A multi-layer composite avionics package shell assembly

Abstract

The utility model provides a kind of multilayer composite avionics packaging shell assembly, it is related to packaging shell technical field, including composite packaging shell, it includes glass-based potting material layer, heat-conducting intermediate layer, high-temperature alloy outer layer;From inside to outside distribution glass-based potting material layer, heat-conducting intermediate layer and high-temperature alloy outer layer constitute multilayer composite packaging shell, glass-based potting material layer has higher heat-conducting performance, high-temperature resistance and anti-radiation performance;Heat-conducting intermediate layer has high thermal conductivity, and low expansion coefficient;High-temperature alloy outer layer has stronger compression resistance and high-temperature resistance, adopt multilayer composite structure to compensate the deficiency of single-layer material performance, form electronic packaging shell assembly with better thermal conductivity, higher compression resistance and anti-radiation performance more suitable for aviation field.

Description

Technical Field

[0001] This utility model relates to the field of packaging housing technology, and in particular to a multi-layer composite avionics packaging housing assembly. Background Technology

[0002] The descriptions in this section provide background information relating to this disclosure and do not constitute prior art.

[0003] In the aerospace field, the packaging requirements for electronic devices are more stringent than those for ordinary electronic devices, such as requiring better thermal conductivity, higher pressure resistance, and radiation resistance.

[0004] Existing avionics packaging housings mostly use single materials or simple composite materials, and there is room for improvement in thermal conductivity, pressure resistance, and radiation resistance. Utility Model Content

[0005] The purpose of this invention is to provide a multi-layer composite avionics packaging housing assembly, which has the advantage of the multi-layer composite structure compensating for the shortcomings of single-layer materials, and solves the technical problem that existing avionics packaging housings mostly use single materials or simple composite materials, resulting in insufficient thermal conductivity, pressure resistance and radiation resistance.

[0006] This utility model provides a multi-layer composite avionics packaging housing assembly, comprising:

[0007] A composite encapsulation housing, comprising:

[0008] A glass-based potting material layer is applied to the outside of the avionics device, and the terminals of the avionics device extend to the outside of the composite encapsulation shell.

[0009] The outer wall of the glass-based potting material layer is vacuum hot-pressed to form a thermally conductive intermediate layer, and its outer wall is provided with a high-temperature resistant alloy outer layer.

[0010] As a further optimization, in order to enhance the device's resistance to deformation under high pressure by supporting the gap between the thermally conductive intermediate layer and the high-temperature resistant alloy outer layer, an anti-deformation support structure is installed between the outer wall of the thermally conductive intermediate layer and the inner wall of the high-temperature resistant alloy outer layer.

[0011] As a further optimization, to ensure the device's resistance to deformation under high-pressure conditions and to enhance the electromagnetic shielding effect, the deformation-resistant support structure includes:

[0012] A support block is uniformly and fixedly assembled between the outer wall of the heat-conducting intermediate layer and the inner wall of the high-temperature resistant alloy outer layer.

[0013] A gap is left between adjacent support blocks.

[0014] As a further optimization, in order to better distribute pressure and improve the pressure resistance of the device, the support block is specifically frustum-shaped, with the outer end of the frustum being the smaller end.

[0015] As a further optimization, in order to form a directional heat conduction path and reduce thermal resistance, the thermally conductive intermediate layer includes:

[0016] High-density layers and low-density layers are distributed in a gradient from the inside out;

[0017] The material density of the high-density layer is greater than that of the low-density layer.

[0018] As a further optimization, in order to modify the high-density layer and low-density layer of the thermally conductive intermediate layer to improve their compressive strength, a mesh skeleton is embedded in both the high-density layer and the low-density layer.

[0019] As a further optimization, in order to improve the compressive strength of the skeleton through the mesh structure, the mesh skeleton includes:

[0020] Horizontal and longitudinal supports;

[0021] The transverse and longitudinal support rods are integrally formed to create a grid pattern.

[0022] As a further optimization, in order to seal the gap between the wiring terminals of the avionics device and the reserved channel on the outer wall of the composite packaging shell, and to improve the high temperature resistance and electromagnetic resistance, the outer wall of the composite packaging shell is provided with a reserved channel corresponding to the wiring terminals of the avionics device.

[0023] The reserved channel contains wiring terminals for corresponding avionics devices.

[0024] A solder layer is provided between the inner wall of the reserved channel and the wiring terminals of the corresponding avionics device.

