier cutting heads; the shifting device is disposed on the worktable; the stage is disposed on the shifting device, and the shifting device is used to drive the stage to reciprocate along a first direction and a second direction, wherein the second direction is not collinear with the first direction; the support frame is disposed on the worktable, and the position of the support frame corresponds to that of the stage; multiple Bezier cutting heads are disposed on the support frame along the second direction. This laser processing equipment uses multiple Bezier cutting heads to simultaneously perform non-contact laser processing on multiple processing areas of a glass substrate on the stage, improving the processing efficiency of large-size glass substrates.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and more specifically, relates to a laser processing device. Background Technology

[0002] In the field of glass substrate processing, laser drilling and cutting technology is widely used due to its high precision and efficiency. Existing laser processing equipment primarily employs a one-to-one stage-to-laser head configuration for laser drilling and cutting of glass substrates. This configuration is sufficient for processing small or medium-sized glass substrates. However, with continuous technological advancements and increasingly diversified market demands, higher requirements are being placed on the size specifications of glass substrates. Large-sized glass substrates are becoming increasingly prevalent in the market. Due to the significantly increased processing area of ​​large-sized glass substrates, continuing to use the one-to-one stage-to-laser head configuration would drastically extend the time required to complete a single processing cycle, severely impacting the processing efficiency of large-sized glass substrates. Utility Model Content

[0003] In order to overcome the problems existing in the prior art, the main objective of this application is to provide a laser processing device.

[0004] To achieve the above objectives, this application specifically adopts the following technical solution:

[0005] A laser processing device, comprising:

[0006] Workbench;

[0007] A shifting device, wherein the shifting device is disposed on the worktable;

[0008] A stage is provided on the shifting device, which is used to drive the stage to reciprocate along a first direction and a second direction, wherein the second direction is not collinear with the first direction;

[0009] A support frame, wherein the support frame is disposed on the worktable, and the position of the support frame corresponds to that of the loading platform; and

[0010] Multiple Bezier cutting heads are disposed on the support frame along the second direction.

[0011] The first possibility is that there are two Bezier cutting heads, which are spaced apart along the second direction.

[0012] The first possibility is that the stage is a vacuum adsorption stage.

[0013] The first possible scenario is that the shifting device includes a first moving mechanism and a second moving mechanism. The first moving mechanism is disposed on the worktable, and the second moving mechanism is disposed on the first moving mechanism. The first moving mechanism is used to drive the second moving mechanism and the platform to reciprocate along the first direction, and the second moving mechanism is used to drive the platform to reciprocate along the second direction.

[0014] The first possible scenario is that the first moving mechanism includes two first driving components and three first guide rails, the length direction of the first guide rails is consistent with the first direction, the two first driving components and the three first guide rails are alternately arranged along the second direction, and the second moving mechanism is disposed on the two first driving components and slides with the three first guide rails along the first direction.

[0015] The first possibility is that each of the first driving components is provided with a grating ruler.

[0016] The first possible scenario is that the second moving mechanism includes a mounting base, a second driving component, and a second guide rail. The mounting base is disposed on the first moving mechanism, the second driving component and the second guide rail are disposed on the mounting base, the length direction of the second guide rail is consistent with the second direction, and the stage is disposed on the second driving component and slides with the second guide rail along the second direction.

[0017] The first possibility is that the laser processing equipment further includes an adjustment device, which is mounted on the support frame, and a plurality of Bezier cutting heads are mounted on the adjustment device. The adjustment device is used to drive the Bezier cutting heads to reciprocate along a third direction, wherein the third direction is perpendicular to the first direction and the second direction.

[0018] In one possible scenario, the adjustment device includes a fixed plate, a third drive assembly, a third guide rail, and a movable plate. The fixed plate is mounted on the support frame, the third drive assembly and the third guide rail are mounted on the fixed plate, the length direction of the third guide rail is aligned with the third third direction, the movable plate is mounted on the third drive assembly and slides with the third guide rail along the third third direction, and a plurality of Bezier cutting heads are mounted on the movable plate along the second direction.

[0019] The first possibility is that the workbench includes a frame and a base plate, the base plate being a marble slab and mounted on the frame, and the first moving mechanism and the support frame both mounted on the base plate.

