Novel heat conduction mechanism of mobile phone CPU

Abstract

The utility model discloses a novel heat conduction mechanism of mobile phone CPU relates to CPU heat conduction technical field, including mainboard, CPU on mainboard, install on mainboard and be located CPU external mainboard shield cover, the top of CPU is provided with mainboard heat conduction pad, the top of mainboard heat conduction pad is provided with heat conduction block, the top of heat conduction block is provided with metal shield heat conduction foil, metal shield heat conduction foil and heat conduction block adopt reflow soldering process and are welded, and the metal shield heat conduction foil is connected with mainboard shield cover through the bottom and is provided with conductive double -sided adhesive. The utility model discloses a metal shield heat conduction foil and heat conduction block directly with reflow soldering process welding, heat conduction double -sided adhesive only places in the area of metal shield heat conduction foil and mainboard shield cover contact, will not influence CPU heat transfer, reduces the heat transfer thermal resistance between CPU and VC, also reduces the thickness of mainboard heat conduction pad simultaneously, and the thickness can be reduced to 0.3mm from 0.8mm, and the thermal resistance drops 60%, is favorable for more fast heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of CPU heat conduction technology, specifically a novel heat conduction mechanism for mobile phone CPUs. Background Technology

[0002] Currently, the CPU used in smartphones is the biggest source of heat. As performance improves, the CPU frequency is getting higher and higher, and the heat problem becomes more and more obvious. At present, the main CPU in mobile phones needs to be shielded to solve the problem of EMI interference. The traditional solution is to directly seal the shielding copper foil. The copper foil has conductive double-sided adhesive on it. The double-sided adhesive has very poor thermal conductivity, which increases thermal resistance.

[0003] Because the gap between the CPU and the copper foil is generally large, thermally conductive gel is used to fill it. The gel thickness is 0.8mm. The thermal conductivity of the gel is very poor compared to metal materials, which increases the thermal resistance.

[0004] Therefore, this utility model proposes a novel heat conduction mechanism for mobile phone CPUs. Utility Model Content

[0005] Technical problems to be solved

[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a new type of heat conduction mechanism for mobile phone CPUs.

[0007] Technical solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a novel heat dissipation mechanism for a mobile phone CPU, comprising a motherboard, a CPU located on the motherboard, a motherboard shield mounted on the motherboard and located outside the CPU, a motherboard thermal pad on the top of the CPU, a thermal block above the motherboard thermal pad, a metal shield thermal foil above the thermal block, the metal shield thermal foil and the thermal block being welded using a reflow soldering process, and the metal shield thermal foil being connected to the motherboard shield via conductive double-sided adhesive on its bottom, a second motherboard thermal pad on the top of the metal shield thermal foil, and a mobile phone VC above the second motherboard thermal pad. By directly welding the metal shield thermal foil and the thermal block using a reflow soldering process, the thermal double-sided adhesive is only placed in the area where the metal shield thermal foil contacts the motherboard shield, without affecting CPU heat transfer, reducing the thermal resistance between the CPU and the VC, and also reducing the thickness of the motherboard thermal pad from 0.8mm to 0.3mm, resulting in a 60% reduction in thermal resistance and facilitating faster heat dissipation.

[0009] Preferably, the thickness of the motherboard thermal pad is 0.3mm.

[0010] Preferably, the metal shielding thermally conductive foil is gold foil, copper foil, or stainless steel foil.

[0011] Preferably, the heat-conducting block is a metal block or a ceramic block, and the thickness of the heat-conducting block is 0.5 mm.

[0012] Preferably, the metal shielding heat-conducting foil has a hole in the middle, and when the heat-conducting block is welded to the metal shielding heat-conducting foil, only the area around the heat-conducting block is welded.

[0013] Preferably, it also includes an aluminum mobile phone frame, a back cover on the back of the phone, and a battery installed inside the phone.

[0014] Preferably, the VC is positioned above a screen, and a large area of ​​copper foil is attached to the screen.

[0015] Preferably, the heat-conducting block is coated with a low-temperature phase change metal material.

[0016] Preferably, the metal shielding thermally conductive foil has a boss structure on the side that contacts the thermally conductive block.

