Packaging structure for optoelectronic components and optoelectronic device

Abstract

This invention discloses a packaging structure and a photoelectric device for optoelectronic components. The packaging structure includes a first support, a second support, and a package body. The first support includes a first body and at least one first protrusion, the first protrusion being located on the first body. The second support is disposed opposite to the first support, and includes a second body and at least one second protrusion, the second protrusion being located on the second body. The package body covers the first and second supports, with the first and second protrusions protruding from the top surface of the package body. In the horizontal direction, the distance between the first and second protrusions is less than the distance between the first and second bodies. This structure reduces manufacturing costs and the overall height of the packaging structure.

Description

Technical Field

[0001] This utility model relates to a packaging structure, and more particularly to a packaging structure that can increase the usable area of ​​an optoelectronic chip. Background Technology

[0002] Existing optoelectronic devices provide a packaging structure with a light-emitting groove that uses the principle of light reflection. Although it has a selective reflection effect, the difficulty lies in the fact that the size of the optoelectronic chip is limited by the size of the light-emitting groove.

[0003] Another option is a planar ceramic packaging structure, which can maximize the size of the optoelectronic chip, but the high cost of ceramics makes it difficult to manufacture. In addition, the overall height of the package is also limited.

[0004] Therefore, how to simplify the size of optoelectronic devices, improve luminous efficiency, and reduce the cost of their manufacturing processes through packaging structure design, thereby overcoming the aforementioned problems, has become one of the important issues that this technical field seeks to address. Utility Model Content

[0005] The purpose of this invention is to provide a packaging structure and optoelectronic device for optoelectronic components to solve at least one of the above-mentioned problems.

[0006] This invention provides a packaging structure for optoelectronic components, comprising: a first support, a second support, and a packaging body. The first support includes a first body and a first protrusion, the first protrusion being located on the first body. The second support is disposed opposite to the first support, and includes a second body and a second protrusion, the second protrusion being located on the second body. The packaging body covers the first and second supports, with the first and second protrusions protruding from the top surface of the packaging body. In the horizontal direction, the distance between the first and second protrusions is less than the distance between the first and second bodies.

[0007] According to one embodiment of the present invention, on the same side, the distance between a first side end face of the first protrusion facing the second protrusion and a first side end face of the first body is less than 100 μm; on the same side, the distance between a second side end face of the second protrusion facing the first protrusion and a second side end face of the second body is less than 100 μm.

[0008] According to one embodiment of the present invention, the height difference between the first bump and the second bump protruding from the top surface of the package body is greater than 0 and less than 15 μm.

[0009] According to one embodiment of the present invention, the ratio of the exposed area of ​​the first protrusion and the second protrusion to the area of ​​the top surface of the package is 1 / 4 to 1 / 2.

[0010] According to one embodiment of the present invention, the thickness of the package is 0.1 to 0.25 mm.

[0011] According to one embodiment of the present invention, the packaging structure for the optoelectronic component has two opposite sides, the first bracket and the second bracket are combined to form a bracket, and a centrally located support end is provided on each of the two opposite sides, wherein the two centrally located support ends have different electrical properties.

[0012] According to one embodiment of the present invention, the first bracket and the second bracket each include an obliquely extending connecting portion, and the two connecting portions extend across at least half of the package body.

[0013] According to one embodiment of the present invention, the cross-section of the first support on a central vertical plane is generally a first Z-shape and the cross-section of the second support on the central vertical plane is generally a second Z-shape.

[0014] This utility model also provides a packaging structure for optoelectronic components, comprising a first support, a second support, and a package body. The first support includes a first body and a first protrusion, the first protrusion being located on the first body, and the cross-section of the first support in its central vertical plane is approximately a first Z-shape. The second support is disposed opposite to the first support, and the second support includes a second body and a second protrusion, the second protrusion being located on the second body, and the cross-section of the second support in its central vertical plane is approximately a second Z-shape. The package body covers the first and second supports, with the first and second protrusions protruding from a top surface of the package body. In the horizontal direction, the distance between the first and second protrusions is less than the distance between the first and second bodies.

[0015] According to one embodiment of the present invention, the first bracket further includes an extension body and an extension protrusion, the extension body extending in a vertically aligned direction, the extension protrusion located on the extension body, and the extension protrusion protruding from the top surface of the package; and wherein the package structure for the optoelectronic component further includes a third bracket adjacent to the first bracket but not connected to the first bracket, the third bracket including a third body and a third protrusion, the third protrusion located on the third body and opposite to the extension protrusion, and the extension protrusion protruding from the top surface of the package.

[0016] This utility model provides a packaging structure for optoelectronic components, including a first support, a second support, and a package body. The first support includes multiple first bodies, at least one connecting portion, and multiple first protrusions. The multiple first bodies are arranged along an arrangement direction, and adjacent first bodies are connected via the at least one connecting portion. The multiple first protrusions are respectively disposed on the multiple first bodies. The cross-section of the first support in its central vertical plane is approximately a first Z-shape. The second support includes multiple second bodies and multiple second protrusions. The multiple second bodies are arranged at intervals along the arrangement direction, and the multiple second protrusions are respectively located on the second bodies. The cross-section of the second support in its central vertical plane is approximately a second Z-shape. The first and second supports are arranged opposite each other, such that the multiple first protrusions and multiple second protrusions are respectively facing each other and are mirror-symmetrical. The package body covers the first and second supports, and the multiple first and multiple second protrusions protrude from a top surface of the package body.

[0017] According to one embodiment of the present invention, a first bracket further includes a first lateral protrusion and a first connecting protrusion. The first lateral protrusion, the first central protrusion and the first connecting protrusion are spaced apart on the first body, such that a first groove is formed between the first lateral protrusion and the first central protrusion, and a second groove is formed between the first central protrusion and the first connecting protrusion.

[0018] According to one embodiment of the present invention, the second protrusion corresponds to the periphery of the second body and forms a plurality of grooves, the plurality of grooves including a first side groove, a central groove and a second side groove, the first side groove and the second side groove being mirror-symmetrical about a central line of the central groove.

