Packaging structure and electronic device
By setting annular reinforcements on the first and second sides of the substrate, the warping problem of the packaging structure is solved, the yield and reliability of the chip are improved, and the overall stability and heat dissipation performance of the packaging structure are enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MOORE THREADS TECH CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-09
AI Technical Summary
As chip integration increases, packaging structure warping becomes a serious problem, affecting chip yield and reliability. Existing reinforcement ring or reinforcement cover solutions have limited effectiveness.
A first reinforcing member is provided on the first side of the substrate and a second reinforcing member is provided on the second side to form a ring structure. Together, they reduce warpage and improve the yield and reliability of chip packaging.
The combination of the first and second reinforcing members significantly reduces substrate warpage, improves chip packaging yield and reliability, enhances structural integrity and stability, and improves chip heat dissipation performance.
Smart Images
Figure CN224343776U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of semiconductor technology, and more specifically, to a packaging structure and an electronic device. Background Technology
[0002] As chip integration becomes increasingly sophisticated, the size of the packaging structure gradually increases. At the same time, the mismatch in the coefficients of thermal expansion (CTE) of different materials in the packaging structure leads to increasingly severe warping of the packaging structure.
[0003] In related technologies, the warpage of the packaging structure can be reduced by arranging reinforcing rings or reinforcing caps connected to the substrate in the circumferential direction of the chip. However, as the size of the packaging structure increases, the warpage problem of the packaging structure remains serious and affects the yield and reliability of the chip. Utility Model Content
[0004] The purpose of this disclosure is to provide a packaging structure and an electronic device, wherein the packaging structure reduces the warpage of the substrate in the packaging structure and improves the yield and reliability of chip packaging by means of a first reinforcing member disposed on a first side of the substrate and a second reinforcing member disposed on a second side of the substrate.
[0005] To achieve the above objectives, according to a first aspect of this disclosure, a packaging structure is provided, comprising:
[0006] The substrate includes opposing first and second sides;
[0007] A chip is disposed on a first side of the substrate; and
[0008] The reinforcement component includes a first reinforcement member and a second reinforcement member. The first reinforcement member is disposed on the first side of the substrate and surrounds the circumference of the chip. The second reinforcement member is disposed on the second side of the substrate.
[0009] Optionally, the projection of the second reinforcing member onto the plane of the substrate surrounds the circumference of the projection of the chip onto the plane of the substrate.
[0010] Optionally, the first reinforcing member is constructed as a first reinforcing ring;
[0011] The second reinforcing member is constructed as a second reinforcing ring.
[0012] Optionally, the first reinforcing ring and / or the second reinforcing ring are bonded or welded to the substrate.
[0013] Optionally, the projections of the first reinforcing ring and the second reinforcing ring onto the plane of the substrate at least partially overlap.
[0014] Optionally, the width of the second reinforcing ring is smaller than the width of the first reinforcing ring.
[0015] Optionally, the first reinforcing member is constructed as a reinforcing cover, and the chip is located inside the receiving space formed by the reinforcing cover and the substrate.
[0016] Optionally, the gap between the side of the chip facing away from the substrate and the reinforcing cover is filled with a thermally conductive layer.
[0017] Optionally, the second side of the substrate is further provided with solder balls, and the thickness of the second reinforcing member is less than the thickness of the solder balls.
[0018] According to a second aspect of this disclosure, an electronic device is also provided, including the above-described packaging structure.
[0019] The packaging structure disclosed herein includes a substrate, a chip, and reinforcing components. The reinforcing components include a first reinforcing member surrounding the chip and connected to a first side of the substrate, and a second reinforcing member connected to a second side of the substrate. Both the first reinforcing member and the chip are located on the first side of the substrate, reducing the impact of substrate warping on the chip. Simultaneously, the second reinforcing member is located on the second side of the substrate, further reducing substrate warping in the packaging structure and improving chip packaging yield and reliability.
