Flexural load plate

CN224343766UActive Publication Date: 2026-06-09KINSUS INTERCONNECT TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
KINSUS INTERCONNECT TECH
Filing Date
2025-08-06
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing circuit boards are prone to bending due to multiple soldering points and heat, resulting in unevenness and poor soldering. Furthermore, existing methods for increasing thickness cannot meet the requirements for reducing the size of electronic products.

Method used

It adopts a combination structure of large-size ceramic substrate, metal layer, resin layer and circuit layer. The flatness and mechanical strength of the carrier board are enhanced by positioning area and through hole design, and the edges and corners are protected by resin layer to avoid cutting damage.

Benefits of technology

It improves the thermal stability and mechanical rigidity of the carrier plate, simplifies the processing flow, shortens the delivery time, reduces thermal expansion and contraction variations, and adapts to the requirements of dense lines and coplanarity.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224343766U_ABST
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Abstract

A kind of anti-flexing carrier plate, including substrate, at least one ceramic plate, multiple metal layers, resin layer, first circuit layer and second circuit layer.The upper surface of substrate defines at least one positioning area, and the number of positioning area is less than six, substrate also has the first through hole of upper surface and lower surface.Ceramic plate is arranged on positioning area respectively, each ceramic plate is provided with multiple second through holes, the area of ceramic plate is 100mm*100mm to 450mm*450mm, and the total area of positioning area is 50% to 85% of substrate area.Each metal layer is at least filled in second through hole.Resin layer is located on the upper surface of substrate and ceramic plate, covers ceramic plate.First circuit layer is located on a part of the surface of resin layer and in the opening of resin layer, and is connected with metal layer.Second circuit layer is located on a part of the lower surface of substrate and in the first through hole, and is connected with metal layer.
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