Power converter and optical storage charging system

Abstract

The application discloses a power converter and a light storage and charging system. The power converter comprises a circuit board provided with a heat generating body, the heat generating body comprising a terminal for connecting a light storage assembly and / or a power device in the power converter; and a temperature detection device comprising a temperature sensor and an insulating heat-conducting medium wrapping the temperature sensor, wherein the insulating heat-conducting medium is connected with the heat generating body, the insulating heat-conducting medium is used for insulating between the temperature sensor and the heat generating body and transmitting the temperature of the heat generating body to the temperature sensor, and the temperature sensor is used for detecting the temperature of the heat generating body. The arrangement can not only reduce or even avoid the detection error caused by heat loss in the heat transmission process, but also make the measurable heat generating body not limited to the terminal for connecting the light storage assembly, effectively improve the precision of temperature detection in the power converter, and be beneficial to temperature diagnosis of the rear end.

Description

Technical Field

[0001] This application relates to the field of temperature detection technology, and more specifically, to a power converter and an optical energy storage and charging system. Background Technology

[0002] In a photovoltaic-storage-charging system, the electrical energy provided by the photovoltaic and storage modules can be converted into power by a power converter so that the converted electrical energy can be used by an AC circuit. For example, the AC circuit can be a user's power circuit or the power grid.

[0003] In related technologies, power converters typically use terminal blocks (which act as heating elements) to electrically connect to photovoltaic energy storage modules in order to obtain power from the modules. As a crucial component of the power converter, overheating of the terminal blocks can damage the converter and, in more serious cases, cause a fire. Utility Model Content

[0004] This application provides a power converter and an optical energy storage and charging system. The various aspects involved in this application embodiment are described below.

[0005] In a first aspect, a power converter is provided, comprising: a circuit board having a heating element disposed thereon, the heating element including terminals for connecting to a photovoltaic storage component and / or power devices within the power converter; and a temperature detection device including a temperature sensor and an insulating thermally conductive medium enclosing the temperature sensor, wherein the insulating thermally conductive medium is connected to the heating element, the insulating thermally conductive medium is used to insulate between the temperature sensor and the heating element and to transfer the temperature of the heating element to the temperature sensor, and the temperature sensor is used to detect the temperature of the heating element.

[0006] As one possible implementation, the temperature detection device further includes a thermally conductive pin, the two ends of which are connected to the insulating thermally conductive medium and the heating element, respectively.

[0007] As one possible implementation, in a power converter, there are multiple heating elements and multiple thermally conductive pins, with the multiple thermally conductive pins used to connect the multiple heating elements one-to-one to the insulating thermally conductive medium.

[0008] As one possible implementation, the temperature detection device further includes a signal output pin, one end of which is connected to the temperature sensor, and the other end is used to connect to the controller.

[0009] As one possible implementation, the circuit board is provided with a first conductive layer connected to the heating element, and the insulating thermally conductive medium is connected to the first conductive layer to connect with the heating element through the first conductive layer.

[0010] As one possible implementation, a first socket is provided on the first conductive layer, and the thermally conductive pin is inserted into the first socket.

[0011] As one possible implementation, the thermally conductive pin is attached to the surface of the first conductive layer.

[0012] As one possible implementation, the circuit board is further provided with a second conductive layer, and the other end of the signal lead-out pin is connected to the second conductive layer, which is used to connect to the controller.

[0013] As one possible implementation, a second socket is provided on the second conductive layer, and the signal lead-out pin is inserted into the second socket.

[0014] As one possible implementation, the signal lead-out pin is attached to the surface of the second conductive layer.

[0015] As one possible implementation, the temperature sensor includes a thermistor.

[0016] As one possible implementation, the insulating thermally conductive medium is an insulating thermally conductive layer.

[0017] In a second aspect, a photovoltaic-storage-charging system is provided, comprising: a photovoltaic-storage module, including a photovoltaic module and / or a battery, for outputting direct current; and a power converter as described in the first aspect, the power converter being connected to the photovoltaic-storage module to perform power conversion on the direct current output by the photovoltaic-storage module.

