Multi-station vacuum chuck for electronic component packaging

Abstract

The utility model discloses a vacuum adsorption mould for multi-station electronic component packaging, include: base station, set up the adsorption station that carries out adsorption positioning to electronic component on the base station, be provided with a plurality of adsorption stations on the adsorption station, and each adsorption station includes adsorption head and buffer cover, and the buffer cover is installed on the adsorption head for the suction force of adsorption station to cause rigid damage to electronic component, the bottom of base station is equipped with the vacuum pump for providing the suction force of adsorption station. In the adsorption and placement process, the buffer cover can buffer the impact force between the element and the adsorption station, avoid the element damage due to rigid collision, improve the security and the yield of electronic component in the packaging process, and the buffer cover adopts the integral forming structure of silica gel material, and the silica gel material has good flexibility and elasticity, can better absorb the impact force, further protect the electronic component, and the silica gel material is also more wear -resisting, can prolong the service life of buffer cover.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing equipment technology, specifically to a vacuum adsorption mold for multi-station electronic component packaging. Background Technology

[0002] Electronic components are the basic building blocks of electronic circuits, including resistors, capacitors, inductors, diodes, transistors, and integrated circuits. They possess specific electrical properties and play crucial roles in signal processing, energy conversion, and circuit connections within electronic devices. Electronic component packaging involves encasing electronic components in a specific shell to protect them from physical damage and chemical corrosion, enhance electrical insulation, and facilitate installation and use. Vacuum adsorption molds play a vital role in the electronic component packaging process. Utilizing the pressure difference generated by a vacuum, they precisely adsorb and fix the electronic components in the appropriate position, ensuring stable component positioning during soldering, coating, and assembly stages. This provides the foundation for high-precision, high-quality packaging operations and is an important tool for ensuring the efficiency and quality of electronic component packaging.

[0003] However, most existing vacuum adsorption stages are rigid structures, lacking a buffer mechanism when adsorbing and placing electronic components. This may result in a large impact force between the component and the adsorption stage, which can easily damage some fragile or delicate components. Furthermore, the rigid structure can easily transmit external vibrations to the electronic components on the adsorption stage. During the packaging process, such vibrations may affect the packaging accuracy or even cause the component to shift during adsorption. Utility Model Content

[0004] The purpose of this invention is to provide a vacuum adsorption mold for multi-station electronic component packaging. During the adsorption and placement process, the buffer cover can buffer the impact force between the component and the adsorption stage, avoiding damage to the component due to rigid collision, thereby improving the safety and yield of electronic components during the packaging process. Furthermore, the buffer cover adopts an integral molding structure made of silicone material. Silicone material has good flexibility and elasticity, which can better absorb impact force and further protect electronic components. At the same time, silicone material is also relatively wear-resistant, which can extend the service life of the buffer cover, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] Vacuum adsorption molds for multi-station electronic component packaging, including:

[0007] abutment;

[0008] The base is provided with an adsorption stage for adsorbing and positioning electronic components. The adsorption stage is provided with multiple adsorption stations. Each adsorption station includes an adsorption head and a buffer cover. The buffer cover is installed on the adsorption head to prevent the adsorption force generated by the adsorption stage from causing rigid damage to the electronic components.

[0009] The buffer cover is cone-shaped, wider at the top and narrower at the bottom, and is a one-piece molded structure made of silicone material.

[0010] A vacuum pump is installed at the bottom of the base to provide suction to the adsorption stage.

[0011] Preferably, the adsorption platform is provided with a connecting groove on the periphery of the adsorption head, and the connecting groove is arranged in a ring.

[0012] Preferably, the lower end of the buffer cover is provided with a connecting ring, and the connecting ring and the connecting groove are adapted to install the buffer cover.

[0013] Preferably, a collar is provided at the bottom of the inner cavity of the buffer cover, and an anti-clogging mesh is provided inside the collar to prevent foreign objects from entering the air passage of the adsorption head.

[0014] Preferably, it also includes a cooling mechanism to prevent heat buildup between the adsorption stage and the electronic components. The cooling mechanism includes fins and cooling grooves. Multiple sets of fins are symmetrically arranged on the outer walls of both sides of the adsorption stage, and the cooling grooves are opened on both sides of the stage.

[0015] Preferably, a cooling medium is injected into the cooling tank, and the fins are arranged in an L-shape and extend into the cooling tank.

[0016] Preferably, the lateral portion of the fin has a first notch to allow airflow and improve heat dissipation and cooling capacity, and the vertical portion of the fin has a second notch to increase the contact area of ​​the cooling medium and improve heat dissipation and cooling capacity.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. This utility model effectively prevents the suction force generated by the adsorption table from causing rigid damage to electronic components by setting a buffer cover at each adsorption station. For fragile or precision electronic components, the buffer cover can buffer the impact force between the component and the adsorption table during adsorption and placement, avoiding damage to the component due to rigid collision, thus improving the safety and yield of electronic components in the packaging process. In addition, the buffer cover adopts an integral molding structure of silicone material. Silicone material has good flexibility and elasticity, which can better absorb impact force and further protect electronic components. At the same time, silicone material is also relatively wear-resistant, which can extend the service life of the buffer cover.

