Package structure, semiconductor module, electronic device, and vehicle

Abstract

This application relates to a packaging structure, a semiconductor module, an electronic device, and a vehicle. The packaging structure includes a packaging housing and terminals. The packaging housing is used to fix the semiconductor module onto the module body to encapsulate the module body. The terminals include a first end, a second end, and a connecting portion connecting the first end and the second end. The connecting portion is injection molded within the packaging housing, and the first end is used for bonding to the module body. By injection molding the connecting portion of the terminals within the packaging housing, this application allows for assembly of the semiconductor module body simply by fixing the packaging structure to the module body and then electrically connecting the first end to the module body. This improves assembly efficiency and solves the problem of low assembly efficiency in the prior art.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a packaging structure, semiconductor module, electronic device, and vehicle. Background Technology

[0002] Semiconductor packaging technology is a crucial step in the semiconductor device manufacturing process. The quality and performance of packaging technology directly affect the performance and stability of semiconductor devices.

[0003] In the prior art, a semiconductor module includes a module body, a package housing, and connection terminals. The package housing is used to encapsulate the module body. One end of the connection terminal is soldered to the module body for electrical connection with the module body, and the other end passes through the package housing and is exposed.

[0004] Typically, there are multiple connection terminals, which need to be connected one by one and then passed through the packaging shell one by one, resulting in low assembly efficiency of this packaging method. Utility Model Content

[0005] This application provides a packaging structure, a semiconductor module, an electronic device, and a vehicle, which improves the assembly efficiency of semiconductor packaging and at least partially solves the above-mentioned technical problems.

[0006] To achieve the above objectives, according to a first aspect of this application, a packaging structure is provided, the packaging structure comprising:

[0007] A packaging shell is used to fix the semiconductor module body to encapsulate the module body;

[0008] A terminal block includes a first end, a second end, and a connecting portion connecting the first end and the second end;

[0009] The connecting portion is embedded in the packaging shell, and the first end is used for bonding connection with the module body.

[0010] Optionally, the packaging housing includes:

[0011] The frame includes a first open end and a second open end opposite to the first open end, and the first open end is fixed to the module body.

[0012] A cover is placed over the second open end;

[0013] The connecting part is embedded in the frame.

[0014] Optionally, the wiring terminal includes a power terminal and a signal terminal, and the cover has a first through-hole and a second through-hole, with the second ends of the power terminal and the signal terminal respectively passing through the first through-hole and the second through-hole.

[0015] Optionally, the cover is provided with markings corresponding to the first opening and the second opening.

[0016] Optionally, the second end of the power terminal passes through the first opening, is bent, and pressed onto the cover.

[0017] Optionally, a fixing groove is formed on the cover, and a fixing hole is formed on the second end of the power terminal. When the second end is pressed onto the cover, the fixing hole corresponds to the fixing groove.

[0018] Optionally, the cover and the frame are snap-fitted together.

[0019] Optionally, one of the cover and the frame is provided with a first engaging portion and the other is provided with a second engaging portion, and the first engaging portion and the second engaging portion engage to snap the cover and the frame together.

[0020] Optionally, the connecting portion is injection molded into the frame.

[0021] According to a second aspect of this application, a semiconductor module is provided, the semiconductor module comprising:

[0022] Module body;

[0023] The packaging structure described above.

[0024] Optionally, the main body of the module includes:

[0025] Base plate;

[0026] A liner plate is fixed to the base plate;

[0027] The chip is fixed to the substrate;

[0028] The liner is bonded to the first end of the terminal block.

[0029] Optionally, the bonding connection is made via leads.

[0030] Optionally, an adhesive layer is provided between the packaging shell and the module body.

[0031] Optionally, the package housing has a first positioning hole, the module body has a second positioning hole corresponding to the first positioning hole, and the semiconductor module further includes a positioning element pressed into the first positioning hole and the second positioning hole.

