Substrate mapping sensor and electronic device
By using optical sensors to detect the presence or absence of a substrate and monitor its sagging state, this technology solves the problem of difficulty in detecting the presence or absence of a substrate and its sagging state in existing technologies, and achieves efficient substrate state detection and damage prevention.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SAMSUNG DISPLAY CO LTD
- Filing Date
- 2025-06-20
- Publication Date
- 2026-06-16
AI Technical Summary
The technical problem of existing technologies is that they cannot simultaneously detect the presence or absence of a substrate as well as its drooping state and degree.
An optical sensor is used to detect the presence or absence of a substrate through light emitting and receiving units, and the sag state and degree of the substrate are detected through light receiving units. Real-time monitoring is achieved using an infrared light source and a photodiode.
It enables efficient detection of the presence or absence of a substrate and can monitor the sag status and degree in real time, preventing substrate damage and reducing installation space and cost.
Smart Images

Figure CN224366209U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to substrate mapping sensors and electronic devices. Background Technology
[0002] With the recent increase in interest in information display, research and development of display devices and the apparatus used to manufacture them continues. Utility Model Content
[0003] Based on the concept of this utility model, a substrate mapping sensor is proposed that can not only detect the presence or absence of a substrate, but also detect the sag state and degree of the substrate.
[0004] The present invention is not limited to the technical features mentioned above, and those skilled in the art will clearly understand from the following description other technical features not mentioned.
[0005] In one embodiment, the substrate mapping sensor according to the embodiment can detect the state of a substrate located in a channel within a housing. The substrate mapping sensor may include: a light emitting unit located on one side of the housing; and a light receiving unit located on the other side of the housing. The light emitting unit may include a first light emitting unit and a second light emitting unit, which are paired and located on one side of the channel. The light receiving unit may include a first light receiving unit and a second light receiving unit, which are paired and located on the other side of the channel. The first light emitting unit and the first light receiving unit can detect the presence or absence of a substrate in the channel, and the second light emitting unit and the second light receiving unit can detect the drooping state of the substrate in the channel.
[0006] The first optical transmitting unit and the first optical receiving unit can face each other in a first direction, and the channel is inserted between the first optical transmitting unit and the first optical receiving unit.
[0007] The first optical emitting unit may include an optical emitting element.
[0008] The first optical receiving unit may include an optical receiving element.
[0009] The second optical emitting unit and the second optical receiving unit can face each other in the first direction, and the channel is inserted between the second optical emitting unit and the second optical receiving unit.
[0010] The second optical emitting unit may include a first optical emitting element, a second optical emitting element, and a third optical emitting element.
[0011] The second optical receiving unit may include a first optical receiving element, a second optical receiving element, a third optical receiving element, a fourth optical receiving element, and a fifth optical receiving element.
[0012] The drooping state of the substrate can be determined by the displacement value of the amount of light reaching the second light receiving unit.
[0013] Based on a normally loaded substrate, the sag detection area of the substrate can be from 5 mm to 13 mm.
[0014] The distance between the first side of the substrate and the light emitting unit can be 150 mm or less.
[0015] The distance between the second side of the substrate and the light receiving unit can be 150 mm or less.
[0016] The light receiving unit may also include a first indicator light indicating the presence or absence of a substrate and a second indicator light indicating the drooping state of the substrate.
[0017] The light source of the light emitting unit can be infrared.
[0018] The light receiving element of the light receiving unit can be a photodiode.
[0019] The electronic device according to the embodiment may include: a processor; and a display device, including pixels, and configured to display an image through the pixels under the control of the processor. The state of the substrate of the display device can be detected by a substrate mapping sensor, which includes: a light emitting unit located on one side of the cell; and a light receiving unit located on the other side of the cell. The light emitting unit includes a first light emitting unit and a second light emitting unit, which are paired and located on one side of the channel. The light receiving unit includes a first light receiving unit and a second light receiving unit, which are paired and located on the other side of the channel. The first light emitting unit and the first light receiving unit detect the presence or absence of the substrate in the channel. The second light emitting unit and the second light receiving unit detect the drooping state of the substrate in the channel.
[0020] Specific details of other implementation methods are included in the detailed embodiments and accompanying drawings. Attached Figure Description
[0021] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated into and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the specification, serve to explain the principles of the inventive concept.
