Water-cooled heat sink test cover

Abstract

This utility model discloses a water-cooled heat dissipation test cover, including a base with a recessed area in the center of the base, the recessed area penetrating the base. A heat dissipation device is disposed within the recessed area and fixedly connected to the base. The heat dissipation device includes a heat sink and a water circulation device. The heat sink is used to contact the product under test, and the water circulation device is disposed on top of the heat sink and partially surrounds the heat sink. This application rapidly absorbs the heat conducted by the product under test through a circulation system, significantly reducing the core temperature. Compared with traditional air cooling, water cooling significantly improves heat dissipation performance through liquid circulation and a higher heat capacity medium, effectively reducing hardware temperature fluctuations under high load scenarios.

Description

Technical Field

[0001] This utility model relates to the field of test covers, specifically to a water-cooled heat dissipation test cover. Background Technology

[0002] A heat dissipation test cover is a device primarily used to provide efficient cooling for high-power components such as the processor (CPU) and graphics card inside a computer, ensuring their stable operation in high-temperature environments. Existing heat dissipation test covers typically use air cooling, but air cooling is noisy, has poor thermal conductivity, and cannot achieve ideal heat dissipation in high-temperature test environments caused by high current or high voltage. Utility Model Content

[0003] To address the aforementioned problems, this utility model provides a water-cooled heat dissipation test cover, comprising a base, a recessed area in the center of the base extending through the base, a heat dissipation device disposed within the recessed area, the heat dissipation device being fixedly connected to the base, the heat dissipation device comprising a heat dissipation plate and a water circulation device, the heat dissipation plate being used to contact the product to be tested, and the water circulation device being disposed on top of the heat dissipation plate and partially enclosing the perimeter of the heat dissipation plate.

[0004] Furthermore, the water circulation device includes a water cavity, an inlet pipe and an outlet pipe are provided at the top of the water cavity, an extension groove is provided on the side of the water cavity near the heat dissipation plate, and a water passage hole is provided at the bottom of the water cavity. The extension groove communicates with the water cavity through the water passage hole.

[0005] Furthermore, the heat sink includes a substrate and a plurality of heat sinks, which are arranged vertically on the top of the substrate. When the heat sink comes into contact with the water circulation device, the substrate and the extension groove cooperate to wrap around the heat sinks.

[0006] Furthermore, a positioning post is provided at the bottom of the extension groove, and a positioning hole matching the position of the positioning post is provided on the substrate. When the heat sink comes into contact with the water circulation device, the positioning post is inserted into the positioning hole.

[0007] Furthermore, several fixing holes are provided at the bottom of the water cavity, and positioning screws matching the positions of the fixing holes are provided at the edge of the recessed area. When the heat dissipation device contacts the base, the positioning screws are inserted into the fixing holes.

[0008] Furthermore, a cover is provided above the base, a pressure plate is provided on the top of the cover, and a handle is provided on one side of the pressure plate.

[0009] Furthermore, latches are provided on both sides of the cover, and the latches are axially connected to the cover.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] This application rapidly absorbs the heat conducted by the product under test through a circulation system, significantly reducing the core temperature. Compared with traditional air cooling, water cooling significantly improves heat dissipation performance through liquid circulation and a medium with higher heat capacity, effectively reducing hardware temperature fluctuations under high load scenarios.

[0012] Additional aspects and advantages of this invention will be set forth in the description which follows, and some will be obvious from the description or may be learned by practice of the invention. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is an exploded view of the overall structure of this utility model;

[0015] Figure 2 This is an exploded view of the heat dissipation device of this utility model;

[0016] Figure 3 This is a schematic diagram of the water circulation device of this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the base of this utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the cover of this utility model.

[0019] The reference numerals and names in the figure are as follows:

[0020] Base 100, recessed area 110, heat dissipation device 200, heat dissipation plate 210, water circulation device 220, water cavity 221, water inlet pipe 222, water outlet pipe 223, extension groove 224, water passage hole 225, base plate 211, heat dissipation fin 212, positioning post 226, positioning hole 213, fixing hole 227, positioning screw 111, cover 300, pressure plate 310, handle 320, and latch 340. Detailed Implementation

[0021] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] The present invention will now be described in more detail. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them.