[0032] Optionally, the positioning element is a pressure ring, one end of which is pressed onto the encapsulation housing, and the other end is fixed in the first positioning hole and the second positioning hole.

[0033] According to a third aspect of this application, an electronic device is provided, the electronic device comprising the semiconductor module or the packaging structure described above.

[0034] According to a third aspect of this application, a means of transportation is provided, the means of transportation including the semiconductor module or the packaging structure described above.

[0035] The packaging structure, semiconductor module, electronic device, and vehicle of this application embodiment, by injection molding the connection part of the terminal block into the packaging shell, can complete the assembly by simply fixing the packaging structure to the module body and then electrically connecting the first end to the module body when packaging the main body of the semiconductor module. This improves the packaging assembly efficiency and solves the technical problem of low assembly efficiency caused by the prior art packaging technology requiring the electrode terminals to be connected one by one and then passed through the packaging shell one by one.

[0036] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0039] Figure 1 This is a schematic diagram of the overall structure of an encapsulation structure provided in an exemplary embodiment of this application;

[0040] Figure 2 yes Figure 1 A schematic diagram of the frame structure of the encapsulation structure in the diagram;

[0041] Figure 3 yes Figure 1 A schematic diagram of the cover structure of the encapsulation structure in the image;

[0042] Figure 4 for Figure 3 A structural schematic diagram of the cover from another perspective;

[0043] Figure 5 This is a schematic diagram of the overall structure of a semiconductor module provided in the exemplary embodiment two of this application;

[0044] Figure 6 for Figure 5 A cross-sectional view of the semiconductor module.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100. Semiconductor modules;

[0047] 10. Packaging structure;

[0048] 11. Encapsulation housing; 111. Frame; 1111. First opening end; 1112. Second opening end; 113. Cover; 1131. First through-hole; 1132. Second through-hole; 1133. Fixing groove; 1134. Mark; 115. First engaging part; 117. Second engaging part;

[0049] 13. Terminal block; 131. First end; 132. Second end; 133. Connecting part; 135. Power terminal; 1351. Mounting hole; 137. Signal terminal;

[0050] 151. First positioning hole; 152. Second positioning hole; 153. Positioning element;

[0051] 20. Module body; 21. Base plate; 23. Liner plate; 25. Chip; 27. Bonding wire. Detailed Implementation

[0052] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0053] This application provides a packaging structure 10 for packaging a module body 20, such as... Figure 1 As shown, Figure 1 This is a schematic diagram of the packaging structure 10 provided in an embodiment of this application.

[0054] The encapsulation structure 10 includes an encapsulation housing 11 and a terminal block 13.

[0055] The encapsulation housing 11 is typically made of a plastic insulating material and formed by injection molding. The encapsulation housing 11 can be made of thermosetting plastics such as epoxy resin and phenolic resin, or thermoplastic plastics such as polyimide and polyphenylene sulfide. Epoxy resin has good adhesion and electrical properties and is one of the most widely used plastic encapsulation materials; polyimide has excellent high-temperature resistance and mechanical properties, making it suitable for high-end semiconductor packaging.

[0056] The encapsulation housing 11 is used to fix the module body 20 of a semiconductor module and encapsulate the module body 20 to protect the chip on the module body 20 from physical damage and external contamination; it can also realize electrical connection, heat dissipation, electromagnetic shielding and other functions, and facilitate the assembly and testing of the semiconductor module to ensure stable chip operation.

[0057] Terminal 13 is used for electrical connection. Terminal 13 connects the circuitry within the main body 20 of the semiconductor module to an external circuit system, allowing current, signals, etc., to be transmitted between them, enabling the main body 20 of the semiconductor module to work in conjunction with other electronic components. Terminal 13 includes a first end 131, a second end 132, and a connecting portion 133, which connects the first end 131 and the second end 132.