[0019] According to one embodiment of the present invention, the distance between the first body and the second body is 0.12 to 0.5 mm; the distance between the first central protrusion and the second protrusion is 0.12 to 0.5 mm.

[0020] According to one embodiment of the present invention, the height difference between the first lateral bump, the first central bump, the first connecting bump and the second bump protruding from the top surface of the package body is greater than 0 and less than 15 μm.

[0021] According to one embodiment of the present invention, the first bracket has a first cantilever connection portion, and the second bracket has a second cantilever connection portion. In the horizontal direction, adjacent first brackets and second brackets are connected by adjacent first cantilever connection portions and second cantilever connection portions extending obliquely. On a plane, the area where the first bracket is located is defined as a first area, and the area where the second bracket is located is defined as a second area. The first cantilever connection portion extends to the second area.

[0022] This utility model also provides a packaging structure for optoelectronic components, comprising: a first support, a second support, and a package body. The first support includes a first body, a first lateral protrusion, a first central protrusion, and a first connecting protrusion. The first lateral protrusion, the first central protrusion, and the first connecting protrusion are spaced apart on the first body, forming a first groove between the first lateral protrusion and the first central protrusion, and a second groove between the first central protrusion and the first connecting protrusion. The second support is disposed opposite to the first support, and includes a second body and a second protrusion. The second protrusion is located on the second body and has multiple grooves corresponding to the periphery of the second body. The second protrusion protrudes horizontally toward the first central protrusion and extends beyond one end face of the second body. The package body covers the first support and the second support, with the first lateral protrusion, the first central protrusion, the first connecting protrusion, and the second protrusion protruding from the top surface of the package body.

[0023] This utility model also provides a photoelectric device, including a packaging structure for photoelectric components and a photoelectric chip. The photoelectric chip is disposed on the top surface of the package and electrically connected to a first bump and a second bump, respectively.

[0024] This utility model also provides a photoelectric device, including a packaging structure for photoelectric components and a plurality of photoelectric chips. Each photoelectric chip is disposed on the top surface of the package and is electrically connected to a second bump and a first bump opposite to the second bump.

[0025] This utility model also provides a photoelectric device, including: a packaging structure for photoelectric components and a photoelectric chip. The photoelectric chip is disposed on the top surface of the package, electrically contacting a second bump, and electrically connected to a first central bump via a wire.

[0026] The packaging structure provided by this utility model has at least the following beneficial effects: "the first support, the second support and the package body have a better combination effect, which can realize the process without setting the support, the installation of the optoelectronic chip can increase the area of ​​the optoelectronic chip, and the process can be simplified to improve the yield."

[0027] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0028] Figure 1 This is a cross-sectional schematic diagram of the packaging structure for an optoelectronic component according to an embodiment of the present invention.

[0029] Figure 2 for Figure 1 The bottom view of the embodiment shown.

[0030] Figure 3 for Figure 1 The illustrated embodiment is a schematic diagram of a support assembly consisting of the first support and the second support.

[0031] Figures 4 to 7 These are three-dimensional schematic diagrams of an embodiment of the photoelectric device of this utility model.

[0032] Figure 8 This is a cross-sectional schematic diagram of the packaging structure for an optoelectronic component according to an embodiment of the present invention.

[0033] Figure 9 for Figure 8 The bottom view of the embodiment shown.

[0034] Figure 10 for Figure 8 The illustrated embodiment is a schematic diagram of the support assembly consisting of the first support and the second support group.

[0035] Figure 11 This is a three-dimensional schematic diagram of an embodiment of the photoelectric device of the present invention.

[0036] Figure 12 This is a cross-sectional schematic diagram of the packaging structure for an optoelectronic component according to an embodiment of the present invention.

[0037] Figure 13 for Figure 12 The bottom view of the embodiment shown.

[0038] Figure 14 for Figure 12 The illustrated embodiment is a schematic diagram of a support assembly consisting of a first support and a second support.

[0039] Figures 15 to 20 These are three-dimensional schematic diagrams of an embodiment of the photoelectric device of this utility model.

[0040] Figure 21 This is a three-dimensional schematic diagram of an embodiment of the photoelectric device of the present invention.

[0041] Figure 22 for Figure 21 The illustrated embodiment shows a bottom view of the packaging structure.

[0042] Figure 23 for Figure 21 Top view of the encapsulation structure in the illustrated embodiment. Detailed Implementation

[0043] The following specific embodiments illustrate the implementation of the "packaging structure and optoelectronic device for optoelectronic components" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0044] Please see Figures 1 to 3 , Figure 1 This is a cross-sectional schematic diagram of the packaging structure 1A for an optoelectronic component according to an embodiment of the present invention. Figure 2 for Figure 1 The bottom view of the embodiment shown. Figure 3 for Figure 1 The illustrated embodiment is a schematic diagram of a support assembly consisting of the first support and the second support.

[0045] The packaging structure 1A for optoelectronic components includes a first support 11, a second support 12, and a package body 13. The first support 11 includes a first body 111 and a first protrusion 112, with the first protrusion 112 located on the first body 111. The second support 12 is disposed opposite to the first support 11, and includes a second body 121 and a second protrusion 122, with the second protrusion 122 located on the second body 121. The package body 13 covers the first support 11 and the second support 12, with the first protrusion 112 and the second protrusion 122 protruding from the top surface 131 of the package body 13. According to some embodiments, the package body 13 may be made of an opaque material, particularly epoxy resin with added titanium dioxide (TiO2). In the horizontal direction D1, the distance W1 between the first protrusion 112 and the second protrusion 122 is less than the distance W2 between the first body 111 and the second body 121, such as... Figure 1 As shown. Furthermore, the distance between the first bump 112 and the second bump 122 can be adjusted appropriately based on the spacing of the PN pads between the chips. See also... Figure 1The first support 11 has a cross-section that is roughly Z-shaped. The second support 12 has a cross-section that is roughly another Z-shaped.

