Copper clad ceramic substrate etch factor measurement apparatus

Abstract

The utility model provides a kind of copper-clad ceramic substrate etching factor measuring equipment, it includes feeding mechanism, conveying positioning mechanism and optical mechanism, the feeding mechanism is correspondingly set with the conveying positioning mechanism, for conveying positioning mechanism one by one transmission substrate;The conveying positioning mechanism includes conveying component and the positioning component on the conveying component conveying path, the positioning component is used to block and position the substrate on the conveying component detection station;The optical mechanism includes movement module, optical function assembly moves above the detection station under the movement module drive, the optical function assembly includes first camera, and the point laser that cooperates with the first camera, second camera and the microscope lens that cooperates with the second camera, the point laser is adjacent with the microscope lens Setting. Such setting, not only realizes the automation of measurement whole process, and greatly improves measurement accuracy and measurement efficiency.

Description

Technical Field

[0001] This utility model relates to the field of optical detection technology, and in particular to a measuring device for etching factor of copper-clad ceramic substrates. Background Technology

[0002] Copper-clad ceramic substrates are core materials in fields such as 5G communication and power electronics, and the quality of their etching process directly affects circuit performance (such as high-frequency loss and heat dissipation efficiency). The etching factor (EF) is a core parameter for evaluating the etching process, defined as the ratio of etching depth to undercut (EF = depth / undercut). Traditional measurement methods have the following shortcomings: 1) High dependence on manual labor: Relying on visual measurement with a microscope or contact probes, which is inefficient and prone to human error; 2) Limited single-dimensional data: Existing optical equipment mostly uses a single sensor, which cannot simultaneously acquire depth and surface morphology data, resulting in EF calculation relying on multiple measurement stitchings and poor data consistency; 3) Insufficient positioning accuracy: The substrate is prone to displacement during transport, requiring repeated manual calibration, which is difficult to adapt to the precise positioning of high-reflectivity copper-clad surfaces; 4) Lack of automation: The separation of loading / unloading, positioning, and inspection processes cannot meet the online inspection requirements of production lines.

[0003] Therefore, it is necessary to design an etching factor measurement device for copper-clad ceramic substrates to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a high-precision, fully automatic, multi-modal fusion etching factor measurement device for copper-clad ceramic substrates.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a copper-clad ceramic substrate etching factor measuring device, comprising a feeding mechanism, a conveying and positioning mechanism, and an optical mechanism. The feeding mechanism is correspondingly arranged with the conveying and positioning mechanism and is used to transfer substrates to the conveying and positioning mechanism one by one. The conveying and positioning mechanism includes a conveying component and a positioning component disposed on the conveying path of the conveying component. The positioning component is used to block the substrates on the conveying component and position them at the detection station. The optical mechanism includes a moving module and an optical functional component that moves above the detection station under the drive of the moving module. The optical functional component includes a first camera, a point laser cooperating with the first camera, a second camera, and a microscope head cooperating with the second camera. The point laser is disposed adjacent to the microscope head.

[0006] As a further improvement of the present invention, the moving module includes an X-axis linear module, an X-axis guide rail arranged parallel to the X-axis linear module, and a Y-axis linear module mounted on the X-axis linear module and the X-axis guide rail. The conveying component passes between the X-axis linear module and the X-axis guide rail, and the optical functional component is mounted on the Y-axis linear module.

[0007] As a further improvement of the present invention, the optical mechanism further includes a Z-axis linear module, which includes a horizontal fixed plate, a vertical fixed plate, a motor and a vertical slide connected in sequence. The horizontal fixed plate is connected to the Y-axis linear module, and the first camera, the point laser, the second camera and the microscope head are mounted on the vertical slide.

[0008] As a further improvement of the present invention, the optical functional component further includes a light source component. The light source component includes a light source and an X-axis moving module that drives the light source to move. The X-axis moving module includes a main body and a slide portion disposed on the main body. The slide portion is fixed to the vertical fixing plate. The light source is fixed to the main body. When the X-axis moving module is activated, the light source moves relative to the vertical fixing plate.