[0018] This embodiment of the application configures the temperature detection device in the power converter as including a temperature sensor and an insulating thermally conductive medium surrounding the temperature sensor. Based on this insulating thermally conductive medium, the low-voltage temperature sensor in the temperature detection device can be connected to a high-voltage heating element through the insulating thermally conductive medium to directly or more closely detect the temperature of the heating element. This configuration not only reduces or even avoids detection errors caused by heat loss during heat transfer, but also allows the measurable heating element to be extended beyond the terminals used to connect the photovoltaic storage components. For example, the heating element can be extended to power devices within the power converter, effectively improving the accuracy of temperature detection of the power converter and facilitating backend temperature diagnostics. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below.

[0020] Figure 1 This is a schematic diagram of the structure of a power converter provided in one embodiment of this application.

[0021] Figure 2 This is a schematic diagram of the structure of a power converter provided in another embodiment of this application.

[0022] Figure 3 This is a schematic diagram of the structure of a power converter provided in another embodiment of this application.

[0023] Figure 4 This is a schematic diagram of the structure of a power converter provided in another embodiment of this application.

[0024] Figure 5 This is a schematic diagram of the structure of a temperature detection device provided in an embodiment of this application.

[0025] Figure 6 This is a schematic diagram of the structure of a power converter provided in another embodiment of this application.

[0026] Figure 7 This is a schematic diagram of a control strategy provided in an embodiment of this application.

[0027] Figure 8 This is a schematic diagram of the structure of an optical storage and charging system provided in one embodiment of this application. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application should fall within the scope of protection of the present application.

[0029] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] Power converters typically use terminal blocks to electrically connect to photovoltaic (PV) and energy storage (ESS) modules, drawing energy from these modules and converting it into power. These terminal blocks are usually soldered onto a circuit board inside the power converter. As heat-generating components within the power converter, overheating of these terminal blocks can damage the converter and, in severe cases, cause a fire. Therefore, monitoring the temperature of the terminal blocks connected to the PV modules is a crucial technical challenge that needs to be addressed.

[0031] To address the above issues, one possible approach is to configure the circuit board as a multi-layer board, with an insulating layer between the layers. This insulating layer is specifically located between the terminals on the circuit board and the temperature detection device, where the terminals are used to connect to the photovoltaic modules. Based on this, the insulating layer in the circuit board acts as a heat conductor, transferring the temperature of the terminals to the temperature detection device, allowing the device to monitor the terminal temperature.

[0032] However, the above method has the following problems: the thermal resistance of the circuit board's insulation layer is relatively high and the thermal conductivity is relatively low, which will lead to a large deviation between the temperature it transmits and the actual temperature of the terminals; secondly, the fan turbulence in the power converter system will cause changes in the ambient temperature inside the machine, which will affect the temperature transmitted by the insulation layer, resulting in a lower actual temperature transmitted to the temperature detection device.

[0033] In summary, the temperature measurements of the terminals obtained using the methods described above are not accurate enough and have significant errors, which is detrimental to downstream temperature diagnosis and often leads to misjudgments. Furthermore, these methods are only applicable to measuring terminal block temperatures; however, power converters may contain other power devices, which act as heat sources, and their temperatures are also crucial for temperature diagnosis.

[0034] In view of this, the temperature detection device in the power converter provided in this application embodiment is configured to include a temperature sensor and an insulating thermally conductive medium enclosing the temperature sensor. Based on the configuration of the insulating thermally conductive medium, the temperature sensor using low-voltage electricity in the temperature detection device can be insulated from the heating element using high-voltage electricity through the insulating thermally conductive medium, so as to directly or more closely detect the temperature of the heating element. Compared with the insulating layer in related technologies, the smaller insulating thermally conductive medium can effectively improve the heat transfer efficiency and heat transfer speed, thereby reducing or even avoiding detection errors caused by heat loss during the heat transfer process. In addition, since the temperature sensor is enclosed by the insulating thermally conductive medium, the measurement position of the temperature sensor can be relatively flexible, so that the measurable heating element is not limited to the wiring terminals used to connect the photovoltaic storage components, but can even be extended to directly measure the temperature of the power devices inside the power converter, that is, the heating element can be extended to the power devices. Based on this, the accuracy of temperature detection inside the power converter is effectively improved, which is beneficial to back-end temperature diagnosis.