[0020] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description
[0021] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:
[0022] Figure 1 These are top views of some packaging structures in related technologies;
[0023] Figure 2 These are side views of some packaging structures in related technologies;
[0024] Figure 3 These are bottom views of some packaging structures in related technologies;
[0025] Figure 4 These are side views of other packaging structures in related technologies;
[0026] Figure 5 This is a top view of the packaging structure provided in some embodiments of this disclosure;
[0027] Figure 6 This is a side view of the packaging structure provided in some embodiments of this disclosure;
[0028] Figure 7 This is a bottom view of the packaging structure provided in some embodiments of this disclosure;
[0029] Figure 8 This is a side view of the packaging structure provided in some other embodiments of this disclosure.
[0030] Explanation of reference numerals in the attached figures
[0031] 100 - Substrate; 101 - First side surface; 102 - Second side surface;
[0032] 200-chip;
[0033] 310 - First reinforcing member; 311 - First reinforcing ring; 312 - Reinforcing cover; 320 - Second reinforcing member; 321 - Second reinforcing ring;
[0034] 400 - Thermal conductive layer;
[0035] 500-welding ball. Detailed Implementation
[0036] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.
[0037] In this disclosure, unless otherwise stated, directional terms such as "upper," "lower," "left," and "right" generally refer to upper, lower, left, and right relative to the figures; "inner" and "outer" refer to the inside and outside of the outline of the corresponding component; and "far" and "near" refer to the corresponding structure or component being away from or near another structure or component. Furthermore, the terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance implications. In addition, in the following description, when referring to the figures, unless otherwise explained, the same reference numerals in different figures denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting this disclosure.
[0038] In related technologies, warpage of the packaging structure is reduced by circumferentially arranging a first reinforcing ring 311 or a reinforcing cover 312 connected to the substrate 100 on the chip 200. For example... Figures 1 to 3 As shown, chip 200 is disposed on the upper surface of substrate 100, and a first reinforcing ring 311 is also disposed on the upper surface of substrate 100, and the first reinforcing ring 311 is disposed in the circumferential direction of chip 200. Figure 4As shown, chip 200 is disposed on the upper surface of substrate 100, and a reinforcing cover 312 is also disposed on the upper surface of substrate 100. The reinforcing cover 312 is disposed in the circumferential direction of chip 200 and is connected to chip 200 and reinforcing cover 312 through thermal conductive layer 400 for heat dissipation. However, with the increase of package structure size, the warpage problem of package structure is still serious, affecting the yield and reliability of chip 200. The warpage problem of package structure also directly affects the thickness of thermal conductive layer 400 (e.g., thermal interface material, TIM) of chip 200, becoming a pain point for heat dissipation of chip 200.
[0039] The purpose of this disclosure is to provide a packaging structure and an electronic device, wherein the packaging structure reduces the warpage of the substrate 100 in the packaging structure and improves the yield and reliability of the chip 200 packaging by means of a first reinforcing member 310 provided on the first side 101 of the substrate 100 and a second reinforcing member 320 provided on the second side 102.
[0040] To achieve the above objectives, such as Figures 5 to 8 As shown, according to a first aspect of this disclosure, a packaging structure is provided, which may include a substrate 100, a chip 200, and a reinforcing component. The substrate 100 includes opposing first side 101 and second side 102; the chip 200 is disposed on the first side 101 of the substrate 100; the reinforcing component includes a first reinforcing member 310 and a second reinforcing member 320, the first reinforcing member 310 being disposed on the first side 101 of the substrate 100 and surrounding the circumference of the chip 200, and the second reinforcing member 320 being disposed on the second side 102 of the substrate 100.
[0041] The packaging structure disclosed herein includes a substrate 100, a chip 200, and reinforcing components. The reinforcing components include a first reinforcing member 310 surrounding the chip 200 and connected to a first side 101 of the substrate 100, and a second reinforcing member 320 connected to a second side 102 of the substrate 100. The first reinforcing member 310 and the chip 200 are both located on the first side 101 of the substrate 100, reducing the impact of warpage deformation of the substrate 100 on the chip 200. Simultaneously, the second reinforcing member 320 is located on the second side 102 of the substrate 100, further reducing warpage of the substrate 100 in the packaging structure and improving the yield and reliability of the chip 200 packaging.
[0042] It should be noted that, as Figure 6 As shown, the upper surface of the substrate 100 is the first side surface 101, and the lower surface of the substrate 100 is the second side surface 102. The substrate 100 can be a silicon interposer or a redistribution layer (RDL) for connecting the chip 200 to the printed circuit board.