[0022] Figure 1 This is a perspective view showing the state in which a substrate mapping sensor according to an embodiment is installed.
[0023] Figure 2 This is a perspective view of the box according to the embodiment.
[0024] Figure 3 This is a side view of a substrate mapping sensor according to an embodiment.
[0025] Figure 4 , Figure 5 , Figure 6 and Figure 7 This is a side view used to explain a method for detecting substrate sagging using a substrate mapping sensor according to an embodiment.
[0026] Figure 8 This is a side view used to explain the indicator lights installed in the light receiving unit according to the embodiment.
[0027] Figure 9 This is a block diagram of an electronic device according to an embodiment.
[0028] Figure 10 This is a schematic diagram illustrating an electronic device according to various embodiments. Detailed Implementation
[0029] In the following description, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. It should be noted that in the following description, only the parts necessary for understanding operation according to the present invention will be described, and descriptions of other parts will be omitted to avoid obscuring the main points of the present invention.
[0030] This invention is not limited to the embodiments described herein, and may be implemented in other forms. The embodiments described herein are provided only to illustrate the technical ideas of this invention in sufficient detail to enable those skilled in the art to readily implement it.
[0031] Throughout this specification, the phrase "connected" to another part includes not only cases where the part is "directly connected," but also cases where the part is "indirectly connected" through other elements interposed therebetween. The terminology used herein is for describing particular embodiments and is not intended to limit the inventive concept.
[0032] Throughout this specification, the use of the word "including" in a section means, unless otherwise stated, that section may include other components, but does not exclude other components. "At least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as one X, one Y, one Z, or any combination of two or more of X, Y, and Z (e.g., XYZ, XY, YZ, and XZ). Here, "and / or" includes all combinations of one or more of the corresponding configurations.
[0033] Here, terms such as “first” and “second” may be used to describe various components, but these components are not limited to these terms. These terms are used to distinguish one component from another. Therefore, without departing from the scope of this disclosure, “first component” may refer to “second component” within a certain scope.
[0034] For illustrative purposes, spatial relative terms such as “below” or “above” may be used to describe the relationship between one element or feature and another element or feature as shown in the accompanying drawings. In addition to the first direction DR1, the second direction DR2, and the third direction DR3 depicted in the drawings, spatial relative terms are intended to include other directions in use, operation, and / or manufacture.
[0035] When the device shown in the accompanying drawings is inverted, an element depicted as positioned "below" other elements or features is positioned "above" other elements or features. Therefore, in embodiments, the term "below" can include both above and below directions. Furthermore, the device may face other directions (e.g., rotated 90 degrees or at other angles), and thus the spatial relative terms used herein should be interpreted accordingly.
[0036] Various embodiments are described with reference to the accompanying drawings, which schematically illustrate preferred embodiments. Therefore, it will be anticipated that the shape may vary depending on, for example, tolerances and / or manufacturing techniques. Consequently, the embodiments disclosed herein should not be construed as limited to the specific shapes shown, and should be interpreted as including, for example, shape changes due to manufacturing processes. As noted above, the shapes shown in the drawings may not represent the actual shape of an area of the device, and this embodiment is not limited thereto.
[0037] Figure 1 This is a perspective view showing the state in which substrate mapping sensors 100 and 200 according to the embodiment are installed. Figure 2 This is a perspective view of box 10 according to the embodiment. Figure 3 This is a side view of the substrate mapping sensors 100 and 200 according to the embodiments.
[0038] refer to Figures 1 to 3 The substrate mapping sensors 100 and 200 can detect the state of the substrate 20 in each of the channels CH01 to CH20 within the housing 10. The substrate 20 can be transparent glass and / or opaque glass, but the present invention is not necessarily limited thereto.
[0039] Substrate mapping sensors 100 and 200 can detect not only the presence or absence of substrate 20 in each of channels CH01 to CH20, but also the sag state and degree of each substrate 20 in channels CH01 to CH20. Although the accompanying drawings show an embodiment in which the number of channels CH01 to CH20 (or optical axes) is 20, the inventive concept is not necessarily limited thereto and can be modified in various ways.
