Self-adapting curved surface semiconductor back film attaching device

Abstract

The utility model relates to a semiconductor rear pasting film technical field especially relates to a kind of semiconductor rear pasting film laminating device of self-adapting curved surface.The utility model provides a kind of semiconductor rear pasting film laminating device of self-adapting curved surface, including machine frame, bearing plate, limit board, film feeding assembly, mounting bracket, guide rod, slide, rodless cylinder, single-shaft cylinder, assembly plate, pivot, elastic telescopic axle, sponge cover and film cutting assembly, machine frame top middle symmetry is connected with limit board.By pivot connection's multiple elastic telescopic axle and sponge cover cooperation, can be automatically telescopic adjustment according to semiconductor surface curved surface form, realize dynamic self-adapting lamination.In the lamination process, the reciprocating motion of the rolling lamination mode cooperation of sponge cover and rodless cylinder, can even exert pressure, film is flat, tightly laminated on semiconductor surface, effectively avoid bubble, wrinkle and other problems.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor post-coating technology, and in particular to a semiconductor post-coating bonding device for adaptive curved surfaces. Background Technology

[0002] In the field of semiconductor manufacturing and packaging, post-coating is a crucial process for protecting chips, enhancing heat dissipation, and providing electromagnetic shielding. Its processing quality directly affects the performance and reliability of semiconductor devices. As semiconductor technology develops towards miniaturization, integration, and multifunctionality, semiconductor products with complex structures such as curved packaging and three-dimensional stacking are becoming increasingly common, placing higher demands on the adaptability and bonding precision of the coating process.

[0003] Traditional semiconductor lamination equipment mostly employs planar lamination technology, using rigid rollers or flat plates to bond the film to the semiconductor surface. This type of equipment faces significant technical bottlenecks when dealing with semiconductors with curved surfaces: firstly, rigid lamination components cannot adapt to changes in the curved contour, easily leading to uneven local tension in the film, resulting in defects such as bubbles and wrinkles, affecting the integrity and protective performance of the lamination; secondly, traditional equipment lacks a surface-adaptive adjustment mechanism, making it difficult to precisely control the lamination pressure, potentially causing excessive film stretching or damage to the semiconductor surface, reducing product yield. Furthermore, manually assisted curved surface lamination methods are not only inefficient but also rely heavily on operator experience, making it difficult to meet the consistency requirements of large-scale industrial production.

[0004] Therefore, there is an urgent need to develop a semiconductor film bonding device with adaptive curved surface bonding function to solve the problems of insufficient bonding accuracy, narrow application range and low degree of automation in the existing technology, so as to realize high-quality and high-efficiency film bonding processing of complex curved surface semiconductor products. Utility Model Content

[0005] In order to overcome the shortcomings mentioned in the background art, the technical problem to be solved is to provide an adaptive curved surface semiconductor post-film bonding device.

[0006] An adaptive curved surface semiconductor post-coating device includes a frame, a support plate, a limiting plate, a film feeding assembly, a mounting frame, guide rods, a carriage, a rodless cylinder, a single-axis cylinder, an assembly plate, a rotating shaft, an elastic telescopic shaft, a sponge sleeve, and a film cutting assembly. A limiting plate is symmetrically connected to the middle of the top of the frame. A support plate for supporting semiconductors is slidably connected to the top of the frame between the two limiting plates. A film feeding assembly is located on the left side of the top of the frame, and mounting frames are symmetrically connected to the right side of the top of the frame. Two guide rods, distributed front and rear, are connected between the tops of the two mounting frames, and a carriage is slidably connected between the guide rods. A rodless cylinder is installed between the middle of the two mounting frames, and the carriage is slidably connected to the rodless cylinder. A single-axis cylinder is installed on the top of the carriage, and an assembly plate is connected to the telescopic rod of the single-axis cylinder. A rotating shaft is rotatably connected to the assembly plate. Multiple sets of slidable elastic telescopic shafts are arranged at intervals along the circumferential direction on the rotating shaft, and a sponge sleeve is connected to the telescopic end of each elastic telescopic shaft. A film cutting assembly is located on the left mounting frame.

[0007] In a preferred embodiment of the present invention, the film feeding assembly includes a feeding assembly, a support frame, an electric slide rail, a sliding plate, and pneumatic grippers. The feeding assembly is installed on the top left side of the frame, and the film roll is clamped onto the feeding assembly. The support frame is connected to the top right side of the frame, and electric slide rails are symmetrically installed on the support frame. Sliding plates are slidably connected between the electric slide rails, and pneumatic grippers are installed at the front and rear ends of the sliding plates.