[0009] As a further improvement of this utility model, the light source is a horizontally arranged ring light source, located between the detection station and the point laser and microscope head.

[0010] As a further improvement of the present invention, the conveying assembly includes a conveying line, a first driving assembly for driving the conveying line, and a first support frame for supporting the conveying line and the first driving assembly.

[0011] As a further improvement of the present invention, the positioning component includes a second support frame, a lifting drive disposed on the second support frame, a fixture disposed on the lifting drive for carrying the substrate, two limiting plates for limiting the left and right sides of the substrate, and a driving member for moving the limiting plates left and right.

[0012] As a further improvement of the present invention, the fixture has two adsorption platforms, and there is a channel between the two adsorption platforms for the conveyor line to pass through. The lifting drive drives the fixture, the limiting plate and the driving component to rise and fall. The conveying plane of the conveyor line is located within the rising and falling range of the adsorption plane of the adsorption platform.

[0013] As a further improvement of the present invention, the feeding mechanism includes multiple material frame conveying lines, a material frame handling component, a material frame flipping component, a substrate conveying line, and a substrate handling component. The multiple material frame conveying lines are arranged in parallel. The material frame handling component is horizontally arranged above the material frame conveying lines and is used to transport the material frames on the material frame conveying lines to the material frame flipping component. The material frame flipping component is connected to the substrate conveying line to transport the substrates in the material frames one by one to the substrate conveying line. The substrate handling component is horizontally arranged above the substrate conveying line and the conveying component to pick up and place the substrates on the substrate conveying line onto the conveying component.

[0014] As a further improvement of this utility model, the invention also includes a feeding mechanism, which includes multiple substrate conveying lines, a substrate handling assembly, a frame flipping assembly, a frame handling assembly, and a frame feeding line. The multiple substrate conveying lines are arranged in parallel. The substrate handling assembly is horizontally disposed above the substrate conveying lines and the conveying assembly, and is used to transport the substrates on the conveying assembly to the substrate conveying lines. The frame flipping assembly is connected to the substrate conveying lines to retract the substrates on the substrate conveying lines one by one into the frame. The frame handling assembly is horizontally disposed above the frame feeding line and the frame flipping assembly to pick up and place the frames on the frame flipping assembly onto the frame feeding line.

[0015] As can be seen from the above technical solutions, the copper-clad ceramic substrate etching factor measurement device of this utility model, through mechatronics integration design and multi-sensor collaboration, has the following technical advantages:

[0016] Full-process automation: The feeding mechanism and the conveying and positioning mechanism work together to achieve continuous feeding and precise positioning of the substrate, improving the detection efficiency; the moving module drives the optical functional components to scan omnidirectionally, covering the entire substrate area and avoiding missed detections caused by manual intervention.

[0017] Accuracy Improvement: On one hand, the etching depth is measured in real time using a point laser, and the laser spot displacement is captured by a first camera to compensate for optical interference from the highly reflective copper layer. On the other hand, the undercut and sidewall morphology are extracted in collaboration with a second camera and a high-resolution microscope, and high detection accuracy is achieved by combining detection algorithms. In addition, the positioning component integrates vacuum adsorption and mechanical clamping to eliminate the influence of substrate warping or vibration on the measurement, further improving measurement accuracy. Attached Figure Description

[0018] Figure 1 This is a top view of a copper-clad ceramic substrate etching factor measuring device according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 A 3D view of the material frame flipping assembly.

[0020] Figure 3 for Figure 1 A 3D view of the material handling assembly.

[0021] Figure 4 for Figure 1 A 3D view of the conveyor positioning mechanism.

[0022] Figure 5 for Figure 4 A three-dimensional view of the central jig.

[0023] Figure 6 for Figure 1 A three-dimensional view of the optical mechanism.

