A testing device and three-temperature testing sorting machine

Abstract

The utility model relates to automatic equipment technical field discloses a kind of testing device and three temperature test sorting machines, including lifting mechanism, gas drive floating module and pressure head;The pressure head is arranged in the gas drive floating module, for contacting with the chip in the placing groove, and the temperature of chip is carried out temperature and is rushed, to facilitate the test to chip;The gas drive floating module is arranged in lifting mechanism, can be moved along the lifting direction under the drive of lifting mechanism, for adjusting the angle of entry slot of the pressure head, so that the pressure head can accurately contact the chip in the placing groove.The utility model can improve the precision and working efficiency of chip test, and it has vital significance and value for the sustained stability of guaranteeing test yield.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a testing device and a three-temperature testing and sorting machine. Background Technology

[0002] With the growth of emerging industries such as mobile internet, cloud computing, the Internet of Things, and big data, the electronic information industry has entered a new stage of development. Control, communication, human-computer interaction, and network interconnection have incorporated a large number of emerging electronic technologies, leading to increasingly complex device functions and systems with higher levels of integration. The development of emerging electronic information technologies relies on the continuous advancement of the semiconductor industry; therefore, chips, as a core technology, are being used more and more frequently and importantly.

[0003] After chip packaging, it is generally tested to separate good and defective products. Currently, in the field of chip testing, when performing three-temperature testing on chips, the pressure head of the testing equipment must be precisely inserted into the placement slot to achieve effective contact with the chip placed in the slot, thereby providing the necessary conditions for comprehensive chip testing.

[0004] However, in practical operation, there is a pressing technical challenge: how to flexibly and precisely adjust the insertion angle of the pressure head according to the specific spatial position of the chip in the placement slot, ensuring that the pressure head can accurately enter the placement slot and make stable contact with the chip inside. This technical challenge has become a key issue that professionals in this field urgently need to solve. Solving this problem is of vital significance and value for improving the accuracy and efficiency of chip testing, as well as ensuring the continuous stability of test yield.

[0005] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0006] This invention provides a testing device and a three-temperature testing and sorting machine to solve the problems existing in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] In the first aspect, this utility model provides a testing device, including a lifting mechanism, a pneumatically driven floating module, and a pressure head;

[0009] The pressure head is disposed on the air-driven floating module and is used to contact the chip in the placement slot to facilitate chip testing;

[0010] The air-driven floating module is mounted on the lifting mechanism and can move along the lifting direction under the drive of the lifting mechanism to adjust the insertion angle of the pressure head so that the pressure head can accurately contact the chip in the placement slot.

[0011] Furthermore, in the testing device, the air-driven floating module includes a cylinder block, cylinder head, sealing gasket, pressure diaphragm, piston, return base, horizontal reset assembly, horizontal rotation assembly, and base plate;

[0012] The cylinder body is hollow inside;

[0013] The cylinder head is disposed on the cylinder body to seal the interior of the cylinder body; the cylinder head is provided with an air inlet; the air inlet communicates with the interior of the cylinder body and is connected to an air source;

[0014] The sealing gasket is disposed at the air inlet;

[0015] The pressure film is disposed inside the cylinder and has elastic deformation capability;

[0016] The piston passes through the cylinder body;

[0017] The return base is located at the bottom of the piston;

[0018] The base plate is located at the bottom of the return base and is provided with a first mounting groove;

[0019] The horizontal reset component and the horizontal rotation component are respectively disposed in the corresponding first mounting slots and are in contact with the bottom of the return base.

[0020] Furthermore, in the testing device, the horizontal reset assembly includes a return bead, a support plate, a reset pin, and a horizontal reset spring;

[0021] The support plate is provided with fixing holes;

[0022] The return bead is disposed in the fixing hole and contacts the bottom of the return base;

[0023] The reset pin is located at the bottom of the return base;

[0024] The horizontal return spring is sleeved on the outer periphery of the return pin.

[0025] Furthermore, in the testing device, the horizontal rotating component is a ball bearing.

[0026] Furthermore, in the testing device, the pressure head is also used to perform temperature counter-pressure on the chip;

[0027] The pressure head includes a housing, a temperature transmission plate, a temperature sensor, a heating element, and a pressure plate;

[0028] The housing is disposed on the gas-driven floating module, and a refrigerant circulation channel is provided inside the housing;

[0029] The surface of the housing is provided with a refrigerant swirl port and a refrigerant injection port that communicate with the interior of the housing;

[0030] The temperature transfer plate is located at the bottom of the housing, and the temperature transfer plate is provided with a second mounting groove facing the bottom of the pressing plate;

[0031] The heating element is disposed in the second mounting groove and is in contact with the pressing plate;

[0032] The temperature sensor is disposed on the surface of the compressed tablet;

[0033] The pressure plate is located at the bottom of the temperature transfer plate.

[0034] Furthermore, in the testing device, the pressing tablet is provided with several heat insulation grooves;

[0035] The aforementioned heat insulation grooves divide the pressed tablet into several temperature isolation zones.

[0036] Secondly, this utility model provides a three-temperature testing and sorting machine, including a workbench, a heat insulation cover, a feeding device, a discharging device, a chip handling device, a preheating device, a chip shuttle device, a ventilation pipe, and a testing device as described in the first aspect above; wherein...