[0020] Compared with existing technologies, the laser processing equipment provided in this application achieves multiple Bezier cutting heads mounted on a support frame along a second direction. This allows for the configuration of multiple Bezier cutting heads on a single stage, enabling simultaneous non-contact laser processing of multiple processing areas of the glass substrate on the stage in the second direction. During processing, the multiple Bezier cutting heads remain stationary, while the position of the stage in both the first and second directions is controlled by a shifting device. This allows the Bezier cutting heads to rapidly complete processing of different points on the glass substrate. This processing method significantly improves the processing efficiency and throughput of glass substrates, especially for large-size glass substrates. Furthermore, by using the worktable as the basic load-bearing structure, the shifting device, support frame, and other components are integrated into a compact unit, reducing the overall footprint of the equipment and improving the stability of the overall structure. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of a laser processing device provided in one embodiment of this application;

[0023] Figure 2 This is a diagram illustrating the usage state of the Bezier cutting head of a laser processing apparatus provided in one embodiment of this application;

[0024] Figure 3 This is a top view of a laser processing apparatus provided in one embodiment of this application;

[0025] Figure 4 This is a partial structural schematic diagram of a laser processing device provided in one embodiment of this application.

[0026] Explanation of key figure labels:

[0027] 10. Workbench; 11. Frame; 12. Base plate;

[0028] 20. Shifting device; 21. First moving mechanism; 211. First driving assembly; 212. First guide rail; 22. Second moving mechanism; 221. Mounting base plate; 222. Second driving assembly; 223. Second guide rail;

[0029] 30. Stage;

[0030] 40. Support frame; 41. Column; 42. Horizontal beam;

[0031] 50. Bezier cutter head;

[0032] 60. Adjustment device; 61. Fixed plate; 62. Third drive assembly; 63. Third guide rail; 64. Moving plate;

[0033] 70. Visual inspection components;

[0034] X, first direction; Y, second direction; Z, third direction;

[0035] 100. Glass substrate; 101. Processing area; 102. Processing point. Detailed Implementation

[0036] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0037] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0038] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0040] Please refer to the following: Figures 1 to 4 The laser processing equipment provided in the embodiments of this application will now be described.

[0041] Please see Figure 1 and Figure 2The laser processing equipment includes a worktable 10, a shifting device 20, a stage 30, a support frame 40, and multiple Bezier cutting heads 50. The shifting device 20 is mounted on the worktable 10, and the stage 30 is mounted on the shifting device 20. The shifting device 20 is used to drive the stage 30 to reciprocate along a first direction X and a second direction Y. The second direction Y is not collinear with the first direction X. The stage 30 is used to support the glass substrate 100. The support frame 40 is mounted on the worktable 10, and the position of the support frame 40 corresponds to that of the stage 30. Multiple Bezier cutting heads 50 are mounted on the support frame 40 along the second direction Y.

[0042] Optionally, the second direction Y is perpendicular to the first direction X. For example, the first direction X is the length direction of the glass substrate 100, and the second direction Y is the width direction of the glass substrate 100. Alternatively, the first direction X is the width direction of the glass substrate 100, and the second direction Y is the length direction of the glass substrate 100. The Bezier cutting head 50 is located above the stage 30.

[0043] When the laser processing equipment needs to process the glass substrate 100, the glass substrate 100 to be processed is placed on the stage 30, and multiple Bezier cutting heads 50 correspond one-to-one with multiple processing areas 101 of the glass substrate 100 in the second direction Y; simultaneously, the multiple Bezier cutting heads 50 are activated, and the multiple Bezier cutting heads 50 simultaneously perform non-contact laser processing on the multiple processing areas 101 of the glass substrate 100, such as... Figure 2 During the processing, according to the preset processing path and parameters, the shifting device 20 drives the stage 30 carrying the glass substrate 100 to move along the first direction X or the opposite direction to the first direction X, and along the second direction Y or the opposite direction to the second direction Y, so that the Bezier cutting head 50 can complete the processing task of the processing area 101 of the glass substrate 100 as required. After the multiple Bezier cutting heads 50 have completed the processing of the multiple processing areas 101 of the glass substrate 100, the first moving mechanism 21, the second moving mechanism 22 and the multiple Bezier cutting heads 50 stop working, the stage 30 stops moving, and the processed glass substrate 100 is removed from the stage 30.