[0025] As a further optimization, in order to reduce weld seams and improve compressive strength, the edges of the outer layer of the high-temperature alloy along its length are rounded.

[0026] As a further optimization, to facilitate the fixation of the device, a connecting lug is fixedly mounted on the side wall of the composite package shell near the edge of the wiring terminals of the avionics device.

[0027] This utility model provides an improved multi-layer composite avionics packaging housing assembly, which has the following improvements and advantages compared with the prior art:

[0028] The system employs a multi-layered composite encapsulation shell consisting of a glass-based potting material layer, a thermally conductive intermediate layer, and a high-temperature resistant alloy outer layer, distributed from the inside out. The glass-based potting material layer exhibits high thermal conductivity, high-temperature resistance, and radiation resistance; the thermally conductive intermediate layer has high thermal conductivity and a low coefficient of thermal expansion; and the high-temperature resistant alloy outer layer possesses strong compressive strength and high-temperature resistance. This multi-layered composite structure compensates for the shortcomings of single-layer materials, resulting in an electronic encapsulation shell assembly that is more suitable for the aerospace field, offering better thermal conductivity, higher compressive strength, and radiation resistance. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of this utility model;

[0031] Figure 2 This is a schematic cross-sectional view of the structure of this utility model;

[0032] Figure 3 This is a schematic cross-sectional view of the thermally conductive intermediate layer structure of this utility model;

[0033] Figure 4 This is a schematic diagram of the mesh skeleton structure of this utility model;

[0034] Figure 5 This is a schematic cross-sectional view of the assembly structure of the composite packaging shell and the corresponding wiring terminals of the avionics device of this utility model.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-Composite encapsulation shell, 11-Glass-based potting material layer, 12-Thermal conductive intermediate layer, 121-High-density layer, 122-Low-density layer, 123-Grid skeleton, 1231-Longitudinal support rod, 1232-Transverse support rod, 13-High-temperature resistant alloy outer layer, 2-Deformation-resistant support structure, 21-Support block, 22-Gap, 3-Reserved channel, 31-Solder layer, 4-Arc surface, 5-Connecting ear plate. Detailed Implementation

[0037] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0038] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0039] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] Please see Figure 1-5 This utility model provides a technical solution: a multi-layer composite avionics packaging housing assembly, comprising:

[0041] A composite encapsulation housing 1, comprising:

[0042] A glass-based potting material layer 11 is potted on the outside of the avionics device, and the terminals of the avionics device extend to the outside of the composite encapsulation shell 1.

[0043] The outer wall of the glass-based potting material layer 11 is vacuum hot-pressed to form a thermally conductive intermediate layer 12, and its outer wall is provided with a high-temperature resistant alloy outer layer 13.

[0044] Specifically, in this embodiment, the glass-based potting material layer 11 is made by doping a ceramic filler into a low-melting-point glass. The added ceramic component is PbTiO3, which ensures that the glass-based potting material layer 11 has high thermal conductivity, heat resistance and chemical stability. Compared with organic materials, glass-based inorganic non-metallic materials have higher chemical stability and radiation damage resistance. After doping with PbTiO3, lead atoms effectively attenuate the incident radiation energy through photoelectric effect and Compton scattering, reducing the damage of radiation to the packaged device.

[0045] The thermally conductive intermediate layer 12 is specifically a carbon fiber reinforced aluminum matrix composite material, which is made by mixing aluminum powder, carbon fiber and rare earth elements and forming it by vacuum hot pressing. The mixing ratio of aluminum powder, carbon fiber and rare earth elements is obtained by comparing multiple experiments. In this embodiment, the ratio of the three is 60%, 37% and 3%, respectively. The carbon fiber reinforced aluminum matrix composite material achieves high thermal conductivity and low expansion coefficient through the material's own properties.

[0046] Rare earth elements include at least one of cerium, gadolinium, europium, dysprosium, samarium, and promethium;

[0047] The high-temperature resistant alloy outer layer 13 is specifically a titanium-aluminum based intermetallic compound, which is set on the outer wall of the thermally conductive intermediate layer 12 using 3D printing technology. It has high high-temperature resistance and, as the outermost layer, has high mechanical strength and compressive strength.

[0048] Furthermore, the glass-based potting material layer 11, the thermally conductive intermediate layer 12, and the high-temperature resistant alloy outer layer 13, distributed from the inside out, constitute a multi-layered composite encapsulation shell. The glass-based potting material layer 11 has high thermal conductivity, high-temperature resistance, and radiation resistance; the thermally conductive intermediate layer 12 has high thermal conductivity and a low coefficient of expansion; and the high-temperature resistant alloy outer layer 13 has strong compressive strength and high-temperature resistance. The multi-layered composite structure compensates for the shortcomings of single-layer materials, forming an electronic encapsulation shell assembly that is more suitable for the aerospace field and has better thermal conductivity, higher compressive strength, and radiation resistance.

