A PCB board with PCB board level magnetic device mounting and heat dissipation structure
By employing threaded connections and a double-layer potting enclosure structure on the PCB board, the problems of loosening and heat dissipation of magnetic components are solved, achieving high reliability and efficient heat dissipation.
CN224343430UActive Publication Date: 2026-06-09XIAN ACTIONPOWER ELECTRIC
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAN ACTIONPOWER ELECTRIC
- Filing Date
- 2025-04-23
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Existing magnetic devices are prone to delamination, loosening, or detachment of potting compound after encapsulation, and wire harness connections occupy space and interfere with other devices, making it difficult to meet the heat dissipation requirements of high power density plug-in power supplies.
Method used
The magnetic components are directly connected to the PCB board via a threaded connection, and a double-layer potting enclosure structure, including a metal enclosure and an insulating enclosure, is used to enhance connection reliability and heat conduction.
Benefits of technology
It improves the reliability of magnetic devices in vibration environments, saves space, avoids wire harness interference, and improves thermal conductivity to prevent PCB board deformation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224343430U_ABST
Abstract
This utility model relates to a PCB board, specifically a PCB board with a PCB board-level magnetic device mounting and heat dissipation structure. The PCB board includes a magnetic device body, a potting enclosure, and the PCB board body itself. Adapter plates are respectively disposed on two opposite sidewalls of the magnetic device body. Multiple connecting posts are disposed on each of the two adapter plates along their length. An insulating layer is disposed at the open end of the potting enclosure. Multiple connecting terminals are disposed on the back of the PCB board body, and multiple connecting holes are correspondingly disposed on the front. The magnetic device body is disposed on the back of the PCB board body and is connected to the corresponding connecting posts by pre-set connectors passing through the connecting holes and connecting terminals in sequence. The potting enclosure is disposed on the outside of the magnetic device body, and its insulating layer abuts against the back of the PCB board body. This utility model replaces the traditional wire harness connection method with a threaded connection, enhancing the reliability of the magnetic device body in vibration environments, providing a compact layout that saves space, and avoiding the problem of wire harness interference.
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