A package structure of a power chip
By using a wrapping layer, a phase change liquid cooling unit, and a substrate structure, combined with a thermal interface material layer and a copper sheet layer, the problems of insufficient heat dissipation and weak mechanical properties in traditional power chip packaging structures are solved, achieving efficient heat dissipation and enhanced mechanical properties, and preventing chip damage.
CN224343764UActive Publication Date: 2026-06-09XIAMEN XINJIANENG SEMICONDUCTOR TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN XINJIANENG SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Traditional power chip packaging structures cannot effectively cope with the instantaneous high temperature of the chip, resulting in insufficient heat dissipation performance, weak mechanical properties, and easy damage.
Method used
By employing a wrapping layer, a phase change liquid cooling unit, and a substrate structure, combined with upper and lower thermal interface material layers and copper sheet layers, multi-dimensional heat transfer is achieved. The phase change liquid cooling absorbs heat, enhancing heat dissipation efficiency and mechanical properties.
Benefits of technology
It improves the chip's heat dissipation efficiency and thermal reliability, avoids damage from instantaneous high temperatures, and enhances mechanical performance.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224343764U_ABST
Abstract
The utility model relates to a kind of packaging structure of power chip, comprising: power chip, wrapping layer, phase change liquid cooling unit and substrate;Power chip is placed in wrapping layer, and wrapping layer top is equipped with upper thermal interface material layer;Upper thermal interface material layer is connected with the bottom of phase change liquid cooling unit, and the phase change liquid cooling unit is used to heat dissipation for power chip;The bottom of the power chip is equipped with bonding layer, and the substrate is arranged below the bonding layer, and the substrate includes copper sheet layer and ceramic layer, the copper sheet layer is arranged on the top of the ceramic layer, and the copper sheet layer is connected with the bonding layer.The utility model uses the cooling mode of phase change liquid cooling, in the case where power chip generates instantaneous high power, can absorb a large amount of heat by phase change endothermic mode, reduce the instantaneous high temperature generated by power chip, improve the thermal reliability of power chip packaging.
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