[0049] More specifically, an electroplating layer is set on the outer wall of the high-temperature alloy outer layer 13. The shell is protected by a process of nickel plating followed by gold plating. A vacuum heat treatment process is used to remove hydrogen ions attached to the plating layer, so as to prevent hydrogen ions from penetrating into the interior of the plating layer and causing the material to become brittle due to a significant reduction in toughness.

[0050] In some embodiments, an anti-deformation support structure 2 is assembled between the outer wall of the thermally conductive intermediate layer 12 and the inner wall of the high-temperature resistant alloy outer layer 13. The anti-deformation support structure 2 is supported in the gap between the thermally conductive intermediate layer 12 and the high-temperature resistant alloy outer layer 13, enhancing the device's resistance to deformation under high pressure. The anti-deformation support structure 2 is made of a material with good thermal conductivity to conduct heat.

[0051] In some embodiments, the deformation-resistant support structure 2 includes:

[0052] Support block 21 is uniformly and fixedly assembled between the outer wall of the heat-conducting intermediate layer 12 and the inner wall of the high-temperature resistant alloy outer layer 13.

[0053] A gap 22 is left between adjacent support blocks 21.

[0054] In this embodiment, the support block 21 is made of a material with good thermal conductivity, high mechanical strength, and high temperature resistance; in this embodiment, a tungsten-copper alloy is used.

[0055] Furthermore, a gap 22 is left between adjacent support blocks 21 to form an air interlayer. The air interlayer, as a low conductivity medium, forms an impedance difference with the metal shell, which can enhance the reflection loss of electromagnetic waves. According to the electromagnetic shielding principle, when electromagnetic waves enter the low impedance medium air interlayer from the high temperature resistant alloy outer layer 13, the reflectivity is significantly improved.

[0056] The spaced support blocks 21 can change the propagation path of electromagnetic waves in the air interlayer, forcing the electromagnetic waves to undergo multiple reflections and refractions, increasing energy dissipation. The density and spacing of the support blocks need to be optimized through simulation to avoid forming electromagnetic leakage channels.

[0057] More specifically, the evenly distributed support blocks 21 uniformly disperse the pressure, ensuring the device's resistance to deformation under high-pressure conditions.

[0058] In some embodiments, the support block 21 is specifically frustum-shaped, with the outer end of the frustum being the smaller end. The shape of the frustum allows the pressure applied to its surface to be distributed more evenly. This uniform pressure distribution helps to reduce local stress concentration, thereby improving the overall stability and durability of the structure. The upper and lower base radii of the frustum are different. This design allows the pressure to change gradually during transmission, rather than changing abruptly. This gradual design helps to smooth the transition of pressure, further reducing stress concentration, better dispersing pressure, and improving the pressure resistance of the device.

[0059] In some embodiments, the thermally conductive intermediate layer 12 includes:

[0060] A high-density layer 121 and a low-density layer 122 are distributed in a gradient from the inside to the outside;

[0061] The material density of the high-density layer 121 is greater than that of the low-density layer 122.

[0062] Specifically in this embodiment, within the critical pressure range, as the density of the pressure-reinforcing material increases, two layers of carbon fiber reinforced aluminum matrix composite material with different densities are prepared, and the two layers are vacuum hot-pressed together to form a connected high-density layer 121 and low-density layer 122.

[0063] Furthermore, the high-density layer 121 and low-density layer 122, with their gradient distribution from the inside out, form a directional heat conduction path, reducing thermal resistance and lateral heat diffusion. This achieves a directional heat conduction path where heat is rapidly conducted away from the bottom while the top remains lightweight to maintain heat dissipation, effectively reducing thermal resistance. This design balances the requirements of lightweight design and efficient heat dissipation in avionics packaging.

[0064] In some embodiments, a mesh skeleton 123 is embedded in both the high-density layer 121 and the low-density layer 122 to support and modify the high-density layer 121 and the low-density layer 122 of the thermally conductive intermediate layer 12, thereby improving their compressive strength.

[0065] In some embodiments, the mesh skeleton 123 includes:

[0066] Transverse support 1232 and longitudinal support 1231;

[0067] The transverse support rod 1232 and the longitudinal support rod 1231 are integrally formed to form a grid.