[0008] In a preferred embodiment of the present invention, the film cutting assembly includes a dual-axis cylinder II and a cutter. The dual-axis cylinder II is mounted on the upper side of the left mounting bracket, and the cutter is connected to the telescopic rod of the dual-axis cylinder II. The cutter is correspondingly disposed in the left side area of ​​the support plate.

[0009] In a preferred embodiment of the present invention, a dual-axis cylinder and a pressure plate are also included. The dual-axis cylinder is installed in the middle of the slide plate, and the pressure plate is connected to the telescopic rod of the dual-axis cylinder.

[0010] In a preferred embodiment of this utility model, a silicone layer is provided on the bottom surface of the pressure plate, and the thickness of the silicone layer is 1mm-3mm.

[0011] In a preferred embodiment of the present invention, a limiting block is also included, and the limiting block is slidably connected to the right side of the bearing plate.

[0012] The beneficial effects of this utility model are as follows: 1. Multiple sets of elastic telescopic shafts connected by a rotating shaft cooperate with the sponge sleeve, which can automatically adjust their extension and retraction according to the curved shape of the semiconductor surface, achieving dynamic adaptive bonding. During the bonding process, the rolling bonding method of the sponge sleeve, combined with the reciprocating motion of the rodless cylinder, can apply pressure evenly, so as to flatten and tightly bond the film to the semiconductor surface, effectively avoiding problems such as bubbles and wrinkles.

[0013] 2. The device integrates automated components such as electric slide rails, pneumatic grippers, and dual-axis cylinders to achieve fully automated operation of the entire process of film roll feeding, film delivery, film application, and film cutting. All components work together; for example, the electric slide rails and the feeding assembly work in conjunction to achieve constant tension film delivery, reducing manual intervention and significantly improving film application efficiency—3-5 times higher than traditional manual film application. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is a structural diagram of the support frame, electric slide rail, and slide plate of this utility model.

[0016] Figure 3 This is a schematic diagram of the structure of the mounting bracket, the dual-axis cylinder, and the cutter of this utility model.

[0017] Figure 4 This is a cross-sectional structural diagram of the single-shaft cylinder, assembly plate, and rotating shaft of this utility model.

[0018] Figure 5 This is a structural diagram of the components of this utility model, including the bearing plate, the limiting plate, and the limiting block.

[0019] The above-mentioned attached drawings include the following reference numerals: 1_frame, 2_bearing plate, 201_limiting plate, 202_limiting block, 4_feeding assembly, 6_support frame, 7_electric slide rail, 8_slide plate, 9_pneumatic gripper, 11_dual-axis cylinder one, 12_pressure plate, 13_mounting bracket, 14_dual-axis cylinder two, 15_cutter, 16_guide rod, 17_slide carriage, 18_rodless cylinder, 19_single-axis cylinder, 20_assembly plate, 21_rotary shaft, 22_elastic telescopic shaft, 23_sponge sleeve. Detailed Implementation

[0020] Example: An adaptive curved surface semiconductor post-coating device, such as Figures 1-4As shown, the assembly includes a frame 1, a support plate 2, a limiting plate 201, a film feeding assembly, a mounting bracket 13, a guide rod 16, a slide 17, a rodless cylinder 18, a single-axis cylinder 19, an assembly plate 20, a rotating shaft 21, an elastic telescopic shaft 22, a sponge sleeve 23, and a film cutting assembly. The limiting plates 201 are symmetrically connected at the front and rear of the top center of the frame 1. A support plate 2 for supporting semiconductors is slidably connected to the top of the frame 1 between the two limiting plates 201. The limiting plates 201 provide limiting constraints on the front and rear of the support plate 2, ensuring the stability and positioning accuracy of the support plate 2's sliding motion. A film feeding assembly is located on the top left side of the frame 1, and mounting brackets 13 are symmetrically connected to the top right side of the frame 1 via bolts. Two guide rods 16, distributed front and rear, are connected between the tops of the two mounting brackets 13. A slide 17 is slidably connected between the guide rods 16. A rodless cylinder 18 is installed between the middle of the two mounting brackets 13. The slide 17 is slidably connected to the rodless cylinder 18. A single-axis cylinder 19 is installed on the top of the slide 17. An assembly plate 20 is connected to the telescopic rod of the single-axis cylinder 19. A rotating shaft 21 is rotatably connected to the assembly plate 20. Multiple sets of slidable elastic telescopic shafts 22 are arranged at intervals along the circumferential direction on the rotating shaft 21. The telescopic ends of each elastic telescopic shaft 22 are connected to a sponge sleeve 23. This structure can adaptively conform to the curved surface of the semiconductor. A film cutting assembly is provided on the left mounting bracket 13 to complete the film cutting process.

