An in-line heat pipe high-efficiency cooling device for activated furnace discharge

Abstract

The utility model relates to the technical field of activation furnace, concretely is a kind of activation furnace discharge recessed heat pipe high-efficiency cooling device, including cooling channel, multiple heat pipes, cooling medium circulating device, temperature monitoring device and control system. Heat pipe is evenly arranged inside cooling channel, its evaporation section is directly contacted with high-temperature discharge, condensing section is connected with cooling medium circulating device, and high-efficiency heat transfer is realized using working medium phase change. Cooling medium circulating device makes cooling medium circulating flow by circulating pump and heat dissipation equipment, and heat is quickly taken away. Temperature monitoring device detects the temperature of discharge and cooling medium in real time, and signal is transmitted to control system, and the flow and circulation speed of cooling medium are dynamically adjusted, to ensure accurate temperature control. The utility model has the advantages of high cooling efficiency, compact structure, accurate temperature control and the like, and is suitable for the rapid cooling needs of activation furnace and other high-temperature discharge scenes.

Description

Technical Field

[0001] This utility model relates to the field of activation furnace technology, specifically to an efficient cooling device with an embedded heat pipe at the outlet of an activation furnace. Background Technology

[0002] In industrial production processes, many pieces of equipment, such as activation furnaces, generate high-temperature discharges during operation. These discharges need to be cooled promptly to meet the requirements of subsequent processing or storage. Traditional cooling methods often suffer from low heat transfer efficiency, large space requirements, and imprecise control. For example, directly using air or water cooling results in low heat transfer efficiency due to the limited contact area between the heat transfer medium and the discharge material, and the cooling process is difficult to control precisely. Furthermore, some large cooling equipment often has complex structures and occupies a large space, which is not conducive to the layout and optimization of the production site.

[0003] With the continuous development of industrial technology, heat pipes, as a highly efficient heat transfer element, are increasingly being applied to various cooling systems. Heat pipes utilize the cyclic process of the working fluid absorbing heat and evaporating in the evaporation section and releasing heat and condensing in the condensation section to achieve rapid heat transfer. However, some technical challenges remain when directly applying heat pipes to the cooling system of activation furnace discharge. While there has been some research and application of heat pipe cooling systems in the existing technology, a mature and efficient solution is still lacking for the specific scenario of activation furnace discharge cooling. Therefore, we propose a high-efficiency heat pipe cooling device embedded in the activation furnace discharge. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency cooling device with an embedded heat pipe at the discharge of an activation furnace, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A high-efficiency cooling device with an embedded heat pipe for the discharge of an activation furnace includes a cooling channel for accommodating the discharge material to be cooled.

[0007] Multiple heat pipes are evenly arranged inside the cooling channel, and the evaporation section of the multiple heat pipes is in direct contact with the material outlet;

[0008] A cooling medium circulation device is installed outside the cooling channel and in contact with the condensation section of the heat pipe. It is used to circulate the cooling medium to absorb and remove the heat conducted by the heat pipe.

[0009] Temperature monitoring device, including multiple temperature sensors installed at the outlet of the cooling channel and the condensation section of the heat pipe;

[0010] The control system is electrically connected to the cooling medium circulation device and the temperature detection device, respectively, and is used to adjust the flow rate and circulation speed of the cooling medium according to the received temperature signal.

[0011] Preferably, the cooling medium circulation device includes a circulation pump and a heat dissipation device. The heat dissipation device is located outside the cooling channel. The inlet of the circulation pump is sealed to the heat dissipation device through a pipeline. The outlet of the circulation pump is transported to the heat pipe condensation section through a pipeline and then sealed to the heat dissipation device.

[0012] Preferably, the heat dissipation device is a cooling tower or a radiator.

[0013] Preferably, the cooling medium of the cooling medium circulation device is water, oil, or air.

[0014] Preferably, a plurality of through holes are provided on one side of the cooling channel, the condensation section of the heat pipe passes through the through holes and contacts the pipeline at the outlet end of the circulating pump, and the outer wall of the heat pipe is sealed to the through holes.

[0015] Preferably, the heat pipe has multiple pores evenly distributed on its wall.