[0023] In the description of this utility model, it should be noted that directional terms such as "front, back, up, down, left, right," "horizontal, vertical, horizontal," and "top, bottom," indicating directions or positional relationships, are generally based on the directions or positional relationships shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or component referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself. In the description of this utility model, it should be noted that the use of terms such as "first" and "second" to define components is merely for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this utility model. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention.

[0025] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0026] The preferred embodiments of this utility model will now be further described with reference to the accompanying drawings. Figure 1 and Figure 4As shown, a water-cooled heat dissipation test cover includes a base 100, a recessed area 110 is provided in the middle of the base 100, the recessed area 110 penetrates the base 100, a heat dissipation device 200 is provided in the recessed area 110, the heat dissipation device 200 is fixedly connected to the base 100, the heat dissipation device 200 includes a heat dissipation plate 210 and a water circulation device 220, the heat dissipation plate 210 is used to contact the product to be tested, and the water circulation device 220 is provided on the top of the heat dissipation plate 210 and partially wraps around the heat dissipation plate 210.

[0027] In the working state of this embodiment, the base 100 is placed around the product to be tested, such as around a chip, so that the product to be tested is located in the recessed area 110. Then, the heat dissipation device 200 is connected to the base 100, so that the heat dissipation plate 210 is in contact with the product to be tested. When the product to be tested encounters a high current and high voltage environment in the test environment, the surface of the product to be tested will generate high temperature, and its heat will be transferred to the heat dissipation plate 210. Since the water circulation device 220 is provided on the top of the heat dissipation plate 210 and the water circulation device 220 is in contact with the heat dissipation plate 210, the high temperature of the surface of the product to be tested will be transferred to the water circulation device 220 through the heat dissipation plate 210. Finally, the heat is carried away by the circulation of water, thereby completing the heat dissipation work.

[0028] Compared to existing technologies, this application rapidly absorbs the heat conducted by the product under test through a circulation system, significantly reducing the core temperature. Compared to traditional air cooling, water cooling significantly improves heat dissipation performance through liquid circulation and a medium with higher heat capacity, effectively reducing hardware temperature fluctuations under high load scenarios.

[0029] Furthermore, based on the above embodiments, combined with Figure 2 and Figure 3 As shown, the water circulation device 220 includes a water chamber 221. An inlet pipe 222 and an outlet pipe 223 are provided at the top of the water chamber 221. An extension groove 224 is provided on the side of the water chamber 221 near the heat sink 210. A water passage hole 225 is provided at the bottom of the water chamber 221. The extension groove 224 communicates with the water chamber 221 through the water passage hole 225. In the working state, the heat sink 210 and the water circulation device 220 are in contact with each other. The water in the water chamber 221 circulates through the inlet pipe 222 and the outlet pipe 223. Then, the water in the water chamber 221 flows through the water passage hole 225 into the extension groove 224 and comes into contact with the heat sink 210, thereby removing the heat from the heat sink 210.

[0030] Furthermore, based on the above embodiments, combined with Figure 2 and Figure 3As shown, the heat sink 210 includes a base plate 211 and a plurality of heat sinks 212. The heat sinks 212 are arranged vertically on the top of the base plate 211. The base plate 211 is connected to the extension groove 224 by welding, thereby ensuring the airtightness between the two. When the heat sink 210 comes into contact with the water circulation device 220, the base plate 211 and the extension groove 224 cooperate to wrap the heat sinks 212. In this way, when the water in the water cavity 221 flows to the extension groove 224 through the water passage 225, the water can fully contact the heat sinks 212 and then exchange heat with the water in the water cavity 221. Finally, the heat is carried away by the circulation of water, thereby completing the heat dissipation work.

[0031] Furthermore, based on the above embodiments, combined with Figure 2 and Figure 3 As shown, a positioning post 226 is provided at the bottom of the extension groove 224, and a positioning hole 213 matching the position of the positioning post 226 is provided on the base plate 211. When the heat sink 210 contacts the water circulation device 220, the positioning post 226 is inserted into the positioning hole 213. This prevents the heat sink 210 from shifting position after contacting the water circulation device 220, thus preventing water from leaking out of the extension groove 224.