[0024] Figure 7 for Figure 6 Exploded view of the optical functional components. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Please refer to Figure 1 As shown, this utility model provides a copper-clad ceramic substrate etching factor measuring device, which includes a feeding mechanism 10, a conveying and positioning mechanism 20, an optical mechanism 30, a barcode scanning mechanism 40, and a unloading mechanism 50.

[0027] The loading mechanism 10 is correspondingly arranged with the conveying and positioning mechanism 20, and is used to transfer substrates one by one to the conveying and positioning mechanism 20. The loading mechanism 10 includes multiple material frame conveying lines 11, a material frame handling assembly 12, a material frame flipping assembly 13, a substrate conveying line 14, and a substrate handling assembly 15. The multiple material frame conveying lines 11 are arranged in parallel, and the material frame handling assembly 12 is arranged horizontally above the material frame conveying lines 11, and is used to transport the material frames on the material frame conveying lines 11 to the material frame flipping assembly 13. Please refer to the following: Figure 2 As shown, the material frame conveying assembly 12 includes a gantry frame 121, a linear module 122 disposed on the gantry frame 121, a lifting module 123 disposed on the linear module 122, and a gripper assembly 124 disposed on the lifting module 123.

[0028] The material frame flipping assembly 13 docks with the substrate conveying line 14 to transport the substrates in the material frame one by one onto the substrate conveying line 14. Please refer to... Figure 3 As shown, the material frame flipping assembly 13 includes a lifting drive 131, a flipping drive 132 disposed on the lifting drive 131, and a flipping platform 133 disposed on the flipping drive 132. The material frame can be locked on the flipping platform 133 and flipped 90° under the drive of the flipping drive 132, flipping from the direction of the horizontal opening upward to the direction of the opening facing the substrate conveying line 14.

[0029] The substrate handling assembly 15 is horizontally disposed above the substrate conveying line 14 and the conveying positioning mechanism 20 to pick up and place substrates from the substrate conveying line 14 onto the conveying positioning mechanism 20. The structure of the substrate handling assembly 15 is generally similar to that of the material frame handling assembly 12. It is only necessary to replace the gripper assembly 124 with grippers or vacuum suction cups that facilitate the picking up and placing of substrates, which will not be described in detail here.

[0030] Please refer to Figure 4 As shown, the conveying and positioning mechanism 20 includes a conveying component 21 and a positioning component 22 disposed on the conveying path of the conveying component 21. The conveying component 21 can be an existing belt conveyor or other streamlined conveying method. In this embodiment, the conveying component 21 includes a conveying line 211, a first driving component 212 for driving the conveying line 211, and a first support frame 213 for supporting the conveying line 211 and the first driving component 212.

[0031] Positioning component 22 is used to block and position the substrate on the conveying component 21 at the inspection station. Please refer to... Figure 5 As shown, the positioning assembly includes a second support frame 221, a lifting drive 222 disposed on the second support frame 221, a fixture 223 disposed on the lifting drive 222 for carrying the substrate, a limiting component 225 for limiting the left and right sides of the substrate, and a lifting baffle 224 disposed in front of the fixture 223.

[0032] A lifting drive 222 is mounted on the second support frame 221 and drives the fixture 223 and the limiting assembly 225 to rise and fall. The fixture 23 includes a U-shaped base plate 2231, a rectangular frame 2232 mounted on the U-shaped base plate 2231, and two adsorption platforms 2233 mounted on the rectangular frame 2232. The adsorption platforms 2233 are mounted on the rectangular frame 2232 in the front-to-back direction. There is a channel between the two adsorption platforms 2233 for the conveyor line 211 to pass through. The conveying plane of the conveyor line 211 is located within the lifting range of the adsorption plane of the adsorption platform 2233. That is, when the adsorption platform 2233 rises from below, it can lift the substrate on the conveyor line 211; when the adsorption platform 2233 descends, it can place the substrate on it on the conveyor line 211. Multiple vacuum suction cups 2234 are provided on the upper surface of the adsorption platform 2233. The vacuum suction cups 2234 are connected to an externally configured air circuit control system through the internal air circuit of the adsorption platform and a speed control valve 2235. The lifting baffle 224 is located in front of the fixture 223 and is used to block the substrate on the conveyor line 211.