[0016] Preferably, a filter is provided at the inlet of the circulating pump, and the cooling medium circulation device further includes a descaling device, which is installed on the connecting pipe between the outlet of the circulating pump and the heat dissipation equipment.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. This activation furnace's embedded heat pipe high-efficiency cooling device features an embedded heat pipe design, where the evaporation section of the heat pipe directly contacts the high-temperature discharged material. Utilizing the working fluid's phase change heat transfer principle, it significantly improves heat transfer efficiency. Simultaneously, the cooling medium circulation device is tightly integrated with the heat pipe's condensation section, rapidly removing heat and achieving efficient cooling of the discharged material. Furthermore, the heat pipes are evenly distributed within the cooling channel, while the cooling medium circulation device is integrated on the outside, resulting in a compact overall structure that occupies little space, facilitating layout and optimization on the production site.

[0019] 2. The activation furnace's in-line heat pipe high-efficiency cooling device monitors the temperature of the discharged material and the cooling medium in real time through a temperature monitoring device, and feeds the data back to the control system. The control system dynamically adjusts the flow rate and circulation speed of the cooling medium based on the temperature signal to ensure a stable and precise cooling process, avoiding over-cooling or under-cooling.

[0020] 3. The high-efficiency cooling device with embedded heat pipe at the discharge of the activation furnace can optimize the ratio of the length of the evaporation section to the condensation section of the heat pipe according to different discharge heat and cooling requirements. It adopts a porous heat pipe structure to further increase the contact area, improve heat transfer efficiency, and meet diverse industrial needs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the embedded heat pipe high-efficiency cooling device in Example 1;

[0022] Figure 2 This is a schematic diagram of the porous heat pipe structure in Example 2.

[0023] In the diagram: 1. Cooling channel; 11. Through hole; 2. Heat pipe; 21. Pore; 3. Cooling medium circulation device; 4. Temperature monitoring device; 5. Circulation pump; 6. Heat dissipation equipment; 7. Temperature sensor; 8. Control system. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" means two or more, unless otherwise explicitly specified.

[0028] Example 1: Please refer to Figure 1 As shown, this utility model provides a technical solution:

[0029] An efficient cooling device with an embedded heat pipe for the discharge of an activation furnace includes a cooling channel 1 for accommodating the discharge material to be cooled. The cooling channel 1 has a rectangular structure and is made of a high-temperature resistant and high-strength metal material to adapt to the cooling environment of high-temperature discharge.

[0030] Multiple heat pipes 2 are evenly arranged inside the cooling channel 1. The heat pipes 2 are made of copper and have good thermal conductivity. The evaporation section of the multiple heat pipes 2 is in direct contact with the discharge material. When the high-temperature discharge material enters the cooling channel 1, the evaporation section of the heat pipe 2 quickly absorbs the heat of the discharge material, causing the working medium inside the heat pipe 2 to absorb heat and evaporate into gas.

[0031] It is worth noting that in this embodiment, the length ratio of the evaporation section and the condensation section of the heat pipe 2 is optimized according to the amount of heat output and the cooling requirements.

[0032] The cooling medium circulation device 3 is located outside the cooling channel 1 and is in contact with the condensation section of the heat pipe 2. It is used to circulate the cooling medium to absorb and remove the heat conducted by the heat pipe 2.

[0033] Furthermore, the cooling medium circulation device 3 includes a circulation pump 5 and a heat dissipation device 6. The heat dissipation device 6 is located outside the cooling channel 1. The inlet of the circulation pump 5 is sealed to the heat dissipation device 6 through a pipeline. The outlet of the circulation pump 5 is transported to the condensation section of the heat pipe 2 through a pipeline and then sealed to the heat dissipation device 6.

[0034] The heat dissipation device 6 is a cooling tower or radiator, preferably a cooling tower in this embodiment. The cooling medium of the cooling medium circulation device 3 is water, oil, or air, preferably water in this embodiment because it has a high specific heat capacity and can effectively absorb and remove heat. The circulation pump 5 draws cooling water from the cooling tower and transports it through pipelines to the position in contact with the condensation section of the heat pipe 2. In the condensation section, the working medium gas evaporated inside the heat pipe 2 exchanges heat with the cooling water, transferring heat to the cooling water and then condensing into liquid, returning to the evaporation section of the heat pipe 2. This cycle repeats, achieving rapid heat transfer. After absorbing heat, the cooling water's temperature rises, and it flows back to the cooling tower through pipelines.

