Circuit board heat dissipation structure, circuit board and electric device

Abstract

The utility model discloses a circuit board radiating structure, circuit board and electrical equipment, the utility model discloses a circuit board radiating structure including board body and the heat dissipation block of embedding board body. Board body has the first plane and the second plane of opposite setting in its thickness direction, and the heat dissipation block has the first end surface and the second end surface of opposite setting in the thickness direction of board body, and the first end surface and the first plane are flush, and the second end surface and the second plane are flush. The outer edge of first end surface is equipped with the first groove, and the outer edge of second end surface is equipped with the second groove, and board body includes the semi-solidified layer, and semi-solidified layer is suitable for the deformation filling first groove and second groove of hot pressing generation. The utility model discloses a circuit board radiating structure can avoid the crack between heat dissipation block and board body, and improve the yield of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board heat dissipation structure, a circuit board, and an electrical device. Background Technology

[0002] With the development of electronic technology, the demand for heat dissipation in circuit boards of electrical equipment is increasing.

[0003] In related technologies, heat dissipation of circuit boards is mainly achieved by embedding heat sinks inside the circuit board. However, since the outer surface of the heat sink is smooth, it cannot fully bond with the circuit board. During the subsequent processing and application of the circuit board, cracks are likely to appear between the heat sink and the circuit board, resulting in a low yield rate of the circuit board. Utility Model Content

[0004] This utility model provides a circuit board heat dissipation structure to solve the problem of cracks easily appearing between the heat sink and the circuit board in related technologies, thereby improving the yield of circuit boards.

[0005] The circuit board heat dissipation structure in this embodiment of the utility model includes:

[0006] A plate having a first plane and a second plane disposed opposite to each other in its thickness direction;

[0007] A heat sink is embedded in the plate body, and the heat sink has a first end face and a second end face that are disposed opposite to each other in the thickness direction of the plate body.

[0008] The outer edge of the first end face is provided with a first groove, and the outer edge of the second end face is provided with a second groove.

[0009] The plate includes a semi-cured layer, which is adapted to deform under heat and pressure to fill the first groove and the second groove.

[0010] The circuit board heat dissipation structure of this utility model provides a first groove and a second groove on the outer edge of the first end face and the outer edge of the second end face of the heat sink, respectively. When the semi-cured layer is heated and pressed, it can fill the first groove and the second groove, thereby increasing the contact area between the heat sink and the semi-cured layer of the board, and thus improving the bonding force between the heat sink and the board. This can prevent cracks from appearing between the heat sink and the board during subsequent processing and application of the circuit board. At the same time, after subsequent silver / tin melting, no blackening or dot-like defects will appear around the heat sink.

[0011] Therefore, the circuit board heat dissipation structure of this utility model embodiment can avoid cracks between the heat sink and the board body, thereby improving the yield of the circuit board.

[0012] In some embodiments, the first end face is flush with the first plane, and the second end face is flush with the second plane.

[0013] In some embodiments, the cross-section of the first groove is one of a rectangle, a sector, and a right triangle; the cross-section of the second groove is one of a rectangle, a sector, and a right triangle.

[0014] In some embodiments, the side length of the rectangle ranges from 0.05 to 0.2 mm, the radius of the sector ranges from 0.05 to 0.2 mm, and the right-angled side of the right triangle ranges from 0.05 to 0.2 mm.

[0015] In some embodiments, the plate body further includes a plurality of core plates, which are stacked along their thickness direction, and the semi-cured layer is provided between adjacent core plates.

[0016] In some embodiments, the core board includes a substrate layer, a first copper foil layer, and a second copper foil layer, wherein the first copper foil layer and the second copper foil layer are respectively disposed on both sides of the substrate layer in the thickness direction.

[0017] In some embodiments, the plate has a mounting groove extending through the plate along its thickness direction; the heat sink is disposed in the mounting groove, and there is a first gap between the sidewall of the heat sink and the inner wall of the mounting groove; the semi-cured layer is adapted to deform under heat and pressure to fill the first gap.

[0018] In some embodiments, the core board has a first through groove extending through the core board in its thickness direction, and the semi-cured layer has a second through groove extending through the semi-cured layer in its thickness direction. The first through groove and the second through groove at least partially overlap in the thickness direction of the board body to define the mounting through groove.

[0019] In some embodiments, the semi-cured layer is a PP layer.

[0020] In some embodiments, the heat sink is a copper block.

[0021] This utility model also provides a circuit board.

[0022] The circuit board of this utility model embodiment includes the heat dissipation structure described in the above embodiment.