[0046] In other words, the first support 11 and the second support 12 have a generally mirror-symmetrical stepped structure (including the first protrusion 112 and the second protrusion 122). In a vertical direction, the first protrusion 112 and the second protrusion 122 protrude to the first support 11 and the second support 12 on opposite sides, respectively, with a protrusion distance of 0-100μm.

[0047] That is, on the same side, the distance W3 between the first side end face of the first protrusion 112 facing the second protrusion 122 and the first side end face of the first body 111 is 0 to 100 μm. On the same side, the distance W4 between the second side end face of the second protrusion 122 facing the first protrusion 112 and the second side end face of the second body 121 is 0 to 100 μm. Furthermore, when the shapes and sizes of the bottom surfaces of the first body 111 and the second body 121 exposed to the package 13 are similar, based on considerations of electrical identification, the second body 121 is provided with an additional identification structure (e.g., a groove), so W4 is preferably greater than W3, and vice versa.

[0048] See again Figure 1 and Figure 3 The first support 11 and the second support 12 each have a Z-shaped mirror-symmetric structure with etched cross-sections, and the first bump 112 and the second bump 122 are mirror-symmetrical. The height difference H1 between the first bump 112 and the second bump 122 protruding from the top surface of the package 13 is greater than 0 and less than 15 μm. This prevents the encapsulant from overflowing onto the metal surface, which could cause poor soldering at the electrical terminals (height difference of about 3 μm) at the bottom of the chip, and reduces the risk of short circuits. In some embodiments, the ratio of the exposed area of ​​the first bump 112 and the second bump 122 to the area of ​​the top surface of the package 13 is approximately 1 / 4 to 1 / 2. Compared to wire bonding support designs, the size of the optoelectronic chip can be more varied. According to some embodiments, the corresponding area of ​​the first bump 112 and the second bump 122 is defined as the die-bonding region A2, on which the optoelectronic chip 15 is correspondingly disposed, and the ratio of the surface area of ​​the optoelectronic chip 15 to the die-bonding region A2 is approximately 1 to 1.5. This structure increases the usable area of ​​the optoelectronic chip within the packaging structure. Based on... Figure 1 The embodiments shown increase the usable area of ​​the optoelectronic chip in the wire bonding flip-chip process (according to one embodiment, the area of ​​the optoelectronic chip can be increased by 55%), and simplify the process and improve the yield.

[0049] In some embodiments, the first support 11 and the second support 12 have upper and lower etching processes to form a Z-shaped mirror-symmetrical structure, and their structure is roughened by sandblasting. According to Figure 1The first support 11 and the second support 12 shown further provide a Z-axis (thickness) connection with the package 13, which can mitigate moisture intrusion and compensate for the weak bonding of the flat support structure, especially when the thickness T of the package structure 1A is 0.1 to 0.25 mm (i.e., the first support 11 and the second support 12 are connected to the package 13 with a thickness of 0.1 to 0.25 mm). According to some embodiments, the bottom surfaces of the first body 111 and the second body 121 protrude from the bottom surface 132 of the package 13, and the protruding portion is greater than 0 and less than 15 μm. Preferably, it is 6-12 μm. See reference. Figure 2 The encapsulation structure 1A has two opposing sides 13A, each side 13A having three electrical terminals of the support 1, and two opposing sides 13B each having a centrally located support terminal. The three electrical terminals on side 13A have two electrical characteristics; more specifically, the two electrical terminals on the middle side of the two opposing sides 13A have different electrical characteristics, and the centrally located support terminals on the two opposing sides 13B have different electrical characteristics.

[0050] like Figure 3 As shown, the brackets are connected in a zigzag bridging pattern. The first bracket 11 and the second bracket 12 define a bracket group. In the horizontal direction, adjacent brackets are connected by obliquely extending connecting portions, which are divided into a first connecting portion 113 and a second connecting portion 123. This solves the problem of isolated sections. Furthermore, to enhance the stability of the brackets and their integration with the package 13, the two connecting portions 113 and 123 extend across half of the package 13; that is, the ends of the two connecting portions 113 and 123 preferably protrude from half or more of the two opposite sides 13A. Additionally, as... Figure 2 As shown, the area where the first support is located is defined as the first region B1, and the area where the second support 12 is located is defined as the second region B2. The first connecting portion 113 extends outward to the area where the first region B1 and the second region B2 overlap. The second connecting portion 123 also extends outward to the area where the first region B1 and the second region B2 overlap. This also enhances the stability of the support and its bonding with the package 13. A die-bonding region A2 (including the region A1 between the first bump 112 and the second bump 122) is formed on the first bump 112 and the second bump 122, providing a planarized surface (or slightly protruding support portion), which is beneficial for the subsequent soldering process of the positive and negative electrodes of the large-size chip (optoelectronic chip 15) and the corresponding double bumps (first bump 112, second bump 122).

[0051] Please see Figures 4 to 7 These are three-dimensional schematic diagrams of photoelectric devices M1, M2, M3, and M4, respectively, according to an embodiment of this utility model. The packaging structures used in various embodiments are as follows: Figure 1The illustrated embodiment. In several embodiments, the optoelectronic devices M1, M2, M3, and M4 further include an optoelectronic chip 15 and a cover layer 16. The optoelectronic chip 15 is disposed on the top surface 131 of the package 13, and is electrically connected to the first bump 112 and the second bump 122, respectively. The cover layer 16 covers the optoelectronic chip 15 and the exposed top surface 131 of the package 13, protecting the optoelectronic chip 15 and preventing moisture intrusion. Furthermore, it can be a flat plate or an external lens with curvature. Figures 4 to 7 In the illustrated embodiment, the cover layer 16 is an external lens with curvature. The optoelectronic devices M1 and M3 also include a reflective layer 14 disposed on the top surface 131 of the package 13 and surrounding the optoelectronic chip 15. Furthermore, the top surface of the reflective layer 14 is flush with the top surface of the optoelectronic chip 15. The cover layer 16 covers the aforementioned flush top surface, meaning that the top surface of the optoelectronic chip 15 and the top surface of the reflective layer 14 are exposed. According to some embodiments, the reflective layer 14 is composed of silicone and titanium dioxide (TiO2).