[0035] The cooling tower adopts an air-cooled structure. Through the action of the fan, the air exchanges heat with the high-temperature cooling water, dissipating the heat in the cooling water into the environment, thereby reducing the temperature of the cooling water, which is then pumped away by the circulating pump 5 to enter the next cycle.

[0036] Furthermore, a plurality of through holes 11 are provided on one side of the cooling channel 1. The condensation section of the heat pipe 2 passes through the through holes 11 and contacts the pipeline at the outlet end of the circulating pump 5. The outer wall of the heat pipe 2 is sealed to the through holes 11.

[0037] Furthermore, to ensure the cleanliness and smooth circulation of the cooling water, a filter is installed at the inlet of the circulating pump 5 to remove impurities and particulate matter from the cooling water; the cooling medium circulation device 3 also includes a descaling device, which is installed on the connecting pipe between the outlet of the circulating pump 5 and the heat dissipation device 6 to prevent scale formation in the cooling water during circulation, which would affect the heat transfer effect.

[0038] Temperature monitoring device 4 includes multiple temperature sensors 7 installed at the outlet of cooling channel 1 and the condensation section of heat pipe 2. The temperature sensors 7 monitor the temperature of the discharge and cooling medium in real time.

[0039] The control system 8 is electrically connected to the cooling medium circulation device 3 and the temperature detection device 4, respectively, and is used to adjust the flow rate and circulation speed of the cooling medium based on the received temperature signal. The control system 8 uses a programmable logic controller (PLC) with powerful data processing and control functions. The temperature sensor 7 converts the monitored temperature signal into an electrical signal and transmits it to the control system 8. Based on the received temperature signal, the control system 8 adjusts the speed of the circulation pump 5 in real time through internally preset programs and algorithms, thereby controlling the flow rate and circulation speed of the cooling water. When the discharge temperature is high, the control system 8 increases the speed of the circulation pump 5, increasing the flow rate and circulation speed of the cooling water to accelerate the cooling process; when the discharge temperature approaches the target value, the control system 8 decreases the speed of the circulation pump 5, reducing the flow rate and circulation speed of the cooling water to avoid over-cooling and ensure the stability and efficiency of the cooling process.

[0040] During the installation and commissioning phase, heat pipe 2 is first precisely installed into cooling channel 1 according to the predetermined layout, ensuring a tight and reliable connection between heat pipe 2 and the discharge and cooling medium circulation system 3 to prevent leaks. Then, each component of the cooling medium circulation system 3 is connected sequentially, including the circulation pump 5, cooling tower 6, and pipes, and the sealing is carefully checked to ensure normal system operation. Next, temperature sensor 7 is installed at the designated location in cooling channel 1 and the condensation section of heat pipe 2, ensuring accurate temperature measurement and stable signal transmission to control system 8. Simultaneously, control system 8 is installed in a suitable location, wired, and initially debugged to ensure it can properly receive and process temperature signals. Finally, the entire cooling device undergoes comprehensive commissioning. First, the connections of each component are checked for secureness and good sealing. Then, cooling medium circulation system 3 is started, and the flow rate and pressure of the cooling water are observed to ensure they meet design requirements. After everything is normal, temperature monitoring device 4 and control system 8 are started to simulate temperature changes under different operating conditions, verifying whether control system 8 can accurately adjust the flow rate and circulation speed of the cooling water in real time based on the temperature signal, ensuring stable and efficient operation of the cooling system.

