Cooling water discharge device for semiconductor processing

Abstract

This utility model relates to the field of semiconductor processing equipment technology, and more particularly to a cooling drainage device for semiconductor processing. It includes a cooling water tank, with lifting components on both sides of the tank, and a fixing component mounted on the lifting components, the fixing component located inside the cooling water tank. In this utility model, the wafer semiconductor is directly placed on the placement plate of the fixing component. After the fixing component descends, the wafer can be quickly immersed in the coolant in the cooling water tank, achieving direct contact cooling. Unlike the prior art where cooling pipes are located on the side of the cooling tank and indirect cooling of the semiconductor requires waiting for the water level to rise, this device avoids cooling delay, significantly accelerates heat transfer, and significantly improves the cooling efficiency of the semiconductor, meeting the stringent requirements of semiconductor production for cooling timeliness.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a cooling drainage device for semiconductor processing. Background Technology

[0002] Semiconductor materials are a special class of substances whose conductivity at room temperature falls between that of excellent conductors and insulators. Their unique electrical properties make them a core foundation of the modern electronics industry. In the field of integrated circuits, semiconductor materials are manufactured into nanoscale transistors through precision processes such as photolithography and etching, constructing complex chip circuits. In consumer electronics, from smartphones to tablets, semiconductor devices provide computing and storage capabilities for various smart terminals. In communication systems, semiconductor chips support signal processing and transmission for 5G and even future 6G networks. In the field of photovoltaic power generation, semiconductor photovoltaic cells achieve efficient conversion of light energy into electrical energy. LED lamps and high-power power conversion equipment in the lighting industry also rely heavily on semiconductor technology; for example, the common diode is a basic electronic device made from semiconductor materials.

[0003] In semiconductor manufacturing, the annealing and cooling process following high-temperature heating is crucial. This step directly affects the microstructure, electrical properties, and product yield of semiconductor devices. Effective cooling can eliminate internal thermal stress in the material, stabilize the crystal structure, and ensure the reliability and stability of semiconductor devices.

[0004] In the prior art, patent application number 202120540182.7 discloses a cooling device for semiconductor manufacturing. It includes a cooling box, with two U-shaped plates fixedly connected to both sides of the inner wall of the cooling box. A support plate is slidably connected between the four U-shaped plates, and a baffle is movably engaged between the four U-shaped plates. Two collars are fixedly connected to both sides of the top of the support plate, and connecting ropes are fixedly connected to the outer walls of the four collars. Vertical plates are symmetrically fixedly connected to both sides of the top of the support plate, and handles are fixedly connected to the top of the vertical plates. One end of two connecting ropes on the same side is fixedly connected to the corresponding sides of the vertical plates. A protective cover is fixedly inserted into the top of one side of the cooling box, and a cold water pipe is fixedly inserted into the top of the other side of the cooling box. This invention, through the combined use of the support plate, baffle, collar, connecting rope, and vertical plates, achieves the purpose of cooling semiconductors by placing them in the cooling box, thereby improving the convenience of semiconductor cooling operations.

[0005] However, this cooling device still has significant shortcomings. First, the cold water pipe is located on the right side of the cooling tank. After the cooling water is injected, it cannot directly contact the semiconductor for heat exchange. Indirect cooling can only be achieved after the water level in the cooling tank rises to submerge the semiconductor. This cooling method results in low heat transfer efficiency, greatly prolonging the time required for semiconductor cooling, and making it difficult to meet the cooling efficiency requirements in semiconductor production. Second, the device's carrier plate design can only cool a single wafer, and cannot simultaneously cool multiple wafers in batches. In large-scale semiconductor production scenarios, production efficiency is limited, and it cannot meet the ever-increasing capacity demands. Utility Model Content

[0006] The purpose of this invention is to provide a cooling drainage device for semiconductor processing to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution, which includes a cooling water tank, lifting components on both sides of the cooling water tank, a fixing component on the lifting components, and the fixing component located inside the cooling water tank.

[0008] As a preferred embodiment of this utility model, the cooling water tank is provided with support legs at the four corners of its bottom, a drain valve pipe is provided at the bottom of the cooling water tank, a liquid filling pipe is provided on one side of the cooling water tank, mounting shells are symmetrically provided on both sides of the cooling water tank, mounting plates are symmetrically provided at the bottom of both sides of the cooling water tank, and a mounting bracket is provided at the bottom of one of the mounting plates.

