Integrated package binding structure and display module

Abstract

The utility model relates to an integrated packaging binding structure, display module, integrated packaging binding structure is used for binding connection with display panel, include: casing, main circuit board is encapsulated in the casing, flexible circuit board, the first end of flexible circuit board is bound connection with main circuit board, the second end of flexible circuit board is opposite the first end and extends to the outside of casing, and is used for binding connection with the binding area of display panel.

Description

Technical Field

[0001] This utility model relates to the field of display product manufacturing technology, and in particular to an integrated packaging and bonding structure and a display module. Background Technology

[0002] With the development of the automotive industry, in-vehicle electronic equipment has become an important component of modern automobiles. Among them, in-vehicle OLED display modules, as an important type of in-vehicle electronic equipment, are widely used in areas such as automotive center console screens, entertainment screens, and rearview mirrors.

[0003] However, existing automotive OLED display module structures suffer from several problems, such as complex assembly and high costs. Current module processes require sequential steps including COF bonding (or FPC bonding), PCB bonding, flip-flop assembly, and bracket mounting. Problems at any step can render the entire module unusable, especially given the high cost of the PNL (panel) and polarizer. Furthermore, in existing structures, the PCB and COF (or FPC) are glued to a support plate on the back of the PNL. Excessive or uneven pressure during bonding can cause film marks, and the operating temperatures of the components after bonding can easily lead to localized overheating of the PNL, resulting in brightness degradation. These issues limit the application and development of automotive OLED display modules, necessitating a new automotive OLED display module structure to address these problems. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides an integrated packaging and bonding structure and a display module, solving the issues of complex and costly bonding processes.

[0005] To achieve the above objectives, the technical solution adopted in this embodiment of the utility model is: an integrated encapsulation and bonding structure for bonding and connecting with a display panel, comprising:

[0006] case;

[0007] The main circuit board is encapsulated within the housing;

[0008] A flexible circuit board, wherein a first end of the flexible circuit board is bonded to the main circuit board, and a second end of the flexible circuit board, which is disposed opposite to the first end, extends to the outside of the housing and is used to bond to the bonding area of ​​the display panel.

[0009] Optionally, in a direction perpendicular to the main circuit board, the housing includes a first surface and a second surface disposed opposite to each other, the first surface being used to connect to the backlight side of the display panel;

[0010] The integrated packaging bonding structure further includes a connecting post for fixing the main circuit board to the housing, and a first connecting hole for the connecting post to pass through is correspondingly provided on the second surface, and a second connecting hole for the connecting post to pass through is provided on the main circuit board.

[0011] Optionally, a sealing material is provided between the connecting post and the first connecting hole.

[0012] Optionally, the outer surface of the connecting post is provided with an external thread, and the inner walls of the first connecting hole and the second connecting hole are provided with internal threads that mate with the external thread on the connecting post.

[0013] Optionally, a third connecting hole is provided on the first surface for the connecting post to pass through.

[0014] Optionally, an elastic shock absorber is provided between the housing and the main circuit board, and an elastic shock absorber is provided between the housing and the flexible circuit board.

[0015] Optionally, a first component is provided on the main circuit board, and a thermally conductive connector is provided between the first component and the housing.

[0016] Optionally, the housing is made of metal, and the main circuit board has an exposed copper area, which is connected to the housing by a conductive component.

[0017] Optionally, the main circuit board is provided with a main body area and a bonding area for bonding and connecting with the flexible circuit board. The main body area is provided with a first bonding terminal, and the inner surface of the housing corresponding to the first bonding terminal is provided with a second bonding terminal. The first bonding terminal and the second bonding terminal are bonded and connected to a power source outside the housing to provide voltage to the light-emitting unit of the display panel.

[0018] This utility model embodiment also provides a display module, including a display panel and the above-mentioned integrated packaging and bonding structure, wherein the display panel and the integrated packaging and bonding structure are bonded together.

[0019] Optionally, the housing of the integrated encapsulation bonding structure is fixedly connected to the backlight side of the display panel by an adhesive layer.

[0020] Optionally, in a direction perpendicular to the main circuit board, the housing includes a first surface and a second surface disposed opposite to each other, the first surface being used to connect to the backlight side of the display panel;

[0021] The integrated packaging bonding structure further includes a connecting post for fixing the main circuit board to the housing, and a first connecting hole for the connecting post to pass through is correspondingly provided on the second surface, and a second connecting hole for the connecting post to pass through is provided on the main circuit board.

