A capacitive touch sensing sensor

Abstract

The utility model relates to a kind of capacitive touch sensing sensor, belong to bathroom technical field.The utility model includes sensing system and main control system, sensing system is connected with main control system, its structural features are as follows: one end of sensing system is connected with capacitive sensing module, the other end of sensing system is connected with female connector, one end of main control system is connected with male connector, the other end of main control system is connected with plug, female connector is connected with male connector, the male connector outer sleeve is equipped with nut, nut is connected with female connector thread, the capacitor C1 in capacitive sensing module, capacitor C2, capacitor C3, resistance R1, resistance R2, resistance R3 and inductance L1 are connected with sensing chip U1, capacitor C1, capacitor C2 are connected with capacitor C3 in parallel, capacitor collection Pad surface K1 is connected with resistance R1, resistance R2 is connected with resistance R3 in parallel, resistance R2 and resistance R3 are connected with antistatic diode D2, antistatic diode D2 is connected with antistatic diode D1, antistatic diode D1 is connected with inductance L1.

Description

Technical Field

[0001] This utility model relates to a capacitive touch sensing sensor, belonging to the field of bathroom technology. Background Technology

[0002] In smart toilets, capacitive foot sensors are primarily responsible for enabling convenient functions such as lid opening and flushing. Their working principle is based on capacitive sensing: the foot-sensing area of ​​the smart toilet contains a built-in capacitive sensing module, which consists of a capacitor plate. When a person's foot approaches or touches the foot-sensing area, because the human body is a conductor, a new capacitor structure is formed between the capacitor plate and the ground, changing the key parameters of the capacitive system.

[0003] On one hand, the human body acts as a new medium between the electrode plate and the ground, directly changing the dielectric constant; on the other hand, changes in the distance between the human body and the electrode plate lead to changes in the spacing, both of which cause fluctuations in the capacitance value. The capacitive foot-sensing module detects these changes in capacitance and converts them into electrical signals. These raw electrical signals are relatively weak and contain interference, requiring amplification, filtering, and other processing before being transmitted to the foot-sensing control chip.

[0004] The control chip has a preset capacitance change threshold. When the capacitance change reflected by the received electrical signal exceeds this threshold, the chip determines it as a valid foot-activated trigger operation and outputs a low level through the OUT port; if the threshold is not exceeded, a high level is output. After receiving the corresponding signal, the smart toilet can control the corresponding functional modules to accurately execute actions such as opening the lid and flushing.

[0005] In the existing technology, to achieve intelligent control of toilets, it is necessary to drill holes in the ceramic base of the toilet and install infrared sensors. This poses a great challenge to the production and yield rate of the ceramic body of the toilet, is costly, unsightly, and prone to bacterial growth in high-humidity environments such as bathrooms.

[0006] Another existing technology for achieving intelligent control of toilets requires a similar capacitive electrostatic sensor to be attached to the inner wall of the ceramic base of the toilet. However, the sensor chip and substrate are made of rigid materials. After encapsulation and attachment, the sensing surface cannot fit tightly against the curved inner wall of the toilet, resulting in poor sensitivity, short sensing distance, and delayed toilet lid opening. The sensor is also large, complex to encapsulate, and expensive. Utility Model Content

[0007] The purpose of this invention is to overcome the above-mentioned shortcomings in the existing technology and to provide a capacitive touch sensor with a reasonable structural design.

[0008] The technical solution adopted by this utility model to solve the above problems is as follows: the capacitive touch sensing sensor includes a sensing system and a main control system. The sensing system is connected to the main control system. Its structural features are: one end of the sensing system is connected to the capacitive sensing module, the other end of the sensing system is connected to the female connector, one end of the main control system is connected to the male connector, the other end of the main control system is connected to the plug, and the female connector is connected to the male connector.

[0009] Furthermore, the male connector is fitted with a nut, which is threadedly connected to the female connector.

[0010] Furthermore, the capacitive sensing module includes an inductor L1, an anti-static diode D1, an anti-static diode D2, capacitors C1, C2, and C3, a sensing chip U1, resistors R1, R2, and R3, and a capacitor collection pad K1. Capacitors C1, C2, and C3, resistors R1, R2, and R3, and inductor L1 are all connected to the sensing chip U1. Capacitors C1, C2, and C3 are connected in parallel. The capacitor collection pad K1 is connected to resistor R1. Resistors R2 and R3 are connected in parallel. Resistors R2 and R3 are both connected to anti-static diode D2. Anti-static diode D2 is connected to anti-static diode D1. Anti-static diode D1 is connected to inductor L1.

[0011] Furthermore, the antistatic diode D2, resistor R2, and resistor R3 are all connected to the plug.