[0058] The connecting part 133 is embedded in the encapsulation housing 11, and the first end 131 of the wiring terminal 13 is used for electrical connection with the module body 20.

[0059] In other words, the middle part of the terminal block 13 is enclosed in the package housing 11, while the two ends can be exposed or enclosed in the package housing 11. Only a through hole needs to be left to electrically connect with the first end 131 and the second end 132, so as to facilitate connection with other circuits. In this way, one end can be used to connect with the packaged module body 20, and the other end can be used to connect with external circuits to connect the semiconductor module to other circuit systems.

[0060] In some embodiments, the connector 133 is injection molded into the package housing 11. The connector 133 can be injection molded into the package housing 11 using the following methods:

[0061] Method 1: Injection Molding with Inserts.

[0062] Molding principle: Before plastic injection molding, the terminal 13 is placed in the mold. After the molten plastic is injected, the plastic wraps the connection part 133 of the terminal 13 and cools and solidifies to form an integrated structure.

[0063] This method is suitable for mass production, and the products formed in this way have high strength.

[0064] Method 2: Thermoforming Insertion.

[0065] Specifically, the plastic is softened by heating and then molded to embed into a metal part. Specifically, the encapsulation housing 11 is heated to its softening point (e.g., by using a hot plate or hot air), and the connection portion 133 of the terminal block 13 is pressed into the target position. After cooling, the plastic solidifies and fixes itself. Alternatively, high-frequency heat energy is generated by ultrasonic vibration to locally melt the surface of the encapsulation housing 11, quickly pressing the connection portion 133 of the terminal block 13 into place. After cooling, a strong bond is formed.

[0066] In this embodiment, the number of terminals 13 is not limited. The number of terminals 13 can be set as needed, such as three or five, etc., and is not limited here. The first end 131 of each terminal 13 is used to connect to the encapsulated module body 20, and the second end 132 can be used to connect to an external circuit. The connecting portion 133 on each terminal 13 that connects the first end 131 and the second end 132 is injection molded into the encapsulation housing 11. In this embodiment, the number of terminals 13 is seven.

[0067] Furthermore, the first end 131 of the terminal block 13 is bonded to the module body 20, that is, in this application, the first end 131 of the terminal block 13 is connected to the module body 20 by a bonding wire 27.

[0068] Bonding connection refers to the technology of electrically connecting the electrodes on the module body 20 to the first end 131 of the terminal 13. Typically, lead wires are used as bonding wires 27. The lead wires are metal wires such as aluminum wires or copper wires. Through ultrasonic bonding, a reliable physical and electrical connection is formed between the electrodes on the module body 20 and the first end 131 of the terminal 13, realizing signal transmission and power supply between the module body 20 and the external circuit. The bonding connection method has the advantages of high precision, high reliability and good electrical performance, which can ensure that the chip can accurately and error-free communicate with the external circuit after packaging.

[0069] The packaging structure 10 provided in this application, by injection molding the connecting part 133 of the terminal 13 into the packaging shell 11, only needs to fix the packaging structure 10 on the module body 20 when packaging the semiconductor module body 20, and then electrically connect the first end 131 to the module body 20 to complete the assembly. This improves the packaging assembly efficiency and solves the technical problem of low assembly efficiency caused by the prior art packaging technology requiring the electrode terminals to be connected one by one and then the electrode terminals to be passed through the packaging shell one by one.

[0070] Furthermore, by molding the connection portion 133 of the terminal block 13 into the encapsulation housing 11, compared to the method where the terminal block is not molded into the encapsulation housing, the connection portion 133 molded into the encapsulation housing 11 can improve the strength and impact resistance of the connection portion, thereby further improving the stability of the connection.

[0071] Furthermore, the first end 131 of the terminal block 13 in this application is bonded to the module body 20. The bonding process is simpler than soldering and has advantages such as high precision, high reliability and good electrical performance. It can ensure that the chip can accurately interact with the external circuit after packaging and is easier to test and troubleshoot.