[0037] The heat insulation cover is set on the workbench to form a test space with the workbench;

[0038] The feeding device, unloading device, chip handling device, preheating device, chip shuttle device, testing device, and ventilation pipe are respectively installed on the workbench and located within the testing space;

[0039] The ventilation duct is used to deliver refrigerant so that the refrigerant circulates within the test space;

[0040] The feeding device is used to feed the tray containing the chips to be tested.

[0041] The chip handling device is used to transfer chips from the loading tray to the preheating device; and to transfer preheated chips from the preheating device to the chip shuttle device; and to transfer tested chips from the chip shuttle device to the unloading device.

[0042] The preheating device is used to pre-adjust the temperature of the chip located on the preheating device before testing;

[0043] The chip shuttle device is provided with a placement slot for transporting the chip in the placement slot to the testing device for testing; and for transporting the tested chip out of the testing device.

[0044] The testing device is used to further regulate the temperature of the chip and to test the chip.

[0045] The feeding device is used to feed the tray containing the tested chips.

[0046] Furthermore, the three-temperature testing and sorting machine also includes a material tray conveying device;

[0047] The feeding device includes an OK feeding module and an NG feeding module;

[0048] The material tray transport device is set on the workbench and located in the test space. It can move within the loading device, the OK unloading module and the NG unloading module. It is used to transfer the empty material tray after the transferred chip is transferred from the loading device to the OK unloading module and the NG unloading module, and is stored by the OK unloading module and the NG unloading module respectively.

[0049] The OK unloading module is used to unload the tray containing chips that have passed the test and are OK.

[0050] The NG unloading module is used to unload the tray containing chips that have been tested and found to be NG.

[0051] Furthermore, the three-temperature testing and sorting machine also includes a barcode scanning device;

[0052] The chip handling device is also used to transfer the preheated chip to the barcode scanning device during the process of transferring the preheated chip from the preheating device to the chip shuttle device;

[0053] The scanning device is mounted on the workbench and located within the test space, and is used to scan the code on the chip.

[0054] Furthermore, the three-temperature testing and sorting machine also includes a camera device;

[0055] The preheating device includes a preheating platform, on which a plurality of preheating slots are provided for placing chips.

[0056] The camera device is mounted on the chip handling device and is used to assist the chip handling device in placing the chip into the preheating tank through visual recognition technology.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] This utility model provides a testing device and a three-temperature testing and sorting machine. The testing device consists of a lifting mechanism, a pneumatically driven floating module, and a pressure head. Driven by the lifting mechanism, the pneumatically driven floating module can adjust the entry angle of the pressure head into the slot, so that the pressure head can accurately enter the placement slot and make stable contact with the chip in the slot. This improves the accuracy and efficiency of chip testing and is of vital significance and value for ensuring the continuous stability of test yield.

[0059] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0061] Figure 1 This is a three-dimensional structural diagram of a testing device provided in Embodiment 1 of this utility model;

[0062] Figure 2 This is a three-dimensional structural diagram of the air-driven floating mold and pressure head provided in Embodiment 1 of this utility model;

[0063] Figure 3 This is one of the (three-dimensional) structural schematic diagrams of the air-driven floating mold provided in Embodiment 1 of this utility model;

[0064] Figure 4 This is the second (three-dimensional) structural schematic diagram of the air-driven floating mold provided in Embodiment 1 of this utility model;

[0065] Figure 5 This is an exploded structural diagram of the air-driven floating mold provided in Embodiment 1 of this utility model;

[0066] Figure 6 This is a (partial) structural schematic diagram of the air-driven floating mold provided in Embodiment 1 of this utility model;

[0067] Figure 7 This is a three-dimensional structural diagram of the pressure head provided in Embodiment 1 of this utility model;

[0068] Figure 8This is one of the (partial) structural schematic diagrams of the pressure head provided in Embodiment 1 of this utility model;

[0069] Figure 9 This is a schematic diagram of the (exploded) structure of the pressure head provided in Embodiment 1 of this utility model;

[0070] Figure 10 This is the second (partial) structural schematic diagram of the pressure head provided in Embodiment 1 of this utility model;

[0071] Figure 11 This is the third (partial) structural schematic diagram of the pressure head provided in Embodiment 1 of this utility model;

[0072] Figure 12 This is one of the (three-dimensional) structural schematic diagrams of a three-temperature testing and sorting machine provided in Embodiment 2 of this utility model;

[0073] Figure 13 This is a top view structural schematic diagram of a three-temperature testing and sorting machine provided in Embodiment 2 of this utility model;

[0074] Figure 14 This is the second (three-dimensional) structural schematic diagram of a three-temperature testing and sorting machine provided in Embodiment 2 of this utility model;

[0075] Figure 15 This is the third (three-dimensional) structural schematic diagram of a three-temperature testing and sorting machine provided in Embodiment 2 of this utility model;

[0076] Figure 16 This is a three-dimensional structural diagram of the feeding device and unloading device provided in Embodiment 2 of this utility model;

[0077] Figure 17 This is a three-dimensional structural diagram of the feeding device, unloading device, tray conveying device, and barcode scanning device provided in Embodiment 2 of this utility model;

[0078] Figure 18 This is a three-dimensional structural diagram of the feeding device, unloading device, tray conveying device, and barcode scanning device provided in Embodiment 2 of this utility model;

[0079] Figure 19 This is a three-dimensional structural diagram of the chip handling device, camera device, and chip shuttle device provided in Embodiment 2 of this utility model;

[0080] Figure 20 This is a three-dimensional structural diagram of the testing device and sensing device provided in Embodiment 2 of this utility model.