[0022] A third connecting hole is provided on the first surface for the connecting post to pass through;

[0023] A metal support layer is provided on the backlight side of the display panel. One end of the connecting post is connected to the metal support layer, and the other end of the connecting post is connected to the grounding structure of the whole machine.

[0024] The beneficial effects of this utility model are as follows: This utility model provides an integrated packaging and bonding structure that integrates the main circuit board and the flexible circuit board into a housing. The end of the flexible circuit board used for bonding with the display panel is exposed outside the housing. In the traditional bonding process, the flexible circuit board needs to be bonded to the display panel first, and then the flexible circuit board needs to be connected to the main circuit board. This process is complex and increases the risk of reduced yield. This utility model integrates the main circuit board and the flexible circuit board. During bonding, only the integrated packaging and bonding structure needs to be bonded to the display panel, simplifying the bonding process and improving the bonding yield. Attached Figure Description

[0025] Figure 1 A schematic diagram showing the display module in an embodiment of this utility model;

[0026] Figure 2 A schematic diagram showing the display module in an embodiment of this utility model;

[0027] Figure 3 A schematic diagram showing the display module in an embodiment of this utility model;

[0028] Figure 4 A schematic diagram showing the display module in an embodiment of this utility model;

[0029] Figure 5 A schematic diagram showing the display module in an embodiment of this utility model;

[0030] Figure 6 A schematic diagram showing the display module in an embodiment of this utility model;

[0031] Figure 7 A schematic diagram showing the display module in an embodiment of this utility model;

[0032] Figure 8 A schematic diagram showing the display module in an embodiment of this utility model;

[0033] Figure 9 This is a schematic diagram showing the main circuit board in an embodiment of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0035] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0036] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0037] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0038] The display module includes a display panel, a flexible circuit board bonded to the display panel, and a main circuit board bonded to the flexible circuit board. The flexible circuit board is disposed between the display panel and the main circuit board to realize signal transmission between the display panel and the main circuit board. In traditional technology, the flexible circuit board needs to be bonded to the display panel first, and then the main circuit board needs to be bonded to the flexible circuit board. Each bonding process causes a certain yield loss. After attaching the BKT (support plate), each adhesive material needs to be applied to the corresponding position, and then the main circuit board and the flexible circuit board are fixed to the side of the support plate away from the display panel with adhesive materials. Each attachment requires alignment and pressure processes, which also cause a certain yield loss.

[0039] refer to Figures 1-8 To address the aforementioned issues, this embodiment provides an integrated encapsulation and bonding structure for bonding and connecting with the display panel 2, comprising:

[0040] Casing 13;

[0041] The main circuit board 11 is encapsulated within the housing 13;

[0042] The flexible circuit board 12 has a first end that is bonded to the main circuit board 11, and a second end of the flexible circuit board 12 that is opposite to the first end extends to the outside of the housing 13 and is used to bond to the bonding area of ​​the display panel 2.

[0043] This utility model embodiment provides an integrated packaging and bonding structure that integrates the main circuit board 11 and the flexible circuit board 12 into a housing 13. The first end of the flexible circuit board 12 is bonded to the main circuit board 11, and the second end of the flexible circuit board 12, opposite to the first end, is exposed outside the housing 13 for bonding to the display panel 2. In other words, in this integrated packaging and bonding structure, the main circuit board 11 and the flexible circuit board 12 are already bonded together. When bonding to the display panel 2, it is only necessary to bond the flexible circuit board 12 to the display panel 2 to achieve signal transmission between the display panel 2 and the main circuit board 11. Furthermore, both the main circuit board 11 and the flexible circuit board 12 are fixed by the housing 13. After the integrated packaging structure is bonded to the display panel 2, it is only necessary to fix the housing 13 to the backlight side of the display panel 2, ensuring the connection stability between the main circuit board 11, the display panel 2, and the flexible circuit board 12, and improving the bonding yield. In traditional bonding processes, the main circuit board 11, the display panel 2, and the flexible circuit board 12 are all independently configured. During bonding, they are bonded separately, meaning that the flexible circuit board 12 must first be bonded to the display panel 2, and then the flexible circuit board 12 must be connected to the main circuit board 11. This process is complex, and each bonding operation carries the risk of reducing yield. Furthermore, during fixing, the flexible circuit board 12 is connected to the backlight side of the display panel 2 via an adhesive layer, and the main circuit board 11 is connected to the backlight side of the display panel 2 via an adhesive layer. In other words, the bonding and fixing of the main circuit board 11 and the flexible circuit board 12 also requires a separate process, which increases the risk of reducing yield. The integrated packaging and bonding structure provided in this embodiment of the utility model integrates the main circuit board 11 and the flexible circuit board 12, pre-bonding them together and encapsulating them with a housing 13. When bonding with the display panel 2, only one bonding process is required, simplifying the bonding process and improving the bonding yield. Furthermore, during the lamination process, since the main circuit board 11 and the flexible circuit board 12 are integrated within the housing 13, only the housing 13 needs to be bonded to the display panel 2, simplifying the lamination process. Compared to directly bonding the main circuit board 11 and the flexible circuit board 12, this also prevents damage to the main circuit board 11 and the flexible circuit board during the lamination process. The housing 13 encapsulates the main circuit board 11 and the flexible circuit board 12, providing protection for them.