[0023] By setting the heat dissipation structure of the circuit board in the present invention, the circuit board can avoid the formation of gaps between the semi-cured layer and the heat sink, thereby improving the yield of the circuit board.

[0024] This utility model also provides an electrical device.

[0025] The electrical equipment in this embodiment of the utility model includes the circuit board described in the above embodiment.

[0026] By providing a circuit board with the heat dissipation structure of the circuit board described in the above embodiment, the electrical equipment of this utility model can avoid the formation of gaps between the semi-cured layer and the heat sink, thereby improving the yield rate of the electrical equipment. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the heat dissipation structure of the circuit board according to an embodiment of the present invention;

[0029] Figure 2 This is one of the structural schematic diagrams of the heat sink block in the circuit board heat dissipation structure of this utility model embodiment;

[0030] Figure 3 This is the second schematic diagram of the heat sink block in the circuit board heat dissipation structure of this utility model embodiment;

[0031] Figure 4 This is the third schematic diagram of the heat sink block in the circuit board heat dissipation structure of this utility model embodiment.

[0032] In the picture:

[0033] 1. Plate body; 101. First plane; 102. Second plane; 103. Mounting through groove;

[0034] 2. Heat sink; 201, First end face; 2011, First slot; 202, Second end face; 2021, Second slot;

[0035] 3. Core board; 301. First copper foil layer; 302. Second copper foil layer; 303. Substrate layer;

[0036] 4. Semi-cured layer;

[0037] 5. First gap;

[0038] 6. First through slot; 7. Second through slot. Detailed Implementation

[0039] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0040] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0041] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal encapsulation of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] The following is in conjunction with the appendix Figure 1-4 This application describes the circuit board heat dissipation structure according to an embodiment.

[0043] like Figure 1 As shown, the circuit board heat dissipation structure of this utility model embodiment includes a board body 1 and a heat dissipation block 2 embedded in the board body 1.

[0044] like Figure 1 As shown, the plate 1 has a first plane 101 and a second plane 102 disposed opposite to each other in its thickness direction; the heat sink 2 has a first end face 201 and a second end face 202 disposed opposite to each other in the thickness direction of the plate 1.

[0045] like Figure 1 As shown, the outer edge of the first end face 201 is provided with a first groove 2011, and the outer edge of the second end face 202 is provided with a second groove 2021.

[0046] The plate 1 includes a semi-cured layer 4, which is adapted to be deformed by heat and pressure to fill the first groove 2011 and the second groove 2021.

[0047] The circuit board heat dissipation structure of this utility model provides a first groove 2011 and a second groove 2021 on the outer edge of the first end face 201 and the outer edge of the second end face 202 of the heat sink 2, respectively. When the semi-cured layer 4 is heated and pressed, it can fill the first groove 2011 and the second groove 2021, thereby increasing the contact area between the heat sink 2 and the board body 1, and thus improving the bonding force between the heat sink 2 and the board body 1. This can prevent cracks from appearing between the heat sink 2 and the board body 1 during subsequent processing and application of the circuit board. At the same time, after subsequent silver / tin melting, no blackening or dot-like defects will appear around the heat sink 2.

[0048] Therefore, the circuit board heat dissipation structure of this utility model embodiment can avoid cracks between the heat sink 2 and the board body 1, thereby improving the yield of the circuit board.

[0049] The following is in conjunction with the appendix Figure 1-4 The circuit board heat dissipation structure of this utility model embodiment is further described.

[0050] like Figure 1 As shown, the circuit board heat dissipation structure of this utility model embodiment includes a board body 1 and a heat dissipation block 2 embedded in the board body 1.

[0051] like Figure 1 As shown, the plate 1 has a first plane 101 and a second plane 102 disposed opposite to each other in its thickness direction; the heat sink 2 has a first end face 201 and a second end face 202 disposed opposite to each other in the thickness direction of the plate 1.

[0052] As shown in the figure, the outer edge of the first end face 201 is provided with a first groove 2011, and the outer edge of the second end face 202 is provided with a second groove 2021.

[0053] The plate 1 includes a semi-cured layer 4, which is adapted to be deformed by heat and pressure to fill the first groove 2011 and the second groove 2021.

[0054] Optionally, the semi-cured layer 4 is a PP layer. Specifically, the semi-cured layer 4 is a thin sheet material made by impregnating fiberglass cloth with resin and then heat-treating it.

[0055] Optionally, heat sink 2 is a copper block.