[0044] Compared with the prior art, the laser processing equipment provided in this application uses the worktable 10 as the basic supporting structure to integrate components such as the shifting device 20 and the support frame 40 into a compact whole, reducing the overall footprint of the equipment and improving the stability of the overall structure, while reducing the impact of vibration during processing on accuracy. By setting multiple Bezier cutting heads 50 along the second direction Y on the support frame 40, multiple Bezier cutting heads 50 can be configured on one stage 30. The multiple Bezier cutting heads 50 can simultaneously perform non-contact laser processing on multiple processing areas 101 of the glass substrate 100 on the stage 30 in the second direction Y. During the processing, the multiple Bezier cutting heads 50 remain stationary, and the position of the stage 30 in the first direction X and the second direction Y is controlled by the shifting device 20, so that the Bezier cutting heads 50 can quickly complete the processing of different processing points 102 of the processing area 101 of the glass substrate 100. This processing method significantly improves the processing efficiency and production capacity of the glass substrate 100, especially for large-size glass substrates 100, the effect is more obvious. In addition, compared with multiple laser processing equipment that uses a one-to-one configuration mode of stage 30 and laser processing head, under the condition of achieving the same processing efficiency, the laser processing equipment of this application uses a stage 30 to configure multiple Bezier cutting heads 50, which reduces the number of equipment and the floor space, reduces the overall volume and weight, and lowers the equipment procurement and maintenance costs.

[0045] It should be noted that the large-size glass substrate 100 mainly refers to a glass substrate 100 with a size greater than or equal to 24 inches. Furthermore, the processing requirements of the multiple processing areas 101 on the glass substrate 100 are consistent, such as the location, number, and size of the processing points 102. The optical parameters of the two Bezier cutting heads 50 are identical. In addition, the laser processing equipment of this application is also used for laser processing of sheet metal parts and plastic parts.

[0046] Understandably, the laser processing equipment also includes a control system, a laser, and a beam splitting assembly. The control system is signal-connected to the laser, the first moving mechanism 21, and the second moving mechanism 22. During laser processing, the control system controls the laser to emit laser light. The laser light emitted by the laser is split by the beam splitting assembly to form multiple laser beams. These multiple laser beams are focused by multiple Bezier cutting heads 50 onto processing points 102 in multiple processing areas 101 of the glass substrate 100 on the stage 30. The laser can be a femtosecond infrared laser, a carbon dioxide laser, or a fiber laser.

[0047] Combined with appendix Figure 1It is understood that the workbench 10 includes a frame 11 and a base plate 12. The base plate 12 is made of marble and is mounted on the frame 11. The first moving mechanism 21 and the support frame 40 are both mounted on the base plate 12. The marble base plate 12 has a high surface flatness, providing a relatively stable installation benchmark for the platform 30 and the support frame 40, effectively avoiding processing deviations caused by unevenness of the base plate 12. Furthermore, marble has high hardness and good wear resistance, and is not easily worn or scratched after long-term use, which helps to reduce the frequency and cost of equipment maintenance.

[0048] Combined with appendix Figure 1 and Figure 4 It is understandable that there are two Bezier cutting heads 50, which are spaced apart along the second direction Y. During processing, the two Bezier cutting heads 50 simultaneously perform laser processing on two processing areas 101 on the glass substrate 100. Using two Bezier cutting heads 50 simultaneously results in high processing efficiency. Of course, it is possible to use three or more Bezier cutting heads 50, which would offer even higher processing efficiency and greater versatility and adaptability.

[0049] Combined with appendix Figure 1 and Figure 2 It is understood that the stage 30 is a vacuum adsorption stage. The vacuum adsorption stage is connected to an external vacuum pump. When loading the glass substrate 100, the glass substrate 100 is placed on the vacuum adsorption stage, and the external vacuum pump evacuates the stage, causing the stage to adsorb the glass substrate 100 under vacuum, thus fixing the glass substrate 100 in place. By setting the stage 30 as a vacuum adsorption stage, the glass substrate 100 can be firmly fixed on the stage 30, avoiding processing deviations caused by movement or shaking of the glass substrate 100, and improving processing accuracy. Moreover, simply turning the vacuum pump on or off allows for rapid fixing and release of the glass substrate 100, reducing loading and unloading time and improving production efficiency. Furthermore, vacuum adsorption is less likely to cause mechanical damage to the surface of the glass substrate 100, effectively ensuring the quality of the glass substrate 100.