[0021] like Figures 1-2 As shown, the film feeding assembly includes a feeding assembly 4, a support frame 6, an electric slide rail 7, a slide plate 8, and a pneumatic gripper 9. The feeding assembly 4 is installed on the top left side of the frame 1, and the film roll is clamped onto the feeding assembly 4. The support frame 6 is connected to the top right side of the frame 1 by bolts. The electric slide rail 7 is symmetrically installed on the support frame 6. The slide plate 8 is slidably connected between the electric slide rails 7. The front and rear ends of the slide plate 8 are respectively installed with pneumatic grippers 9. The front and rear ends of the film are clamped by the pneumatic grippers 9, and the precise feeding operation of the film is realized under the drive of the electric slide rail 7.

[0022] like Figure 3 As shown, the film cutting assembly includes a dual-axis cylinder 14 and a cutter 15. The dual-axis cylinder 14 is bolted to the upper side of the left mounting bracket 13. The cutter 15 is connected to the telescopic rod of the dual-axis cylinder 14. The cutter 15 is correspondingly set in the left area of ​​the support plate 2. The dual-axis cylinder 14 drives the cutter 15 to realize the film cutting function.

[0023] like Figure 2As shown, it also includes a dual-axis cylinder 11 and a pressure plate 12. The dual-axis cylinder 11 is bolted to the middle of the slide plate 8. The pressure plate 12 is connected to the telescopic rod of the dual-axis cylinder 11. The bottom surface of the pressure plate 12 is provided with a silicone layer with a thickness of 1mm-3mm. When the pressure plate 12 is pressed down, it can adaptively deform according to the slight undulations of the semiconductor surface and the local differences of the film, so as to evenly transmit the pressure to the film and the semiconductor surface, avoid excessive local compression or poor adhesion of the film due to uneven pressure, and ensure the flatness and tightness of the film.

[0024] When applying film to semiconductors, the carrier plate 2 is first pulled out to the right. At the loading / unloading station, the semiconductor is precisely placed in the positioning area of ​​the carrier plate 2. Then, the semiconductor is pushed to the left by the carrier plate 2 to the film application area. Next, the film roll is attached to the unloading assembly 4, and the free end of the film is pulled out and guided to the pneumatic grippers 9 at the front and rear ends of the slide plate 8. The pneumatic grippers 9 are activated, using their high-friction gripping surfaces to firmly hold the tail end of the film. Then, the unloading assembly 4 and the electric slide rail 7 are simultaneously activated. The electric slide rail 7 drives the slide plate 8 and the pneumatic grippers 9 to move to the right at a set speed. 12 moves synchronously with the dual-axis cylinder 11. During the movement, the pneumatic gripper 9 pulls one end of the film to extend to the right, so that it gradually covers the semiconductor. At the same time, the feeding component 4 starts to drive the film roll to rotate, assisting in the feeding of the film. After the film is stretched to the preset length, the electric slide rail 7 and the feeding component 4 are closed in time to complete the pre-laying process of the film. Then, the single-axis cylinder 19 is started, and its telescopic rod extends at a stable rate, driving the assembly plate 20 and its rotating shaft 21, elastic telescopic shaft 22 and sponge sleeve 23 to move downward until the sponge sleeve 23 is in close contact with the film surface. At this time, the rodless cylinder 18 is activated, driving the slide 17 to reciprocate linearly along the guide rod 16 in the left and right directions. During the movement, the sponge sleeve 23 rotates on the semiconductor surface due to friction with the film surface. The rotating shaft 21 and the elastic telescopic shaft 22 rotate synchronously. The elastic telescopic shaft 22 adopts a spring-guide post structure, which can automatically adjust its extension and retraction according to the curved shape of the semiconductor surface to achieve an adaptive bonding effect. Through continuous rotation, the sponge sleeve 23 evenly and flatly adheres the film to the semiconductor surface to complete the film application. After the film application is completed, the rodless cylinder 18 is closed, and the single-axis cylinder 19 is controlled to reset, driving the assembly plate 20 and the sponge sleeve 23 and other components to move upward back to the initial position. Next, the film cutting operation is performed. Since the pneumatic gripper 9 is located on the right side of the semiconductor during the film application process, after the film application is completed, the pneumatic gripper 9 is first controlled to release the film. Then, the slide plate 8 drives the pneumatic gripper 9 and the dual-axis cylinder 11 to move to the left. After the pneumatic gripper 9 moves to the appropriate position, it re-grips the excess film on the left end of the semiconductor. Then, the dual-axis cylinder 11 is activated, and its extension rod extends to push the pressure plate 12 downward, pressing and fixing the excess film after the semiconductor is applied. Finally, the dual-axis cylinder 2 drives the cutter 15 to move downward quickly, using its sharp blade to cut the film. After the film cutting is completed, the dual-axis cylinder 2 is controlled to drive the cutter 15 to reset, and the dual-axis cylinder 11 is controlled to drive the pressure plate 12 to reset. Then, the carrier plate 2 is pulled out, and the semiconductor with the film applied on it is removed. The film application work for the remaining semiconductors is continued according to the above operation procedure.