[0035] To facilitate understanding of this application, the following is combined with... Figures 1-7 The power converter provided in the embodiments of this application will be described in detail.

[0036] like Figure 1 As shown, the power converter 100 includes a circuit board 110 and a temperature detection device 120.

[0037] The circuit board can be, for example, a printed circuit board (PCB). The PCB can be any suitable type of PCB, such as a multilayer board, flexible PCB, rigid PCB, or a rigid-flex PCB. A heat source 111 is provided on the circuit board 110.

[0038] The heating element 111 is a device that affects the internal temperature of the power converter. For example, the heating element 111 may include terminals for connecting to a photovoltaic energy storage module located outside the power converter. Alternatively, the heating element 111 may include power devices within the power converter. Or, the heating element 111 may include terminals for connecting a photovoltaic energy storage module located outside the power converter and power devices within the power converter. The photovoltaic energy storage module outside the power converter may be, for example, a photovoltaic module and / or an energy storage battery. The power devices within the power converter may be, for example, relays, inverters, controllable switches, or other components that use high voltage and can generate heat.

[0039] The temperature detection device 120 includes a temperature sensor 121 and an insulating thermally conductive medium 122. The insulating thermally conductive medium 122 encapsulates the temperature sensor 121, that is, the temperature sensor 121 is encapsulated within the insulating thermally conductive medium 122. The insulating thermally conductive medium 122 is formed of an insulating thermally conductive material that is both insulating and thermally conductive. For example, the insulating thermally conductive medium can be one or more of the following materials: aluminum nitride, silicon nitride, alumina, silicone, epoxy resin, thermally conductive plastic, thermally conductive adhesive, and boron nitride.

[0040] The insulating thermally conductive medium 122 in the temperature detection device 120 is connected to the heating element 111. The insulating thermally conductive medium 122 serves to insulate between the temperature sensor 121 and the heating element 111 and to transfer the temperature of the heating element 111 to the temperature sensor 121. The temperature sensor 121 is used to detect the temperature of the heating element 111. In some embodiments, the temperature sensor 121 is also used to convert the temperature signal into an electrical signal.

[0041] This application does not specifically limit the connection method between the insulating thermally conductive medium 122 and the heating element 111. As one implementation method, such as... Figure 1 As shown, the insulating thermally conductive medium 122 can be directly connected to the heating element 111. As another implementation method, such as... Figures 2-4 As shown, the insulating thermally conductive medium 122 can be connected to the first conductive layer 112 used to fix the heating element 111. The connection method can be, for example, adhesive bonding, attachment, or physical fixing. Physical fixing can be, for example, welding, patch-type mechanical connection, plug-in type mechanical connection, or snap-fit ​​type mechanical connection.

[0042] Based on the insulating thermally conductive medium 122, the temperature sensor 121 inside the temperature detection device 120 can use low-voltage electricity to connect to the controller described later, while the outside of the temperature detection device 120 can be connected to the heating element 111, which uses high-voltage electricity. In other words, the insulating thermally conductive medium 122 can achieve strong and weak current insulation isolation. Based on this configuration, the temperature of the heating element 111 connected to the temperature detection device 120 can be detected directly, or the temperature of the heating element 111 can be detected at a location closer to the heating element 111 using the temperature detection device 120.

[0043] Compared to the insulating layer in related technologies, the insulating thermally conductive medium 122 in this embodiment is smaller and has lower thermal resistance, thus effectively improving heat transfer efficiency and speed, reducing or even avoiding detection errors caused by heat loss during heat transfer. Furthermore, since the temperature sensor 121 is encased in the insulating thermally conductive medium 122, it is insulated from the outside environment, allowing for more flexible measurement positions. This means the measurable heat source 111 is not limited to the terminals used to connect the photovoltaic storage components, but can even be extended to directly measure power devices connected within the power converter 100, i.e., the heat source is a power device. Simultaneously, it effectively improves the utilization rate of the circuit board 110's layout area. Based on this, the accuracy of temperature detection within the power converter 100 is effectively improved, which is beneficial for downstream temperature diagnostics.