[0072] Bonding connections are made using lead wires. Bonding connection refers to the technique of electrically connecting the electrodes on the module body 20 to the first end 131 of the terminal block 13. Lead wires, such as aluminum wires or copper wires, are typically used as bonding wires 27 and are connected by ultrasonic bonding.

[0073] The following is a detailed description of the specific structure of the encapsulation housing 11.

[0074] In some embodiments, the encapsulation housing 11 includes a frame 111 and a cover 113.

[0075] like Figure 2 As shown, the frame 111 includes a first open end 1111 and a second open end 1112 opposite to the first open end 1111. The first open end 1111 is fixed to the module body 20. The frame 111 is generally in the shape of a panel. When fixed to the module body 20, it encloses the electronic components that need to be packaged on the module body 20 within it, so as to facilitate the packaging of the module body 20.

[0076] Specifically, the connection portion 133 of the terminal block 13 is specifically injection molded inside the frame 111, and both ends of the terminal block 13 are exposed outside the frame 111.

[0077] like Figure 3 and Figure 4 As shown, the cover 113 is placed on the second opening end 1112 of the frame 111 to close the second opening end 1112 of the frame 111 and encapsulate the module body 20.

[0078] During assembly, the first open end 1111 of the frame 111 is fixed to the module body 20, and then the first end 131 of the terminal block 13 is connected to the module body 20, specifically by a keying connection. After the connection is completed, the cover 113 is placed on the second open end 1112 of the frame 111. By providing the second open end 1112 on the frame 111 and the cover 113 on the second open end 1112, it is convenient to connect the first end 131 of the terminal block 13 to the module body 20 when the frame 111 is fixed to the module body 20, providing operating space for connecting the first end 131 of the terminal block 13 to the module body 20.

[0079] The frame 111 forms a robust enclosure around the module body 20, providing physical protection on the sides to prevent the module body 20 from being impacted or scratched. The cover 113 covers the top of the module body 20, protecting the front of the module body 20 from dust, moisture, and other contaminants. This combined structure provides all-around protection for the module body 20, improving its reliability and stability.

[0080] Furthermore, by configuring the packaging housing 11 to include a frame 111 and a cover 113, this structure is relatively simple and facilitates manufacturing and assembly. The frame 111 and the cover 113 can be processed separately and then assembled, which helps to improve production efficiency and reduce costs. At the same time, during the assembly process, the structure of the frame 111 and the cover 113 also facilitates the alignment and fixation of the module body 20, as well as the connection with external circuits, improving the accuracy and consistency of the packaging.

[0081] In some embodiments, specifically, the terminal block 13 includes two types of terminals: a power terminal 135 and a signal terminal 137.

[0082] The power terminal 135 is mainly used to provide power to the module body 20, undertaking the task of transmitting large currents to meet the energy requirements for the normal operation of various circuit components within the module body 20. It can stably deliver electrical energy from the external power source to the module body 20, ensuring that the module body 20 has sufficient power to perform various functions. Simultaneously, the power terminal is also responsible for conducting away the heat generated by the module body 20 during operation through the heat dissipation path, preventing overheating of the module body 20 due to power loss and ensuring that the module body 20 operates stably within the normal temperature range.

[0083] The main function of signal terminal 137 is to enable signal transmission between the module body 20 and other external devices or chips. These signals can be electrical signals used to control the on and off of the module body 20, enabling the module body 20 to work in conjunction with surrounding electronic components, thereby realizing the complex functions of the entire electronic system.

[0084] When the terminal block 13 includes a power terminal 135 and a signal terminal 137, a first through-hole 1131 and a second through-hole 1132 are provided on the cover 113, and the second ends 132 of the power terminal 135 and the signal terminal 137 are respectively inserted into the first through-hole 1131 and the second through-hole 1132.