[0043] Understandably, chip 200 may include logic chips and / or memory chips, where logic chips may include, for example, a GPU (Graphics Processing Unit), a CPU (Central Processing Unit), or a SOC (System on a Chip). Memory chips may also include HBM (High Bandwidth Memory), which employs 3D stacking technology to vertically stack multiple DRAM chips and achieves high-speed interconnection between memory chips through through-silicon vias (TSVs). This stacking method significantly shortens the signal transmission distance between memory chips, thereby significantly improving memory bandwidth.
[0044] The second reinforcing member 320 can be constructed in any suitable manner. For example, in some embodiments, the second reinforcing member 320 can be a ring-shaped member, and the projection of the second reinforcing member 320 onto the plane of the substrate 100 surrounds the circumference of the projection of the chip 200 onto the plane of the substrate 100. The first side 101 of the substrate 100 is provided with the chip 200, and the first reinforcing member 310 is arranged circumferentially on the chip 200 and connected to the substrate 100 to reduce the impact of substrate 100 deformation on the chip 200. The second side 102 of the substrate 100 is also provided with the second reinforcing member 320, which can also be a ring-shaped member (i.e., a second reinforcing ring 321). Its projection onto the substrate 100 also surrounds the circumference of the projection of the chip 200 onto the substrate 100. Through the combined action of the first reinforcing member 310 and the second reinforcing member 320, the warpage deformation of the substrate 100 is further limited, improving the yield and reliability of the chip 200.
[0045] The projection of the second reinforcing member 320 onto the plane of the substrate 100 specifically refers to the projection pattern formed by projecting the second reinforcing member 320 in a direction perpendicular to the plane of the substrate 100. This projection pattern can intuitively reflect the relative position and coverage area of the second reinforcing member 320 on the plane of the substrate 100. Similarly, the projection of the chip 200 onto the plane of the substrate 100 involves projecting the chip 200 in a direction perpendicular to the plane of the substrate 100, thereby obtaining the projection area of the chip 200 on that plane. This projection area clearly defines the positional range occupied by the chip 200 on the plane of the substrate 100.
[0046] As described above, the projection pattern of the second reinforcing member 320 on the plane of the substrate 100 presents a layout that surrounds the chip 200 around the projection area on that plane. Similarly, since the first reinforcing member 310 is arranged around the chip 200, its projection pattern on the plane of the substrate 100 also presents a layout that surrounds the chip 200 around the projection area on that plane. In other words, the projections of the first and second reinforcing members 310 and 320 surround the chip 200 from all sides. This layout is significant. On the one hand, it provides comprehensive support and protection for the chip 200, effectively dispersing external stresses that the chip 200 may experience during operation and reducing the risk of damage due to stress concentration. On the other hand, it enhances the integrity and stability of the entire packaging structure, making the connections between components more robust and contributing to improved yield and reliability of the chip 200.
[0047] like Figure 5 and Figure 6 As shown, in some embodiments, the first reinforcing member 310 is constructed as a first reinforcing ring 311; the second reinforcing member 320 is constructed as a second reinforcing ring 321. Both the first reinforcing member 310 and the second reinforcing member 320 are reinforcing ring structures, i.e., closed shapes, which can better withstand forces from multiple directions within the plane where different substrates 100 are located, further reducing warping. The reinforcing ring can be circular, elliptical, or other irregularly shaped ring structures, and can be configured according to the specific shape of the chip 200. For example... Figure 5 As shown, chip 200 can be rectangular, and correspondingly, the first reinforcing ring 311 and the second reinforcing ring 321 can also be constructed as rectangular rings.
[0048] It should be noted that the first reinforcing ring 311 and the second reinforcing ring 321 can be integrally formed ring structures. Alternatively, they can be multiple separate structures connected together by any suitable fixing method, for example, a rectangle formed by four strips welded together.
[0049] In other embodiments, the second reinforcing member 320 can also be in other structural forms. For example, it can be two strips arranged crosswise on the second side 102, with the intersection point corresponding to the chip 200 in the thickness direction of the substrate 100, which can also reduce the warping of the substrate 100. Of course, the second reinforcing member 320 can also be multiple crosswise arranged ribs or ribs, which can also reduce the warping deformation of the substrate 100.