[0009] In a preferred embodiment of this utility model, the lifting assembly includes a pair of lead screws, which are movably mounted in the mounting housing via a pair of bearing seats. A speed reducer is mounted on the mounting plate, and the transmission end of the speed reducer is connected to one end of the lead screw via a coupling. The output ends of the two speed reducers are connected via a transmission rod, and the output end of the speed reducer is connected to one end of the transmission rod via a coupling. A motor is mounted on the mounting frame, and the transmission end of the motor is connected to the input end of one of the speed reducers via a coupling.

[0010] As a preferred embodiment of the present invention, the fixing component includes several placement parts, which are connected by several connecting rods. The middle placement part is symmetrically provided with drive plates on both sides. The two drive plates are respectively sleeved on two lead screws. A nut is provided inside the drive plate, and the nut is threaded on the lead screw.

[0011] In a preferred embodiment of this utility model, the placement component includes a placement plate with several liquid permeation grooves and several perforated grooves. A first inverted L-shaped limiting plate is symmetrically arranged on both sides of the top rear of the placement plate. A sliding groove is symmetrically arranged on both sides of the top front of the placement plate, and a slider is movably disposed within each of the two sliding grooves. A second inverted L-shaped limiting plate is disposed on the top of each slider. A bolt is threaded onto the tail of each sliding groove, and a top post is disposed on the top of the bolt. A shaft is disposed on the outer side of the top post, and a bearing is disposed within the slider.

[0012] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0013] In this invention, the wafer semiconductor is directly placed on the mounting plate of the fixed component. After the fixed component descends, the wafer can be quickly immersed in the coolant in the cooling water tank, achieving direct contact cooling. Unlike the existing technology where the cooling pipe is set on the side of the cooling tank and the semiconductor can only be indirectly cooled by waiting for the water level to rise, this device avoids cooling delay, greatly accelerates the heat transfer speed, significantly improves the cooling efficiency of the semiconductor, and meets the stringent requirements of semiconductor production for cooling timeliness.

[0014] This invention comprises several placement components in a fixed assembly, each capable of holding multiple semiconductor wafers. Through this design, the device can simultaneously cool multiple wafers. Compared to the limitations of existing devices, this device can significantly increase the number of wafers cooled per unit time. In large-scale semiconductor production scenarios, it effectively reduces the number of equipment runs and waiting time, significantly improving overall production efficiency and reducing production costs.

[0015] This invention utilizes an inverted L-shaped limiting plate 1 and an adjustable inverted L-shaped limiting plate 2 on the placement component to securely limit and fix the wafer, ensuring that the wafer is reliably constrained in the front-back and left-right directions. This avoids uneven cooling caused by wafer displacement and shaking during the cooling process, thereby ensuring the consistency and stability of the cooling effect and helping to improve the quality and yield of semiconductor products. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the bottom structure of the cooling water tank of this utility model;

[0018] Figure 3 This is a schematic diagram of the lifting component structure of this utility model;

[0019] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0020] Figure 5 This is a schematic diagram of the fixing component structure of this utility model;

[0021] Figure 6 This is a schematic diagram of the placement component structure of this utility model;

[0022] Figure 7 This is a schematic diagram of the inverted L-shaped limiting plate of this utility model.

[0023] Figure 8 This is a schematic diagram of the unfolded inverted L-shaped limiting plate of this utility model.

[0024] Reference numerals: Cooling water tank 1, Mounting shell 10, Mounting plate 11, Mounting bracket 12, Drain valve pipe 13, Liquid filling pipe 14, Support leg 15, Lifting assembly 2, Lead screw 20, Bearing seat 21, Reducer 22, Coupling one 23, Coupling two 24, Coupling three 25, Motor 26, Transmission rod 27, Fixing assembly 3, Connecting rod 30, Drive plate 31, Nut 32, Placement piece 33, Placement plate 330, Liquid permeable groove 331, Perforated groove 332, Inverted L-shaped limit plate one 333, Slide groove 334, Inverted L-shaped limit plate two 335, Bolt 336, Top column 337, Bearing 338, Slider 339. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0026] like Figure 1-8 As shown, the present invention proposes a cooling drainage device for semiconductor processing, which consists of a cooling water tank 1, a lifting assembly 2, a fixing assembly 3, etc.

