Display module and display device

Abstract

Embodiments of the present application disclose a display module and a display device, which comprise a flexible display panel, a back plate layer, a buffer stack, a first adhesive layer and a flexible circuit board. The back plate layer is arranged on the backlight side of the flexible display panel, and the buffer stack is arranged on the side of the back plate layer away from the flexible display panel. The first adhesive layer is arranged on the side of the buffer stack away from the back plate layer. The flexible circuit board is arranged on the side of the first adhesive layer away from the buffer stack. The elastic modulus of the back plate layer is greater than or equal to 100 GPa. In the embodiments of the present application, the elastic modulus of the back plate layer is set to be greater than or equal to 100 GPa, so as to greatly improve the anti-deformation performance of the back plate layer, and thus reduce the risk of the display module producing an indentation. In addition, based on the increase of the elastic modulus of the back plate layer, the support performance of the back plate layer is improved, and thus the back plate layer can be thinned to thin the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and display device. Background Technology

[0002] With the differentiation of mobile phone designs, the display module stack-up also varies in design. For example, in products with a short "neck" of the flexible circuit board, the flexible circuit board is fixed to the back of the supporting stack with adhesive. The supporting stack usually uses structures with low elastic modulus, such as copper sheets and foam layers. However, during the design and assembly process, the flexible circuit board is inevitably stretched, resulting in concentrated tensile stress at the adhesive attachment points. Due to the low modulus of the supporting stack, it is prone to tensile deformation when stretched, causing deformation of the various film layers in the display module. This difference in light reflection paths leads to macroscopic marks. Utility Model Content

[0003] This application provides a display module and display device that can reduce the risk of marks on the display module caused by stretching of the flexible circuit board.

[0004] This application provides a display module, which includes:

[0005] Flexible display panel;

[0006] A back panel layer is disposed on the backlight side of the flexible display panel;

[0007] A buffer stack is disposed on the side of the back panel layer away from the flexible display panel;

[0008] A first adhesive layer is disposed on the side of the buffer stack away from the backing layer; and

[0009] A flexible circuit board is disposed on the side of the first adhesive layer away from the buffer stack;

[0010] The elastic modulus of the backplate layer is greater than or equal to 100 gigapascals.

[0011] Optionally, in some embodiments of this application, the backsheet layer is connected to the backlight side of the flexible display panel via a second adhesive layer.

[0012] Optionally, in some embodiments of this application, the backsheet layer is selected from stainless steel, ceramic, and polymer composite film layers.

[0013] Optionally, in some embodiments of this application, the backsheet layer is directly connected to the backlight side of the flexible display panel.

[0014] Optionally, in some embodiments of this application, the backing layer is a hard coating.

[0015] Optionally, in some embodiments of this application, the thickness of the backsheet layer is between 60 micrometers and 90 micrometers.

[0016] Optionally, in some embodiments of this application, the backsheet layer is black.

[0017] Optionally, in some embodiments of this application, the buffer stack includes a third adhesive layer, a buffer layer, and a heat dissipation layer. The third adhesive layer is disposed on the side of the back panel away from the flexible display panel, the buffer layer is disposed on the side of the third adhesive layer away from the back panel, and the heat dissipation layer is disposed on the side of the buffer layer away from the third adhesive layer.

[0018] The elastic modulus of the heat dissipation layer is greater than that of the buffer layer.

[0019] Optionally, in some embodiments of this application, the elastic modulus of the heat dissipation layer is greater than 120 gigapascals.

[0020] Accordingly, this application also provides a display device, which includes a display module as described in any of the above embodiments.

[0021] The display module of this application embodiment includes a flexible display panel, a backplate layer, a buffer stack, a first adhesive layer, and a flexible circuit board. The backplate layer is disposed on the backlight side of the flexible display panel, and the buffer stack is disposed on the side of the backplate layer away from the flexible display panel. The first adhesive layer is disposed on the side of the buffer stack away from the backplate layer, and the flexible circuit board is disposed on the side of the first adhesive layer away from the buffer stack. The elastic modulus of the backplate layer is greater than or equal to 100 gigapascals.