[0040] Each substrate 20 can be supported by a support rod 11 disposed in the housing 10. Each substrate 20 can be loaded or stored on the support rod 11. If the support rod 11 supporting the substrate 20 deforms or sags, the substrate 20 loaded on the support rod 11 may sag, and the substrate 20 may collide with the substrate loading robot, resulting in damage to the substrate 20. Therefore, the substrate mapping sensors 100 and 200 according to the embodiments can not only detect the presence or absence of the substrate 20 in real time, but also detect the sag state and degree of the substrate 20 in real time, thereby preventing damage to the substrate 20 due to the sag of the support rod 11 and the substrate 20. A detailed description of this will be provided later. Figures 4 to 7 describe.
[0041] Substrate mapping sensors 100 and 200 can be optical sensors using light emission and light reception methods. Substrate mapping sensors 100 and 200 can include a light emission unit 100 and a light reception unit 200. The light emission unit 100 can be located on one side of the housing 10. The light reception unit 200 can be located on the other side of the housing 10. In the first direction DR1 (e.g., the horizontal direction), the distance D between the light emission unit 100 and the light reception unit 200 can be from 0.8 m to 1.8 m. However, the present invention is not necessarily limited to this, and the distance D between the light emission unit 100 and the light reception unit 200 in the first direction DR1 (or the horizontal direction) can be adjusted according to the size of the housing 10.
[0042] The light emitting unit 100 can emit a detection beam, which can be received by the light receiving unit 200. The light source of the light emitting unit 100 can be infrared. For example, the light source of the light emitting unit 100 can have a wavelength of 850 nm, but the present invention is not necessarily limited to this. The light receiving element of the light receiving unit 200 can be a photodiode. However, the present invention is not necessarily limited to this, and various changes can be made according to the embodiments.
[0043] Figures 4 to 7 This is a side view used to explain a method for detecting substrate sagging using a substrate mapping sensor according to an embodiment.
[0044] refer to Figures 1 to 7The light emitting unit 100 may include a pair of first light emitting units 110 and second light emitting units 120 located on one side of each of channels CH01 to CH20 (or substrate 20).
[0045] The distance between adjacent pairs of first light emitting units 110 and second light emitting units 120 (i.e., the optical axis spacing) can be 56 mm, but the present invention is not necessarily limited to this. The number of pairs of first light emitting units 110 and second light emitting units 120 (i.e., the number of optical axes) can be 20, but the present invention is not necessarily limited to this. According to the embodiments, the number of optical axes can be 26, or can be varied.
[0046] In the first direction DR1 (or horizontal direction), the distance D1 between the light emitting unit 100 (first light emitting unit 110 and / or second light emitting unit 120) and the first side of the substrate 20 can be 150 mm or less, but the present invention is not necessarily limited to this.
[0047] The pair of the first optical emitting unit 110 and the second optical emitting unit 120 can be positioned at a location corresponding to one of the channels CH01 to CH20. As an example, the pair of the first optical emitting unit 110 and the second optical emitting unit 120 can be aligned with one of the channels CH01 to CH20 in a first direction DR1 (or horizontal direction).
[0048] The light receiving unit 200 may include a pair of first light receiving units 210 and second light receiving units 220 located on the other side of each of channels CH01 to CH20 (or substrate 20).
[0049] The distance between adjacent pairs of first light receiving units 210 and second light receiving units 220 (i.e., the optical axis spacing) can be 56 mm, but the present invention is not necessarily limited to this. The number of pairs of first light receiving units 210 and second light receiving units 220 (i.e., the number of optical axes) can be 20, but the present invention is not necessarily limited to this. According to the embodiments, the number of optical axes can be 26, or can be varied.
[0050] In the first direction DR1 (or horizontal direction), the distance D2 between the light receiving unit 200 (first light receiving unit 210 and / or second light receiving unit 220) and the second side of the substrate 20 can be 150 mm or less, but the present invention is not necessarily limited to this.
[0051] The pair of the first optical receiving unit 210 and the second optical receiving unit 220 can be positioned at a location corresponding to one of the channels CH01 to CH20. As an example, the pair of the first optical receiving unit 210 and the second optical receiving unit 220 can be aligned with one of the channels CH01 to CH20 in the first direction DR1 (or the horizontal direction).
[0052] The first light emitting unit 110 and the first light receiving unit 210 can detect the presence or absence of the substrate 20 in each of the channels CH01 to CH20. As an example, the first light emitting unit 110 and the first light receiving unit 210 can be sensors that determine the presence or absence of the substrate 20 in each of the channels CH01 to CH20.