[0044] This application does not specifically limit the type of temperature sensor 121. For example, temperature sensor 121 can be any of the following: a thermistor, a thermocouple, a resistance temperature detector, an integrated circuit temperature sensor 121, etc. Preferably, temperature sensor 121 can be a thermistor, which can ensure high temperature detection sensitivity while effectively reducing detection costs.

[0045] To facilitate the connection between the insulating thermally conductive medium 122 and the heating element 111 and to further improve the efficiency of heat conduction, in some embodiments, such as Figures 2-3 as well as Figures 5-6 As shown, the temperature detection device 120 also includes a heat-conducting pin 123.

[0046] The two ends of the thermally conductive pin 123 are connected to the insulating thermally conductive medium 122 and the heating element 111, respectively. That is, one end of the thermally conductive pin 123 is connected to the insulating thermally conductive medium 122; for example, one end of the thermally conductive pin 123 can be inserted into the insulating thermally conductive medium 122, or one end of the thermally conductive pin 123 can be soldered or bonded to the insulating thermally conductive medium 122. The other end of the thermally conductive pin 123 is used to connect to the heating element 111. For example, the other end of the thermally conductive pin 123 can be directly connected to the heating element 111. Alternatively, the other end of the thermally conductive pin 123 can be directly connected to the first conductive layer 112 to connect to the heating element 111.

[0047] This application does not specify a particular number of thermally conductive pins 123. In some embodiments, such as Figures 2-3 as well as Figure 5 As shown, the number of thermally conductive pins 123 in this embodiment can be one.

[0048] In other embodiments, such as Figure 6 As shown, the number of heat-conducting pins 123 in this embodiment can be multiple. When there are multiple heat-conducting pins 123, the number of heating elements 111 is also multiple, and the number of heating elements 111 is the same as the number of heat-conducting pins. Multiple heat-conducting pins 123 are used to connect the multiple corresponding heating elements 111 to the insulating heat-conducting medium 122. The multiple heating elements 111 can be different. For example, some of the heating elements 111 may be terminals for connecting to optical storage components located outside the power converter 100, while the remaining heating elements 111 may be power devices within the power converter 100, and may be one or more of the multiple heating elements 111. Alternatively, some heating elements 111 and the remaining heating elements 111 may be terminals for connecting different optical storage components outside the power converter 100. Or, some heating elements 111 and the remaining heating elements 111 may be different power devices within the power converter 100.

[0049] This configuration allows the temperature of multiple heating elements 111 connected to the same temperature detection device 120 to be transferred via multiple thermally conductive pins 123 to the insulating thermally conductive medium 122, and then to the temperature sensor 121. This enables the temperature sensor 121 to detect the higher temperature among the multiple heating elements 111. This method allows for simultaneous monitoring of the temperatures of multiple heating elements 111 while reducing the number of sensors, thereby lowering costs.

[0050] For ease of understanding, such as Figure 6As shown, the heat-conducting pin 123 in the temperature detection device 120 includes a first heat-conducting pin 1231 and a second heat-conducting pin 1232. The heating element 111 includes a first heating element 1111 and a second heating element 1112. The two ends of the first heat-conducting pin 1231 are respectively connected to the insulating heat-conducting medium 122 and the first heating element 1111, and the two ends of the second heat-conducting pin 1232 are respectively connected to the insulating heat-conducting medium 122 and the second heating element 1112. It should be noted that... Figure 6 This explanation uses two thermally conductive pins 123 as an example. The number of thermally conductive pins 123 can be set as needed. This application does not impose a specific limit on the number of thermally conductive pins 123.

[0051] As previously mentioned, the temperature of the wiring electronics detected by temperature sensor 121 is used for temperature diagnostics. Temperature diagnostics as described here can be understood as adjusting and optimizing control strategies based on the temperature detected by temperature sensor 121. Therefore, in some embodiments, the power converter 100 also includes a controller ( Figures 1-6 (Not shown). The controller can be connected to the temperature sensing device 120 and is used to control the operating state of the power converter 100 according to the temperature of the heating element 111. For example, as Figure 7 As shown, the control logic of controller 130 includes: when the temperature detected by temperature detection device 120 is less than threshold A, the power converter is controlled to maintain its current state; when the temperature detected by temperature detection device 120 is greater than threshold B, the power converter is controlled to immediately block the waveform and shut down with an alarm; when the temperature detected by temperature detection device 120 is greater than A and less than B, the power of the power converter is constrained according to the corresponding temperature control curve.