[0052] The following describes the light emission angles of each optoelectronic device: In some embodiments, the cover layer 16 includes a convex lens. According to some embodiments, the lens has a base 161 with a thickness T1 of 0.05-0.50 mm (see...). Figures 4 to 7 When the convex lens is an asymmetric lens, the visible angles of the photoelectric chip 15 in the two emission directions are not the same, ranging from 50 degrees to 135 degrees. When the convex lens is an asymmetric lens with chamfered edges on both sides, for example in... Figure 4 and Figure 5 In the illustrated embodiment, the light emission angle of photoelectric devices M1 and M2 is 105 degrees on side 13A corresponding to package 13, and 70 degrees on side 13B corresponding to package 13. When the convex lens is a symmetrical lens with four chamfered edges, the visible angle of the photoelectric chip 15 in both light emission directions is 90 degrees to 125 degrees. For example, in Figure 6 and Figure 7 In the illustrated embodiment, the light emission angle of photoelectric devices M3 and M4 is 125 degrees on side 13A corresponding to package 13, and 90 degrees on side 13B corresponding to package 13. Furthermore, according to... Figure 4 and Figure 6 In one embodiment, photoelectric devices M1 and M3 have a reflective layer 14. Compared to photoelectric devices M2 and M4 without a reflective layer 14, the brightness of the photoelectric devices with a reflective layer 14 can be increased by 10-15%.

[0053] Please see Figures 8 to 10 , Figure 8 This is a cross-sectional schematic diagram of the packaging structure 1B for an optoelectronic component according to an embodiment of the present invention. Figure 9 for Figure 8 The bottom view of the embodiment shown. Figure 10 for Figure 8 The illustrated embodiment is a schematic diagram of a support assembly consisting of a first support and a second support.

[0054] The packaging structure 1B for optoelectronic components includes a first support, a second support, and a package body 13. The first support includes a first bracket 11, which has multiple first bodies 111, multiple connecting portions 113, and multiple first protrusions 112. The second bracket 12 includes multiple second bodies and multiple second protrusions. The multiple second protrusions are respectively located on the multiple second bodies. Figure 9 and Figure 10 For example, the first bracket 11 includes three first bodies 111, two connecting portions 113, and three first protrusions 112. The three first bodies 111 are arranged along the arrangement direction P, and adjacent first bodies 111 are connected via connecting portions 113. Multiple connecting portions 113 extend across half of the encapsulation body 13. The three first protrusions 112 are respectively disposed on the three first bodies 111. The cross-section of the first bracket 11 in the central vertical plane E2 is generally Z-shaped. The second bracket 12 includes three second bodies 121. The three second bodies 121 are arranged along the arrangement direction P and are independent and not connected. The three second protrusions 122 are arranged along the arrangement direction P. The cross-section of the second bracket 12 in the central vertical plane E2 is also generally Z-shaped. The second bracket 12 is disposed opposite to the first bracket 11, and the three second protrusions 122 correspond to and face the three first protrusions 112, and are mirror-symmetrical. Figure 8 As shown, in a vertical direction, multiple first bumps 112 and multiple second bumps 122 protrude towards the opposite sides of the first support 11 and the second support 12, respectively. That is, in the horizontal direction, the distance between the three first bumps 112 and the corresponding three second bumps 122 is less than the distance between the three first bodies 111 and the corresponding three second bodies 121. In other words, the package 13 covers the first support 11 and the second support 12, and the multiple first bumps 112 and the multiple second bumps 122 protrude from the top surface 131 of the package 13. The first support 11 and the second support 12 have an upper and lower etched structure to form a Z-shaped mirror-symmetrical cross-section.

[0055] in accordance with Figure 8In the illustrated embodiment, the thickness T of the package structure 1B is 0.1 to 0.25 mm. The height difference H2 of the three first bumps 112 and the three second bumps 122 protruding from the top surface of the package body 13 is greater than 0 and less than 15 μm, preferably 6-12 μm. This prevents the encapsulant from overflowing onto the metal surface, which could cause poor soldering at the electrical terminals (height difference of approximately 3 μm) at the bottom of the chip, and reduces the risk of short circuits. Multiple first bodies 111 and multiple three second bodies 121 also protrude from the bottom surface of the package body 13, preferably less than 15 μm. The first bodies 111 are connected, while the three second bodies 121 of the second support 12 are independent and not connected. This enables a polycrystalline flip-chip process, simplifies the process, improves process yield, and meets the design requirements for product miniaturization.

[0056] in accordance with Figure 9 In the embodiment shown, the total exposed area of ​​the plurality of first bumps 121 and the plurality of second bumps 122 is approximately 1 / 4 to 1 / 2 the area of ​​the top surface of the package 13.

[0057] The first support 11 and the second support 12 are formed by upper and lower etching processes to create a Z-shaped mirror-symmetrical structure, and their structure is roughened by sandblasting. The first support 11 and the second support assembly are bonded to the package 13 with a thickness of 0.1 to 0.25 mm. Under the cover of the package 13, moisture intrusion can be mitigated, and the structure of the first support 11 and the second support assembly can be reinforced. The package structure 1B has two opposite sides 13A, each side 13A having three electrical terminals of the support 1, and two support terminals on the other two opposite sides 13B (see...). Figure 9 ).

[0058] like Figure 10 As shown, the bracket assembly presents an "H"-shaped connecting bridge configuration. The first bracket 11 and the second bracket define a bracket combination. In the horizontal direction, adjacent brackets are connected by the second bracket 12 to the first bracket 11 through multiple extension connectors 30. This structure solves the problem of isolated components in the assembly. Based on the design of the first bracket 11 and the second bracket 12, the circuit is located at the same pole (common cathode or common anode). The optoelectronic chip 15 is disposed on the first bump 112 and the second bump 122, maintaining a coplanar arrangement. The bracket assembly, injection molded from the package 13, has a certain degree of stability.

[0059] According to some embodiments, the distances L1 and L2 between the first body 111, the second body 121 and the top surface of the package 13 are preferably 1 / 4 to 1 / 2 of the thickness of the support group.