[0081] Figure label:

[0082] Workbench 1, Insulation cover 2, Feeding device 3, Unloading device 4, Chip handling device 5, Preheating device 6, Chip shuttle device 7, Testing device 8, Ventilation pipe 9, Tray handling device 10, Barcode scanning device 11, Camera device 12, Sensing device 13.

[0083] OK blanking module 401, NG blanking module 402;

[0084] Preheating table 601, preheating bath 602;

[0085] Lifting mechanism 801, air-driven floating module 802, pressure head 803;

[0086] Cylinder block 8021, cylinder head 8022, sealing gasket 8023, pressure diaphragm 8024, piston 8025, return base 8026, horizontal reset assembly 8027, horizontal rotation assembly 8028, base plate 8029.

[0087] Return bead 80271, support plate 80272, reset pin 80273, horizontal reset spring 80274;

[0088] Housing 8031, temperature transfer plate 8032, temperature sensor 8033, heating element 8034, pressing plate 8035, refrigerant rotary channel 8036, refrigerant swirl port 8037, refrigerant injection port 8038, heat insulation tank 8039. Detailed Implementation

[0089] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0090] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0091] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0092] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0093] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0094] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0095] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0096] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0097] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0098] Example 1

[0099] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0100] Please refer to Figure 1-2 This utility model provides a testing device, including a lifting mechanism 801, a pneumatically driven floating module 802, and a pressure head 803; the following is a detailed description of each component of the device and its functions:

[0101] First, the pressure head 803 is ingeniously mounted on the air-driven floating module 802. Its design is intended to achieve precise contact with the chip inside the placement slot, so that the test device 8 can accurately perform various electrical performance tests on the chip, such as voltage, current, and resistance.

[0102] Secondly, the pneumatically driven floating module 802, serving as a bridge connecting the lifting mechanism 801 and the pressure head 803, is particularly crucial in both its structural design and functional implementation. The pneumatically driven floating module 802 is securely mounted on the lifting mechanism 801. Thanks to the power support provided by the lifting mechanism 801, the pneumatically driven floating module 802 can move flexibly along a preset lifting direction. This movement characteristic gives the pressure head 803 adjustable insertion angle, ensuring that the pressure head 803 enters the placement slot at the most suitable angle when contacting the chip, thereby greatly improving the stability and accuracy of the contact.

[0103] The testing apparatus proposed in this embodiment ingeniously combines the lifting mechanism 801, the pneumatically driven floating module 802, and the pressure head 803 to form a highly efficient and precise testing system. Under the precise drive of the lifting mechanism 801, the pneumatically driven floating module 802 can flexibly adjust the entry angle of the pressure head 803, ensuring that the pressure head 803 enters the placement slot without deviation and establishes stable and reliable contact with the chip inside. This design not only significantly improves the accuracy of chip testing but also effectively enhances the efficiency of the testing process, playing a crucial role in ensuring the continuous stability of test yield.

[0104] Therefore, the testing device proposed in this embodiment of the present invention has extremely high practical value and application prospects in the field of chip testing, and has immeasurable significance and value for promoting the progress and development of related technologies.

[0105] Please refer to Figure 3-6 In one embodiment of this invention, a detailed implementation of a pneumatically driven floating module 802 is shown. This module achieves precise adjustment of the insertion angle of the pressure head 803 into the groove by cleverly combining pneumatic drive and mechanical reset mechanisms. The following is a detailed description of the components of the pneumatically driven floating module 802 and their working principles:

[0106] The air-driven floating module 802 is mainly composed of key components such as cylinder block 8021, cylinder head 8022, sealing gasket 8023, pressure diaphragm 8024, piston 8025, return base 8026, horizontal reset assembly 8027, horizontal rotation assembly 8028, and base plate 8029.

[0107] The cylinder block 8021, as the core structure of the module, is hollow inside to accommodate the piston 8025 and other internal components. A cylinder head 8022 is mounted on top of the cylinder block 8021, tightly sealing it to ensure the internal airtightness of the cylinder. An air inlet is provided on the cylinder head 8022, which communicates with the internal space of the cylinder block 8021 and is connected to an external air source to supply air pressure into the cylinder.

[0108] To prevent gas leakage and maintain stable air pressure within the cylinder 8021, a sealing gasket 8023 is installed at the air inlet. The sealing gasket 8023 effectively prevents gas from escaping from the air inlet, ensuring the reliability and stability of the pneumatic drive.

[0109] The pressure diaphragm 8024 is located inside the cylinder 8021 and has the ability to elastically deform. When air pressure is applied to the pressure diaphragm 8024, the pressure diaphragm undergoes elastic deformation and transmits the air pressure evenly to the piston 8025. This uniform pressure transmission method ensures the uniformity of pressure distribution inside the cylinder 8021, thereby improving the stability and accuracy of the angle adjustment of the pressure head 803.