[0017] Preferably, the boss structure is provided with thermally conductive metal.

[0018] Beneficial effects:

[0019] Compared with existing technologies, this novel heat dissipation mechanism for mobile phone CPUs has the following beneficial effects:

[0020] This invention directly welds the metal shielding thermally conductive foil to the thermally conductive block using a reflow soldering process. The thermally conductive double-sided adhesive is only placed in the area where the metal shielding thermally conductive foil contacts the motherboard shielding cover, without affecting CPU heat transfer. This reduces the thermal resistance between the CPU and the VC, and also reduces the thickness of the motherboard thermal pad from 0.8mm to 0.3mm, resulting in a 60% reduction in thermal resistance and facilitating faster heat dissipation. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the structure of this utility model in this application;

[0024] Figure 3 This is a schematic diagram of the structure of the metal shielding heat-conducting foil of this utility model;

[0025] Figure 4 This is a schematic diagram of the installation structure of the heat-conducting block of this utility model;

[0026] Figure 5 This is a schematic diagram of the heat conduction process of this utility model;

[0027] Figure 6 This is a schematic diagram of the prior art of this utility model;

[0028] Figure 7 This is a schematic diagram of the heat conduction process in the prior art of this utility model;

[0029] Figure 8 This is a schematic diagram of the heat conduction process in the prior art of this utility model;

[0030] Figure 9 This is a schematic diagram of the heat conduction process in the prior art of this utility model.

[0031] In the picture:

[0032] 1. Screen; 2. Mobile phone VC; 3. Mobile phone mid-frame; 4. Motherboard shielding cover; 5. Motherboard thermal pad; 6. ...; 7. Motherboard; 8. Back cover; 9. Battery; 10. Motherboard thermal pad II; 11. Metal shielding thermal foil; 12. Thermal block; 11-1. Conductive double-sided adhesive; 11-2. Hole; 11-3. Boss structure; 11-4. Thermally conductive metal. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figures 1 to 7As shown, this utility model provides a technical solution: a novel heat dissipation mechanism for a mobile phone CPU, including a motherboard 7, a CPU 6 located on the motherboard 7, a motherboard shield 4 mounted on the motherboard 7 and located outside the CPU 6, a motherboard thermal pad 5 with a thickness of 0.3mm on the top of the CPU 6, the motherboard thermal pad 5 being a thermal interface material used to quickly dissipate heat from the motherboard, a thermal block 12 above the motherboard thermal pad 5, using a metal block to replace part of the thermal pad thickness, the metal block having a much stronger thermal conductivity than thermal gel, effectively reducing thermal resistance, a metal shielding thermal foil 11 above the thermal block 12, the metal shielding thermal foil 11 being welded to the thermal block 12 using a reflow soldering process, and the metal shielding thermal foil 11 being welded to the thermal block 12 using a reflow soldering process, and the metal shielding thermal foil 11 being welded to the CPU 6. The thermal foil 11 is connected to the motherboard shield 4 via conductive double-sided adhesive 11-1 at its bottom. A motherboard thermal pad 2 10 is placed on top of the metal shield thermal foil 11. The motherboard thermal pad 2 10 is a thermal interface material used to quickly dissipate heat from the motherboard. The mobile phone VC2 is placed above the motherboard thermal pad 2 10. The metal shield thermal foil 11 and the thermal block 12 are directly soldered using a reflow soldering process. The thermal double-sided adhesive is only placed in the area where the metal shield thermal foil 11 contacts the motherboard shield 4, which does not affect the heat transfer of the CPU. This reduces the thermal resistance between the CPU and the VC, and also reduces the thickness of the motherboard thermal pad from 0.8mm to 0.3mm, resulting in a 60% reduction in thermal resistance and facilitating faster heat dissipation.

[0035] Please refer to the following carefully. Figure 2 The metal shielding thermal conductive foil 11 can be any metal shielding material such as gold foil, copper foil, or stainless steel foil; the thermal conductive block 12 can be any metal material such as gold block, silver block, or aluminum block, or ceramic thermal conductive material, and the thickness of the thermal conductive block 12 is 0.5mm.