[0012] Furthermore, the capacitive sensing module is disposed on the substrate, and a lower interlayer and an upper interlayer are respectively disposed on both sides of the substrate. The lower interlayer is disposed between the substrate and the bottom layer, and the upper interlayer is disposed between the substrate and the surface layer.

[0013] Furthermore, the lower interlayer and the upper interlayer are of equal size and both are larger than the substrate, and the lower interlayer and the upper interlayer are bonded at their edges.

[0014] Furthermore, the substrate is made of a flexible material.

[0015] Furthermore, the bottom layer is adhered to the inner wall of the toilet.

[0016] Furthermore, the female connector is provided with a limiting platform, and the male connector is provided with a limiting surface, the limiting surface being in contact with the limiting platform.

[0017] Furthermore, the plug has an external wire.

[0018] Compared with existing technologies, this utility model has the following advantages: The capacitive sensing module is a highly sensitive capacitive foot-sensing module that can directly replace traditional mechanical touch switches. Its significant advantage lies in eliminating the need for openings in the toilet seat body, thus avoiding damage to the product's appearance and simplifying the manufacturing process, which is more conducive to improving product aesthetics and production convenience.

[0019] The substrate is made of flexible material, which can adapt to the curved surface of the toilet bowl and fit seamlessly with various ceramic curved surfaces. Compared with traditional plastic shell sensors, it fits the shape of the toilet bowl better. The product is lightweight and portable. The lightweight design will not cause the adhesive to come off due to its own weight after it is pasted, ensuring long-term stability. The capacitive sensing module has a significantly expanded sensing area, which effectively improves sensing sensitivity and consistency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the sensing system according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the main control system according to an embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram of the capacitive sensing module according to an embodiment of the present invention.

[0023] Figure 4 This is a structural schematic diagram of the capacitive sensing module according to an embodiment of the present invention.

[0024] In the diagram: Sensing system, main control system, capacitive sensing module, female connector H4, male connector H3, nut H2, plug H1.

[0025] Inductor L1, anti-static diode D1, anti-static diode D2, capacitor C1, capacitor C2, capacitor C3, sensing chip U1, resistor R1, resistor R2, resistor R3, capacitor collection pad surface K1,

[0026] A. Bottom layer, B. Lower interlayer, C. Substrate, D. Upper interlayer, E. Surface layer. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings and through embodiments. The following embodiments are explanations of the present invention, but the present invention is not limited to the following embodiments.

[0028] Example

[0029] See Figures 1 to 4As shown in the accompanying drawings, the structures, proportions, sizes, etc., depicted in this specification are merely for illustrative purposes to aid those skilled in the art and to provide a clear understanding. They are not intended to limit the scope of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the use of terms such as "upper," "lower," "left," "right," "middle," and "one" in this specification is solely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0030] The capacitive touch sensor in this embodiment includes a sensing system and a main control system. The sensing system is connected to the main control system. One end of the sensing system is connected to the capacitive sensing module, and the other end of the sensing system is connected to the female connector H4. One end of the main control system is connected to the male connector H3, and the other end of the main control system is connected to the plug H1. The female connector H4 is connected to the male connector H3, that is, the male connector H3 is fitted with a nut H2, and the nut H2 is threadedly connected to the female connector H4. The female connector H4 is provided with a limiting platform, and the male connector H3 is provided with a limiting surface. The limiting surface fits into the limiting platform, and the plug H1 is connected to an external wire.

[0031] The capacitive sensing module in this embodiment includes an inductor L1, an anti-static diode D1, an anti-static diode D2, capacitors C1, C2, and C3, a sensing chip U1, resistors R1, R2, and R3, and a capacitor collection pad K1. Capacitors C1, C2, and C3, resistors R1, R2, and R3, and inductor L1 are all connected to the sensing chip U1. Capacitors C1, C2, and C3 are connected in parallel. The capacitor collection pad K1 is connected to resistor R1. Resistors R2 and R3 are connected in parallel. Resistors R2 and R3 are both connected to anti-static diode D2. Anti-static diode D2 is connected to anti-static diode D1. Anti-static diode D1 is connected to inductor L1. Anti-static diode D2, resistors R2 and R3 are all connected to plug H1.

[0032] In this embodiment, the capacitive sensing module is disposed on the substrate C. The substrate C has a lower interlayer B and an upper interlayer D on its two sides. The lower interlayer B is disposed between the substrate C and the bottom layer A, and the upper interlayer D is disposed between the substrate C and the surface layer E. The lower interlayer B and the upper interlayer D are equal in size and both are larger than the substrate C. The lower interlayer B and the upper interlayer D are bonded at their edges. The substrate C is made of flexible material, and the bottom layer A is pasted on the inner wall of the toilet.

[0033] The bottom layer A is a film (release paper, release sticker), preferably 76x36mm in size and 0.1mm thick.