[0052] This application does not specifically limit the type of controller. For example, the controller can be a microcontroller (MCU), a programmable logic controller (PLC), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), etc.

[0053] By setting a controller connected to the temperature sensor 121, the operating state of the power converter 100 can be controlled according to the temperature of the heating element 111 detected by the temperature sensor 121. This not only helps to ensure the safe and stable operation of the power converter 100, but also improves its overall performance, extends its service life, and helps to save energy and reduce emissions.

[0054] To facilitate the connection between the controller and the temperature sensor 121, in some embodiments, such as Figures 2-3 as well as Figures 5-6 As shown, the temperature detection device 120 also includes a signal output pin 124.

[0055] The two ends of the signal output pin 124 are connected to the temperature sensor 121 and the controller, respectively. That is, one end of the signal output pin 124 is connected to the temperature sensor 121; for example, one end of the signal output pin 124 can be soldered or glued to the temperature sensor 121. The other end of the signal output pin 124 is connected to the controller; for example, the signal output pin 124 can be directly or indirectly connected to the controller.

[0056] In some embodiments, the thermally conductive pin 123 may be referred to as the primary side of the temperature sensing device 120. Since the primary side is used to connect to the heating element 111, the primary side can be understood as being located on the high-voltage side. The quotation mark pin may be referred to as the secondary side of the temperature sensing device 120. Since the secondary side is used to connect to the controller, the secondary side can be understood as being located on the low-voltage side.

[0057] Setting the external connection leads of the temperature sensor 121 to high voltage (thermal lead pin 123) and low voltage (signal lead pin 124) not only improves electrical safety and signal quality, but also simplifies the installation and maintenance process and enhances the reliability and compliance of the system.

[0058] As previously described, in some embodiments, the insulating thermally conductive medium 122 may be attached to the first conductive layer 112 used for connecting the heating element 111. Specifically, as... Figures 2-4 As shown, a first conductive layer 112 is disposed on the circuit board 110. The first conductive layer 112 can also be referred to as the PCB conductive layer, and the first conductive layer 112 is connected to the heating element 111. This embodiment does not specifically limit the connection method between the first conductive layer 112 and the heating element 111. For example, the connection between the first conductive layer 112 and the heating element 111 can be soldering, pressing, plugging, gluing, or screwing. An insulating thermally conductive medium 122 can be connected to the first conductive layer 112 to connect to the heating element 111 through the first conductive layer 112. Since the first conductive layer 112 is a conductive material and has a flatter mounting surface, connecting the insulating thermally conductive medium 122 to the first conductive layer 112, compared to the traditional method of heat conduction through the insulating layer of the circuit board 110, further improves the heat transfer efficiency and speed. This avoids heat loss caused by heat conduction and also improves the connection reliability of the temperature sensor 121.

[0059] As mentioned earlier, signal output pin 124 can be indirectly connected to the controller. As an example, such as... Figures 2-3As shown, a second conductive layer 113 is also provided on the circuit board 110. The second conductive layer 113 can also be called a signal acquisition conductive layer. The second conductive layer 113 is used to connect to the controller. The two ends of the signal output pin 124 are respectively connected to the temperature sensor 121 and the second conductive layer 113.

[0060] The signal lead-out pin 124 is indirectly connected to the controller through the second conductive layer 113 to transmit the detected temperature to the controller. This not only helps to improve the overall performance and reliability of the circuit, but also brings convenience to the design, manufacturing and subsequent maintenance.

[0061] The first conductive layer 112 or the second conductive layer 113 is one or more layers of conductive material on the circuit board 110. For example, the conductive material can be one or more of the following materials: aluminum, copper, and conductive polymers, etc. Preferably, the conductive material can be copper to reduce the overall cost.