[0085] The size of the opening is adapted to the terminal. For example, if the signal terminal 137 is smaller, the second opening 1132 is also set to be smaller. If the power terminal 135 is larger, the first opening 1131 is also set to be larger.

[0086] Because the semiconductor module 100 needs to connect to other circuit systems, the position of the second end 132 of the terminal block 13 also needs to be adapted to the terminals of other circuit systems. In this embodiment, the projection of the frame 111 onto the module body 20 is approximately rectangular. The signal terminal 137 is located on the short side of the frame 111, while the power terminal 135 is located on the long side of the frame 111. In other embodiments, to accommodate connections to circuit systems with different structures or terminal positions, the positions of the terminals can be adjusted as needed. For example, the power terminal 135 can be located on the short side, and the signal terminal 137 on the long side, or both the power terminal 135 and the signal terminal 137 can be located on either the long or short side. Of course, it is understood that the frame 111 may not distinguish between long and short sides; that is, the projection of the frame 111 onto the module body 20 may not be rectangular, but rather other shapes such as squares, circles, polygons, or other regular or irregular shapes. These are not exhaustively listed here.

[0087] Furthermore, in this embodiment, there are four signal terminals 137, which are arranged side-by-side on one short side of the frame 111. There are also three power terminals 135, which are arranged side-by-side on one long side of the frame 111. It is understood that the number of terminals 13 may not be three or four; the specific number can be set as needed and is not specifically limited here.

[0088] In other embodiments, terminal 13 may be other terminals, not limited to signal terminal 137 and power terminal 135.

[0089] In some embodiments, since there are multiple power terminals 135 and signal terminals 137, in order to avoid connection confusion when connecting to terminals of other circuit systems, this application provides markings 1134 on the cover 113 corresponding to the first through-hole 1131 and the second through-hole 1132. In this way, after the power terminals 135 and signal terminals 137 pass through the cover 113, they can be directly connected to terminals of other circuit systems according to the markings 1134 without further differentiation, thereby further improving assembly efficiency.

[0090] In some embodiments, the second end 132 of the signal terminal 137 can be used to connect to terminals of other circuit systems simply by passing through the second through-hole 1132. However, the second end 132 of the power terminal 135, after passing through the first through-hole 1131, needs to be bent and pressed onto the cover 113 before it can be used to connect to terminals of other circuit systems. By passing the second end 132 of the power terminal 135 through the first through-hole 1131 and bending it to press it onto the cover 113, it is easier to connect to terminals of other circuit systems.

[0091] In some embodiments, for secure connection to terminals of other circuit systems, a fixing groove 1133 is provided on the cover 113, and a fixing hole 1351 is provided on the second end 132 of the power terminal 135. When the second end 132 of the power terminal 135 is pressed onto the cover 113, the fixing hole 1351 corresponds to the fixing groove 1133. When connection to terminals of other circuit systems is required, the terminals of other electronic systems contact the power terminal 135, and then a fastener such as a nut or bolt passes through the terminals of the other electronic systems, passes through the fixing hole 1351, and is fixed in the fixing groove 1133, thereby securely connecting the terminals of other electronic systems to the power terminal 135.

[0092] In some embodiments, to make the connection between the cover 113 and the frame 111 more secure, the cover 113 is configured to snap-fit ​​with the frame 111, thereby securing the cover 113 to the frame 111 firmly. In other embodiments, the cover 113 can also be fixed to the frame 111 in other ways, such as by adding fasteners.

[0093] Specifically, one of the cover 113 and the frame 111 is provided with a first engaging part 115, and the other is provided with a second engaging part 117. The first engaging part 115 and the second engaging part 117 engage to fasten the cover (113) and the frame 111. In this embodiment, the first engaging part 115 is provided on the cover 113, and its specific structure is a hook. The second engaging part 117 is provided on the frame 111, and its specific structure is a buckle. When the cover 113 is placed on the frame 111, the hook engages with the buckle to fix the cover 113 to the frame 111.