[0033] Please refer to Figure 6 and Figure 7As shown, the optical mechanism 30 includes a moving module and an optical functional component 34 that moves above the inspection station under the drive of the moving module. The moving module includes an X-axis linear module 31, an X-axis guide rail arranged parallel to the X-axis linear module, a Y-axis linear module 32 mounted on the X-axis linear module 31 and the X-axis guide rail, and a Z-axis linear module 33 mounted on the Y-axis linear module 32. The conveying component 21 passes between the X-axis linear module 31 and the X-axis guide rail. The Z-axis linear module 33 includes a horizontal fixed plate 331, a vertical fixed plate 332, a motor 333, and a vertical slide 334 connected in sequence. The horizontal fixed plate 331 is connected to the Y-axis linear module 32.

[0034] Optical functional component 34 is mounted on Z-axis linear module 33. Optical functional component 34 includes a vertical plate 341 mounted on a vertical slide 334, an adjustment block 342 mounted on the vertical plate 341, a first camera 343 mounted on the vertical plate 341, a point laser 344 cooperating with the first camera 343, a second camera 345 mounted on the vertical plate 341 via the adjustment block 342, and a microscope lens 346 cooperating with the second camera 345. The point laser 344 is positioned adjacent to the microscope lens 346. Optical functional component 34 also includes a light source assembly, which includes a light source 347 and an X-axis moving module 348 that moves the light source 347. The X-axis moving module 348 includes a main body and a slide mounted on the main body. The slide is fixed to the vertical fixed plate 332, and the light source 347 is fixed to the main body. When the X-axis moving module 348 is activated, the light source 347 moves relative to the vertical fixed plate 332. The light source 347 is a horizontally positioned ring light source located between the detection station and the point laser 344 and the microscope head 346.

[0035] A barcode scanning mechanism 40 is located between the conveying and positioning mechanism 20 and the unloading mechanism 50, and is used to scan the inspected substrates. The unloading mechanism 50 includes a substrate handling assembly 51, multiple substrate conveying lines 52, a frame flipping assembly 53, a frame handling assembly 54, and a frame unloading line 55. The multiple substrate conveying lines 52 are arranged in parallel. The substrate handling assembly 51 is horizontally positioned above the substrate conveying lines 52 and the conveying assembly 21, and is used to transport the substrates on the conveying assembly 21 to the substrate conveying lines 52. The frame flipping assembly 53 is connected to the substrate conveying lines 52 to retract the substrates on the substrate conveying lines 52 one by one into the frame. The frame handling assembly 54 is horizontally positioned above the frame unloading line 55 and the frame flipping assembly 53 to pick up and place the frames on the frame flipping assembly 53 onto the frame unloading line 55. The structure of the frame flipping assembly 53 is largely the same as that of the frame flipping assembly 13, and the structure of the frame handling assembly 54 is largely the same as that of the frame handling assembly 12, and will not be described in detail here.

[0036] The terms used herein, such as “up,” “down,” “left,” “right,” “front,” and “back,” indicating spatial relative position, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0037] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A copper clad ceramic substrate etch factor measurement apparatus, characterized by: The application relates to a substrate detection device, which comprises a feeding mechanism, a conveying and positioning mechanism and an optical mechanism, wherein the feeding mechanism is correspondingly arranged with the conveying and positioning mechanism and used for conveying the substrates to the conveying and positioning mechanism one by one; the conveying and positioning mechanism comprises a conveying assembly and a positioning assembly arranged on the conveying path of the conveying assembly, the positioning assembly is used for blocking and positioning the substrates on the conveying assembly to a detection station; the optical mechanism comprises a moving module, an optical functional assembly moving above the detection station under the driving of the moving module, the optical functional assembly comprises a first camera, a point laser cooperating with the first camera, a second camera and a microscope lens cooperating with the second camera, and the point laser is arranged adjacent to the microscope lens.