[0050] Optionally, the stage 30 has an adsorption area with uniformly distributed vacuum adsorption holes, through which the glass substrate 100 is simultaneously adsorbed. Alternatively, the stage 30 is provided with clamping members, so that when loading the glass substrate 100, the glass substrate 100 is placed on the stage 30 and clamped on the stage 30 by the clamping members.

[0051] Combined with appendix Figure 1It is understandable that the support frame 40 is a gantry frame, which spans the first moving mechanism 21 and the second moving mechanism 22 along the second direction Y. Using a gantry frame for the support frame 40 provides structural stability, effectively resisting vibrations and deformations generated during processing. This results in a more fixed and precise relative position between the Bezier cutting head 50 and the stage 30, contributing to improved laser processing accuracy. Furthermore, the gantry frame spanning the first moving mechanism 21 and the second moving mechanism 22 along the second direction Y allows for flexible arrangement of multiple Bezier cutting heads 50 along the second direction Y on the gantry frame, without affecting the movement of the stage 30 in the first direction X and the second direction Y.

[0052] Combined with appendix Figure 1 It is understood that the support frame 40 includes two uprights 41 and a crossbeam 42. The two uprights 41 are spaced apart relative to each other along the second direction Y. The two ends of the crossbeam 42 are connected to the tops of the two uprights 41 respectively. The crossbeam 42 is a marble crossbeam, and multiple Bezier cutting heads 50 are mounted on the crossbeam 42. By using marble as the material for the crossbeam 42, the crossbeam 42 has high rigidity and stability, providing stable support for the Bezier cutting heads 50. This helps to reduce errors caused by vibration or deformation during processing. In addition, marble is hard and wear-resistant, and can resist wear and scratches during long-term use.

[0053] Combined with appendix Figure 1 It is understood that the shifting device 20 includes a first moving mechanism 21 and a second moving mechanism 22. The first moving mechanism 21 is mounted on the worktable 10, the second moving mechanism 22 is mounted on the first moving mechanism 21, and the stage 30 is mounted on the second moving mechanism 22. The first moving mechanism 21 drives the second moving mechanism 22 and the stage 30 to reciprocate along a first direction X, and the second moving mechanism 22 drives the stage 30 to reciprocate along a second direction Y. During the processing, according to the preset processing path and parameters, the first moving mechanism 21 drives the second moving mechanism 22 and the stage 30 carrying the glass substrate 100 to move along the first direction X or in a direction opposite to the first direction X, and the second moving mechanism 22 drives the stage 30 carrying the glass substrate 100 to move along the second direction Y or in a direction opposite to the second direction Y, so that the Bezier cutting head 50 can complete the processing task of the processing area 101 of the glass substrate 100 as required.

[0054] Combined with appendix Figure 1It is understood that the first moving mechanism 21 includes two first driving components 211 and three first guide rails 212. The length direction of the first guide rails 212 is consistent with the first direction X. The two first driving components 211 and the three first guide rails 212 are alternately arranged along the second direction Y. The second moving mechanism 22 is disposed on the two first driving components 211 and slides with the three first guide rails 212 along the first direction X. The first driving components 211 are connected to the control system signal. The two first driving components 211 are used to simultaneously drive the first moving mechanism 21 to reciprocate along the first direction X. Then, the first moving mechanism 21 drives the stage 30 to reciprocate along the first direction X. The three first guide rails 212 are used to simultaneously guide the movement of the first moving mechanism 21.

[0055] The above technical solution, by alternately setting two first drive components 211 and three first guide rails 212, can ensure that the stage 30 moves more smoothly in the first direction X. Specifically, the two drive components cooperate to provide a more stable driving force, and the three first guide rails 212 cooperate to provide a more precise guiding effect, which helps to reduce the vibration and shaking of the stage 30 during the movement, thereby improving the processing accuracy of the glass substrate 100 on the stage 30.

[0056] Optionally, the first drive component 211 may be, but is not limited to, a coreless linear motor or a servo electric cylinder.

[0057] It is understood that each of the first drive components 211 is equipped with a grating ruler. The grating ruler is connected to the control system signal and is a high-precision position measuring element. Specifically, when the first drive component 211 drives the first moving mechanism 21 and the stage 30 to reciprocate along the first direction X, the feedback from the grating ruler enables the first drive component 211 to precisely control the movement of the stage 30, measure the position of the stage 30 in the first direction X in real time and accurately, effectively avoid processing defects caused by displacement errors, and help improve the processing accuracy of the glass substrate 100.