[0060] Please see Figure 11 This is a three-dimensional schematic diagram of the optoelectronic device M5 according to an embodiment of the present invention. According to this embodiment, the packaging structure 1B used is as follows... Figure 8The embodiment shown. In this embodiment, the optoelectronic device M5 includes a first optoelectronic chip 15a, a second optoelectronic chip 15b, and a third optoelectronic chip 15c, a reflective layer 14, and a cover layer 16. The first optoelectronic chip 15a is disposed on the top surface of the package 13 and is electrically connected to a second bump 122 and a first bump 112 opposite to the second bump 122. The second optoelectronic chip 15b is disposed on the top surface 131 of the package 13 and is electrically connected to a second bump 182 and a first bump 112 opposite to the second bump 182. The third optoelectronic chip 15c is disposed on the top surface 131 of the package 13 and is electrically connected to a second bump 192 and a first bump 112 opposite to the second bump 192. The cover layer 16 is located outside the first optoelectronic chip 15a, the second optoelectronic chip 15b, and the third optoelectronic chip 15c. In this embodiment, the cover layer 16 is an external flat lens. A reflective layer 14 is disposed on the top surface 131 of the package 13 and laterally covers the first photoelectric chip 15a, the second photoelectric chip 15b, and the third photoelectric chip 15c. According to some embodiments, the reflective layer 14 is composed of silicone and titanium dioxide (TiO2).

[0061] Please see Figures 12 to 14 , Figure 12 This is a cross-sectional schematic diagram of the packaging structure 1C for an optoelectronic component according to an embodiment of the present invention. Figure 13 for Figure 12 The bottom view of the embodiment shown. Figure 14 for Figure 12The illustrated embodiment shows a schematic diagram of the bracket assembly consisting of the first bracket 11 and the second bracket 12. The packaging structure 1C for optoelectronic components includes the first bracket 11, the second bracket 12, and the package body 13. The first bracket 11 includes a first body 111 and a first protrusion 112. In this embodiment, the first protrusion 112 includes a first lateral protrusion 1121, a first central protrusion 1122, and a first connecting protrusion 1123. The first lateral protrusion 1121, the first central protrusion 1122, and the first connecting protrusion 1123 are spaced apart on the first body 111, such that a first groove C1 is formed between the first lateral protrusion 1121 and the first central protrusion 1122, and a second groove C2 is formed between the first central protrusion 1122 and the first connecting protrusion 1123. The second bracket 12 is disposed opposite to the first bracket 11. The second support 12 includes a second body 121 and a second protrusion 122. The second protrusion 122 is located on the second body 121 and corresponds to the periphery of the second body 121, forming multiple grooves C3. The second protrusion 122 protrudes towards the first central protrusion 1122 in the horizontal direction D1 and protrudes from one side end face of the second body 121. The package 13 covers the first support 11 and the second support 12. The first groove C1, the second groove C2, and the multiple grooves C3 on the support can enhance their bonding with the package 13. In addition, after the package 13 surrounds and laterally covers the first support 11 and the second support 12, the sidewalls of the package structure 1C have the same thickness. The first lateral protrusion 1121, the first central protrusion 1122, the first connecting protrusion 1123, and the second protrusion 122 protrude from the top surface 131 of the package 13. In this embodiment, the bottom surface of the second body 121 protrudes from the bottom surface 132 of the package 13. like Figure 13 and Figure 14 As shown, the two opposite sides 13A of the package 13 each have two electrical ends of the bracket 1. The two electrical ends of one side 13A extend from the second protrusion 122 of the second bracket 12, and the other two electrical ends of the other side 13A extend from the first lateral protrusion 1121 and the first connecting protrusion 1123 of the first bracket 11. The other two sides 13B each have two supporting ends of the bracket 1. The two supporting ends of one side 13B are electrically different, while the other two supporting ends of the other side 13B are electrically the same.

[0062] like Figure 13 and Figure 14 As shown, the first support 11 and the second support 12 define a support 1, wherein the first support 11 has a cantilevered connecting part 113 and the second support 12 has a cantilevered connecting part 123. In the horizontal direction, adjacent supports 1 are connected by two adjacent cantilevered connecting parts 113 and 123 extending obliquely. This can solve the problem of contiguous isolated islands (see...). Figure 14 ).like Figure 13As shown, the area where the first support 11 is located is defined as the first region B1, and the area where the second support 12 is located is defined as the second region B2. The cantilevered connector 113 extends into the region B2 defined by the second support 12 at its exposed end on the side 13B. Alternatively, the cantilevered connector 113 extends outward to the overlapping area of ​​the first region B1 and the second region B2, thereby improving the strength of the packaging structure 1C.

[0063] According to some embodiments, the plurality of grooves C3 of the second support 12 can be roughened by sandblasting, which can further enhance the bonding between the supports (first support 11 and second support 12) and the package 13, especially when the thickness of the package structure 1C is less than 0.25 mm. The design of the first bump 111 and the second bump 121 can maximize the area used by the optoelectronic chip, thereby improving the luminous efficiency. In some embodiments, the area of ​​the optoelectronic chip is increased by 34%, and the luminous efficiency is increased by 30%.

[0064] like Figure 13 As shown, the bottom of the second body 121 has a trapezoidal shape. The large trapezoidal shape provides a large heat dissipation area and has a good heat dissipation effect. This shape can avoid sacrificing the conductive pins to create a strong and seamless solder interface, and can also solve the problem of burrs on the solder interface during cutting.

[0065] In this embodiment, the plurality of grooves C3 include a first side groove C31, a central groove C32 and a second side groove C33, and the first side groove C31 and the second side groove C33 are mirror-symmetrical about the central line CL of the central groove C32.

[0066] According to some embodiments, the distance L3 between the first body 111 and the second body 121 is 0.12 to 0.5 mm. In the horizontal direction D1, the distance between the first central protrusion 1122 of the first protrusion 112 and the second protrusion 122 is less than the distance L3 between the first body 111 and the second body 121, such as... Figure 13 As shown.