[0019] 2. The buffer cover is tapered, wider at the top and narrower at the bottom. This special shape design not only helps to disperse the adsorption force, but also absorbs and blocks the transmission of external vibrations to a certain extent, reducing the impact of external vibrations on the electronic components on the adsorption stage, reducing the risk of component displacement caused by vibration, ensuring the stability of the electronic component position during the packaging process, and thus improving the packaging accuracy. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the connecting groove of this utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the buffer cover of this utility model;

[0023] Figure 4 This is a schematic diagram of the cooling tank structure of this utility model.

[0024] In the diagram: 1. Base; 2. Adsorption stage; 3. Adsorption head; 4. Buffer cover; 5. Connecting groove; 6. Connecting ring; 7. Collar; 8. Anti-clogging mesh; 9. Fin; 10. Cooling tank; 11. First notch; 12. Second notch; 13. Vacuum pump. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-3 This utility model provides a technical solution:

[0027] Vacuum adsorption molds for multi-station electronic component packaging, including:

[0028] Base 1; An adsorption stage 2 for adsorbing and positioning electronic components is mounted on base 1. Adsorption stage 2 has multiple adsorption stations, each including an adsorption head 3 and a buffer cover 4. The buffer cover 4 is mounted on the adsorption head 3 to prevent rigid damage to the electronic components from the suction force generated by the adsorption stage 2. A vacuum pump 13 is installed at the bottom of base 1 to provide suction force to the adsorption stage 2. The buffer cover 4 is tapered at the top and tapered at the bottom, and is a one-piece molded structure made of silicone. A connecting groove 5 is located around the adsorption head 3 on the adsorption stage 2, and the connecting groove 5 is annular. A connecting ring 6 is located at the lower end of the buffer cover 4, and the connecting ring 6 is fitted into the connecting groove 5 for mounting the buffer cover 4.

[0029] The base 1 serves as a supporting component, with the vacuum pump 13 installed at its bottom. During operation, the vacuum pump 13 extracts air from the adsorption stage 2 to create a negative pressure, causing the adsorption head 3 to generate suction, thereby adsorbing and positioning electronic components. The buffer cover 4 is installed on the adsorption head 3 by connecting the lower end of the connecting ring 6 and engaging with the annular connecting groove 5 on the outer periphery of the adsorption head 3. The adsorption stage 2 is equipped with multiple adsorption stations, which can simultaneously adsorb and position multiple electronic components. Compared with a single-station adsorption device, this greatly improves production efficiency, meets the needs of mass production, and helps to improve the overall efficiency of electronic component packaging and reduce production costs.

[0030] The adsorption platform 2 and adsorption head 3 realize the adsorption and fixation function of electronic components. Multiple adsorption stations can process multiple electronic components at the same time, improving work efficiency. The buffer cover 4 is made of silicone material and is a cone shape with a larger top and a smaller bottom. It can buffer the impact force between the electronic components and the adsorption platform 2 to avoid rigid damage. At the same time, it can absorb and block external vibrations to ensure the stability and safety of electronic components during the packaging process.

[0031] Please see Figure 3 :

[0032] A collar 7 is provided at the bottom of the inner cavity of the buffer cover 4, and an anti-clogging mesh 8 is provided inside the collar 7 to prevent foreign objects from entering the air passage of the adsorption head 3.

[0033] An anti-clogging net 8 is installed inside the connecting ring 6 at the bottom of the inner cavity of the buffer cover 4. When the adsorption head 3 generates suction to adsorb electronic components, the airflow will pass through the anti-clogging net 8, which will intercept foreign objects in the airflow.

[0034] This design prevents foreign objects from entering the air passage of the adsorption head 3, avoids air passage blockage affecting the adsorption effect, ensures the normal operation of the adsorption head 3, and extends the service life of the adsorption stage 2.

[0035] Additionally, please see Figure 1 and 4 In the electronic component packaging process, some processes (such as soldering and curing) generate heat. If the adsorption stage 2 is made of a material with poor thermal conductivity and lacks a reasonable heat dissipation structure, heat will accumulate on the adsorption stage 2 and the component, affecting the component's performance and packaging quality. Therefore, this application also includes the following design:

[0036] It also includes a cooling mechanism to prevent heat buildup between the adsorption platform 2 and the electronic components. The cooling mechanism includes fins 9 and cooling tanks 10. Multiple sets of fins 9 are symmetrically arranged on both outer walls of the adsorption platform 2, and the cooling tanks 10 are opened on both sides of the base 1. Cooling medium is injected into the cooling tanks 10, and the fins 9 are arranged in an L-shape and extend into the cooling tanks 10.

