Semiconductor refrigeration piece temperature difference testing device

Abstract

This utility model relates to the technical field of thermoelectric cooler testing devices, and discloses a thermoelectric cooler temperature difference testing device, including a mounting box. Two temperature detectors are symmetrically fixedly connected to the inner walls of opposite sides of the mounting box. A mounting bracket is inserted into the mounting box, and multiple thermoelectric cooler bodies are vertically arranged and fixedly connected to the inner walls of opposite sides of the mounting bracket. Each thermoelectric cooler body is electrically connected to a power supply line, and each temperature detector is electrically connected to a data line. This utility model is simple to use. Multiple thermoelectric cooler bodies are installed in the mounting bracket, and multiple temperature detectors can perform multiple batches of temperature difference tests. This allows for the acquisition of multiple sets of data in a single test, resulting in more comprehensive temperature difference detection data. Furthermore, multiple rectangular holes guide the cold air blown out by the thermoelectric cooler bodies, thus fixing the airflow path.

Description

Technical Field

[0001] This utility model relates to the technical field of thermoelectric cooling device testing equipment, specifically a thermoelectric cooling device for testing temperature difference of semiconductor thermoelectric cooling devices. Background Technology

[0002] Semiconductor refrigeration technology, also known as electronic refrigeration or thermoelectric refrigeration, is a new type of refrigeration method based on the Peltier effect. It achieves energy transfer by driving semiconductor PN junction thermocouples with direct current. It is one of the three major refrigeration methods in the world, along with compression refrigeration and absorption refrigeration.

[0003] In the prior art, a separate temperature measuring device is used to test the temperature difference of a thermoelectric cooler. The data that can be detected is too one-sided and cannot represent the overall quality. Therefore, the data is relatively simple. Thus, those skilled in the art have provided a thermoelectric cooler temperature difference testing device to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide a temperature difference testing device for a semiconductor refrigeration chip to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a thermoelectric cooling chip temperature difference testing device, comprising a mounting box, wherein two temperature detectors are symmetrically fixedly connected to the inner walls of opposite sides of the mounting box, a mounting frame is inserted into the mounting box, and multiple thermoelectric cooling chip bodies are vertically arranged and fixedly connected to the inner walls of opposite sides of the mounting frame, each of the multiple thermoelectric cooling chip bodies is electrically connected to a power supply line, and each of the multiple temperature detectors is electrically connected to a data line.

[0006] As a further improvement of this utility model: multiple debugging buttons are arranged horizontally on the top of the mounting box, and multiple temperature detectors are located on both sides of the mounting frame, with the multiple debugging buttons electrically connected to the multiple temperature detectors.

[0007] As a further improvement of this utility model: multiple rectangular holes are arranged horizontally on both sides of the mounting bracket, and the air outlets of multiple semiconductor cooling chip bodies are all facing the rectangular holes.

[0008] As a further improvement of this utility model: multiple support frames are fixedly connected in a rectangular arrangement on the transverse inner wall of the mounting box, and the multiple support frames are respectively fixedly connected to the bottom and top of multiple temperature detectors.

[0009] As a further improvement of this utility model: multiple sets of clamping tubes are installed in a rectangular arrangement on the transverse inner wall of the mounting box, and each set of clamping tubes contains six tubes.

[0010] As a further improvement of this utility model: multiple sets of the clamp tubes are located behind multiple temperature detectors, and all of the clamp tubes are installed vertically.

[0011] As a further improvement of this utility model: the top inner wall and the bottom inner wall of the mounting bracket are symmetrically provided with two round holes, and the top and bottom of the mounting bracket are respectively attached to the top inner wall and the bottom inner wall of the mounting box.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] Multiple thermoelectric coolers are activated to blow cold air into a rectangular hole. The temperature detectors can be activated and their status adjusted by pressing the adjustment button. The cold air blown out of the rectangular hole will then be directed towards multiple temperature detectors for detection. This allows for simultaneous temperature difference detection of multiple rows of thermoelectric coolers, resulting in four sets of data at the same time. Furthermore, each row of thermoelectric coolers can be activated sequentially for batch testing, providing more comprehensive data.

[0014] This invention is simple to use. Multiple semiconductor cooling chip bodies are installed in the mounting bracket, and multiple temperature detectors can perform multiple batches of temperature difference tests. This allows multiple sets of data to be obtained in one test, making the temperature difference detection data more comprehensive. In addition, multiple rectangular holes guide the cold air blown out by the semiconductor cooling chip body, which can fix the airflow path of the cold air. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the entire utility model;

[0016] Figure 2 This is a three-dimensional exploded view of the present invention;

[0017] Figure 3 This is a three-dimensional schematic diagram of the mounting bracket in this utility model;

[0018] Figure 4 This is a three-dimensional schematic diagram of the tube clamp in this utility model.

[0019] In the diagram: 1. Mounting box; 2. Debugging button; 3. Mounting bracket; 4. Semiconductor cooling chip body; 5. Power supply cable; 6. Temperature detector; 7. Data cable; 8. Support bracket; 9. Tube clamp; 10. Round hole; 11. Rectangular hole. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-4 In this embodiment of the present invention, a semiconductor refrigeration chip temperature difference testing device includes a mounting box 1. Two temperature detectors 6 are symmetrically fixedly connected to the inner walls of opposite sides of the mounting box 1. A mounting bracket 3 is inserted into the mounting box 1, and multiple semiconductor refrigeration chip bodies 4 are vertically arranged and fixedly connected to the inner walls of opposite sides of the mounting bracket 3. Each of the multiple semiconductor refrigeration chip bodies 4 is electrically connected to a power supply line 5, and each of the multiple temperature detectors 6 is electrically connected to a data line 7.