[0027] As the basic component of the device, the cooling water tank 1 has support legs 15 installed at its four corners to support the entire device and ensure its stability when placed. The drain valve pipe 13 at the bottom of the cooling water tank 1 facilitates the drainage of the coolant in the tank after the cooling operation is completed, which is convenient for subsequent maintenance, coolant replacement and other operations. The liquid filling pipe 14 on one side of the cooling water tank 1 is the channel for injecting coolant. Operators can add sufficient coolant to the cooling water tank 1 through the liquid filling pipe 14.

[0028] Mounting shells 10 are symmetrically arranged on both sides of the cooling water tank 1 for mounting the lifting assembly 2; at the same time, mounting plates 11 are symmetrically arranged at the bottom of both sides of the cooling water tank 1, and a mounting bracket 12 is installed at the bottom of one of the mounting plates 11 to provide a support structure for the installation of the motor 26.

[0029] The lifting assembly 2 is the key component for realizing the lifting of the fixed assembly 3. It includes a pair of lead screws 20, which are movably mounted in the mounting housing 10 via a pair of bearing seats 21. The bearing seats 21 effectively reduce the frictional resistance when the lead screws 20 rotate, ensuring the smooth rotation of the lead screws 20. The reducer 22 mounted on the mounting plate 11 has its transmission end connected to one end of the lead screw 20 via a coupling 23 to realize power transmission. The output ends of the two reducers 22 are connected via a transmission rod 27, and the output end of the reducer 22 is connected to one end of the transmission rod 27 via a coupling 24. This connection method can ensure that the two lead screws 20 rotate synchronously. The motor 26 mounted on the mounting frame 12 has its transmission end connected to the input end of one of the reducers 22 via a coupling 25. The motor 26 serves as a power source and drives the lead screw 20 to rotate through the reduction and torque amplification effect of the reducer 22, thereby realizing the lifting movement of the fixed assembly 3.

[0030] The fixing component 3 is used to place and fix the wafer semiconductor to be cooled. It includes several placement components 33, which are connected by several connecting rods 30. The middle placement component 33 is symmetrically provided with drive plates 31 on both sides. The drive plate 31 is provided with a nut 32, which is threadedly engaged with the lead screw 20. The drive plate 31 is respectively sleeved on the two lead screws 20. When the lead screw 20 rotates, under the helical transmission action of the nut 32 and the lead screw 20, the drive plate 31 drives the placement component 33 to move up and down along the axis of the lead screw 20.

[0031] The placement component 33 includes a placement plate 330. Several liquid permeable grooves 331 on the placement plate 330 ensure free flow of coolant during cooling, improving the cooling effect. Perforated grooves 332 on the placement plate 330 can be used to install other auxiliary components or to facilitate observation of the wafer cooling status. Symmetrically arranged inverted L-shaped limiting plates 333 on both sides of the top rear of the placement plate 330 provide initial positioning of the wafer placed on the placement plate 330, restricting its horizontal movement. Within the symmetrically arranged grooves 334 on both sides of the top front of the wafer, a slider 339 is movably installed. The top of the slider 339 is provided with an inverted L-shaped limiting plate 335. The bolt 336 with threads at the tail of the groove 334 has a bearing 338 sleeved on the outside of the top post 337. The bearing 338 is installed in the slider 339. When the bolt 336 is turned, the top post 337 pushes the slider 339 to move within the groove 334, thereby driving the inverted L-shaped limiting plate 335 to move, thereby achieving the limiting and fixing of the wafer in the front and rear directions.

[0032] Before use, the operator needs to add sufficient coolant to the cooling water tank 1 through the liquid filling pipe 14. When in use, the operator sends a start command to the motor 26 through the controller. The motor 26 starts to run. The power of the motor 26 is reduced and increased in torque by the reducer 22 and then transmitted to the lead screw 20. Since the two reducers 22 are connected by the transmission rod 27, the two lead screws 20 can rotate synchronously. Under the screw transmission cooperation of the nut 32 and the lead screw 20, the fixed component 3 moves smoothly upward from the cooling water tank 1 until it reaches a height that is convenient for the operator to operate and then stops.