[0053] The first light emitting unit 110 and the first light receiving unit 210 may face each other across each channel CH01 to CH20 in a first direction DR1 (or horizontal direction). Each channel CH01 to CH20 may be disposed between the first light emitting unit 110 and the first light receiving unit 210. The detection beam emitted from the light emitting element of the first light emitting unit 110 may have a selected detection width. For example, the detection beam emitted from the light emitting element of the first light emitting unit 110 may be irradiated to have a detection width wider than the thickness of the substrate 20 mounted in the housing 10. If the substrate 20 is present in each of the channels CH01 to CH20, the presence or absence of the substrate 20 can be determined using the amount of light reduction passing through the substrate 20.
[0054] The first light emitting unit 110 may include a light emitting element. The first light receiving unit 210 may include a light receiving element. However, the present invention is not necessarily limited thereto, and the number of light emitting elements in the first light emitting unit 110 and the number of light receiving elements in the first light receiving unit 210 may be varied according to the embodiments.
[0055] The second light emitting unit 120 and the second light receiving unit 220 can detect the drooping state of each intermediate substrate 20 in channels CH01 to CH20. As an example, the second light emitting unit 120 and the second light receiving unit 220 can be sensors for determining the drooping state of each intermediate substrate 20 in channels CH01 to CH20. With each channel CH01 to CH20, the second light emitting unit 120 and the second light receiving unit 220 can face each other across each channel CH01 to CH20 in a first direction DR1 (or horizontal direction). Each channel CH01 to CH20 can be disposed between the second light emitting unit 120 and the second light receiving unit 220.
[0056] The second light emitting unit 120 may include a first light emitting element 121, a second light emitting element 122, and a third light emitting element 123. The second light receiving unit 220 may include a first light receiving element 221, a second light receiving element 222, a third light receiving element 223, a fourth light receiving element 224, and a fifth light receiving element 225. The drooping state of the substrate 20 in each of the channels CH01 to CH20 can be determined by the displacement value of the amount of light reaching the first light receiving element 221, the second light receiving element 222, the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225 of the second light receiving unit 220.
[0057] refer to Figure 4 If the substrate 21 is properly loaded, 100% of the amount of light emitted from the second light emitting unit 120 can reach the second light receiving unit 220. For example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 can reach all of the first light receiving element 221, the second light receiving element 222, the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225 of the second light receiving unit 220.
[0058] refer to Figures 5 to 7 As described above, the drooping of the support rod 11 can cause the substrates 22, 23, and 24 to droop. In this case, an amount of light equivalent to the portion blocked by the drooping substrates 22, 23, and 24 can reach the second light receiving unit 220.
[0059] For example, in Figure 5 When the substrate 22 has a relatively small sag, 60% of the amount of light emitted from the second light emitting unit 120 can reach the second light receiving unit 220. For example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 can reach some of the first light receiving element 221, the second light receiving element 222, the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225 of the second light receiving unit 220. As an example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 can be blocked by the sag portion of the substrate 22, and therefore cannot reach the first light receiving element 221 and the second light receiving element 222, but can only reach the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225.
[0060] exist Figure 6 In the case of substrate 23, Figure 6 The sag of substrate 23 is greater than Figure 5 The substrate 22 has a large sag, so that 20% of the light emitted from the second light emitting unit 120 can reach the second light receiving unit 220. For example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 can reach some of the first light receiving element 221, the second light receiving element 222, the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225 of the second light receiving unit 220. As an example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 can be blocked by the sag portion of the substrate 23, and therefore cannot reach the first light receiving element 221, the second light receiving element 222, the third light receiving element 223, and the fourth light receiving element 224, but can only reach the fifth light receiving element 225.
[0061] exist Figure 7 In the case of substrate 24, Figure 7 The sag of substrate 24 is greater than Figure 6 The substrate 23 has a large sag, preventing the entire detection beam emitted from the second light emitting unit 120 from reaching the second light receiving unit 220. For example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 cannot reach any one of the first light receiving elements 221, the second light receiving element 222, the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225 of the second light receiving unit 220. As an example, the detection beam emitted from the first light emitting element 121, the second light emitting element 122, and the third light emitting element 123 of the second light emitting unit 120 can be blocked by the sag of the substrate 24, and therefore cannot reach any one of the first light receiving elements 221, the second light receiving element 222, the third light receiving element 223, the fourth light receiving element 224, and the fifth light receiving element 225.