[0068] like Figure 4 As shown, the mesh skeleton 123 is made of carbon fiber material and consists of a mesh of transverse support rods 1232 and longitudinal support rods 1231 to support and modify the high-density layer 121 or the low-density layer 122.

[0069] In some embodiments, the outer wall of the composite encapsulation housing 1 has a reserved channel 3 corresponding to the wiring terminals of the avionics device;

[0070] The reserved channel 3 contains wiring terminals for corresponding avionics devices;

[0071] A solder layer 31 is provided between the inner wall of the reserved channel 3 and the wiring terminal of the corresponding avionics device.

[0072] Specifically, in this embodiment, the gap between the wiring terminals of the avionics device and the reserved channel on the outer wall of the composite packaging shell 1 is sealed by the solder layer 31, thereby improving the overall high temperature resistance of the composite packaging shell 1; the solder is made of conductive material, and the gap between the reserved channel on the outer wall of the high temperature resistant alloy outer layer 13 and the wiring terminals of the avionics device is sealed by the solder layer 31, thereby improving the electromagnetic resistance of the high temperature resistant alloy outer layer 13.

[0073] In some embodiments, the edges of the high-temperature alloy outer layer 13 along its length are rounded surfaces 4. The integrated shell is formed using 3D printing technology. The design of the edges along its length being rounded surfaces 4 reduces welds and improves compressive strength.

[0074] In some embodiments, a connecting lug 5 is fixedly mounted on the side wall of the composite package housing 1 near the edge of the wiring terminals of the avionics device. When needed, the connecting lug 5 can be fixed to the circuit board or other structure by screws to ensure that it remains stable and secure during use.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A multi-layer composite avionics packaging housing assembly, characterized in that, include: A composite encapsulation housing (1), comprising; A glass-based potting material layer (11) is potted on the outside of the avionics device, and the terminals of the avionics device extend to the outside of the composite package shell (1). The outer wall of the glass-based potting material layer (11) is vacuum hot-pressed to form a thermally conductive intermediate layer (12), and its outer wall is provided with a high-temperature resistant alloy outer layer (13).

2. The multi-layer composite avionics packaging housing assembly according to claim 1, characterized in that, An anti-deformation support structure (2) is assembled between the outer wall of the thermally conductive intermediate layer (12) and the inner wall of the high-temperature resistant alloy outer layer (13).

3. The multi-layer composite avionics packaging housing assembly according to claim 2, characterized in that, The deformation-resistant support structure (2) includes: Support block (21) is uniformly fixed between the outer wall of the heat-conducting intermediate layer (12) and the inner wall of the high-temperature resistant alloy outer layer (13); A gap (22) is left between adjacent support blocks (21).

4. The multi-layer composite avionics packaging housing assembly according to claim 1, characterized in that, The support block (21) is specifically frustum-shaped, with the smaller end being the outermost frustum-shaped end.

5. A multi-layer composite avionics packaging housing assembly according to claim 1, characterized in that, The thermally conductive intermediate layer (12) includes: A high-density layer (121) and a low-density layer (122) are distributed in a gradient from the inside to the outside; The material density of the high-density layer (121) is greater than that of the low-density layer (122).

6. A multi-layer composite avionics packaging housing assembly according to claim 5, characterized in that, Both the high-density layer (121) and the low-density layer (122) are equipped with embedded mesh skeletons (123).

7. A multi-layer composite avionics packaging housing assembly according to claim 6, characterized in that, The mesh skeleton (123) includes: Horizontal support (1232) and longitudinal support (1231); The transverse support rod (1232) and the longitudinal support rod (1231) are integrally formed to form a grid.

8. A multi-layer composite avionics packaging housing assembly according to claim 1, characterized in that, The outer wall of the composite encapsulation shell (1) has a reserved channel (3) corresponding to the wiring terminals of the avionics device; The reserved channel (3) contains wiring terminals for corresponding avionics devices; A solder layer (31) is provided between the inner wall of the reserved channel (3) and the wiring terminal of the corresponding avionics device.

9. A multi-layer composite avionics packaging housing assembly according to claim 1, characterized in that, The edges of the outer layer (13) of the high-temperature alloy along its length are rounded surfaces (4).

10. A multi-layer composite avionics packaging housing assembly according to claim 1, characterized in that, The composite encapsulation housing (1) has a connecting ear plate (5) fixedly mounted on its side wall near the edge of the wiring terminal of the avionics device.

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