[0022] In this embodiment, multiple debugging buttons 2 are arranged horizontally on the top of the mounting box 1, and multiple temperature detectors 6 are located on both sides of the mounting frame 3. The multiple debugging buttons 2 are electrically connected to the multiple temperature detectors 6.

[0023] In this embodiment, multiple rectangular holes 11 are arranged horizontally on both sides of the mounting bracket 3, and the air outlets of multiple semiconductor cooling chip bodies 4 are all facing the rectangular holes 11.

[0024] In this embodiment, multiple support frames 8 are fixedly connected in a rectangular arrangement on the transverse inner wall of the mounting box 1, and the multiple support frames 8 are fixedly connected to the bottom and top of multiple temperature detectors 6 respectively.

[0025] In this embodiment, multiple sets of clamping tubes 9 are installed in a rectangular arrangement on the transverse inner wall of the mounting box 1, and each set of clamping tubes 9 contains six tubes.

[0026] In this embodiment, multiple sets of retaining tubes 9 are located behind multiple temperature detectors 6, and all multiple retaining tubes 9 are installed vertically.

[0027] In this embodiment, two round holes 10 are symmetrically opened on the top inner wall and bottom inner wall of the mounting bracket 3, and the top and bottom of the mounting bracket 3 are respectively attached to the top inner wall and bottom inner wall of the mounting box 1. The clamp tube 9 installed on the inner wall of the mounting box 1 plays a fixing role, which can embed the wires in the mounting box 1 into the clamp tube 9 for fixing. Multiple support brackets 8 are connected to multiple temperature detectors 6, thereby playing a supporting role. Screws can be inserted into the multiple round holes 10 to connect with the mounting box 1, which can fix the mounting bracket 3 more firmly.

[0028] The working principle of this utility model is as follows: Multiple semiconductor cooling chip bodies 4 of the same model are installed on the inner walls of both sides of the mounting bracket 3. Finally, the mounting bracket 3 is inserted between multiple temperature detectors 6 in the mounting box 1. This completes the placement of the mounting bracket 3. Then, the power supply line 5 connected to the multiple semiconductor cooling chip bodies 4 is turned on. At that time, the multiple semiconductor cooling chip bodies 4 can be activated to generate cold air and blow it into the rectangular hole 11. The rectangular hole 11 is used to fix the direction of the cold air blowing out, which plays a guiding role. The temperature detectors 6 can be activated and their status adjusted by adjusting the adjustment button 2. At that time, the cold air blown out of the rectangular hole 11 will be directed towards the multiple temperature detectors 6 for detection. This allows for temperature difference detection of multiple rows of semiconductor cooling chip bodies 4 at the same time, thereby obtaining four sets of data at the same time. Furthermore, each row of semiconductor cooling chip bodies 4 can be activated sequentially for batch testing, resulting in more comprehensive data. The detection data can be transmitted to the computer for display via the data cable 7.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor refrigeration chip temperature difference testing device, comprising a mounting box (1), characterized in that: Two temperature detectors (6) are symmetrically fixedly connected to the inner walls of opposite sides of the mounting box (1). A mounting bracket (3) is inserted into the mounting box (1), and multiple semiconductor cooling chip bodies (4) are vertically arranged and fixedly connected to the inner walls of opposite sides of the mounting bracket (3). Each of the multiple semiconductor cooling chip bodies (4) is electrically connected to a power supply line (5), and each of the multiple temperature detectors (6) is electrically connected to a data line (7).

2. The semiconductor refrigeration chip temperature difference testing device according to claim 1, characterized in that: The top of the mounting box (1) is provided with multiple debugging buttons (2) arranged horizontally, and multiple temperature detectors (6) are located on both sides of the mounting frame (3). The multiple debugging buttons (2) are electrically connected to the multiple temperature detectors (6).

3. The semiconductor refrigeration chip temperature difference testing device according to claim 1, characterized in that: The mounting bracket (3) has multiple rectangular holes (11) arranged horizontally on both sides, and the air outlets of multiple semiconductor cooling chip bodies (4) are all facing the rectangular holes (11).

4. The semiconductor refrigeration chip temperature difference testing device according to claim 1, characterized in that: The mounting box (1) has multiple support frames (8) arranged in a rectangular pattern on its inner horizontal wall, and the multiple support frames (8) are respectively fixedly connected to the bottom and top of multiple temperature detectors (6).

5. The semiconductor refrigeration chip temperature difference testing device according to claim 1, characterized in that: The mounting box (1) has multiple sets of clamping tubes (9) arranged in a rectangular pattern on its transverse inner wall, and each set of clamping tubes (9) has six tubes.

6. The semiconductor refrigeration chip temperature difference testing device according to claim 5, characterized in that: The multiple sets of the card tubes (9) are located behind the multiple temperature detectors (6), and the multiple card tubes (9) are all installed vertically.

7. The semiconductor refrigeration chip temperature difference testing device according to claim 1, characterized in that: The mounting bracket (3) has two circular holes (10) symmetrically opened on its top inner wall and bottom inner wall, and the top and bottom of the mounting bracket (3) are respectively attached to the top inner wall and bottom inner wall of the mounting box (1).

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