[0067] in accordance with Figure 12 In the illustrated embodiment, the thickness T of the package structure 1c is 0.1 to 0.25 mm. The height difference H3 between the first bump 112 and the second bump protruding from the top surface of the package body 13 is less than 15 μm and greater than 0. Preferably, it is 6-12 μm. This prevents the encapsulant from overflowing onto the metal surface, which could cause poor soldering at the electrical terminals (height difference of approximately 3 μm) at the bottom of the chip, and reduces the risk of short circuits. The first body 111 and the second body also protrude from the bottom surface of the package body 13 by less than 15 μm and greater than 0. Preferably, it is 6-12 μm.

[0068] Please see Figures 15 to 20These are perspective schematic diagrams of photoelectric devices (M6-M11) according to an embodiment of the present invention. Each photoelectric device includes at least: a packaging structure 1C for photoelectric components, a photoelectric chip 15, and a cover layer 16. The photoelectric chip 15 is disposed on the top surface 131 of the package, electrically contacting the second bump 122, and electrically connected to the first bump 112 via a wire 20. Furthermore, in some embodiments, a reflective layer 14 may be selectively disposed on the top surface 131 of the package 13, surrounding the photoelectric chip 15, for example... Figure 18 The illustrated embodiment. According to some embodiments, the reflective layer 14 is, for example, a combination of silicone and titanium dioxide.

[0069] In some embodiments, the cover layer 16 includes an outer lens. According to some embodiments, the outer lens has a base 161 with a thickness T1 of 0.05-0.50 mm (see...). Figures 15 to 20 In several embodiments, the lens used is an external lens with curvature. When the lens is a symmetrical aspherical lens and has no truncated edges on all four sides, the light emission angle of the photoelectric device can be adjusted from 40 degrees to 150 degrees by adjusting the lens curvature. For example, according to... Figure 15 In the embodiment shown in 20, the external lens is a symmetrical aspherical lens with a nearly planar surface and no chamfered edges on all four sides. The light emission angle of the photoelectric devices M6 and M11 is 130 degrees. According to... Figure 16 In the embodiment shown in 18, the external lens is a symmetrical aspherical lens with no chamfered edges on all four sides, and the light emission angle of the photoelectric devices M7 and M9 is 50 degrees. When the convex lens is an asymmetrical lens with chamfered edges on both sides, the visible angle of the photoelectric chip 15 is different in the two light emission directions, and the light emission angle of the photoelectric device covers 50 degrees to 120 degrees. For example, according to... Figure 17 In the embodiment shown in 19, the external lens is an asymmetric lens with chamfered edges on both sides. On side 13A of the package 13, the light emission angle of photoelectric devices M8 and M10 is 70 degrees; on side 13B of the package 13, the light emission angle of photoelectric device M8 is 105 degrees. Furthermore, according to... Figures 18-20 In one embodiment, multiple optoelectronic devices M6, M7, and M8 have a reflective layer 14. Compared to optoelectronic devices M9, M10, and M11 without a reflective layer 14, the brightness of the optoelectronic devices with a reflective layer 14 can be increased by 10-15%.

[0070] Please see Figures 21 to 23 , Figure 21 This is a three-dimensional schematic diagram of the photoelectric device M12 according to an embodiment of the present invention. Figure 22 for Figure 21 The illustrated embodiment shows a bottom view of the encapsulation structure 1D. Figure 23 for Figure 21The illustrated embodiment shows a top view of the encapsulation structure 1D. The optoelectronic device M12 includes the encapsulation structure 1D for optoelectronic components, the optoelectronic component 15, and a cover layer 16. In this embodiment, the optoelectronic component 15 includes RGB light-emitting diodes 15a, 15b, and 15c, and a white light-emitting component 15d. The white light-emitting component 15d consists of an optoelectronic chip and phosphor. For example, a blue light-emitting chip and a yellow-green phosphor (YAG) layer, which can also be replaced by a phosphor sheet. A reflective layer 14 is disposed on the top surface 131 of the encapsulation body 13 and surrounds the white light-emitting component 15d. Furthermore, the top surface of the reflective layer 14 is flush with the top surface of the white light-emitting component 15d. The white light-emitting component 15d can also be a CSP (Chip Scale Package), which includes a white light-emitting component (a blue light-emitting chip combined with a light conversion component) surrounded by the reflective layer 14.

[0071] The packaging structure 1D includes a first support 11, a second support 12, a third support 31, and a package body 13. The first support 11 includes multiple first bodies 111, multiple connecting portions 113, and multiple first protrusions 112. Adjacent first bodies 111 are connected by connecting portions 113, and three first bodies 111 are connected in series in an arrangement direction P. The first support 11 also includes an extension body 111' extending perpendicular to the arrangement direction P. Multiple first protrusions 112 are respectively located on the multiple first bodies 111, and the first support 11 also includes an extension protrusion 112' located on the first body 111'. The multiple first protrusions 112 are arranged in the arrangement direction P. The second support 12 includes multiple second bodies 121 and multiple second protrusions 122. The multiple second bodies 121 are independent and not connected, and the multiple second protrusions 122 are respectively located on the multiple second bodies 121. The second protrusions 122 are respectively disposed opposite to the first protrusions 112. The third support 31 is adjacent to but not connected to the first support 11. The third support 31 includes a third body 311 and a third protrusion 312. The third protrusion 312 is located on the third body 311 and is disposed opposite to the extension protrusion 112'. The package 13 covers the first support 11, the second support 12, and the third support 31. A plurality of first protrusions 112, extension protrusions 112', a plurality of second protrusions 122, and third protrusions 312 protrude from the top surface 131 of the package 13, with a height difference greater than 0 and less than 15 μm, preferably 6-12 μm. Similarly, the bottoms of the first body 111, extension body 111', a plurality of second bodies 121, and third body 311 are exposed on the bottom surface 132 of the package 13, with a height difference greater than 0 and less than 15 μm, preferably 6-12 μm.