[0036] Please refer to the following carefully. Figure 3 and Figure 4 The metal shielding heat-conducting foil 11 has a hole 11-2 in the middle. When the heat-conducting block 12 is welded to the metal shielding heat-conducting foil 11, only the area around the heat-conducting block 12 is welded. This can meet the shielding performance while making the welding process simpler and preventing welding defects that could lead to a decrease in thermal conductivity.

[0037] The heat-conducting block 12 in this application is coated with a low-temperature phase change metal material, which can directly contact the CPU6. After the CPU6 is heated, the metal phase change material melts directly and fills the gap, serving as an interface material that simultaneously has shielding and thermal conductivity properties.

[0038] Please refer to the following carefully. Figure 1It also includes an aluminum mid-frame 3, which is generally made of 6063 aluminum CNC machined and has excellent thermal conductivity with a thermal conductivity coefficient of 180W / mk. The back cover 8 is located on the back of the phone, as well as the battery 9 installed inside the phone. The VC2 is the component with the strongest thermal conductivity inside the phone, with an equivalent thermal conductivity coefficient of up to 6000W / mk. It quickly transfers the heat of the CPU to the mid-frame, reducing the CPU temperature. Above the VC2 is the screen 1, which has a large area of ​​copper foil attached to it to help dissipate heat from the phone.

[0039] Please refer to the following carefully. Figure 8 and Figure 9 A boss structure 11-3 is provided on the side of the metal shielding heat-conducting foil 11 that contacts the heat-conducting block 12, and a heat-conducting metal 11-4 is provided in the boss structure 11-3.

[0040] Working principle: This utility model directly welds copper foil (which can be replaced with stainless steel or other metal materials) to heat-conducting blocks (including metal heat-conducting blocks and ceramic heat-conducting blocks) using a reflow soldering process. The thermally conductive double-sided adhesive is only placed in the area where bonding is required, without affecting the heat transfer of the CPU, reducing the thermal resistance between the CPU and the VC, and also reducing the thickness of the motherboard thermal pad, which can be reduced from 0.8mm to 0.3mm, resulting in a 60% reduction in thermal resistance.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel heat dissipation mechanism for a mobile phone CPU, comprising a motherboard (7), a CPU (6) located on the motherboard (7), and a motherboard shielding cover (4) mounted on the motherboard (7) and located outside the CPU (6), characterized in that: A motherboard thermal pad (5) is provided on the top of the CPU (6). A thermal block (12) is provided above the motherboard thermal pad (5). A metal shielding thermal foil (11) is provided above the thermal block (12). The metal shielding thermal foil (11) and the thermal block (12) are welded by reflow soldering. The metal shielding thermal foil (11) is connected to the motherboard shielding cover (4) through conductive double-sided adhesive (11-1) at its bottom. A motherboard thermal pad II (10) is provided on the top of the metal shielding thermal foil (11). A mobile phone VC (2) is provided above the motherboard thermal pad II (10).

2. The novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The thickness of the motherboard thermal pad (5) is 0.3 mm.

3. The novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The metal shielding thermally conductive foil (11) is gold foil, copper foil, or stainless steel foil.

4. The novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The heat-conducting block (12) is a metal block or a ceramic block, and the thickness of the heat-conducting block (12) is 0.5 mm.

5. A novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The metal shielding heat-conducting foil (11) has a hole (11-2) in the middle. When the heat-conducting block (12) is welded to the metal shielding heat-conducting foil (11), only the area around the heat-conducting block (12) is welded.

6. The novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: It also includes an aluminum mobile phone frame (3), a back cover (8) on the back of the phone, and a battery (9) installed inside the phone.

7. A novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The mobile phone VC (2) is topped with a screen (1), and a large area of ​​copper foil is attached to the screen (1).

8. The novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The heat-conducting block (12) is coated with a low-temperature phase change metal material.

9. A novel heat-conducting mechanism for a mobile phone CPU according to claim 1, characterized in that: The metal shielding heat-conducting foil (11) has a boss structure (11-3) on the side that contacts the heat-conducting block (12).

10. A novel heat-conducting mechanism for a mobile phone CPU according to claim 9, characterized in that: The boss structure (11-3) is provided with a heat-conducting metal (11-4).

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