[0041] In this embodiment, the high-efficiency cooling device with embedded heat pipes at the activation furnace discharge point requires operators to regularly monitor various parameters of the cooling system, such as discharge temperature, cooling water temperature, flow rate, and pressure, to ensure these parameters remain within predetermined ranges. Simultaneously, the cooling effect of the discharge and the state of the cooling water must be closely observed, and the system's operating status adjusted promptly based on actual conditions. Furthermore, regular maintenance of the cooling medium circulation device 3 is necessary, including cleaning the filter to prevent clogging and affecting cooling water flow; checking the descaling device to ensure it effectively prevents scaling; cleaning and inspecting the heat pipes 2 and cooling channels 1 to ensure their surfaces are clean and undamaged; and inspecting and testing electrical components such as the control system 8 to ensure normal operation and prevent malfunctions.

[0042] Example 2: As Figure 2 As shown, the overall structure of the cooling channel embedded heat pipe cooling system in this embodiment is similar to that in embodiment 1. It also includes a cooling channel 1, a heat pipe 2, a cooling medium circulation system 3, a temperature monitoring device 4, and a control system 8, but the structure of the heat pipe 2 has been optimized.

[0043] In this embodiment, the heat pipe 2 adopts a porous structure design. Multiple pores 21 are evenly distributed on the wall of the heat pipe 2, greatly increasing the contact area between the heat pipe 2 and the discharge material. When the high-temperature discharge material enters the cooling channel 1 and contacts the evaporation section of the heat pipe 2, the significantly increased contact area allows the heat pipe 2 to absorb the heat from the discharge material more quickly and fully. This enables the working medium inside the heat pipe 2 to absorb heat and evaporate into gas more rapidly, thereby greatly improving the heat transfer efficiency.

[0044] The working principle of this embodiment is basically the same as that of Embodiment 1, and will not be repeated here.

[0045] In this application, the structures and connections not described in detail are all prior art, and their structures and principles are well known, so they will not be described in detail here.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency cooling device with an embedded heat pipe at the discharge of an activation furnace, characterized in that: Includes a cooling channel (1) for accommodating the material to be cooled; Multiple heat pipes (2) are evenly arranged inside the cooling channel (1), and the evaporation section of the multiple heat pipes (2) is in direct contact with the material outlet; The cooling medium circulation device (3) is set outside the cooling channel (1) and is in contact with the condensation section of the heat pipe (2) to circulate the cooling medium to absorb and carry away the heat conducted by the heat pipe (2); Temperature monitoring device (4) includes multiple temperature sensors (7) installed at the outlet of cooling channel (1) and the condensation section of heat pipe (2); The control system (8) is electrically connected to the cooling medium circulation device (3) and the temperature monitoring device (4) respectively, and is used to adjust the flow rate and circulation speed of the cooling medium according to the received temperature signal.

2. The activated furnace discharge inline heat pipe high efficiency cooling device according to claim 1, characterized in that: The cooling medium circulation device (3) includes a circulation pump (5) and a heat dissipation device (6). The heat dissipation device (6) is located outside the cooling channel (1). The inlet of the circulation pump (5) is sealed to the heat dissipation device (6) through a pipeline. The outlet of the circulation pump (5) is transported to the condensation section of the heat pipe (2) through a pipeline and then sealed to the heat dissipation device (6).

3. The activated furnace discharge inline heat pipe high efficiency cooling device according to claim 2, characterized in that: The heat dissipation device (6) is a cooling tower or radiator.

4. The activated furnace discharge inline heat pipe high efficiency cooling device according to claim 3, characterized in that: The cooling medium of the cooling medium circulation device (3) is water, oil or air.

5. The activated furnace discharge inline heat pipe high efficiency cooling device according to claim 2, characterized in that: The cooling channel (1) has multiple through holes (11) on one side. The condensation section of the heat pipe (2) passes through the through holes (11) and contacts the pipeline at the outlet of the circulating pump (5). The outer wall of the heat pipe (2) is sealed to the through holes (11).

6. The activated furnace discharge inline heat pipe high efficiency cooling device of claim 1, wherein: The heat pipe (2) has multiple pores (21) evenly distributed on its wall.

7. The activated furnace discharge inline heat pipe high efficiency cooling device according to claim 2, characterized in that: The circulation pump (5) is equipped with a filter at the inlet, and the cooling medium circulation device (3) also includes a descaling device, which is installed on the connecting pipe between the outlet end of the circulation pump (5) and the heat dissipation device (6).

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