[0072] The optoelectronic component 15 is disposed on the top surface 131 of the package structure 1D. In this embodiment, each RGB light-emitting diode 15a, 15b, 15c is electrically connected to the first bump 112 and the corresponding second bump 122, respectively. The white light-emitting component is electrically connected to the extension bump 112' and the third bump 312, respectively. The cover layer 16 covers the package structure 1D and the three optoelectronic chips (e.g., RGB light-emitting diodes 15a, 15b, 15c) and the white light-emitting component 15d disposed thereon. In this embodiment, the cover layer 16 is an external flat lens, but it is not limited thereto. Depending on the requirements, an external lens with curvature, such as a symmetrical aspherical lens with a base 161 or an asymmetrical lens, can be used.

[0073] "Beneficial effects of the embodiments"

[0074] One of the beneficial effects of this utility model is that the packaging structure provided by this utility model can achieve a better combination effect with the first support, the second support and the package body through the technical features such as "a first support, including a first body and at least one first bump, the at least one first bump being located on the first body", "a second support, disposed opposite to the first support, the second support including a second body and at least one second bump" and "the distance between the first bump and the second bump is less than the distance between the first body and the second body". This enables a process that does not require the setting of a support, and the installation of the optoelectronic chip can increase the area of ​​the optoelectronic chip and simplify the process to improve the yield.

[0075] One of the beneficial effects of this utility model is that, in one embodiment of the packaging structure provided by this utility model, the bonding capability with optoelectronic chips, optoelectronic components, or external substrates is improved through technical features such as "the first bump and the second bump protruding from the top surface of the package body 13" and "the first body and the second body protruding from the bottom surface of the package body 13". In one embodiment, "the portion of the first bump and the second bump protruding from the top surface of the package body 13 is greater than 0 and less than 15 μm", thereby preventing the encapsulant from overflowing onto the metal surface, which could cause poor soldering at the electrical terminals (with a height difference of about 3 μm) at the bottom of the chip, and reducing the risk of short circuits.

[0076] One of the beneficial effects of this utility model is that, in one embodiment of the packaging structure provided by this utility model, the thickness of the package can also be reduced.

[0077] One of the beneficial effects of this utility model is that, in one embodiment of the packaging structure provided by this utility model, the first body and the second body are simultaneously covered by the packaging body, which can reduce the intrusion of moisture and strengthen the structure of the first support and the second support.

[0078] One of the beneficial effects of this utility model is that the packaging structure provided by this utility model can maximize the use of optoelectronic chips and improve luminous efficiency through technical features such as "a first lateral bump, a first central bump and a first connecting bump are spaced apart on a first body, so that a first groove is formed between the first lateral bump and the first central bump, and a second groove is formed between the first central bump and the first connecting bump" and "a second bump is located on a second body, and the second bump corresponds to the periphery of the second body to form multiple grooves".

[0079] One of the beneficial effects of this utility model is that the optoelectronic device provided by this utility model, due to its encapsulation structure, not only has the aforementioned technical effects, but also improves the luminous efficiency of the optoelectronic chip (and light-emitting element), reduces manufacturing costs, and improves product quality.

[0080] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of protection of the claims of the present utility model. Therefore, all equivalent technical changes made based on the content of the present utility model specification and drawings are included in the scope of protection of the claims of the present utility model.

Claims

1. A packaging structure for an optoelectronic component, characterized in that, The packaging structure for the optoelectronic components includes: A first support includes a first body and a first protrusion, wherein the first protrusion is located on the first body; A second bracket, disposed opposite to the first bracket, the second bracket including a second body and a second protrusion, the second protrusion being located on the second body; and A package body covers the first bracket and the second bracket, with the first protrusion and the second protrusion protruding from a top surface of the package body; In a horizontal direction, the distance between the first protrusion and the second protrusion is less than the distance between the first body and the second body.

2. The packaging structure for optoelectronic components according to claim 1, characterized in that, On the same side, the distance between the first side end face of the first protrusion facing the second protrusion and the first side end face of the first body is less than 100 μm; on the same side, the distance between the second side end face of the second protrusion facing the first protrusion and the second side end face of the second body is less than 100 μm.

3. The packaging structure for optoelectronic components according to claim 1, characterized in that, The height difference between the first bump and the second bump protruding from the top surface of the package is greater than 0 and less than 15 μm.

4. The packaging structure for optoelectronic components according to claim 1, characterized in that, The ratio of the exposed area of ​​the first bump and the second bump to the area of ​​the top surface of the package is 1 / 4 to 1 / 2.

5. The packaging structure for optoelectronic components according to claim 1, characterized in that, The thickness of the package is 0.1 to 0.25 mm.

6. The packaging structure for optoelectronic components according to claim 1, characterized in that, The packaging structure for the optoelectronic component has two opposite sides. The first bracket and the second bracket are combined to form a bracket. Each of the two opposite sides has a centrally located support end, wherein the two centrally located support ends have different electrical properties.

7. The packaging structure for optoelectronic components according to claim 1, characterized in that, The first bracket and the second bracket each include an obliquely extending connecting portion, and the two connecting portions extend across at least half of the package.

8. The packaging structure for optoelectronic components according to any one of claims 1 to 7, characterized in that... The first support has a cross-section in a central vertical plane that is generally in the shape of a first Z-shape, and the second support has a cross-section in the central vertical plane that is generally in the shape of a second Z-shape.

9. A packaging structure for an optoelectronic component, characterized in that, The packaging structure for the optoelectronic components includes: A first support includes a plurality of first bodies, at least one connecting portion and a plurality of first protrusions. The plurality of first bodies are arranged along an arrangement direction, and adjacent first bodies are connected via the at least one connecting portion. The plurality of first protrusions are respectively disposed on the plurality of first bodies. A second support includes a plurality of second bodies and a plurality of second protrusions. The plurality of second bodies are arranged at intervals along the arrangement direction, and the plurality of second protrusions are respectively located on the plurality of second bodies. The first support and the second support are arranged opposite to each other, such that the plurality of first protrusions and the plurality of second protrusions are respectively corresponding to and facing each other, and are mirror-symmetrical. A package body covers the first bracket and the second bracket, and the plurality of first protrusions and the plurality of second protrusions protrude from a top surface of the package body.