[0044] In an exemplary embodiment, in a direction perpendicular to the main circuit board 11, the housing 13 includes a first surface and a second surface disposed opposite to each other, the first surface being used to connect to the backlight side of the display panel 2.

[0045] The integrated packaging bonding structure further includes a connecting post 101 for fixing the main circuit board 11 to the housing 13. A first connecting hole for the connecting post 101 to pass through is correspondingly provided on the second surface, and a second connecting hole for the connecting post 101 to pass through is provided on the main circuit board 11.

[0046] The main circuit board 11 is fixedly connected by the connecting post 101, which improves the connection stability of the main circuit board 11.

[0047] In an exemplary embodiment, a sealing material is provided between the connecting post 101 and the first connecting hole. This improves the sealing performance and prevents moisture and other contaminants from entering the module.

[0048] In an exemplary embodiment, the outer surface of the connecting post 101 is provided with an external thread, and the inner walls of the first connecting hole and the second connecting hole are both provided with internal threads that mate with the external thread on the connecting post 101.

[0049] The main circuit board 11 is fixedly connected by screws, which improves the sealing performance and tightness of the housing 13.

[0050] In an exemplary embodiment, a third connecting hole is provided on the first surface for the connecting post 101 to pass through.

[0051] The housing 13 is connected to the backlight side of the display panel 2 via an adhesive layer 9. Specifically, the housing 13 is fixedly connected to the support plate 3 of the backlight layer of the display panel 2 via the adhesive layer 9. The connecting post 101 passes through the third connecting hole and is exposed on the first surface, contacting the support plate 3. This limits the thickness of the adhesive layer 9 and ensures the connection stability between the housing 13 and the support plate 3.

[0052] In some embodiments, the connecting post 101 passes through the third connecting hole and is exposed on the first surface, which allows the connecting post 101 to serve as an alignment mark, that is, the connecting post 101 is used to fix the housing 13 to the support plate 3 at a preset position.

[0053] It should be noted that the cross-sectional shape of the housing 13 in the direction parallel to the light-emitting surface of the display panel 2 can be set according to actual needs, specifically according to the outer contour of the display panel 2. The position of the connection area on the support plate 3 for fixed connection with the housing 13 can be set according to actual needs. After the display panel 2 is bonded to the integrated packaging and bonding structure, and after the integrated packaging and bonding structure is bent to the backlight side of the display panel 2, the orthographic projection of the integrated packaging and bonding structure on the display panel 2 is completely located within the display panel 2.

[0054] refer to Figure 3 In an exemplary embodiment, an elastic shock absorber 4 is provided between the housing 13 and the main circuit board 11, and an elastic shock absorber 4 is provided between the housing 13 and the flexible circuit board 12.

[0055] The elastic damping component 4 can effectively absorb impact energy through elastic deformation, significantly improving the stability and shock resistance of the entire display module. It is particularly suitable for applications in automotive and industrial control scenarios where environmental stability requirements are high.

[0056] In an exemplary embodiment, the elastic damping element 4 is made of damping foam, but it is not limited thereto.

[0057] In an exemplary embodiment, the shock-absorbing foam is tightly fitted to the housing 13 and the main circuit board 11, so as to fully achieve the effect of buffering and shock absorption.

[0058] In an exemplary embodiment, shock-absorbing foam is provided in the middle area of ​​the main circuit board 11 and at both opposite ends of the main circuit board 11 in the direction from the main circuit board 11 to the flexible circuit board 12, so as to effectively buffer and protect the main circuit board 11.