[0110] Piston 8025 is installed inside cylinder 8021 and is a directly force-bearing component driven by pneumatic pressure. When external pneumatic pressure is input, piston 8025 will be pushed by the pneumatic pressure and thus be displaced, thereby causing the connected pressure head 803 to change angle.

[0111] The return base 8026 is located at the bottom of the piston 8025, serving to support the piston 8025 and provide a base for reset. The base plate 8029 is located at the bottom of the return base 8026 and is provided with a first mounting slot for mounting the horizontal reset assembly 8027 and the horizontal rotation assembly 8028.

[0112] The horizontal reset assembly 8027 is disposed in the first mounting groove and contacts the bottom of the return base 8026. When the air pressure is released, the horizontal reset assembly 8027 provides a reverse force to ensure that the piston 8025 and the pressure head 803 can quickly return to their initial positions, avoiding angular deviation.

[0113] The horizontal rotation assembly 8028 is also located in the first mounting slot and contacts the bottom of the return base 8026. Its main function is to reduce frictional resistance, making the pressure head 803 more flexible and smooth during rotation. By reducing frictional resistance, the horizontal rotation assembly 8028 ensures the smoothness and accuracy of the angle adjustment of the pressure head 803.

[0114] In summary, when external air pressure is input, the piston 8025 inside the cylinder 8021 is displaced by the air pressure, which in turn causes the connected pressure head 803 to change angle. By precisely adjusting the magnitude or direction of the air pressure (e.g., using a multi-chamber cooperative working method), the stroke of the piston 8025 can be precisely controlled, thereby accurately adjusting the insertion angle of the pressure head 803. This combination of pneumatic drive and mechanical reset not only improves the flexibility and accuracy of the pressure head 803 angle adjustment but also ensures the stability and reliability of the testing device.

[0115] Please refer to this again. Figure 5In one embodiment of this invention, the specific structure and working principle of the horizontal reset assembly 8027 are shown in detail. This assembly plays a crucial role in the pneumatic floating module 802, ensuring that the piston 8025 and the pressure head 803 can quickly and accurately reset to their initial positions when the pneumatic pressure is released. The following is a detailed description of the components and functions of the horizontal reset assembly 8027:

[0116] The horizontal reset assembly 8027 is mainly composed of key components such as the return bead 80271, the support plate 80272, the reset pin 80273, and the horizontal reset spring 80274.

[0117] The support plate 80272 is the basic support structure for the horizontal reset assembly 8027, and it is provided with a fixing hole. The design of this fixing hole provides space for the installation of the return bead 80271 and ensures the stable position of the return bead in the assembly.

[0118] The return bead 80271 is cleverly positioned in the fixing hole of the support plate 80272 and maintains contact with the bottom of the return base 8026. As a rolling element, the return bead 80271 significantly reduces the frictional resistance between its contact surface with the return base 8026 during the reset process. This design not only improves the flexibility of reset but also extends the service life of the component.

[0119] The reset pin 80273 is located at the bottom of the return base 8026 and serves as a support and guide structure for the horizontal return spring 80274. The design of the reset pin 80273 ensures that the horizontal return spring 80274 can deform in a predetermined direction when compressed or released, thereby providing a stable reverse force.

[0120] The horizontal return spring 80274, sleeved on the outer periphery of the return pin 80273, is the core component of the horizontal return assembly 8027. When the pneumatic pressure is released, the horizontal return spring 80274 generates a reverse force through its elastic deformation, driving the piston 8025 and the pressure head 803 to quickly return to their initial positions. Simultaneously, the horizontal return spring 80274 can also absorb the impact energy during the pneumatic drive process, effectively improving the smoothness of the operation.

[0121] In summary, the horizontal reset assembly 8027 reduces frictional resistance through the rolling design of the return ball 80271, and provides stable reverse force and impact energy absorption capacity through the synergistic action of the reset pin 80273 and the horizontal reset spring 80274. These designs together ensure that the piston 8025 and the pressure head 803 can quickly and accurately reset to their initial positions when the air pressure is released, thus improving the working efficiency and stability of the pneumatic floating module 802.

[0122] In one specific embodiment of this invention, the horizontal rotary assembly 8028 employs a ball bearing design. Ball bearings, as a widely used mechanical component, are renowned for their low friction, high precision, and ability to withstand radial and axial loads.

[0123] Using a ball bearing as the horizontal rotating component 8028 can significantly reduce the frictional resistance of the pressure head 803 during rotation. The balls inside the ball bearing roll between the inner and outer rings of the bearing, effectively converting sliding friction into rolling friction, thereby greatly reducing the coefficient of friction and making the rotation of the pressure head 803 more flexible and smooth.

[0124] Furthermore, ball bearings are characterized by high precision, ensuring that the indenter 803 maintains a stable trajectory and accurate positioning during rotation. This is crucial for testing devices that require precise control of the indenter 803's entry angle into the groove.

[0125] In summary, using ball bearings as the horizontal rotating component 8028 not only improves the flexibility and smoothness of the pressure head 803's rotation, but also ensures the accuracy and stability of the testing device, providing a more reliable guarantee for chip testing.