[0050] The first reinforcing ring 311 and the second reinforcing ring 321 can be connected to the substrate 100 in any suitable manner. Optionally, the first reinforcing ring 311 and / or the second reinforcing ring 321 can be bonded or welded to the substrate 100 to achieve a reliable connection between the first reinforcing ring 311 and the second reinforcing ring 321 and the substrate 100.
[0051] In some embodiments, the first reinforcing ring 311 and the second reinforcing ring 321 can be bonded to the first side 101 and the second side 102 of the substrate 100 respectively using an adhesive to ensure a reliable connection between the first reinforcing ring 311 and the second reinforcing ring 321 and the substrate 100. It should be noted that when using an adhesive connection method, a high-performance adhesive compatible with the materials of the first reinforcing ring 311, the second reinforcing ring 321, and the substrate 100 can be selected. This adhesive must possess good bonding strength, temperature resistance, and chemical stability.
[0052] In other embodiments, the first reinforcing ring 311 and the second reinforcing ring 321 can also be connected to the first side 101 and the second side 102 of the substrate 100 by welding to ensure a reliable connection between the first reinforcing ring 311 and the second reinforcing ring 321 and the substrate 100. It should be noted that when using this connection method, corresponding welding areas need to be provided at corresponding positions on the substrate 100, and the welding areas are welded together with the first reinforcing ring 311 and the second reinforcing ring 321 using a suitable welding process. It should also be noted that if the first reinforcing ring 311 and the second reinforcing ring 321 are connected to the substrate 100 by welding, a suitable welding process needs to be selected based on the materials of the first reinforcing ring 311, the second reinforcing ring 321, and the substrate 100. For common metal materials, such as stainless steel and aluminum alloys, welding methods such as argon arc welding and laser welding can be used.
[0053] In some other embodiments, one of the first reinforcing ring 311 and the second reinforcing ring 321 can be bonded to the substrate 100, and the other can be welded to the substrate 100. This also achieves the same result of fixing the first reinforcing ring 311 and the second reinforcing ring 321 to the substrate 100, thereby reducing or avoiding warping.
[0054] In the embodiments of this disclosure, there are multiple options for the layout of the first reinforcing ring 311 and the second reinforcing ring 321 to achieve a better structural reinforcement effect. Optionally, the projections of the first reinforcing ring 311 and the second reinforcing ring 321 onto the plane of the substrate 100 at least partially overlap.
[0055] When it is mentioned that the projections of the first reinforcing ring 311 and the second reinforcing ring 321 onto the plane of the substrate 100 at least partially overlap, it means that when the first reinforcing ring 311 and the second reinforcing ring 321 are projected perpendicularly onto the plane of the substrate 100, there is an overlapping area between the two projected patterns. "At least partially overlap" here includes various situations, ranging from only a small portion of the two projected patterns overlapping to most or even all of them overlapping.
[0056] In some embodiments, when the projections of the first reinforcing ring 311 and the second reinforcing ring 321 overlap only slightly, this arrangement can achieve a superposition of reinforcing effects at a specific location. For example, the first reinforcing ring 311 can offset most of the warping of the substrate 100, and the second reinforcing ring 321 is arranged on the second side 102 to offset the remaining warping deformation. This provides better structural support for the substrate 100, improves the load-bearing capacity of the substrate 100 in this area, and avoids damage to the packaging structure due to stress.
[0057] In some embodiments, if the projections of the first reinforcing ring 311 and the second reinforcing ring 321 largely overlap, this arrangement ensures that the first reinforcing ring 311 and the second reinforcing ring 321 are substantially at the same corresponding position in the thickness direction of the substrate 100, thereby enhancing the overall strength and stability of the substrate 100 over a larger range. With this largely overlapping projection arrangement, the two reinforcing rings can work together at corresponding positions on the first side 101 and the second side 102 of the substrate 100, more easily addressing warping of the substrate 100, making the stress on the substrate 100 more uniform in this area, reducing deformation caused by uneven local stress, and ensuring the flatness and precision of the substrate 100.