[0062] For the circuit board 110 with a first conductive layer 112 and a second conductive layer 113, and the power converter 100 including a heat-conducting pin 123 and a signal output pin 124, the temperature detection mechanism is as follows: Since the heating element 111 is in contact with the first conductive layer 112, current flows through the heating element 111 and the first conductive layer 112. The temperature change of the heating element 111 is transmitted to the heat-conducting pin 123 of the temperature sensor 121 through the first conductive layer 112. The heat-conducting pin 123 then conducts the temperature to the temperature sensor 121 through the insulating dielectric layer. The temperature sensor 121 transmits the detected temperature signal to the second conductive layer 113 through the signal output pin 124, so as to realize the transmission of the detected temperature signal to the controller, thereby realizing the detection of the temperature of the heating element 111.

[0063] This application embodiment does not impose specific limitations on the packaging method of the heat-conducting pin 123 in the temperature detection device 120.

[0064] For example, the thermal pin 123 can be packaged in any of the following ways: the thermal pin 123 is a surface mount package or the thermal pin 123 is a through-hole package.

[0065] As an example, thermal pin 123 is a through-hole package. Specifically, as... Figure 2 As shown, a first socket is provided on the first conductive layer 112, and a thermally conductive pin 123 is inserted into the first socket to mount the thermally conductive pin 123 on the circuit board 110. The thermally conductive pin 123 can be inserted into and soldered into the first socket. By connecting the thermally conductive pin 123 to the first conductive layer 112 on the circuit board 110 in a plug-in manner, the reliability of the temperature detection device 120 can be improved, thereby enhancing the reliability of temperature detection.

[0066] As another example, such as Figure 3 As shown, the thermally conductive pin 123 is attached to the surface of the first conductive layer 112. For example, the thermally conductive pin 123 is attached to the surface of the first conductive layer 112 using a surface mount package. Alternatively, the thermally conductive pin 123 can be attached to the surface of the first conductive layer 112 using adhesive. By attaching the thermally conductive pin 123 to the surface of the first conductive layer 112 on the circuit board 110, it is not necessary to drill holes in the circuit board 110, which facilitates double-sided wiring of the circuit board 110 and reduces costs.

[0067] For example, such as Figure 4 As shown, the heat-conducting pin 123 is an integral snap-fit ​​with the insulating heat-conducting medium 122, so that the insulating heat-conducting medium 122 is connected to the circuit board 110 in a snap-fit ​​manner (or inverted snap-fit ​​manner).

[0068] This application does not impose specific limitations on the packaging method of the signal lead-out pin 124 in the temperature detection device 120. For example, the packaging method of the signal lead-out pin 124 may be a surface mount package or a through-hole package.

[0069] As an example, signal pin 124 is a through-hole package. Specifically, as... Figure 2 As shown, a second socket is provided on the second conductive layer 113, and the signal lead-out pin 124 is inserted into the second socket to mount the signal lead-out pin 124 on the circuit board 110. The signal lead-out pin 124 can be inserted into and soldered into the second socket. By connecting all the signal lead-out pins 124 to the second conductive layer 113 on the circuit board 110 in a plug-in manner, the reliability of the temperature detection device 120 can be improved, thereby enhancing the reliability of temperature detection.

[0070] As another example, such as Figure 3 As shown, the signal lead 124 is attached to the surface of the second conductive layer 113. For example, the signal lead 124 is attached to the surface of the second conductive layer 113 using a surface mount package. Alternatively, the signal lead 124 can be attached to the surface of the second conductive layer 113 using adhesive. By attaching the signal lead 124 to the surface of the second conductive layer 113 on the circuit board 110, drilling holes in the circuit board 110 is unnecessary, which facilitates double-sided wiring of the circuit board 110 while reducing costs.

[0071] When the temperature detection device 120 includes both a heat-conducting pin 123 and a signal output pin 124, this application embodiment does not impose specific limitations on the packaging method of the heat-conducting pin 123 and the signal output pin 124 in the temperature detection device 120.

[0072] For example, the thermal lead 123 and the signal lead 124 can be packaged in any of the following ways: both thermal lead 123 and the signal lead 124 are surface mount packages, both thermal lead 123 and the signal lead 124 are through-hole packages, thermal lead 123 is a through-hole package and the signal lead 124 is a surface mount package, or thermal lead 123 is a surface mount package and the signal lead 124 is a through-hole package, etc.

[0073] This application embodiment does not specifically limit the insulating and heat-conducting medium 122 in the temperature detection device 120.