[0059] In an exemplary embodiment, an elastic shock absorber 4 is provided between the flexible circuit board 12 and the housing 13. The elastic shock absorber 4 may be made of shock-absorbing foam, but is not limited thereto.

[0060] The shock-absorbing foam can act as a buffer to protect the flexible circuit board 12.

[0061] In an exemplary embodiment, in order to ensure the stability of the bonding connection between the main circuit board 11 and the flexible circuit board 12, the shock-absorbing foam is provided between the first area of ​​the flexible circuit board 12 near the main circuit board 11 and the housing 13 to ensure the levelness of the first area, that is, to ensure that the first area is arranged parallel to the main circuit board 11, thereby ensuring the connection stability between the main circuit board 11 and the flexible circuit board 12.

[0062] refer to Figure 6 and Figure 7 In an exemplary embodiment, a first component 100 is provided on the main circuit board 11, and a heat-conducting connector 6 is provided between the first component 100 and the housing 13.

[0063] The heat-conducting connector 6 serves to dissipate heat, especially for some high-heat-generating components. Through the heat-conducting connector 6, heat can be quickly conducted to the metal housing 13 (the housing 13 is made of a metal with high thermal conductivity), and then the heat on the housing 13 can be effectively dissipated through the host's heat dissipation system, thereby improving heat dissipation efficiency.

[0064] In an exemplary implementation, the first component 100 may be a PMIC (Power Management Integrated Circuit) or a TCONIC (Timing Controller Integrated Circuit), but is not limited thereto.

[0065] In an exemplary embodiment, the thermally conductive connector 6 may be thermally conductive foam, but is not limited thereto.

[0066] In an exemplary embodiment, the orthographic projection of the thermally conductive connector 6 on the main circuit board at least partially overlaps with the first component 100 to facilitate heat conduction.

[0067] refer to Figure 4 and Figure 5 In an exemplary embodiment, the housing 13 is made of metal, and the main circuit board 11 has an exposed copper area 111. The exposed copper area 111 and the housing 13 are connected by a conductive element 5. This can improve the EMI (electromagnetic shielding) protection capability of the display module.

[0068] In an exemplary embodiment, the conductive component 5 can be conductive foam, which has both conductive and elastic properties. The housing 13 and the conductive surface are tightly fitted together, and the conductive foam is tightly fitted to the exposed copper area 111 to ensure the stability of the circuit's conductivity.

[0069] In an exemplary embodiment, the specific location and shape of the exposed copper area 111 can be set according to actual needs. Figure 5 In the circuit, a strip-shaped exposed copper area is provided at one end of the main circuit board 11, and block-shaped exposed copper areas are provided on the side edges of the opposite sides of the main circuit board 11.

[0070] refer to Figure 8 and Figure 9In an exemplary embodiment, the main circuit board 11 is provided with a main body area and a binding area for binding and connecting with the flexible circuit board 12. The main body area is provided with a first binding terminal 8. The inner surface of the housing 13 corresponding to the first binding terminal 8 is provided with a second binding terminal 7. The first binding terminal 8 and the second binding terminal 7 are bound together for connection with a power source outside the housing 13 to provide voltage to the light-emitting unit of the display panel 2.

[0071] EL (Light Emitting Unit) Control IC (Reference) Figure 9 The EL IC (Elastic Compute Service) is positioned close to the connection between the PCB and FPC to minimize the space occupied by the EL circuit on the PCB. The housing 13 can be provided with additional power contacts (i.e., the configuration of the first bonding terminal 8 and the second bonding terminal 7) to independently supply power to the EL circuit, avoiding mutual interference between the logic circuit (low voltage, low current) and the EL circuit (high voltage, high current). By providing dedicated EL signal contacts (i.e., the configuration of the first bonding terminal 8 and the second bonding terminal 7) on the main circuit board 11 and the housing 13, the host can directly send control signals to the EL IC, achieving efficient communication and power supply.

[0072] This utility model embodiment also provides a display module, including a display panel 2 and the above-mentioned integrated packaging and bonding structure, wherein the display panel 2 and the integrated packaging circuit bonding structure are bonded together.

[0073] In an exemplary embodiment, the housing 13 of the integrated encapsulation bonding structure is fixedly connected to the backlight side of the display panel 2 by adhesive 9.