[0058] Combined with appendix Figure 1 It is understood that the second moving mechanism 22 includes a mounting base plate 221, a second driving component 222, and a second guide rail 223. The mounting base plate 221 is disposed on the first moving mechanism 21, the second driving component 222 and the second guide rail 223 are disposed on the mounting base plate 221, the length direction of the second guide rail 223 is consistent with the second direction Y, and the stage 30 is disposed on the second driving component 222 and slides with the second guide rail 223 along the second direction Y.

[0059] Specifically, the bottom of the mounting base 221 is connected to two first drive components 211 and slides with three first guide rails 212 along the first direction X. The mounting base 221 supports the second drive component 222 and the second guide rails 223. The second drive component 222 is connected to the control system signal and is used to drive the stage 30 to reciprocate along the second direction Y. The second guide rails 223 guide the movement of the stage 30.

[0060] In the above technical solution, the mounting substrate 221 serves as the foundation of the second moving mechanism 22, providing stable support for the second driving assembly 222 and the second guide rail 223, which helps reduce structural deformation caused by vibration or external forces. The second driving assembly 222 precisely controls the movement speed and position of the stage 30, and the second guide rail 223 provides stable guidance for the stage 30, ensuring that the stage 30 maintains linearity when moving along the second direction Y, reducing offset and vibration, thereby improving the processing accuracy of the glass substrate 100.

[0061] Optionally, the mounting base plate 221 is a marble slab. Marble slabs have high rigidity and stability, which can effectively resist vibration and deformation generated during processing. In addition, the surface of marble slabs is hard and wear-resistant, which can resist wear and scratches during long-term use.

[0062] Optionally, the second drive component 222 may be, but is not limited to, a coreless linear motor or a servo electric cylinder.

[0063] Combined with appendix Figure 1 It is understood that the laser processing equipment also includes an adjustment device 60, which is mounted on the support frame 40. Multiple Bezier cutting heads 50 are mounted on the adjustment device 60. The adjustment device 60 is used to drive the Bezier cutting heads 50 to reciprocate along a third direction, wherein the third direction is perpendicular to the first direction X and the second direction Y. It is understood that the third direction is a direction perpendicular to the surface of the glass substrate 100. Exemplarily, the third direction is a vertical direction.

[0064] When changing glass substrates 100 of different thicknesses or performing different processing tasks, the Bezier cutting head 50 is driven to reciprocate along a third direction by the adjustment device 60, so that the Bezier cutting head 50 moves closer to or further away from the worktable, thereby adjusting the distance between the cutting head and the worktable 30, making the laser processing equipment more flexible and more applicable.

[0065] Combined with appendix Figure 3 and Figure 4It is understood that the adjustment device 60 includes a fixed plate 61, a third drive assembly 62, a third guide rail 63, and a moving plate 64. The fixed plate 61 is mounted on the support frame 40. The third drive assembly 62 and the third guide rail 63 are mounted on the fixed plate 61. The length direction of the third guide rail 63 is consistent with the third third direction. The moving plate 64 is mounted on the third drive assembly 62 and slides with the third guide rail 63 along the third third direction. Multiple Bezier cutting heads 50 are mounted on the moving plate 64 along the second direction Y.

[0066] Specifically, the fixed plate 61 is installed in the middle of the crossbeam 42, the third drive assembly 62 is connected to the control system signal, the third drive assembly 62 is used to drive the moving plate 64 to reciprocate along the third direction, and then the moving plate 64 drives multiple Bezier cutting heads 50 to reciprocate along the third direction, and the third guide rail 63 is used to guide the movement of the moving plate 64.

[0067] In the above technical solution, the adjustment device 60 drives the moving plate 64 to reciprocate along a third direction through the third drive component 62, and combined with the guiding effect of the third guide rail 63, it realizes precise control of the distance between the Bezier cutting head 50 and the glass substrate 100.

[0068] Optionally, the third drive component 62 may be, but is not limited to, a servo electric cylinder or a coreless linear motor.

[0069] Optionally, there are two third guide rails 63. The two third guide rails 63 are respectively arranged on opposite sides of the third drive component 62 along the second direction Y. The movement of the moving plate 64 is guided by the cooperation of the two third guide rails 63, which helps to improve the stability of the moving plate 64 during movement.