2. The copper clad ceramic substrate etch factor measurement apparatus of claim 1, wherein: The moving module comprises an X-axis linear module, an X-axis guide rail arranged in parallel with the X-axis linear module and a Y-axis linear module arranged on the X-axis linear module and the X-axis guide rail, the conveying assembly passes through the X-axis linear module and the X-axis guide rail, and the optical functional assembly is arranged on the Y-axis linear module.

3. The copper clad ceramic substrate etch factor measurement apparatus of claim 2, wherein: The optical mechanism further comprises a Z-axis linear module, the Z-axis linear module comprises a horizontal fixing plate, a vertical fixing plate, a motor and a vertical sliding table connected in sequence, the horizontal fixing plate is connected with the Y-axis linear module, and the first camera, the point laser, the second camera and the microscope lens are arranged on the vertical sliding table.

4. The copper clad ceramic substrate etch factor measurement apparatus of claim 3, wherein: The optical functional assembly further comprises a light source assembly, the light source assembly comprises a light source and an X-axis moving module driving the light source to move, the X-axis moving module comprises a main body part and a sliding table part arranged on the main body part, the sliding table part is fixed on the vertical fixing plate, the light source is fixed on the main body part, and when the X-axis moving module is started, the light source moves relative to the vertical fixing plate.

5. The copper clad ceramic substrate etch factor measurement apparatus of claim 4, wherein: The light source is a horizontally arranged annular light source and is located between the detection station and the point laser and the microscope lens.

6. The copper clad ceramic substrate etch factor measurement apparatus of claim 1, wherein: The conveying assembly comprises a conveying line, a first driving assembly driving the conveying line and a first supporting frame supporting the conveying line and the first driving assembly.

7. The copper clad ceramic substrate etch factor measurement apparatus of claim 6, wherein: The positioning assembly comprises a second supporting frame, a jacking drive arranged on the second supporting frame, a jig arranged on the jacking drive and used for carrying the substrate, two limiting plates limiting the left and right sides of the substrate and a driving member driving the limiting plates to move leftward and rightward.

8. The copper clad ceramic substrate etch factor measurement apparatus of claim 7, wherein: The jig has two suction tables, the two suction tables have a channel for the conveying line to pass through, the jacking drive drives the jig, the limiting plates and the driving member to move up and down, and the conveying plane of the conveying line is located in the up-and-down range of the suction plane of the suction tables.

9. The copper clad ceramic substrate etch factor measurement apparatus of claim 1, wherein: The feeding mechanism comprises a plurality of frame conveying lines, a frame carrying assembly, a frame overturning assembly, a substrate conveying line and a substrate carrying assembly. The frame conveying lines are arranged in parallel. The frame carrying assembly is arranged above the frame conveying lines and is used to carry the frames on the frame conveying lines to the frame overturning assembly. The frame overturning assembly is connected to the substrate conveying line and is used to convey the substrates in the frames to the substrate conveying line one by one. The substrate carrying assembly is arranged above the substrate conveying line and the conveying assembly and is used to take and place the substrates on the substrate conveying line to the conveying assembly.

10. The copper clad ceramic substrate etch factor measurement apparatus of claim 1, wherein: The feeding mechanism comprises a plurality of frame conveying lines, a frame carrying assembly, a frame overturning assembly, a substrate conveying line and a substrate carrying assembly. The frame conveying lines are arranged in parallel. The frame carrying assembly is arranged above the frame conveying lines and is used to carry the frames on the frame conveying lines to the frame overturning assembly. The frame overturning assembly is connected to the substrate conveying line and is used to convey the substrates in the frames to the substrate conveying line one by one. The substrate carrying assembly is arranged above the substrate conveying line and the conveying assembly and is used to take and place the substrates on the substrate conveying line to the conveying assembly.

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