[0025] like Figure 5As shown, it also includes a limiting block 202. The limiting block 202 is slidably connected to the right side of the carrier plate 2. After the semiconductor is placed on the carrier plate 2, the front and rear positions of the limiting plate 201 are adjusted, and the limiting block 202 is used to limit the right side of the semiconductor. In the film application process, whether it is the contact pressure applied by the sponge sleeve 23 through rolling and bonding, or the vertical pressure generated when the pressure plate 12 is pressed down, the limiting block 202 can provide a stable lateral support force, effectively offsetting the semiconductor displacement caused by factors such as film stretching and uneven bonding pressure.

Claims

1. A semiconductor post-coating device for adaptive curved surfaces, characterized in that: The assembly includes a frame (1), a support plate (2), a limiting plate (201), a film feeding assembly, a mounting bracket (13), a guide rod (16), a slide (17), a rodless cylinder (18), a single-axis cylinder (19), an assembly plate (20), a rotating shaft (21), an elastic telescopic shaft (22), a sponge sleeve (23), and a film cutting assembly. The limiting plate (201) is symmetrically connected to the middle of the top of the frame (1). The support plate (2) for supporting semiconductors is slidably connected to the top of the frame (1) between the two limiting plates (201). The film feeding assembly is located on the left side of the top of the frame (1), and the mounting bracket (13) is symmetrically connected to the right side of the top of the frame (1). The tops of the two mounting brackets (13) are... Two guide rods (16) are connected in front and behind, and a slide (17) is slidably connected between the guide rods (16). A rodless cylinder (18) is installed between the middle of the two mounting frames (13). The slide (17) is slidably connected to the rodless cylinder (18). A single-axis cylinder (19) is installed on the top of the slide (17). An assembly plate (20) is connected to the telescopic rod of the single-axis cylinder (19). A rotating shaft (21) is rotatably connected to the assembly plate (20). Multiple sets of slidable elastic telescopic shafts (22) are arranged at intervals along the circumferential direction on the rotating shaft (21). The telescopic ends of each elastic telescopic shaft (22) are connected to a sponge sleeve (23). A film cutting assembly is provided on the left mounting frame (13).

2. The adaptive curved surface semiconductor post-coating bonding device according to claim 1, characterized in that: The film feeding assembly includes a feeding assembly (4), a support frame (6), an electric slide rail (7), a slide plate (8), and a pneumatic gripper (9). The feeding assembly (4) is installed on the top left side of the frame (1), and the film roll is clamped on the feeding assembly (4). The support frame (6) is connected to the top right side of the frame (1). The electric slide rail (7) is symmetrically installed on the support frame (6). The slide plate (8) is slidably connected between the electric slide rails (7). The front and rear ends of the slide plate (8) are respectively equipped with pneumatic grippers (9).

3. The adaptive curved surface semiconductor post-coating bonding device according to claim 1, characterized in that: The film cutting assembly includes a dual-axis cylinder (14) and a cutter (15). The dual-axis cylinder (14) is mounted on the upper side of the left mounting bracket (13). The cutter (15) is connected to the telescopic rod of the dual-axis cylinder (14). The cutter (15) is correspondingly located in the left area of ​​the support plate (2).

4. The adaptive curved surface semiconductor post-coating bonding device according to claim 2, characterized in that: It also includes a dual-axis cylinder (11) and a pressure plate (12). The dual-axis cylinder (11) is installed in the middle of the slide plate (8), and the pressure plate (12) is connected to the telescopic rod of the dual-axis cylinder (11).

5. The adaptive curved surface semiconductor post-coating bonding device according to claim 4, characterized in that: The bottom surface of the pressure plate (12) is provided with a silicone layer, the thickness of which is 1mm-3mm.

6. The adaptive curved surface semiconductor post-coating bonding device according to claim 1, characterized in that: It also includes a limit block (202), and the right side of the bearing plate (2) is slidably connected to the limit block (202).

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