[0126] Please refer to Figure 7-11 In one embodiment of this invention, the specific structure and components of an indenter 803 are shown in detail. This indenter 803 is ingeniously designed. During testing, the indenter 803 not only undertakes the task of physical contact with the chip but also performs temperature offsetting, a step crucial for the accuracy and reliability of subsequent chip performance testing. Through temperature offsetting, the indenter 803 can effectively simulate the temperature conditions of the chip in its actual working environment, thereby providing a more realistic evaluation environment for testing. The following is a detailed description of the components and functions of the indenter 803:

[0127] The pressure head 803 is mainly composed of key components such as housing 8031, temperature transmission plate 8032, temperature sensor 8033, heating element 8034, and pressure plate 8035.

[0128] The housing 8031, as the main structure of the pressure head 803, is securely mounted on the air-driven floating module 802. The interior of the housing 8031 ​​is carefully designed with a refrigerant circulation channel 8036, which allows the refrigerant to circulate inside the housing, thereby achieving temperature regulation and control.

[0129] To facilitate refrigerant injection and circulation, the surface of the housing 8031 ​​is provided with a refrigerant swirl port 8037 and a refrigerant injection port 8038. The refrigerant swirl port 8037 serves as a channel for refrigerant outflow, while the refrigerant injection port 8038 is used to inject refrigerant into the housing. The design of these two ports ensures smooth flow and effective circulation of refrigerant within the housing.

[0130] The temperature transfer plate 8032 is located at the bottom of the housing 8031. It serves as a heat transfer medium, uniformly transferring the temperature inside the housing to the pressure plate 8035. A second mounting groove is provided on the bottom of the temperature transfer plate 8032 facing the pressure plate 8035 for mounting the heating element 8034.

[0131] The heating element 8034 is cleverly installed in the second mounting slot and in close contact with the pressure plate 8035. The function of the heating element 8034 is to provide additional heat when needed to adjust the temperature of the pressure plate 8035. Through the heating effect of the heating element 8034, precise temperature control can be achieved during chip testing.

[0132] A temperature sensor 8033 is disposed on the surface of the tablet 8035 and is used to monitor the temperature change of the tablet 8035 in real time. The feedback signal of the temperature sensor 8033 can be transmitted to the control system so that the heating power of the heating element 8034 or the circulation of the refrigerant can be adjusted as needed to maintain the tablet 8035 within a constant temperature range.

[0133] The clamping plate 8035 is located at the bottom of the temperature transfer plate 8032 and is the component that directly contacts the chip. The clamping plate 8035 is designed with good thermal conductivity and mechanical strength in mind to ensure that pressure can be applied stably and temperature transferred during testing.

[0134] In summary, the pressure head 803 in this embodiment, through the integration of components such as the housing 8031, temperature transfer plate 8032, temperature sensor 8033, heating element 8034, and pressure plate 8035, achieves precise control of temperature and pressure during chip testing. This design not only improves the accuracy and reliability of chip testing but also provides more comprehensive data support for chip performance evaluation.

[0135] Please refer to this again. Figure 10-11 In one embodiment of this invention, the design of the tablet 8035 is described in detail, especially the innovative arrangement of several heat insulation grooves 8039 in its structure. The presence of these heat insulation grooves brings unique functional characteristics to the tablet 8035.

[0136] Several temperature-insulating grooves 8039 are carefully arranged on the tablet 8035. These temperature-insulating grooves not only change the overall structure of the tablet, but more importantly, they effectively divide the tablet 8035 into several temperature-isolation zones. Each temperature-isolation zone is relatively independent and can isolate or slow down the transfer of heat inside the tablet to a certain extent.

[0137] The benefits of this design are multifaceted. First, it improves the accuracy of temperature control. During chip testing, different areas may require different temperature conditions. By setting up temperature isolation zones, the temperature of each area can be controlled more precisely to meet the specific needs of the test.

[0138] Secondly, the design of the temperature insulation zone 8039 also helps to reduce thermal interference. During testing, if a certain area of ​​the tablet 8035 is affected by an external heat source, the temperature insulation zone can prevent or slow down the spread of this thermal interference to other areas, thereby maintaining the stability of the overall tablet temperature distribution.

[0139] Furthermore, the temperature insulation bath 8039 can increase the flexibility of the tablet pressing 8035. Depending on different testing requirements, the layout of the temperature isolation zone can be optimized by adjusting the position, number, and shape of the temperature insulation bath, making the tablet pressing more adaptable to various testing scenarios.

[0140] In summary, the pressing 8035 in this embodiment, by setting several temperature isolation grooves 8039, is divided into several temperature isolation zones, which not only improves the accuracy and stability of temperature control, but also increases the flexibility of pressing, providing a more reliable and diverse temperature control solution for chip testing.

[0141] Although this application frequently uses terms such as lifting mechanism and pneumatic floating module, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0142] The present invention provides a testing device consisting of a lifting mechanism, a pneumatically driven floating module, and a pressure head. Driven by the lifting mechanism, the pneumatically driven floating module can adjust the entry angle of the pressure head into the slot, so that the pressure head can accurately enter the placement slot and make stable contact with the chip in the slot. This improves the accuracy and efficiency of chip testing and is of vital importance and value for ensuring the continuous stability of test yield.