10. The packaging structure for an optoelectronic component according to claim 9, characterized in that, The first support has a cross-section in a central vertical plane that is generally in the shape of a first Z-shape, and the second support has a cross-section in the central vertical plane that is generally in the shape of a second Z-shape.

11. The packaging structure for optoelectronic components according to claim 9, characterized in that, The height difference between the plurality of first bumps and the plurality of second bumps protruding from the top surface of the package is greater than 0 and less than 15 μm.

12. The packaging structure for optoelectronic components according to claim 9, characterized in that, The ratio of the total exposed area of ​​the first bump and the second bump to the area of ​​the top surface of the package is 1 / 4 to 1 / 2.

13. The packaging structure for optoelectronic components according to claim 9, characterized in that, The thickness of the package is 0.1 to 0.25 mm.

14. The packaging structure for an optoelectronic component according to any one of claims 9 to 13, characterized in that, The first bracket further includes an extension body and an extension protrusion. The extension body extends in a vertically aligned direction, and the extension protrusion is located on the extension body and protrudes from the top surface of the package. as well as The packaging structure for the optoelectronic component further includes a third support, which is adjacent to the first support but not connected to it. The third support includes a third body and a third protrusion. The third protrusion is located on the third body and is disposed opposite to the extension protrusion. The extension protrusion protrudes from the top surface of the package.

15. A packaging structure for an optoelectronic component, characterized in that, The packaging structure for the optoelectronic components includes: A first support, including a first body and a first central protrusion, is disposed on the first body; and A second bracket, disposed opposite to the first bracket, includes a second body and a second protrusion. The second protrusion is located on the second body, protruding horizontally toward the first central protrusion and extending beyond one end face of the second body; and A package body covers the first bracket and the second bracket, with the first central protrusion and the second protrusion protruding from a top surface of the package body.

16. The packaging structure for optoelectronic components according to claim 15, characterized in that, The first bracket further includes a first lateral protrusion and a first connecting protrusion. The first lateral protrusion, the first central protrusion and the first connecting protrusion are spaced apart on the first body, such that there is a first groove between the first lateral protrusion and the first central protrusion, and a second groove between the first central protrusion and the first connecting protrusion.

17. The packaging structure for optoelectronic components according to claim 15, characterized in that, The second protrusion corresponds to the periphery of the second body and forms a plurality of grooves, including a first side groove, a central groove and a second side groove. The first side groove and the second side groove are mirror-symmetrical about a central line of the central groove.

18. The packaging structure for an optoelectronic component according to claim 15, characterized in that, The distance between the first body and the second body is 0.12 to 0.5 mm; the distance between the first central protrusion and the second protrusion is 0.12 to 0.5 mm.

19. The packaging structure for an optoelectronic component according to claim 15, characterized in that, The first bracket further includes a first lateral protrusion and a first connecting protrusion. The first lateral protrusion, the first central protrusion, and the first connecting protrusion are spaced apart on the first body. The height difference between the first lateral protrusion, the first central protrusion, the first connecting protrusion, and the second protrusion protruding from the top surface of the package is greater than 0 and less than 15 μm.

20. The packaging structure for an optoelectronic component according to any one of claims 15 to 19, characterized in that, The first bracket has a first cantilever connection, and the second bracket has a second cantilever connection. In the horizontal direction, adjacent first brackets and second brackets are connected by adjacent first cantilever connections and second cantilever connections extending obliquely. On a plane, the area where the first bracket is located is defined as a first area, and the area where the second bracket is located is defined as a second area. The first cantilever connection extends to the second area.

21. A photoelectric device, characterized in that, The optoelectronic device includes: Packaging structure for optoelectronic components according to any one of claims 1 to 7; A photoelectric chip is disposed on the top surface of the package and electrically connected to the first bump and the second bump, respectively; and A cover layer is applied to the optoelectronic chip.

22. The photoelectric device according to claim 21, characterized in that, The area corresponding to the first bump and the second bump is defined as the die-bonding area, and the ratio of the surface area of ​​the optoelectronic chip to the die-bonding area is 1-1.

5.

23. The photoelectric device according to claim 21, characterized in that, The cover layer includes a convex lens. When the convex lens is an asymmetric lens with at least two chamfered edges, the visible angles of the photoelectric chip in the two light emission directions are different and the visible angles of the photoelectric chip in the two light emission directions are 50 degrees to 135 degrees.

24. The photoelectric device according to claim 21, characterized in that, The optoelectronic device further includes a reflective layer disposed on the top surface of the package and surrounding the optoelectronic chip.

25. A photoelectric device, characterized in that, The optoelectronic device includes: The packaging structure for optoelectronic components according to claim 8; A photoelectric chip is disposed on the top surface of the package and electrically connected to the first bump and the second bump, respectively; and A cover layer is applied to the optoelectronic chip.

26. A photoelectric device, characterized in that, The optoelectronic device includes: Packaging structure for optoelectronic components according to any one of claims 9 to 13; Multiple optoelectronic chips are disposed on the top surface of the package, and each optoelectronic chip is electrically connected to the second bump and the first bump opposite to the second bump.

27. A photoelectric device, characterized in that, The optoelectronic device includes: The packaging structure for optoelectronic components according to claim 14; An optoelectronic component, comprising a plurality of optoelectronic chips and a white light emitting component, wherein each optoelectronic chip is electrically connected to a first bump and a corresponding second bump, and the white light emitting component is electrically connected to an extended bump and a third bump; and A covering layer is disposed on the optoelectronic component.

28. A photoelectric device, characterized in that, The optoelectronic device includes: The packaging structure for optoelectronic components according to any one of claims 15 to 19; and An optoelectronic chip is disposed on the top surface of the package, electrically contacting the second bump, and electrically connected to the first central bump via a wire.

29. The photoelectric device according to claim 28, characterized in that, The optoelectronic device further includes a reflective layer disposed on the top surface of the package and surrounding the optoelectronic chip.

30. The photoelectric device according to claim 28 or the present invention, characterized in that, The optoelectronic device further includes a cover layer located outside the optoelectronic chip, and the cover layer is a flat lens or a lens with curvature.

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