[0022] It is understandable that conventional display modules use polyimide as the backsheet layer, and polyimide backsheet layers have a low elastic modulus, making them prone to stretching and deformation. In this application, the elastic modulus of the backsheet layer is set to be greater than or equal to 100 gigapascals to significantly improve its resistance to deformation, thereby reducing the risk of marks on the display module. Secondly, the increased elastic modulus of the backsheet layer strengthens its support, allowing for a thinner backsheet layer and a thinner display module. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the display module provided in the embodiment of this application;

[0024] Figure 2 This is another structural schematic diagram of the display module provided in the embodiments of this application;

[0025] Figure 3 This is a schematic diagram of the structure of the display device provided in the embodiments of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] Display device 1000; housing 200; display module 100; flexible display panel 11; back panel layer 12; buffer stack 13; first adhesive layer 14; flexible circuit board 15; second adhesive layer 16; third adhesive layer 131; buffer layer 132; heat dissipation layer 133; polarizer 17; cover plate 18; fourth adhesive layer 19. Detailed Implementation

[0028] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0029] This application provides a display module and a display device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0030] Please refer to Figure 1 This application provides a display module 100, which includes a flexible display panel 11, a backplate layer 12, a buffer stack 13, a first adhesive layer 14, and a flexible circuit board 15.

[0031] A backplane layer 12 is disposed on the backlight side of the flexible display panel 11. A buffer stack 13 is disposed on the side of the backplane layer 12 away from the flexible display panel 11. A first adhesive layer 14 is disposed on the side of the buffer stack 13 away from the backplane layer 12. A flexible circuit board 15 is disposed on the side of the first adhesive layer 14 away from the buffer stack 13.

[0032] Among them, the elastic modulus (Young's modulus) of the backing layer 12 is greater than or equal to 100 gigapascals.

[0033] It is understandable that polyimide is used as the backsheet layer in conventional display modules, and the elastic modulus of polyimide backsheet layer is relatively low, making it easily stretched and deformed. In this embodiment, the elastic modulus of the backsheet layer 12 is set to be greater than or equal to 100 gigapascals to greatly improve the deformation resistance of the backsheet layer 12, thereby reducing the risk of imprints on the display module 100.

[0034] Secondly, the increased elastic modulus of the backplate layer 12 strengthens its support, thereby allowing the backplate layer 12 to be thinned to reduce the thickness of the display module 100.

[0035] Optionally, the elastic modulus (Young's modulus) of the backing layer 12 can be 100 GPa, 110 GPa, 120 GPa, 130 GPa, 140 GPa, 150 GPa, 160 GPa, 170 GPa, 180 GPa, 190 GPa, 200 GPa, 210 GPa, 220 GPa, 230 GPa, 240 GPa, 250 GPa, 260 GPa, 270 GPa, 280 GPa, 290 GPa, or 300 GPa.

[0036] Optionally, in some embodiments of this application, the thickness of the backsheet layer 12 is between 60 micrometers and 90 micrometers, for example, it can be 60 micrometers, 65 micrometers, 70 micrometers, 75 micrometers, 80 micrometers, 85 micrometers or 90 micrometers.

[0037] It is understandable that the greater the thickness of the back panel layer 12, the stronger its support and the stronger its resistance to deformation. However, this would result in a greater thickness of the display module 100. Therefore, based on considerations of support, resistance to deformation and thinning, the thickness of the back panel layer 12 is selected to be between 60 micrometers and 90 micrometers to meet the requirements of support for the flexible display panel 11, resistance to external pulling forces, and the thinning of the display module 100.

[0038] In the embodiments of this application, the flexible display panel 11 can be an organic light-emitting display panel, a micro light-emitting diode display panel, or a quantum dot light-emitting display panel, etc.

[0039] Optionally, the flexible circuit board 15 is configured to transmit electrical signals to the flexible display panel 11. One end of the flexible circuit board 15 is bonded to a bonding area of ​​the flexible display panel 11.

[0040] Optionally, in some embodiments of this application, the back panel layer 12 is black. It is understood that the black back panel layer 12 has strong light absorption properties and can absorb ambient light to improve the contrast of the display module 100.

[0041] Secondly, since the back panel layer 12 itself is black, or a black coating is formed on the back panel layer 12 by coating, the thickness of the back panel layer 12 can be reduced, thereby thinning the display module 100.

[0042] Optional, such as Figure 1 As shown, in some embodiments of this application, the back panel layer 12 is connected to the backlight side of the flexible display panel 11 via a second adhesive layer 16.