[0062] As described above, the sag state and degree of the substrate 20 can be determined by the displacement value of the amount of light reaching the second light receiving unit 220.
[0063] In an implementation, based on a normally loaded substrate 21, the droop detection area of substrate 20 in substrate mapping sensors 100 and 200 can be 5 mm to 13 mm. For example, on a third direction DR3 (e.g., a vertical direction perpendicular to the first direction DR1 and perpendicular to the second direction DR2 intersecting the first direction DR1), the distance H1 between the normally loaded substrate 21 and the first light emitting element 121 (e.g., see...) Figure 4 The distance H2 between the first light emitting element 121 and the third light emitting element 123 in the third direction DR3 (or vertical direction) can be 5 mm or greater. Figure 4 The distances can be 13 mm or smaller. However, the present invention is not necessarily limited to this, and the distances H1 and H2 can vary depending on the degree of sag of the substrate 20 detected by the substrate mapping sensors 100 and 200.
[0064] The accompanying drawings illustrate, by way of example, an embodiment in which the second light emitting unit 120 includes three light emitting elements 121, 122, and 123, and the second light receiving unit 220 includes five light receiving elements 221, 222, 223, 224, and 225. However, the inventive concept is not necessarily limited thereto, and the number of light emitting elements and the number of light receiving elements can be varied according to the embodiment.
[0065] As described above, the substrate mapping sensors 100 and 200 according to the embodiments can not only detect the presence or absence of the substrate 20 in each of channels CH01 to CH20 in real time using the first light emitting unit 110 and the first light receiving unit 210, but also determine the sag state and degree of the substrate 20 in each of channels CH01 to CH20 in real time using the displacement value of the amount of light reaching the second light receiving unit 220. Therefore, damage to the substrate 20 due to collision with the substrate loading robot caused by sag can be prevented. Therefore, the slot pitch margin of the cassette 10 can be minimized, thereby increasing the number of substrates 20 that can be loaded.
[0066] Furthermore, the substrate mapping sensors 100 and 200 according to the embodiments, using a light emitting unit 100 and a light receiving unit 200, can not only determine the presence or absence of the substrate 20, but also determine the sag state and degree of the substrate 20 due to the sag of the support rod 11. Therefore, there is no need to configure a separate tester to test the sag of the support rod 11, thus minimizing installation space and installation costs.
[0067] Figure 8 This is a side view used to explain the indicator lights installed in the light receiving unit according to the embodiment.
[0068] The state of substrate 20 detected as described above can be communicated via communication module 201 (e.g., see...). Figure 1 The presence or absence of the substrate 20 in each of the channels CH01 to CH20 can be easily checked by the indicator light 202 located in the light receiving unit 200. The communication module 201 can output the presence or absence of the substrate 20 in each of the channels CH01 to CH20, and output the sag detection of the substrate 20 in each of the channels CH01 to CH20. As an example, the communication module 201 can be a CC-LINK (Control & Communication Link), but the inventive concept is not necessarily limited to this.
[0069] Indicator light 202 may include a first indicator light L1 indicating the presence or absence of substrate 20 in each of channels CH01 to CH20, and a second indicator light L2 indicating sag detection of substrate 20 in each of channels CH01 to CH20. According to an embodiment, indicator light 202 may also include an indicator light STB OUT that illuminates when no sag of substrate 20 is detected in all channels CH01 to CH20, an indicator light Run that illuminates when substrate mapping sensors 100 and 200 are operating normally, an indicator light PW that illuminates when power is supplied, etc.
[0070] In embodiments, the substrate 20 described above can form the substrate of a display device. The display device according to the embodiments can be applied to various electronic devices. The electronic device according to the embodiments may include a display device, and may also include modules or devices having additional functions besides the display device.
[0071] Figure 9 This is a block diagram of an electronic device ED according to an embodiment. (Reference) Figure 9 The electronic device ED according to the embodiments may include a display module 11, a processor 12, a memory 13 and a power module 14.
[0072] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.
[0073] The memory 13 can store data necessary for the operation of the processor 12 or the display module 11. If the processor 12 executes an application stored in the memory 13, image data signals and / or input control signals can be transmitted to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.