[0037] During use, the heat generated during the packaging of electronic components is transferred to the adsorption stage 2. Traditional adsorption stages 2 are mostly made of stainless steel, but in this application, they can be made of aluminum alloy (the same applies to the fins 9). Multiple sets of fins 9 on the outer walls of both sides of the adsorption stage 2 can increase the heat dissipation area and accelerate heat dissipation. The fins 9 extend in an L-shape into the cooling tanks 10 on both sides of the base 1. Cooling medium is injected into the cooling tanks 10. The fins 9 transfer heat to the cooling medium, and the heat is carried away through the heat exchange effect of the cooling medium, thus avoiding heat accumulation between the adsorption stage 2 and the electronic components.

[0038] This design effectively solves the problem of heat accumulation caused by the poor thermal conductivity of the adsorption stage 2 and the unreasonable heat dissipation structure, ensuring that electronic components are packaged in a suitable temperature environment, avoiding the adverse effects of heat on component performance and packaging quality, and improving the stability and reliability of electronic component packaging.

[0039] Please see Figure 4 :

[0040] The lateral portion of the fin 9 has a first notch 11 to allow air circulation and improve heat dissipation and cooling capacity, and the vertical portion of the fin 9 has a second notch 12 to increase the contact area of ​​the cooling medium and improve heat dissipation and cooling capacity.

[0041] The first notch 11 in the lateral portion of the fin 9 alters the airflow path around the fin 9, allowing air to flow more smoothly through it, increasing the contact between the air and the fin 9, and enhancing the air convection cooling effect. Air in the encapsulation environment can quickly carry away heat from the fin 9 through the first notch 11, accelerating the heat transfer process.

[0042] The second notch 12 in the vertical section of the fin 9 effectively increases the contact area between the fin 9 and the cooling medium in the cooling tank 10. More cooling medium can exchange heat with the fin 9, allowing the fin 9 to transfer the heat from the adsorption stage 2 to the cooling medium more quickly, improving the efficiency of heat removal by the cooling medium. This comprehensively enhances the heat dissipation and cooling performance of the cooling mechanism for the adsorption stage 2 and electronic components, better ensuring that electronic components are packaged at suitable temperatures, and ensuring that packaging quality and component performance are not affected by high temperatures.

[0043] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A vacuum adsorption mold for multi-station electronic component packaging, characterized in that, include: abutment(1); The base (1) is provided with an adsorption stage (2) for adsorbing and positioning electronic components. The adsorption stage (2) is provided with multiple adsorption stations. Each adsorption station includes an adsorption head (3) and a buffer cover (4). The buffer cover (4) is installed on the adsorption head (3) so that the suction force generated by the adsorption stage (2) can cause rigid damage to the electronic components. The buffer cover (4) is a cone-shaped structure with a larger top and a smaller bottom, and the buffer cover (4) is a one-piece molded structure made of silicone material; The bottom of the base (1) is equipped with a vacuum pump (13) for providing suction to the adsorption stage (2).

2. The vacuum adsorption mold for multi-station electronic component packaging according to claim 1, characterized in that: The adsorption platform (2) is provided with a connecting groove (5) located around the adsorption head (3), and the connecting groove (5) is arranged in a ring.

3. The vacuum adsorption mold for multi-station electronic component packaging according to claim 2, characterized in that: The lower end of the buffer cover (4) is provided with a connecting ring (6), and the connecting ring (6) and the connecting groove (5) are adapted to install the buffer cover (4).

4. The vacuum adsorption mold for multi-station electronic component packaging according to claim 1, characterized in that: The bottom of the inner cavity of the buffer cover (4) is provided with a collar (7), and an anti-clogging mesh (8) is provided inside the collar (7) to prevent foreign objects from entering the air passage of the adsorption head (3).

5. The vacuum adsorption mold for multi-station electronic component packaging according to claim 1, characterized in that: It also includes a cooling mechanism to prevent heat buildup between the adsorption platform (2) and the electronic components. The cooling mechanism includes fins (9) and cooling tanks (10). Multiple sets of fins (9) are symmetrically arranged on the outer walls of both sides of the adsorption platform (2), and the cooling tanks (10) are opened on both sides of the base (1).

6. The vacuum adsorption mold for multi-station electronic component packaging according to claim 5, characterized in that: Cooling medium is injected into the cooling tank (10), and the fins (9) are arranged in an L-shape and extend into the cooling tank (10).

7. The vacuum adsorption mold for multi-station electronic component packaging according to claim 6, characterized in that: The fin (9) has a first notch (11) in the horizontal part to allow air to circulate and improve heat dissipation and cooling capacity, and the fin (9) has a second notch (12) in the vertical part to increase the contact area of ​​the cooling medium and improve heat dissipation and cooling capacity.

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