[0143] Example 2

[0144] Please refer to Figure 12-20This utility model provides a three-temperature testing and sorting machine, including a workbench 1, a heat insulation cover 2, a feeding device 3, a discharging device 4, a chip handling device 5, a preheating device 6, a chip shuttle device 7, a ventilation pipe 9, and a testing device 8 as provided in Embodiment 1 above; the following will describe in detail the components and functions of the sorting machine:

[0145] First, the thermal insulation cover 2 is carefully installed on the workbench 1, its main function being to form a closed testing space together with the workbench 1. This design aims to ensure the stability of the testing environment and provide a temperature-controlled closed environment for subsequent chip testing.

[0146] Secondly, key components such as the loading device 3, unloading device 4, chip handling device 5, preheating device 6, chip shuttle device 7, testing device 8, and ventilation pipe 9 are all cleverly arranged on the workbench 1, and all are located within the aforementioned testing space. This layout design not only optimizes the space utilization of the equipment but also ensures efficient and smooth collaboration between the various components.

[0147] Ventilation duct 9 serves as a refrigerant delivery channel, its function being to circulate the refrigerant within the test space. This design effectively regulates and controls the temperature within the test space, providing a uniform and stable temperature environment for chip testing.

[0148] The loading device 3 is responsible for feeding the tray containing the chips to be tested into the testing process. It ensures that the chips can enter the testing system accurately and quickly, preparing them for subsequent testing.

[0149] The chip handling device 5 is responsible for transferring the chips from the loaded tray to the preheating device 6. Simultaneously, it transfers the preheated chips from the preheating device 6 to the chip shuttle device 7, and transfers the tested chips from the chip shuttle device 7 to the unloading device 4. This device design significantly improves the handling efficiency of chips during the testing process.

[0150] The function of the pre-temperature device 6 is to pre-adjust the temperature of the chip before it undergoes formal testing. This step ensures that the chip is in an optimal temperature state during testing, thereby improving the accuracy and reliability of the test.

[0151] The chip shuttle 7 is responsible for transporting the pre-warmed chips to the testing device 8 for testing. At the same time, it also transports the tested chips out of the testing device 8, preparing them for subsequent chip processing.

[0152] Test unit 8 is the core component of chip testing. It not only further regulates the temperature of the chip to ensure the stability of the test environment, but also performs comprehensive tests on the chip to evaluate its performance and quality.

[0153] Finally, the unloading device 4 is responsible for removing the tray containing the tested chips from the testing system. It ensures that the tested chips can leave the testing system accurately and quickly, preparing them for subsequent chip processing or packaging.

[0154] In summary, this embodiment, by setting up a heat insulation cover 2 on the workbench 1, forming a closed testing space together with the workbench 1, and utilizing a refrigerant as a medium to circulate within the testing space, ensures the consistency and stability of the temperature within the testing space. This design not only automates the chip three-temperature testing process but also pre-adjusts the chip temperature by adding a pre-temperature device 6, resulting in more uniform heating of the chip. Furthermore, by fully utilizing the waiting time for pre-temperature adjustment, the total testing time is saved. Therefore, the three-temperature testing and sorting machine of this embodiment not only ensures the accuracy of chip test results and the stability of test yield but also significantly improves testing efficiency, possessing broad application prospects and promotional value.

[0155] In one embodiment of this invention, the design of the three-temperature testing and sorting machine has been further improved and optimized, with the introduction of a key component, the material tray conveying device 10, to enhance the automation level and testing efficiency of the entire equipment.

[0156] In this embodiment, the unloading device 4 is carefully designed to include two independent modules: the OK unloading module 401 and the NG unloading module 402. Each of these two modules undertakes a different unloading task, ensuring the orderly classification and storage of the chips after testing.

[0157] The tray transport device 10 is cleverly positioned on the workbench 1 within the testing space. It has the ability to move freely between the loading device 3, the OK unloading module 401, and the NG unloading module 402. This design allows the tray transport device 10 to accurately pick up trays that have become empty after the chips have been transferred away by the chip transport device 5 from the loading device 3, and transfer them to the OK unloading module 401 or the NG unloading module 402 respectively.

[0158] Specifically, the OK unloading module 401 is responsible for receiving and storing trays containing chips that have passed testing (i.e., are OK). The chips in these trays have passed all testing procedures and have been confirmed to meet quality standards, so they can be safely stored in the OK unloading module 401, awaiting further processing or packaging.

[0159] The NG unloading module 402 is used to receive and store trays containing chips that have been tested and found to be NG (i.e., unqualified). The chips in these trays have been found to have problems or defects during the testing process, so they need to be stored separately for subsequent analysis, repair, or disposal.

[0160] Through the close cooperation between the tray handling device 10 and the OK unloading module 401 and NG unloading module 402, the three-temperature test sorting machine in this embodiment achieves efficient and accurate tray handling and sorting. This design not only improves the automation level of the testing process but also ensures the accuracy and reliability of the test results, providing strong support for chip production and quality control.

[0161] In one embodiment of this invention, the functions of the three-temperature testing and sorting machine have been further expanded and improved, with the addition of a key component, a barcode scanning device 11, to achieve accurate tracking and management of the chips.