[0058] In other embodiments, when the projections of the first reinforcing ring 311 and the second reinforcing ring 321 completely overlap, it is equivalent to providing a double reinforcing structure on the first side 101 and the second side 102 of the substrate 100. When the substrate 100 needs to withstand extremely high loads or has extremely high structural strength requirements, the synergistic effect of the two reinforcing rings can greatly improve the strength and stiffness of the substrate 100 at that location, effectively resisting external deformation. At the same time, this arrangement can also improve the reliability of the structure; even if one reinforcing ring is slightly damaged, the other reinforcing ring can still provide a certain degree of reinforcement, ensuring the normal operation of the entire structure.
[0059] like Figure 6As shown, in some embodiments, the width of the second reinforcing ring 321 is smaller than the width of the first reinforcing ring 311. The first reinforcing ring 311 and the chip 200 are both located on the first side 101 of the substrate 100, primarily to reduce warpage caused by differences in temperature systems between the substrate 100 and the chip 200. The second reinforcing ring 321 is located on the second side 102 of the substrate 100 and can be used to further reduce warpage. Therefore, to save materials and costs, the width of the second reinforcing ring 321 can be made smaller than that of the first reinforcing ring 311, while also avoiding affecting the arrangement area of the solder ball array on the second side 102 of the substrate 100.
[0060] like Figure 6 As shown, the outer edge of the second reinforcing ring 321 can be aligned with the outer edge of the first reinforcing ring 311. The projection of the inner edge of the second reinforcing ring 321 onto the plane of the substrate 100 is further away from the chip 200 than the projection of the inner edge of the first reinforcing ring 311 onto the plane of the substrate 100. This makes the width of the second reinforcing ring 321 smaller than that of the first reinforcing ring 311, and also provides more space for the arrangement of the multiple solder balls 500 of the solder ball array inside the second reinforcing ring 321.
[0061] like Figure 8 As shown, in some embodiments, the first reinforcing member 310 can also be configured as a reinforcing cover 312, with the chip 200 located inside the receiving space formed by the reinforcing cover 312 and the substrate 100. The reinforcing cover 312 is a cover structure with an opening at one end, capable of forming a relatively sealed receiving space with the substrate 100 to house the chip 200 within this space. The sidewalls of the reinforcing cover 312 can be fixedly connected to the substrate 100 and surround the chip 200 circumferentially to prevent warping of the substrate 100.
[0062] like Figure 8 As shown, in some embodiments, the gap between the side of the chip 200 facing away from the substrate 100 and the reinforcing cover 312 is filled with a thermally conductive layer 400. The reinforcing cover 312 also includes a top wall connected to the sidewall, and when the reinforcing cover 312 is mounted on the first side 101 of the substrate 100, the top wall is above the chip 200, and the chip 200 is connected to the top wall via the thermally conductive layer 400 for heat dissipation of the chip 200.
[0063] Due to the combined effect of the first reinforcing member 310 and the second reinforcing member 320, the warpage of the packaging structure is reduced. When the warpage is reduced, the thickness of the TIM material can be reduced, which is more conducive to the heat dissipation of the entire packaging structure.
[0064] Understandably, there is a specific gap between the side of chip 200 facing away from substrate 100 and reinforcing cover 312. To achieve efficient thermal management and improve system stability and reliability, this gap is filled with a thermally conductive layer 400. This thermally conductive layer 400 is made of a specialized material with high thermal conductivity, such as TIM (Thermal Interface Material), which possesses excellent thermal conductivity. When chip 200 generates heat during operation, based on Fourier's law of thermal conduction, the thermally conductive layer 400 quickly and efficiently transfers the heat dissipated by chip 200 to reinforcing cover 312, and the heat is rapidly dissipated through the heat sink on reinforcing cover 312, ensuring the stable and reliable operation of chip 200.
[0065] To enable electrical connection between the substrate 100 and other electrical components, such as a PCB board, for communication purposes, in some embodiments, the second side 102 of the substrate 100 is further provided with solder balls 500, and the thickness of the second reinforcing member 320 is less than the thickness of the solder balls 500. The number of solder balls 500 can be multiple, and they can be arranged in a matrix to form a solder ball array.