[0056] The circuit board heat dissipation structure of this utility model provides a first groove 2011 and a second groove 2021 on the outer edge of the first end face 201 and the outer edge of the second end face 202 of the heat sink 2, respectively. When the semi-cured layer 4 is heated and pressed, it can fill the first groove 2011 and the second groove 2021, thereby increasing the contact area between the heat sink 2 and the board body 1, and thus improving the bonding force between the heat sink 2 and the board body 1. This can prevent cracks from appearing between the heat sink 2 and the board body 1 during subsequent processing and application of the circuit board. At the same time, after subsequent silver / tin melting, no blackening or dot-like defects will appear around the heat sink 2.

[0057] In some embodiments, the first end face 201 and the first plane 101 are flush, and the second end face 202 and the second plane 102 are flush. That is, the heat sink penetrates through the plate 1, thereby preventing the heat sink from being completely submerged in the semi-cured layer that is deformed by heat and pressure, which would affect the heat dissipation performance of the heat sink.

[0058] In some embodiments, the cross-section of the first groove 2011 is one of a rectangle, a sector, and a right triangle; the cross-section of the second groove 2021 is one of a rectangle, a sector, and a right triangle. The cross-sections of the first groove 2011 and the second groove 2021 may be the same or different, and can be set according to actual needs.

[0059] It is understandable that, in order to facilitate the processing of the first groove 2011 and the second groove 2021 on the heat sink 2, the cross sections of the first groove 2011 and the second groove 2021 can be the same, that is, the cross sections of the first groove 2011 and the second groove 2021 are both rectangular, or the first groove 2011 and the second groove 2021 are both fan-shaped, or the first groove 2011 and the second groove 2021 are both right-angled triangles.

[0060] like Figure 2 As shown, the cross-sections of the first groove 2011 and the second groove 2021 are both rectangular, with the side length of the rectangle ranging from 0.05 to 0.2 mm. That is, the length and width of the rectangle both range from 0.05 to 0.2 mm.

[0061] By setting the length and width of the rectangle to a range of 0.05-0.2mm, it is possible to avoid excessively reducing the area of ​​the first end face 201 and the second end face 202, which would affect the heat dissipation performance of the heat sink 2. In other words, the bonding force between the semi-cured layer 4 and the heat sink 2 can be improved without affecting the heat dissipation performance of the heat sink 2, thus preventing cracks from forming between the semi-cured layer 4 and the heat sink 2.

[0062] like Figure 3 As shown, the cross-sections of the first groove 2011 and the second groove 2021 are both sector-shaped, and the radius of the sector is in the range of 0.05-0.2mm.

[0063] By setting the radius of the fan-shaped area to a range of 0.05-0.2mm, it is possible to avoid excessively reducing the area of ​​the first end face 201 and the second end face 202, which would affect the heat dissipation performance of the heat sink 2. In other words, the bonding force between the semi-cured layer 4 and the heat sink 2 can be improved without affecting the heat dissipation performance of the heat sink 2, thus preventing cracks from forming between the semi-cured layer 4 and the heat sink 2.

[0064] like Figure 4 As shown, the cross-sections of the first groove 2011 and the second groove 2021 are both right-angled triangles, and the dimensions of the two right-angled sides of the right triangle are both in the range of 0.05-0.2mm.

[0065] By setting the dimensions of the two right-angled sides of the right triangle to 0.05-0.2mm, it is possible to avoid excessively reducing the area of ​​the first end face 201 and the second end face 202, which would affect the heat dissipation performance of the heat sink 2. In other words, the bonding force between the semi-cured layer 4 and the heat sink 2 can be improved without affecting the heat dissipation performance of the heat sink 2, thus preventing cracks from forming between the semi-cured layer 4 and the heat sink 2.

[0066] In some embodiments, the plate body 1 further includes a plurality of core plates 3, which are stacked along their thickness direction, and a semi-cured layer 4 is provided between adjacent core plates 3.

[0067] Furthermore, the core board 3 includes a substrate layer 303, a first copper foil layer 301, and a second copper foil layer 302, with the first copper foil layer 301 and the second copper foil layer 302 respectively disposed on both sides of the substrate layer 303 in the thickness direction.

[0068] In some embodiments, the plate 1 has a mounting groove 103 extending through the plate 1 along its thickness direction; the heat sink 2 is disposed in the mounting groove 103, and there is a first gap 5 between the side wall of the heat sink 2 and the inner wall of the mounting groove 103; the semi-cured layer 4 is adapted to deform under heat and pressure to fill the first gap 5. The semi-cured layer 4 fills the first gap 5 between the side wall of the heat sink 2 and the inner wall of the mounting groove 103, which can further improve the bonding force between the heat sink 2 and the semi-cured layer 4 and avoid cracks between the heat sink 2 and the semi-cured layer 4.