[0094] like Figure 5 and Figure 6 As shown, this application also provides a semiconductor module 100, which includes a module body 20 and a packaging structure 10. The packaging structure 10 in this semiconductor module 100 has all the beneficial effects of the packaging structure 10 described above, and will not be repeated here.

[0095] The semiconductor module 100 provided in this application, by injection molding the connection portion 133 of the terminal 13 into the packaging housing 11, only needs to fix the packaging structure 10 onto the module body 20 when packaging the module body 20, and then electrically connect the first end 131 to the module body 20 to complete the assembly. This improves the packaging assembly efficiency and solves the technical problem of low assembly efficiency caused by the prior art packaging technology requiring the electrode terminals to be connected one by one and then the electrode terminals to be passed through the packaging housing one by one.

[0096] In some embodiments, the module body 20 includes a base plate 21, a backing plate 23, and a chip 25. The backing plate 23 is fixed to the base plate 21, the chip 25 is fixed to the backing plate 23, and the backing plate 23 is bonded to the first end 131 of the terminal block 13. The backing plate 23 can be a copper backing plate. The bonding connection process is simpler than soldering, easier to test and troubleshoot, and offers higher reliability.

[0097] Chip 25 can be one or more of the following: IGBT chip, FRD chip, MOSFET, etc.

[0098] In some embodiments, an adhesive layer is provided between the encapsulation housing 11 and the module body 20. By providing an adhesive layer between the encapsulation housing 11 and the module body 20, a strong bond is not only provided between the encapsulation housing 11 and the module body 20, ensuring the stability and reliability of the module body 20, but it also provides multiple functions such as electrical insulation protection and isolation from environmental corrosion. Specifically, the adhesive layer is typically a sealant.

[0099] In some embodiments, the package housing 11 has a first positioning hole 151, and the module body 20 has a second positioning hole 152 corresponding to the first positioning hole 151. The semiconductor module 100 also includes a positioning member 153 pressed into the first positioning hole 151 and the second positioning hole 152. When connecting the package housing 11 to the module body 20, the first positioning hole 151 and the second positioning hole 152 are first aligned, and the positioning member is placed in the first positioning hole 151 and the second positioning hole 152 to determine the relative positional relationship between the package housing 11 and the module body 20. Then, bonding, fixing, etc., can be performed. In this embodiment, a first positioning hole 151 is provided at each of the rectangular ends of the package housing 11. In other embodiments, the number of first positioning holes 151 can be set as needed, such as three, or they can be set at both ends of the shorter direction of the package housing 11.

[0100] In some embodiments, the positioning element (153) is specifically a pressure ring. One end of the pressure ring is pressed onto the encapsulation housing 11, and the other end is fixed in the first positioning hole 151 and the second positioning hole 152, thereby fixing the encapsulation housing 11 and the module body 20 to avoid relative displacement between the encapsulation housing 11 and the module body 20, and improving the stability of the connection between the encapsulation housing 11 and the module body 20.

[0101] The packaging structure 10 and semiconductor module 100 provided in this application, by injection molding the connection portion 133 of the terminal 13 into the packaging housing 11, only need to fix the packaging structure 10 on the module body 20 when packaging the module body 20, and then electrically connect the first end 131 to the module body 20 to complete the assembly, which improves the packaging assembly efficiency and solves the technical problem of low assembly efficiency caused by the prior art packaging technology requiring the electrode terminals to be connected one by one and then the electrode terminals to be passed through the packaging housing one by one.

[0102] This application also provides an electronic device, which includes the semiconductor module 100 or the packaging structure 10 described above. The semiconductor module 100 in this electronic device has all the beneficial effects of the semiconductor module 100 or the packaging structure 10 described above, which will not be repeated here. The electronic device can be a welding machine, a computer, etc.