[0033] Next, the operator places several wafer semiconductors to be cooled onto several placement plates 330 of the fixing component 3 in sequence. During placement, it is necessary to ensure that the wafers are pressed against the inner walls of the two inverted L-shaped limiting plates 333. These two limiting plates constitute the initial positioning reference of the wafers, which can initially limit the movement of the wafers in the horizontal direction and ensure the accuracy of the wafer placement position.

[0034] After the wafer is initially placed, the operator uses a special tool to tighten the two bolts 336 fixed on the slider 339. As the bolts 336 are tightened, the slider 339 moves inward against friction in the groove 334, which in turn drives the inverted L-shaped limiting plate 335 connected to the slider 339 to move inward. When the inverted L-shaped limiting plate 335 is tightly pressed against the front end of the wafer, the bolts 336 are stopped. At this time, the wafer is limited and constrained in the front-back and left-right directions and is firmly fixed on the placement plate 330, which effectively prevents the wafer from shifting or shaking during the subsequent cooling process and ensures the uniformity and stability of the cooling process.

[0035] After the wafers are loaded and secured, the operator starts the motor 26 again via the controller to reverse it. The power generated by the reverse rotation of the motor 26 is transmitted to the lead screw 20 via the reducer 22 and the transmission rod 27. With the cooperation of the lead screw 20 and the lead screw 32, the fixing component 3 begins to descend smoothly and slowly returns to the cooling water tank 1. As the fixing component 3 descends, the several wafers placed on it gradually sink into the coolant. The coolant can quickly remove the heat generated by the wafers during the processing and achieve the cooling treatment of the wafers through heat exchange.

[0036] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A cooling drainage device for semiconductor processing, comprising a cooling water tank (1), characterized in that: Lifting components (2) are provided on both sides of the cooling water tank (1), and a fixing component (3) is provided on the lifting components (2). The fixing component (3) is located inside the cooling water tank (1).

2. A cooling drainage device for semiconductor processing according to claim 1, characterized in that: The cooling water tank (1) is provided with support legs (15) at the four corners of the bottom. The cooling water tank (1) is provided with a drain valve pipe (13) at the bottom. The cooling water tank (1) is provided with a liquid filling pipe (14) on one side. The cooling water tank (1) is provided with mounting shells (10) symmetrically on both sides. The cooling water tank (1) is provided with mounting plates (11) symmetrically on the bottom of both sides. One of the mounting plates (11) is provided with a mounting bracket (12) at the bottom.

3. A cooling drainage device for semiconductor processing according to claim 2, characterized in that: The lifting assembly (2) includes a pair of lead screws (20), which are movably mounted in the mounting housing (10) via a pair of bearing seats (21). A speed reducer (22) is mounted on the mounting plate (11). The transmission end of the speed reducer (22) is connected to one end of the lead screw (20) via a coupling (23). The output ends of the two speed reducers (22) are connected via a transmission rod (27), and the output end of the speed reducer (22) is connected to one end of the transmission rod (27) via a coupling (24). A motor (26) is mounted on the mounting frame (12), and the transmission end of the motor (26) is connected to the input end of one of the speed reducers (22) via a coupling (25).

4. A cooling drainage device for semiconductor processing according to claim 3, characterized in that: The fixing component (3) includes several placement parts (33), which are connected by several connecting rods (30). The middle placement part (33) has drive plates (31) symmetrically arranged on both sides. The two drive plates (31) are respectively sleeved on two lead screws (20). The drive plates (31) are provided with nuts (32), and the nuts (32) are threaded on the lead screws (20).

5. A cooling drainage device for semiconductor processing according to claim 4, characterized in that: The placement component (33) includes a placement plate (330), on which several liquid permeation grooves (331) are provided, and several perforation grooves (332) are also provided. On the rear side of the top of the placement plate (330), an inverted L-shaped limiting plate (333) is symmetrically arranged. On the front side of the top of the placement plate (330), sliding grooves (334) are symmetrically arranged. A slider (339) is movably arranged in each of the two sliding grooves (334). An inverted L-shaped limiting plate (335) is provided on the top of the slider (339). A bolt (336) is threaded at the tail of the sliding groove (334). A top post (337) is provided on the top of the bolt (336). A bearing (338) is provided on the outside of the top post (337). The bearing (338) is located inside the slider (339).

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