[0074] As an example, the insulating thermally conductive medium 122 can be an insulating thermally conductive layer formed on the outer surface of the temperature sensor 121 after insulating the temperature sensor 121, which fully encloses the temperature sensor 121. For example, the insulating thermally conductive layer is formed by coating or encapsulating the temperature sensor 121 with an insulating thermally conductive material.

[0075] As another example, the insulating thermally conductive medium 122 may be an insulating thermally conductive layer formed of an insulating thermally conductive material that wraps around a portion of the outer surface of the temperature sensor 121, such as the surface of the temperature sensor 121 near the heat source 111.

[0076] This application does not specifically limit the type of power converter 100. For example, the power converter 100 may include one or more of the following: inverter, power conversion system (PCS), and rectifier.

[0077] In addition, such as Figure 8 As shown in the figure, this application embodiment also provides a photovoltaic-storage-charging system 10, which includes: a photovoltaic-storage module 200, including a photovoltaic module and / or a battery, for outputting direct current; and a power converter 100 as described above, which is connected to the photovoltaic-storage module 200 to perform power conversion on the direct current output by the photovoltaic-storage module 200.

[0078] It should be noted that the elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately.

[0079] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into multiple separate components and / or parts. The use of the public designation "a" or "an" to describe a component or part is not intended to exclude other components or parts.

[0080] It should be understood that although terms such as “first” or “second” may be used in this application to describe various elements, these elements are not defined by these terms, which are only used to distinguish one element from another.

[0081] The scope of protection of this application is not limited to the above embodiments. Any variations or substitutions that can be conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power converter, characterized in that, include: A circuit board, wherein a heating element is provided on the circuit board, the heating element comprising: a wiring terminal for connecting the optical storage component and / or a power device within the power converter; A temperature detection device includes a temperature sensor and an insulating thermally conductive medium enclosing the temperature sensor, wherein the insulating thermally conductive medium is connected to a heating element, the insulating thermally conductive medium is used to insulate between the temperature sensor and the heating element and to transfer the temperature of the heating element to the temperature sensor, and the temperature sensor is used to detect the temperature of the heating element.

2. The power converter according to claim 1, characterized in that, The temperature detection device also includes a heat-conducting pin, the two ends of which are connected to the insulating heat-conducting medium and the heating element, respectively.

3. The power converter according to claim 2, characterized in that, The number of heating elements and the number of heat-conducting pins are both multiple, and the multiple heat-conducting pins are used to connect the multiple heating elements in a one-to-one correspondence to the insulating heat-conducting medium.

4. The power converter according to claim 1, characterized in that, The temperature detection device also includes a signal lead-out pin, one end of which is connected to the temperature sensor, and the other end is used to connect to the controller.

5. The power converter according to any one of claims 1-4, characterized in that, The circuit board is provided with a first conductive layer that is connected to the heating element, and the insulating thermally conductive medium is connected to the first conductive layer so as to be connected to the heating element through the first conductive layer.

6. The power converter according to claim 5, characterized in that, A first socket is provided on the first conductive layer, and a thermally conductive pin is inserted into the first socket.

7. The power converter according to claim 5, characterized in that, The thermally conductive pins are attached to the surface of the first conductive layer.

8. The power converter according to claim 4, characterized in that, The circuit board is also provided with a second conductive layer, and the other end of the signal lead-out pin is connected to the second conductive layer. The second conductive layer is used to connect to the controller.

9. The power converter according to claim 8, characterized in that, A second socket is provided on the second conductive layer, and the signal lead-out pin is inserted into the second socket.

10. The power converter according to claim 8, characterized in that, The signal lead-out pin is attached to the surface of the second conductive layer.

11. The power converter according to claim 1, characterized in that, The temperature sensor is a thermistor.

12. The power converter according to claim 1, characterized in that, The insulating thermally conductive medium is an insulating thermally conductive layer.

13. A photovoltaic energy storage and charging system, characterized in that, include: Photovoltaic and energy storage modules, including photovoltaic modules and / or batteries, for outputting direct current; and The power converter as described in any one of claims 1-12, wherein the power converter is connected to the photovoltaic energy storage component to perform power conversion on the DC power output by the photovoltaic energy storage component.

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