[0074] The power module 14 may include a power supply module such as a power adapter or battery device and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device ED.
[0075] At least one of the components of the electronic device ED described above may be included in the display device according to the embodiments described above. Furthermore, some of the independent modules that are functionally included within a single module may be included in the display device, while other modules may be disposed separately from the display device. For example, the display device may include a display module 11, and the processor 12, memory 13, and power module 14 may be disposed in the form of other devices within the electronic device ED that are not part of the display device.
[0076] Figure 10 This is a schematic diagram illustrating an electronic device according to various embodiments.
[0077] refer to Figure 10 The various electronic devices that utilize the display device according to the embodiments may include not only electronic devices for displaying images, such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, and desktop monitors 10_1e, but also wearable electronic devices including display modules, such as smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c, as well as vehicle electronic devices 10_3 including display modules, such as dashboards, center consoles, central information displays (CID) arranged on the dashboard, and rearview mirror displays.
[0078] The substrate mapping sensor according to the embodiments described above can not only determine the presence or absence of a substrate, but also determine the sag state and degree of the substrate, thereby minimizing installation space and installation costs.
[0079] The effects of the embodiments are not limited to those described above, and this specification includes many other different effects.
[0080] Although specific embodiments have been described herein, other embodiments and modifications can be derived from the foregoing description. Therefore, the spirit of this inventive concept should not be limited to the above embodiments, and the scope of the claims and all equivalents or modifications thereof should be considered to fall within the scope of the spirit of this inventive concept.
Claims
1. A substrate mapping sensor for detecting the state of a substrate in a channel within a cell, the substrate mapping sensor comprising: A light emitting unit is located on one side of the box; as well as The light receiving unit is located on the other side of the box. The light emitting unit is characterized in that it includes a first light emitting unit and a second light emitting unit, the first light emitting unit and the second light emitting unit being paired and located on one side of the channel. The optical receiving unit includes a first optical receiving unit and a second optical receiving unit, which are paired and located on the other side of the channel. The first light emitting unit and the first light receiving unit detect the presence or absence of the substrate in the channel, and The second light emitting unit and the second light receiving unit detect the drooping state of the substrate in the channel.
2. The substrate mapping sensor according to claim 1, characterized in that, The first light emitting unit and the first light receiving unit face each other in a first direction, and the channel is inserted between the first light emitting unit and the first light receiving unit.
3. The substrate mapping sensor according to claim 1, characterized in that, The second light emitting unit and the second light receiving unit face each other in a first direction, and the channel is inserted between the second light emitting unit and the second light receiving unit.
4. The substrate mapping sensor according to claim 1, characterized in that, The second optical emitting unit includes a first optical emitting element, a second optical emitting element, and a third optical emitting element.
5. The substrate mapping sensor according to claim 1, characterized in that, The second optical receiving unit includes a first optical receiving element, a second optical receiving element, a third optical receiving element, a fourth optical receiving element, and a fifth optical receiving element.
6. The substrate mapping sensor according to claim 1, characterized in that, The drooping state of the substrate is determined by the displacement value of the amount of light reaching the second light receiving unit.
7. The substrate mapping sensor according to claim 1, characterized in that, Based on a normally loaded substrate, the sag detection area of the substrate is 5 mm to 13 mm.
8. The substrate mapping sensor according to claim 1, characterized in that, The distance between the first side of the substrate and the light emitting unit is 150 mm or less.
9. The substrate mapping sensor according to claim 1, characterized in that, The distance between the second side of the substrate and the light receiving unit is 150 mm or less.
10. Electronic devices, including: processor; as well as A display device, comprising pixels, and configured to display an image through the pixels under the control of the processor. The characteristic feature is that the state of the substrate of the display device is detected by a substrate mapping sensor, the substrate mapping sensor comprising: The light emitting unit is located on one side of the box; and The light receiving unit is located on the other side of the box. The optical emitting unit includes a first optical emitting unit and a second optical emitting unit, which are paired and located on one side of the channel. The optical receiving unit includes a first optical receiving unit and a second optical receiving unit, which are paired and located on the other side of the channel. The first light emitting unit and the first light receiving unit detect the presence or absence of the substrate in the channel, and The second light emitting unit and the second light receiving unit detect the drooping state of the substrate in the channel.