[0043] Understandably, the backsheet layer 12 is attached to the backlight side of the flexible display panel 11 using a second adhesive layer 16. Due to the low elastic modulus of the second adhesive layer 16, it can buffer external impact forces. Secondly, the second adhesive layer 16 is located on the side of the backsheet layer 12 closest to the flexible display panel 11; therefore, when subjected to external tensile forces, the second adhesive layer 16 is unaffected by the resistance of the backsheet layer 12. Furthermore, if the external tensile force transmitted to the second adhesive layer 16 is relatively weak, the second adhesive layer 16 can absorb this force and restore its original shape using its elasticity, further reducing the risk of imprints.

[0044] Optionally, in some embodiments of this application, the backsheet layer 12 is selected from stainless steel, ceramic and polymer composite film layers.

[0045] Understandably, the polymer composite film layer can be a mixture of graphene and polyimide, or a mixture of carbon nanotubes and polyimide. A high proportion of graphene or carbon nanotubes can enhance the elastic modulus of the polymer film. Secondly, since graphene or carbon nanotubes are black, the backsheet layer 12 is black to absorb external light and improve the contrast of the display module 100.

[0046] Optionally, the back panel layer 12 can be a stainless steel sheet with a black coating or a ceramic sheet with a black coating, or a black ceramic sheet, to improve the back panel layer 12's resistance to external pulling forces while improving the display contrast of the display module 100.

[0047] Optional, such as Figure 2 As shown, in some embodiments of this application, the back panel layer 12 is directly connected to the backlight side of the flexible display panel 11.

[0048] Understandably, compared to Figure 1 Corresponding implementation examples, Figure 2 In a corresponding embodiment, the back sheet layer 12 is formed directly on the backlight side of the flexible display panel 11, which can save the first adhesive layer 14 and thus thin the display module 100.

[0049] Optionally, in some embodiments of this application, the backing layer 12 is a hard coating.

[0050] It is understandable that by using a coating process to form the back panel layer 12 on the backlight side of the flexible display panel 11, the back panel layer 12 can be made thinner due to the precision advantage of the coating process, thereby further thinning the display module 100.

[0051] Optionally, the hard coating may be selected from silicon carbide, diamond-like carbon, zirconium oxide, and titanium nitride.

[0052] Optionally, the backplate layer 12 is a black hard coating to improve the contrast of the display module 100 while maintaining the requirement for a thinner and lighter display module 100. The backplate layer 12 can be a black diamond-like carbon coating, a black titanium nitride coating, or a black silicon carbide coating, etc.

[0053] Optional, see reference Figure 1 and Figure 2 In some embodiments of this application, the buffer stack 13 includes a third adhesive layer 131, a buffer layer 132, and a heat dissipation layer 133. The third adhesive layer 131 is disposed on the side of the back panel layer 12 away from the flexible display panel 11, the buffer layer 132 is disposed on the side of the third adhesive layer 131 away from the back panel layer 12, and the heat dissipation layer 133 is disposed on the side of the buffer layer 132 away from the third adhesive layer 131.

[0054] The elastic modulus of the heat dissipation layer 133 is greater than that of the buffer layer 132.

[0055] Understandably, the buffer layer 132 is used to buffer and absorb external impact forces to protect the flexible display panel 11. The heat dissipation layer 133 is used to dissipate heat from the flexible display panel 11 to maintain the stability of the flexible display panel 11 during operation.

[0056] Secondly, the heat dissipation layer 133 also has a conductive function, which can serve as part of the electrostatic discharge path of the flexible display panel 11 and the flexible circuit board 15.

[0057] Optionally, the buffer layer 132 can be foam. The heat dissipation layer 133 can be an aluminum layer or a copper layer.

[0058] Optionally, in some embodiments of this application, the elastic modulus of the heat dissipation layer 133 is greater than 120 gigapascals.

[0059] Understandably, setting the elastic modulus of the heat dissipation layer 133 to be greater than 120 gigapascals can improve the heat dissipation layer 133's ability to resist deformation and further reduce the risk of marks on the display module 100.

[0060] Optionally, the elastic modulus of the heat dissipation layer 133 can be 121 GPa, 122 GPa, 123 GPa, 124 GPa, 125 GPa, 126 GPa, 127 GPa, 128 GPa, 129 GPa, 130 GPa, 135 GPa, 140 GPa, 145 GPa, 150 GPa, 155 GPa, 160 GPa, 165 GPa, 170 GPa, 175 GPa, 180 GPa, 185 GPa, 190 GPa, 200 GPa, 250 GPa, 300 GPa, or 400 GPa, etc.

[0061] Optionally, the heat dissipation layer 133 can be an alloy.

[0062] Optionally, in some embodiments of this application, the display module 100 may further include a polarizer 17 and a cover plate 18.