[0162] In this embodiment, the chip handling device 5 not only transfers the preheated chips from the preheating device 6 to the chip shuttle device 7, but also cleverly transfers the chips temporarily to the barcode scanning device 11 during the transfer process. This design allows the chips to undergo a barcode scanning process before entering the formal testing process, ensuring that the identity information of each chip is accurately recorded.

[0163] The barcode scanner 11 is carefully positioned on the workbench 1 within the testing space, its location chosen to ensure seamless integration with the chip handling device 5, the preheating device 6, and the chip shuttle device 7. When the chip handling device 5 transfers a chip to the barcode scanner 11, the scanner 11 quickly and accurately scans the codes on the chip. These codes typically contain key information such as the chip's unique identifier, production date, and batch number, serving as crucial evidence for chip traceability and management.

[0164] With the addition of the barcode scanning device 11, the three-temperature testing and sorting machine in this embodiment achieves full-chain tracking and management of chips. From chip production, pre-temperature control, testing to final unloading, information from each step can be accurately recorded, providing strong data support for chip quality control, problem tracing, and production optimization. At the same time, this design also improves the automation level of the testing process, reduces manual intervention, and ensures the accuracy and reliability of test results.

[0165] In one embodiment of this invention, the technical configuration of the three-temperature testing and sorting machine has been further upgraded and optimized, with the introduction of a camera device 12 to enhance the intelligence and automation level of the equipment.

[0166] In this embodiment, the pre-temperature device 6 is a crucial part of the testing process, and its design is particularly sophisticated. The pre-temperature device 6 includes a pre-temperature stage 601, on which several pre-temperature slots 602 are carefully arranged. These pre-temperature slots 602 are specifically designed to place the chip to be tested, ensuring that the chip can reach the required temperature state before testing.

[0167] The camera device 12 is cleverly mounted on the chip handling device 5. This design allows the camera device 12 to move along with the chip handling device 5 and perform visual recognition of the preheating tank 602 and the chip when appropriate. Through advanced visual recognition technology, the camera device 12 can accurately capture the position information of the preheating tank 602 and the specific shape of the chip, thereby providing precise placement guidance for the chip handling device 5.

[0168] During chip handling, camera device 12 transmits image data to the control system in real time. The control system analyzes this data to determine the optimal placement position and directs chip handling device 5 to accurately place the chip into the preheating bath 602. This process not only improves the accuracy and efficiency of chip placement but also reduces errors and risks caused by human operation.

[0169] In summary, the three-temperature testing and sorting machine in this embodiment, through the introduction of the camera device 12 and its close cooperation with the pre-temperature device 6 and the chip handling device 5, achieves intelligent and automated chip placement. This design not only improves the smoothness and efficiency of the testing process but also provides strong technical support for chip quality control and production management.

[0170] In a specific embodiment described in detail in this example, the functional system of the three-temperature test sorting machine has been further improved, with the addition of a sensing device 13 to enhance the intelligent monitoring capability of the equipment in the chip testing process.

[0171] The sensor 13 is carefully positioned on the workbench 1 within the test space. After the test process is completed, the chip shuttle 7 transports the chip to the sensor 13 for subsequent monitoring operations.

[0172] The main function of the sensing device 13 is to monitor the status of the chips in the placement slots of the chip shuttle device 7. Specifically, when there are no chips in the placement slots or the chips are placed at an angle, the sensing device 13 can quickly and accurately send a sensing signal. This design ensures the accurate placement and transfer of chips after the testing process is completed, avoiding material feeding abnormalities caused by missing or improperly placed chips.

[0173] With the addition of sensing device 13, the three-temperature testing and sorting machine in this embodiment achieves real-time monitoring and feedback of chip status. Once sensing device 13 sends a sensing signal, the control system immediately receives this information and takes corresponding measures, such as stopping equipment operation, issuing an alarm, or prompting operators to check. This design not only improves the operational safety and reliability of the equipment but also reduces errors and risks caused by human operation.

[0174] In summary, the three-temperature testing and sorting machine in this embodiment, through the introduction of the sensing device 13 and its close cooperation with the chip shuttle device 7, achieves intelligent monitoring and management of chip status. This design not only improves the smoothness and efficiency of the testing process but also provides strong technical support for chip quality control and production management.

[0175] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A testing device, characterized in that, It includes a lifting mechanism (801), a pneumatically driven floating module (802), and a pressure head (803). The pressure head (803) is disposed on the air-driven floating module (802) for contacting the chip in the placement slot to facilitate chip testing; The air-driven floating module (802) is disposed on the lifting mechanism (801) and can move along the lifting direction under the drive of the lifting mechanism (801) to adjust the insertion angle of the pressure head (803) so that the pressure head (803) can accurately contact the chip in the placement slot.