[0032] Furthermore, based on the above embodiments, combined with Figure 3 and Figure 4 As shown, a plurality of fixing holes 227 are provided at the bottom of the water cavity 221, and a positioning screw 111 matching the position of the fixing holes 227 is provided at the edge of the recessed area 110. When the heat dissipation device 200 contacts the base 100, the positioning screw 111 is inserted into the fixing hole 227, thereby fixing the heat dissipation device 200 to the base 100.

[0033] Furthermore, based on the above embodiments, such as Figure 5 As shown, a cover 300 is provided above the base 100, a pressure plate 310 is provided on the top of the cover 300, and a handle 320 is provided on one side of the pressure plate 310. By operating the handle 320, the pressure plate 310 can be controlled to press down on the cover 300, thereby allowing the cover 300 to press down on the base 100 to ensure the flatness around the product under test, and thus allowing the heat dissipation device 200 to better contact the product under test.

[0034] Furthermore, based on the above embodiments, such as Figure 5 As shown, latches 340 are provided on both sides of the cover 300. The latches 340 are axially connected to the cover 300. The latches 340 are used to hold the edge of the product under test, such as the edge of the circuit board of the chip under test, so that the contact between the entire product and the product under test is more stable.

[0035] The details of the above exemplary embodiments are provided, and the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the present invention is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all changes falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. A water-cooled heat dissipation test cover, characterized in that, Includes a base (100), a recessed area (110) is provided in the middle of the base (100), the recessed area (110) penetrates the base (100), a heat dissipation device (200) is provided in the recessed area (110), the heat dissipation device (200) is fixedly connected to the base (100), the heat dissipation device (200) includes a heat dissipation plate (210) and a water circulation device (220), the heat dissipation plate (210) is used to contact the product to be tested, and the water circulation device (220) is provided on the top of the heat dissipation plate (210) and partially wraps around the heat dissipation plate (210).

2. The water-cooled heat dissipation test cover according to claim 1, characterized in that, The water circulation device (220) includes a water chamber (221), an inlet pipe (222) and an outlet pipe (223) are provided at the top of the water chamber (221), an extension groove (224) is provided on the side of the water chamber (221) near the heat sink (210), and a water passage hole (225) is provided at the bottom of the water chamber (221). The extension groove (224) communicates with the water chamber (221) through the water passage hole (225).

3. The water-cooled heat dissipation test cover according to claim 2, characterized in that, The heat sink (210) includes a base plate (211) and a plurality of heat sinks (212). The heat sinks (212) are arranged vertically on the top of the base plate (211). The base plate (211) is connected to the extension groove (224) by welding. When the heat sink (210) comes into contact with the water circulation device (220), the base plate (211) and the extension groove (224) cooperate to wrap the heat sinks (212).

4. The water-cooled heat dissipation test cover according to claim 3, characterized in that, A positioning post (226) is provided at the bottom of the extension groove (224), and a positioning hole (213) matching the position of the positioning post (226) is provided on the substrate (211). When the heat sink (210) contacts the water circulation device (220), the positioning post (226) is inserted into the positioning hole (213).

5. The water-cooled heat dissipation test cover according to claim 4, characterized in that, A number of fixing holes (227) are provided at the bottom of the water cavity (221), and a positioning screw (111) matching the position of the fixing holes (227) is provided at the edge of the recessed area (110). When the heat dissipation device (200) contacts the base (100), the positioning screw (111) is inserted into the fixing hole (227).

6. The water-cooled heat dissipation test cover according to claim 1, characterized in that, A cover (300) is provided above the base (100), a pressure plate (310) is provided on the top of the cover (300), and a handle (320) is provided on one side of the pressure plate (310).

7. The water-cooled heat dissipation test cover according to claim 6, characterized in that, Buckles (340) are provided on both sides of the cover (300), and the buckles (340) are axially connected to the cover (300).

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