[0063] The polarizer 17 is disposed on the light-emitting side of the flexible display panel 11, and the cover plate 18 is disposed on the side of the polarizer 17 away from the flexible display panel 11. However, it is not limited to this. For example, the cover plate 18 may be disposed on the light-emitting side of the flexible display panel 11, and the polarizer 17 may be disposed on the side of the cover plate 18 away from the flexible display panel 11.

[0064] The polarizer 17 and the cover plate 18 are connected by a fourth adhesive layer 19. The fourth adhesive layer 19 is an optical adhesive layer.

[0065] Accordingly, please refer to Figure 3 This application also provides a display device 1000, which includes a display module 100 as described in any of the above embodiments.

[0066] It is understood that the structure of the display module 100 of the display device 1000 in this application embodiment is similar to or the same as the structure of the display module 100 in any of the above embodiments. For details, please refer to... Figures 1 to 2 Therefore, the relevant explanations will not be repeated here.

[0067] Optionally, the display device 1000 also includes a housing 200, in which the display module 100 is disposed.

[0068] Optionally, the display device 1000 may be a mobile phone, cellular phone, tablet PC, personal digital assistant (PDA), portable multimedia player (PMP), television, game console, watch-type electronic device, head-mounted display, personal computer monitor, laptop computer, vehicle navigation system, vehicle dashboard, digital camera, camcorder, outdoor billboard, electronic display panel, medical device, examination device, various household appliances such as refrigerators and washing machines, or Internet of Things device.

[0069] The display module 100 of the display device 1000 of this application embodiment includes a flexible display panel 11, a backplane layer 12, a buffer stack 13, a first adhesive layer 14, and a flexible circuit board 15. The backplane layer 12 is disposed on the backlight side of the flexible display panel 11, and the buffer stack 13 is disposed on the side of the backplane layer 12 away from the flexible display panel 11. The first adhesive layer 14 is disposed on the side of the buffer stack 13 away from the backplane layer 12. The flexible circuit board 15 is disposed on the side of the first adhesive layer 14 away from the buffer stack 13. The elastic modulus of the backplane layer 12 is greater than or equal to 100 gigapascals.

[0070] Understandably, since polyimide is used as the backsheet layer in conventional display modules, and polyimide backsheet layers have a low elastic modulus, they are easily stretched and deformed. In this embodiment, the elastic modulus of the backsheet layer 12 is set to be greater than or equal to 100 gigapascals to significantly improve the deformation resistance of the backsheet layer 12, thereby reducing the risk of marks appearing on the display device 1000. Secondly, the increased elastic modulus of the backsheet layer 12 strengthens its support, allowing for a thinner backsheet layer 12 to reduce the thickness of the display module 100.

[0071] The above provides a detailed description of a display module and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, characterized in that, include: Flexible display panel; A back panel layer is disposed on the backlight side of the flexible display panel; A buffer stack is disposed on the side of the back panel layer away from the flexible display panel; The first adhesive layer is disposed on the side of the buffer stack away from the back plate layer; as well as A flexible circuit board is disposed on the side of the first adhesive layer away from the buffer stack; The elastic modulus of the backing layer is greater than or equal to 100 gigapascals.

2. The display module according to claim 1, characterized in that, The back panel layer is connected to the backlight side of the flexible display panel via a second adhesive layer.

3. The display module according to claim 2, characterized in that, The backsheet layer is selected from stainless steel, ceramic and polymer composite film layers.

4. The display module according to claim 1, characterized in that, The back panel layer is directly connected to the backlight side of the flexible display panel.

5. The display module according to claim 4, characterized in that, The backing layer is a hard coating.

6. The display module according to any one of claims 1-5, characterized in that, The thickness of the backsheet layer is between 60 micrometers and 90 micrometers.

7. The display module according to any one of claims 1-5, characterized in that, The backsheet layer is black.

8. The display module according to any one of claims 1-5, characterized in that, The buffer stack includes a third adhesive layer, a buffer layer, and a heat dissipation layer. The third adhesive layer is disposed on the side of the back panel away from the flexible display panel, the buffer layer is disposed on the side of the third adhesive layer away from the back panel, and the heat dissipation layer is disposed on the side of the buffer layer away from the third adhesive layer. The elastic modulus of the heat dissipation layer is greater than that of the buffer layer.

9. The display module according to claim 8, characterized in that, The elastic modulus of the heat dissipation layer is greater than 120 gigapascals.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

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