2. The testing apparatus according to claim 1, characterized in that, The air-driven floating module (802) includes a cylinder block (8021), a cylinder head (8022), a sealing gasket (8023), a pressure diaphragm (8024), a piston (8025), a return base (8026), a horizontal reset assembly (8027), a horizontal rotation assembly (8028), and a base plate (8029). The cylinder body (8021) is hollow inside; The cylinder head (8022) is disposed on the cylinder body (8021) to seal the interior of the cylinder body (8021); the cylinder head (8022) is provided with an air inlet; the air inlet communicates with the interior of the cylinder body (8021) and is connected to an air source; The sealing gasket (8023) is disposed at the air inlet; The pressure film (8024) is disposed inside the cylinder (8021) and has elastic deformation capability; The piston (8025) passes through the cylinder (8021). The return base (8026) is located at the bottom of the piston (8025); The base plate (8029) is located at the bottom of the return base (8026) and is provided with a first mounting groove; The horizontal reset assembly (8027) and the horizontal rotation assembly (8028) are respectively disposed in the corresponding first mounting slots and respectively contact the bottom of the return base (8026).

3. The testing apparatus according to claim 2, characterized in that, The horizontal reset assembly (8027) includes a return bead (80271), a support plate (80272), a reset pin (80273), and a horizontal reset spring (80274). The support plate (80272) is provided with fixing holes; The return bead (80271) is disposed in the fixing hole and contacts the bottom of the return base (8026); The reset pin (80273) is located at the bottom of the return base (8026); The horizontal return spring (80274) is sleeved on the outer periphery of the return pin (80273).

4. The testing apparatus according to claim 2, characterized in that, The horizontal rotary assembly (8028) is a ball bearing.

5. The testing apparatus according to claim 1, characterized in that, The pressure head (803) is also used to perform temperature counter-pressure on the chip; The pressure head (803) includes a housing (8031), a temperature transmission plate (8032), a temperature sensor (8033), a heating element (8034), and a pressure plate (8035). The housing (8031) is disposed on the air-driven floating module (802), and a refrigerant rotary flow channel (8036) is provided inside the housing (8031). The surface of the housing (8031) is provided with a refrigerant swirl port (8037) and a refrigerant injection port (8038) that communicate with the interior of the housing (8031). The temperature transfer plate (8032) is located at the bottom of the housing (8031), and the temperature transfer plate (8032) is provided with a second mounting groove facing the bottom of the pressure plate (8035); The heating element (8034) is disposed in the second mounting groove and is in contact with the pressure plate (8035); The temperature sensor (8033) is disposed on the surface of the pressure plate (8035); The press (8035) is located at the bottom of the temperature transfer plate (8032).

6. The testing apparatus according to claim 5, characterized in that, The tablet press (8035) is provided with several heat insulation grooves (8039); The heat insulation grooves (8039) divide the pressed tablet (8035) into several temperature isolation zones.

7. A three-temperature testing and sorting machine, characterized in that, The device includes a workbench (1), a heat insulation cover (2), a feeding device (3), a discharging device (4), a chip handling device (5), a preheating device (6), a chip shuttle device (7), a ventilation duct (9), and a testing device (8) as described in any one of claims 1-6; wherein, The heat insulation cover (2) is set on the workbench (1) to form a test space with the workbench (1); The loading device (3), unloading device (4), chip handling device (5), preheating device (6), chip shuttle device (7), testing device (8) and ventilation pipe (9) are respectively set on the workbench (1) and located in the testing space; The ventilation duct (9) is used to deliver refrigerant so that the refrigerant circulates within the test space; The feeding device (3) is used to feed the tray containing the chips to be tested; The chip handling device (5) is used to transfer the chips in the loading tray to the preheating device (6); and to transfer the preheated chips from the preheating device (6) to the chip shuttle device (7); and to transfer the tested chips from the chip shuttle device (7) to the unloading device (4). The preheating device (6) is used to pre-adjust the temperature of the chip located on the preheating device (6) before testing; The chip shuttle device (7) is provided with a placement slot for transporting the chip in the placement slot to the testing device (8) for testing; and for transporting the tested chip out of the testing device (8); The testing device (8) is used to further adjust the temperature of the chip and to test the chip; The feeding device (4) is used to feed the tray loaded with the tested chips.

8. The three-temperature testing and sorting machine according to claim 7, characterized in that, It also includes a material tray handling device (10); The feeding device (4) includes an OK feeding module (401) and an NG feeding module (402). The material tray transport device (10) is set on the workbench (1) and located in the test space. It can move within the loading device (3), the OK unloading module (401) and the NG unloading module (402) to transfer the empty material tray after the transferred chip from the loading device (3) to the OK unloading module (401) and the NG unloading module (402), and is stored by the OK unloading module (401) and the NG unloading module (402) respectively. The OK unloading module (401) is used to unload the tray containing chips that have passed the test and are OK. The NG unloading module (402) is used to unload the tray containing chips that have been tested and found to be NG.

9. The three-temperature testing and sorting machine according to claim 7, characterized in that, It also includes a barcode scanning device (11); The chip handling device (5) is also used to transfer the preheated chip to the barcode scanning device (11) during the process of transferring the preheated chip from the preheating device (6) to the chip shuttle device (7). The scanning device (11) is set on the workbench (1) and located in the test space, and is used to scan the code on the chip.

10. The three-temperature testing and sorting machine according to claim 7, characterized in that, It also includes a camera device (12); The preheating device (6) includes a preheating platform (601), on which a plurality of preheating tanks (602) are provided for placing chips. The camera device (12) is mounted on the chip handling device (5) and is used to assist the chip handling device (5) in placing the chip into the preheating tank (602) through visual recognition technology.

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