[0069] In some embodiments, the core board 3 has a first through groove 6 extending through the core board 3 in its thickness direction, and the semi-cured layer 4 has a second through groove 7 extending through the semi-cured layer 4 in its thickness direction. The first through groove 6 and the second through groove 7 coincide in the thickness direction of the board body 1 to define the mounting through groove 103.

[0070] It is understandable that there is a gap between the side wall of the heat sink 2 and the inner wall of the first through groove 6 of the core plate 3, and there is a gap between the inner wall of the second through groove 7 of the semi-cured layer 4 of the heat sink 2. After being heated and pressed, the semi-cured layer 4 can fill the gaps, which can further improve the bonding force between the heat sink 2 and the semi-cured layer 4 and prevent cracks from forming between the heat sink 2 and the semi-cured layer 4.

[0071] This utility model also provides a circuit board.

[0072] The circuit board of this utility model embodiment includes the circuit board heat dissipation structure of the above embodiment.

[0073] By setting the heat dissipation structure of the circuit board in the present invention, the circuit board can avoid the formation of gaps between the semi-cured layer 4 and the heat sink 2, thereby improving the yield of the circuit board.

[0074] This utility model also provides an electrical device.

[0075] The electrical equipment in this embodiment of the utility model includes the circuit board described in the above embodiment.

[0076] By providing a circuit board with the heat dissipation structure of the circuit board described in the above embodiment, the electrical equipment of this utility model can avoid the formation of gaps between the semi-cured layer 4 and the heat sink 2, thereby improving the yield rate of the electrical equipment.

[0077] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A heat dissipation structure for a circuit board, characterized in that, include: The plate (1) has a first plane (101) and a second plane (102) disposed opposite to each other in its thickness direction. Heat sink (2), the heat sink (2) is embedded in the plate (1), the heat sink (2) has a first end face (201) and a second end face (202) in the thickness direction of the plate (1). The outer edge of the first end face (201) is provided with a first groove (2011), and the outer edge of the second end face (202) is provided with a second groove (2021). The plate (1) includes a semi-cured layer (4), which is adapted to be deformed by heat and pressure to fill the first groove (2011) and the second groove (2021).

2. The circuit board heat dissipation structure according to claim 1, characterized in that, The first end face (201) is flush with the first plane (101), and the second end face (202) is flush with the second plane (102).

3. The circuit board heat dissipation structure according to claim 1, characterized in that, The first groove (2011) has a cross-section that is one of a rectangle, a sector, and a right triangle; the second groove (2021) has a cross-section that is one of a rectangle, a sector, and a right triangle.

4. The circuit board heat dissipation structure according to claim 3, characterized in that, The side length of the rectangle is in the range of 0.05-0.2mm, the radius of the sector is in the range of 0.05-0.2mm, and the right-angled side of the right triangle is in the range of 0.05-0.2mm.

5. The circuit board heat dissipation structure according to claim 1, characterized in that, The plate (1) also includes a plurality of core plates (3), which are stacked along their thickness direction, and the semi-cured layer (4) is provided between adjacent core plates (3).

6. The circuit board heat dissipation structure according to claim 5, characterized in that, The core board (3) includes a substrate layer (303), a first copper foil layer (301), and a second copper foil layer (302), wherein the first copper foil layer (301) and the second copper foil layer (302) are respectively disposed on both sides of the substrate layer (303) in the thickness direction.

7. The circuit board heat dissipation structure according to claim 5, characterized in that, The plate (1) has a mounting groove (103) that extends through the plate (1) along its thickness direction; the heat sink (2) is disposed in the mounting groove (103), and there is a first gap (5) between the side wall of the heat sink (2) and the inner wall of the mounting groove (103); the semi-cured layer (4) is adapted to be deformed by heat and pressure to fill the first gap (5), the first groove (2011) and the second groove (2021).

8. The circuit board heat dissipation structure according to claim 7, characterized in that, The core board (3) has a first through groove (6) extending through the core board (3) in its thickness direction, and the semi-cured layer (4) has a second through groove (7) extending through the semi-cured layer (4) in its thickness direction. The first through groove (6) and the second through groove (7) at least partially overlap in the thickness direction of the board body (1) to define the mounting through groove (103).

9. A circuit board, characterized in that, Includes the circuit board heat dissipation structure as described in any one of claims 1-8.

10. An electrical appliance, characterized in that, Includes the circuit board as described in claim 9.

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