[0070] Combined with appendix Figure 1 and Figure 4 It is understood that the laser processing equipment also includes a vision inspection component 70, which is mounted on the adjustment device 60. Specifically, the vision inspection component 70 is mounted on the moving plate 64 and is connected to the control system. The vision inspection component 70 is used to inspect the glass substrate 100 on the stage 30 and feeds the inspection data back to the control system. The control system determines the position of the glass substrate 100 based on the inspection data, which helps to improve processing accuracy. In addition, both the vision inspection component 70 and the Bezier cutting head 50 are mounted on the adjustment device 60, and their spatial positions are relatively fixed, effectively ensuring the consistency between the inspection position and the processing position.

[0071] Optionally, the vision inspection component 70 may be, but is not limited to, a charge-coupled device (CCD) component, a complementary metal-oxide-semiconductor (CMOS) component, and an infrared vision inspection component 70. For example, the vision inspection component 70 is a CCD component, which takes pictures of the glass substrate 100 on the stage 30. Image recognition technology is used to detect the actual position, edge contour, or marker points of the glass substrate 100. After comparing these with preset processing coordinates, a position compensation signal is generated. The control system uses the compensation signal to achieve precise positioning of the glass substrate 100, effectively ensuring the accuracy and efficiency of the glass substrate 100 processing.

[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser processing apparatus characterized by comprising: include: Workbench; A shifting device, wherein the shifting device is disposed on the worktable; A stage is provided on the shifting device, which is used to drive the stage to reciprocate along a first direction and a second direction, wherein the second direction is not collinear with the first direction; A support frame is provided on the workbench, and the position of the support frame corresponds to that of the loading platform; as well as Multiple Bezier cutting heads are disposed on the support frame along the second direction.

2. The laser processing equipment as described in claim 1, characterized in that: The number of Bezier cutting heads is two, and the two Bezier cutting heads are spaced apart along the second direction.

3. The laser processing equipment as described in claim 1, characterized in that: The stage is a vacuum adsorption stage.

4. The laser processing equipment as described in claim 1, characterized in that: The shifting device includes a first moving mechanism and a second moving mechanism. The first moving mechanism is disposed on the worktable, and the second moving mechanism is disposed on the first moving mechanism. The first moving mechanism is used to drive the second moving mechanism and the platform to reciprocate along the first direction, and the second moving mechanism is used to drive the platform to reciprocate along the second direction.

5. The laser processing equipment as described in claim 4, characterized in that: The first moving mechanism includes two first driving components and three first guide rails. The length direction of the first guide rails is consistent with the first direction. The two first driving components and the three first guide rails are alternately arranged along the second direction. The second moving mechanism is disposed on the two first driving components and slides with the three first guide rails along the first direction.

6. The laser processing equipment as described in claim 5, characterized in that: Each of the first driving components is provided with a grating ruler.

7. The laser processing equipment as described in claim 4, characterized in that: The second moving mechanism includes a mounting base, a second driving component, and a second guide rail. The mounting base is disposed on the first moving mechanism, and the second driving component and the second guide rail are disposed on the mounting base. The length direction of the second guide rail is consistent with the second direction. The stage is disposed on the second driving component and slides with the second guide rail along the second direction.

8. The laser processing equipment according to any one of claims 1-7, characterized in that: The laser processing equipment also includes an adjustment device, which is mounted on the support frame. Multiple Bezier cutting heads are mounted on the adjustment device. The adjustment device is used to drive the Bezier cutting heads to reciprocate along a third direction, wherein the third direction is perpendicular to the first direction and the second direction.

9. The laser processing equipment as described in claim 8, characterized in that: The adjustment device includes a fixed plate, a third drive assembly, a third guide rail, and a movable plate. The fixed plate is mounted on the support frame. The third drive assembly and the third guide rail are mounted on the fixed plate. The length direction of the third guide rail is consistent with the third third direction. The movable plate is mounted on the third drive assembly and slides with the third guide rail along the third third direction. A plurality of Bezier cutting heads are mounted on the movable plate along the second direction.

10. The laser processing equipment according to any one of claims 4-7, characterized in that: The workbench includes a frame and a base plate. The base plate is a marble slab and is mounted on the frame. The first moving mechanism and the support frame are both mounted on the base plate.

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