[0074] In an exemplary embodiment, the adhesive layer 9 improves the strength and rigidity of the housing 13, thereby enhancing its resistance to external forces.

[0075] In an exemplary embodiment, the adhesive layer 9 is a conductive adhesive layer, which can provide necessary conductive properties while maintaining certain mechanical properties, such as for electrostatic protection or auxiliary electrical connection.

[0076] In an exemplary embodiment, the adhesive layer 9 is made of conductive PET, providing necessary conductivity while maintaining certain mechanical properties. Conductive PET (conductive polyethylene terephthalate) is a polyester material with conductive properties. PET is an abbreviation for polyethylene terephthalate, a widely used plastic with excellent mechanical properties, heat resistance, and chemical stability. By adding conductive fillers (such as carbon black, conductive polymers, or metal particles), PET can acquire conductivity, thereby expanding its application range.

[0077] In an exemplary embodiment, in a direction perpendicular to the main circuit board 11, the housing 13 includes a first surface and a second surface disposed opposite to each other, the first surface being used to connect to the backlight side of the display panel 2.

[0078] The integrated packaging and bonding structure further includes a connecting post 101 for fixing the main circuit board 11 to the housing 13. A first connecting hole for the connecting post 101 to pass through is correspondingly provided on the second surface, and a second connecting hole for the connecting post 101 to pass through is provided on the main circuit board 11.

[0079] A third connecting hole is provided on the first surface for the connecting post 101 to pass through;

[0080] A metal support layer is provided on the backlight side of the display panel 2. One end of the connecting post 101 is connected to the metal support layer, and the other end of the connecting post 101 is connected to the grounding structure of the whole machine.

[0081] By adopting the above solution, the grounding of the main circuit board 11 and the grounding wire of the display module are effectively connected, which helps to improve electromagnetic compatibility and safety.

[0082] This utility model embodiment also provides a method for assembling a display module, used to assemble the above-mentioned display module, including the following steps:

[0083] Provides a display panel 2 and an integrated encapsulation bonding structure;

[0084] A polarizer and a cover plate are provided on the light-emitting side of the display panel 2;

[0085] A heat dissipation support layer is provided on the backlight side of the display panel 2;

[0086] The display panel 2 is bonded to the integrated packaging bonding structure;

[0087] The integrated packaging bonding structure is bent to the backlight side of the display panel 2;

[0088] The housing of the integrated encapsulation bonding structure is connected to the heat dissipation support layer by an adhesive layer.

[0089] Traditional bonding processes require multiple bonding steps: first, the flexible circuit board 12 is bonded to the display panel 2, and then the flexible circuit board 12 is bonded to the main circuit board 11. This bonding process is complex, and each bonding step carries the risk of reduced bonding yield. Furthermore, after the bonding process, the main circuit board and the flexible circuit board need to be bonded to the support plate 3 on the backlight side of the display panel. The bonding of the main circuit board and the flexible circuit board is performed in separate processes, making the bonding process complex and carrying the risk of poor bonding at each step.

[0090] In this embodiment, by setting the integrated packaging and bonding structure, the integrated packaging and bonding structure is bonded to the display panel as a whole, which simplifies the bonding process and improves the bonding yield. When making a fixed connection, the integrated packaging and bonding structure is also attached to the support plate 3 on the backlight side of the display panel, which simplifies the bonding process and improves the bonding yield.

[0091] In an exemplary embodiment, the support plate 3 is made of metal material and can cooperate with the metal shell of the integrated packaging and bonding structure to achieve antistatic and electromagnetic shielding performance.

[0092] In summary, the display module of this utility model has the following effects:

[0093] 1. Reduce the quantity of secondary materials (secondary materials typically refer to auxiliary materials used in the production or manufacturing process. These materials are not the main components of the final product, but they have a significant impact on the production process and the quality and performance of the product. Secondary materials can include packaging materials, lubricants, cleaning agents, auxiliary tools, etc.) to simplify the module process flow.

[0094] 2. Improved yield: The design of the integrated packaging and bonding structure further optimizes the component installation process, making the entire module easier to assemble and reducing the generation of film marks and bubbles.

[0095] 3. The housing can be equipped with shock-absorbing foam, conductive foam and thermally conductive foam to improve the module's shock resistance, EMI capability and reduce module temperature rise.