[0103] The electronic device provided in this application solves the technical problem of low assembly efficiency caused by the prior art electronic device's semiconductor module requiring the electrode terminals to be connected one by one during packaging and then the electrode terminals to be passed through the packaging shell one by one during packaging, by using a semiconductor module 100 or a packaging structure 10.

[0104] This application also provides a means of transportation, which includes the semiconductor module 100 or the packaging structure 10 described above. The semiconductor module 100 in this means of transportation has all the beneficial effects of the semiconductor module 100 or the packaging structure 10 described above, and will not be repeated here. The means of transportation may be a car, a transport vehicle, a bus, a ship, etc.

[0105] The vehicle provided in this application solves the technical problem of low assembly efficiency caused by the prior art vehicle semiconductor module requiring the electrode terminals to be connected one by one and then passed through the package shell one by one during the packaging process by adopting semiconductor module 100 or package structure 10.

[0106] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0107] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0108] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0109] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A packaging structure, characterized in that, The packaging structure includes: A packaging housing is used to fix the semiconductor module body to encapsulate the module body; A terminal block includes a first end, a second end, and a connecting portion connecting the first end and the second end; The connecting portion is embedded in the packaging shell, and the first end is used for bonding connection with the module body.

2. The packaging structure according to claim 1, characterized in that, The packaging housing includes: The frame includes a first open end and a second open end opposite to the first open end, and the first open end is fixed to the module body; A cover is placed over the second open end; The connecting part is embedded in the frame.

3. The packaging structure according to claim 2, characterized in that, The terminal block includes a power terminal and a signal terminal. The cover has a first through-hole and a second through-hole, and the second ends of the power terminal and the signal terminal are respectively inserted into the first through-hole and the second through-hole.

4. The packaging structure according to claim 3, characterized in that, The cover is provided with markings corresponding to the first opening and the second opening.

5. The packaging structure according to claim 3, characterized in that, The second end of the power terminal passes through the first opening, is bent, and pressed onto the cover.

6. The packaging structure according to claim 5, characterized in that, A fixing groove is formed on the cover, and a fixing hole is formed on the second end of the power terminal. When the second end is pressed onto the cover, the fixing hole corresponds to the fixing groove.

7. The packaging structure according to any one of claims 2-6, characterized in that, The cover and the frame are snapped together.

8. The packaging structure according to claim 7, characterized in that, One of the cover and the frame is provided with a first engaging part, and the other is provided with a second engaging part. The first engaging part and the second engaging part engage to fasten the cover and the frame together.

9. The packaging structure according to any one of claims 1-6, characterized in that, The connecting part is injection molded into the frame.

10. A semiconductor module, characterized in that, The semiconductor module includes: Module body; The packaging structure as described in any one of claims 1-9.

11. The semiconductor module according to claim 10, characterized in that, The main body of the module includes: Base plate; A liner plate is fixed to the base plate; The chip is fixed to the substrate; The liner is bonded to the first end of the terminal block.

12. The semiconductor module according to claim 10, characterized in that, The bonding connection is made by means of leads.

13. The semiconductor module according to claim 10, characterized in that, An adhesive layer is provided between the packaging shell and the module body.

14. The semiconductor module according to any one of claims 10-13, characterized in that, The packaging shell has a first positioning hole, the module body has a second positioning hole corresponding to the first positioning hole, and the semiconductor module also includes a positioning element pressed into the first positioning hole and the second positioning hole.

15. The semiconductor module according to claim 14, characterized in that, The positioning element is a pressure ring, one end of which is pressed onto the encapsulation housing, and the other end is fixed in the first positioning hole and the second positioning hole.

16. An electronic device, characterized in that, The electronic device includes a semiconductor module as described in any one of claims 10-15 or a packaging structure as described in any one of claims 1-9.

17. A means of transportation, characterized in that, The vehicle includes a semiconductor module as described in any one of claims 10-15 or a packaging structure as described in any one of claims 1-9.

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