[0034] The lower interlayer B is made of acrylic grey glue (foam), preferably 76x36mm in size and 1.5mm thick, with adhesive on both sides.

[0035] The substrate C is an encapsulated and bonded FPC flexible substrate, which is equipped with a capacitive sensing module and preferably has a size of 74x34mm.

[0036] The upper interlayer D is made of acrylic gray glue (foam), preferably 76x36mm in size and 1.5mm thick. It has an adhesive on the inside and is fixed to the outer layer on the outside (it is not a hydrophobic material and cannot be peeled off after being pasted).

[0037] The outermost layer E is a protective layer that is impact-resistant, waterproof, moisture-proof, and mildew-proof. The preferred dimensions are 76x36mm and 0.2mm thick.

[0038] For encapsulation and bonding, silicone rubber 703 is preferred, but 702, 704, 705, etc. can also be selected according to different requirements and environments.

[0039] Connecting the sensing system and the main control system using female connector H4 and male connector H3 allows for easy maintenance without removing the toilet body. The connection points of female connector H4 and male connector H3 are fitted with a limiting surface to prevent misalignment. Additionally, a sealing ring is installed at the connection point of female connector H4 and male connector H3 to provide waterproof sealing.

[0040] Peeling off the bottom layer A allows you to attach the lower interlayer B, substrate C, upper interlayer D, and surface layer E to the inner wall of the toilet. The substrate C is made of flexible material to fit the curvature of the toilet's inner wall. The substrate C is encapsulated in the cavity formed by the lower interlayer B and the upper interlayer D. Connecting the plug H1 to an external device allows you to control the opening and closing of the toilet lid, as well as set functions such as pre-flushing and post-flushing.

[0041] The specifications, models, and manufacturers of the electrical components are listed below:

[0042]

[0043] Furthermore, it should be noted that the specific embodiments described in this specification may differ in the shape and name of their components. The above description is merely illustrative of the structure of this utility model. All equivalent or simple variations made based on the structure, features, and principles described in this utility model are included within the protection scope of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, as long as they do not deviate from the structure of this utility model or exceed the scope defined by the claims, all of which should fall within the protection scope of this utility model.

Claims

1. A capacitive touch sensing sensor, comprising a sensing system and a main control system, wherein the sensing system is connected to the main control system, characterized in that: One end of the sensing system is connected to the capacitive sensing module, and the other end of the sensing system is connected to the female connector. One end of the main control system is connected to the male connector, and the other end of the main control system is connected to the plug. The female connector is connected to the male connector.

2. The capacitive touch sensing sensor according to claim 1, characterized in that: The male connector is fitted with a nut, which is threadedly connected to the female connector.

3. The capacitive touch sensing sensor according to claim 1, characterized in that: The capacitive sensing module includes an inductor L1, an anti-static diode D1, an anti-static diode D2, capacitors C1, C2, and C3, a sensing chip U1, resistors R1, R2, and R3, and a capacitor collection pad K1. Capacitors C1, C2, and C3, resistors R1, R2, and R3, and inductor L1 are all connected to the sensing chip U1. Capacitors C1, C2, and C3 are connected in parallel. The capacitor collection pad K1 is connected to resistor R1. Resistors R2 and R3 are connected in parallel. Resistors R2 and R3 are both connected to anti-static diode D2. Anti-static diode D2 is connected to anti-static diode D1. Anti-static diode D1 is connected to inductor L1.

4. The capacitive touch sensing sensor according to claim 3, characterized in that: The antistatic diode D2, resistor R2, and resistor R3 are all connected to the plug.

5. The capacitive touch sensing sensor according to claim 1, characterized in that: The capacitive sensing module is disposed on a substrate (C). A lower interlayer (B) and an upper interlayer (D) are respectively disposed on both sides of the substrate (C). The lower interlayer (B) is disposed between the substrate (C) and the bottom layer (A), and the upper interlayer (D) is disposed between the substrate (C) and the surface layer (E).

6. The capacitive touch sensing sensor according to claim 5, characterized in that: The lower interlayer (B) and the upper interlayer (D) are the same size and both are larger than the substrate (C), and the lower interlayer (B) and the upper interlayer (D) are bonded at their edges.

7. The capacitive touch sensing sensor according to claim 5, characterized in that: The substrate (C) is made of a flexible material.

8. The capacitive touch sensing sensor according to claim 5, characterized in that: The bottom layer (A) is adhered to the inner wall of the toilet.

9. The capacitive touch sensing sensor according to claim 1, characterized in that: The female connector is provided with a limiting platform, and the male connector is provided with a limiting surface, the limiting surface being in contact with the limiting platform.

10. The capacitive touch sensing sensor according to claim 1, characterized in that: The plug has an external wire.

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