[0096] 4. The housing may be provided with additional power contact points (i.e., the first bonding terminal 8 and the second bonding terminal 7) to independently supply power to the EL circuit, so as to avoid mutual interference between the logic circuit (small voltage, small current) and the EL circuit (large voltage, large current).

[0097] In an exemplary embodiment, this embodiment also provides a display device, including the aforementioned display module. This display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the structure of the aforementioned display device does not constitute a limitation on the display device. The display device may include more or fewer of the aforementioned components, or a combination of certain components, or different arrangements of components. In this embodiment of the present invention, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, a navigation display device, etc.

[0098] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0099] Furthermore, embodiments of this disclosure provide an electronic device including a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device performs the silicon wafer pick-and-place method as described above.

[0100] In one embodiment, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0101] The aforementioned computer-readable storage medium, since the computer program stored in its memory is executed by the processor to implement the steps in the above-described method embodiments, can similarly bring about the beneficial effects of the above-described silicon wafer placement and removal method, which will not be elaborated here.

[0102] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0103] The following points need to be explained:

[0104] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0105] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0106] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0107] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. An integrated encapsulation bonding structure for bonding and connecting with a display panel, characterized in that, include: case; The main circuit board is encapsulated within the housing; A flexible circuit board, wherein a first end of the flexible circuit board is bonded to the main circuit board, and a second end of the flexible circuit board, which is disposed opposite to the first end, extends to the outside of the housing and is used to bond to the bonding area of ​​the display panel.

2. The integrated packaging and bonding structure according to claim 1, characterized in that, In a direction perpendicular to the main circuit board, the housing includes a first surface and a second surface disposed opposite to each other, the first surface being used to connect to the backlight side of the display panel; The integrated packaging bonding structure further includes a connecting post for fixing the main circuit board to the housing, and a first connecting hole for the connecting post to pass through is correspondingly provided on the second surface, and a second connecting hole for the connecting post to pass through is provided on the main circuit board.

3. The integrated packaging and bonding structure according to claim 2, characterized in that, A sealing material is provided between the connecting post and the first connecting hole.

4. The integrated packaging and bonding structure according to claim 2, characterized in that, The outer surface of the connecting post is provided with an external thread, and the inner walls of the first connecting hole and the second connecting hole are provided with internal threads that mate with the external thread on the connecting post.

5. The integrated packaging and bonding structure according to claim 2, characterized in that, A third connecting hole is provided on the first surface for the connecting post to pass through.

6. The integrated packaging and bonding structure according to claim 2, characterized in that, An elastic shock absorber is provided between the housing and the main circuit board, and an elastic shock absorber is provided between the housing and the flexible circuit board.

7. The integrated packaging and bonding structure according to claim 2, characterized in that, The main circuit board is provided with a first component, and a heat-conducting connector is provided between the first component and the housing.

8. The integrated packaging and bonding structure according to claim 1, characterized in that, The housing is made of metal, and the main circuit board has an exposed copper area. The exposed copper area and the housing are connected by a conductive component.

9. The integrated packaging and bonding structure according to claim 1, characterized in that, The main circuit board is provided with a main body area and a bonding area for bonding and connecting with the flexible circuit board. The main body area is provided with a first bonding terminal. The inner surface of the housing corresponding to the first bonding terminal is provided with a second bonding terminal. The first bonding terminal and the second bonding terminal are bonded and connected to a power source outside the housing to provide voltage to the light-emitting unit of the display panel.

10. A display module, characterized in that, It includes a display panel and an integrated packaging and bonding structure as described in any one of claims 1-9, wherein the display panel and the integrated packaging and bonding structure are bonded together.

11. The display module according to claim 10, characterized in that, The housing of the integrated encapsulation bonding structure is fixedly connected to the backlight side of the display panel by an adhesive layer.

12. The display module according to claim 10, characterized in that, In a direction perpendicular to the main circuit board, the housing includes a first surface and a second surface disposed opposite to each other, the first surface being used to connect to the backlight side of the display panel; The integrated packaging bonding structure further includes a connecting post for fixing the main circuit board to the housing, and a first connecting hole for the connecting post to pass through is correspondingly provided on the second surface, and a second connecting hole for the connecting post to pass through is provided on the main circuit board. A third connecting hole is provided on the first surface for the connecting post to pass through; A metal support layer is provided on the backlight side of the display panel. One end of the connecting post is connected to the metal support layer, and the other end of the connecting post is connected to the grounding structure of the whole machine.

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