[0066] The second side 102 of the substrate 100 is also provided with an array of solder balls 500. The solder balls 500 play a crucial role in the electrical connection and mechanical fixation of the entire system, providing the basis for a reliable connection between the substrate 100 and other electronic components, such as printed circuit boards.
[0067] It should be noted that the second reinforcing member 320 is disposed on the second side 102 of the substrate 100, and the thickness of the second reinforcing member 320 is less than the thickness of the solder ball 500. This is to prevent the second reinforcing member 320 from being too thick, which would affect the connection stability of the multiple solder balls 500, and to ensure that the solder balls 500 can form a good electrical connection with other components during the soldering process, thus ensuring stable current transmission. Setting the thickness of the second reinforcing member 320 to be less than the thickness of the solder ball 500 effectively balances the dual requirements of structural strength and electrical connection, providing a guarantee for the stable operation of the entire system.
[0068] According to a second aspect of this disclosure, an electronic device is also provided, which includes the aforementioned packaging structure. Therefore, this electronic device also possesses all the advantages of the aforementioned packaging structure, which will not be elaborated upon here. The electronic device includes, but is not limited to, mobile phones, tablet computers, laptops, smartwatches, workstations, data center equipment, etc.
[0069] The disclosed packaging structure and electronic device include a substrate 100, a chip 200, and reinforcing components. The reinforcing components include a first reinforcing member 310 surrounding the chip 200 and connected to a first side 101 of the substrate 100, and a second reinforcing member 320 connected to a second side 102 of the substrate 100. The first reinforcing member 310 and the chip 200 are both located on the first side 101 of the substrate 100, which reduces the impact of warpage deformation of the substrate 100 on the chip 200. Simultaneously, the second reinforcing member 320 is disposed on the second side 102 of the substrate 100, further reducing warpage of the substrate 100 in the packaging structure and improving the yield and reliability of the chip 200 packaging.
[0070] Furthermore, the first reinforcing member 310 and the second reinforcing member 320 are constructed as reinforcing rings. The two reinforcing rings work together to reduce the warpage of the chip 200 during the packaging process, thereby improving the yield and reliability of the chip 200 packaging. In addition, after the warpage of the substrate 100 of the packaging structure is reduced, the thickness of the TIM (Thermal Interface Material) material can be reduced, which is beneficial to the heat dissipation of the entire packaging structure.
[0071] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.
[0072] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.
[0073] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.
Claims
1. A packaging structure, characterized in that, include: The substrate includes opposing first and second sides; The chip is disposed on the first side of the substrate; and The reinforcement component includes a first reinforcement member and a second reinforcement member. The first reinforcement member is disposed on the first side of the substrate and surrounds the circumference of the chip. The second reinforcement member is disposed on the second side of the substrate.
2. The packaging structure according to claim 1, characterized in that, The projection of the second reinforcing member onto the plane of the substrate surrounds the circumference of the projection of the chip onto the plane of the substrate.
3. The packaging structure according to claim 2, characterized in that, The first reinforcing member is constructed as a first reinforcing ring; The second reinforcing member is constructed as a second reinforcing ring.
4. The packaging structure according to claim 3, characterized in that, The first reinforcing ring and / or the second reinforcing ring are bonded or welded to the substrate.
5. The packaging structure according to claim 3, characterized in that, The projections of the first reinforcing ring and the second reinforcing ring onto the plane of the substrate at least partially overlap.
6. The packaging structure according to claim 5, characterized in that, The width of the second reinforcing ring is smaller than the width of the first reinforcing ring.
7. The packaging structure according to claim 1, characterized in that, The first reinforcing member is constructed as a reinforcing cover, and the chip is located inside the receiving space formed by the reinforcing cover and the substrate.
8. The packaging structure according to claim 7, characterized in that, The gap between the side of the chip facing away from the substrate and the reinforcing cover is filled with a thermally conductive layer.
9. The packaging structure according to any one of claims 1-8, characterized in that, The second side of the substrate is further provided with solder balls, and the thickness of the second reinforcing member is less than the thickness of the solder balls.
10. An electronic device, characterized in that, Includes the packaging structure described in any one of claims 1-9.