Lightweight high-strength composite substrate and PCB processing table top

Abstract

The utility model relates to PCB board processing technical field, especially a kind of light high-strength composite substrate and PCB board processing mesa, including bottom plate, upper cover and support layer;Support layer is the honeycomb structure core material of light high-strength.This scheme adopts the composite design of honeycomb structure core material and rigid surface layer, while significantly reducing the dead weight of substrate, effectively disperses knocking stress by the distributed support effect of honeycomb unit, and the impact deformation resistance is greatly improved.FR4 upper cover plate provides stable insulating work surface, avoids the risk of static electricity accumulation in processing;Galvanized steel bottom plate strengthens overall bending stiffness, ensures the flatness stability under long-term use.Sandwich structure synergistic effect fundamentally solves the contradiction between traditional aluminum plate in anti-deformation and light weight.

Description

Technical Field

[0001] This utility model relates to the field of PCB board processing technology, and in particular to a lightweight, high-strength composite substrate and a PCB board processing table. Background Technology

[0002] In PCB manufacturing, board fixing is a crucial step in ensuring processing accuracy. Currently, the industry commonly uses two fixing methods: one is a double-pin clamping method, which quickly fixes the PCB board with positioning pins by clamping it between front and rear pins; the other is a template positioning method, which requires machining matching holes on the bakelite board and the PCB board before fixing by hammering in the positioning pins. While the template positioning method offers higher positioning accuracy and adaptability to PCB boards of all sizes, the impact force generated when hammering the pins can easily cause plastic deformation of the workbench substrate (usually a thin aluminum plate), affecting the flatness of the workbench. To enhance resistance to deformation, existing technologies attempt to use thicker aluminum plates as the substrate, but the significantly increased weight (usually more than twice that of traditional substrates) makes equipment installation and debugging difficult and increases the load on the transmission system.

[0003] The existing substrates are not impact-resistant enough and are prone to dents after pin knocking. In addition, traditional PCB processing tables cannot simultaneously accommodate both dual-pin clamping and template positioning modes. Switching requires replacing the entire worktable, reducing the flexibility of the production line. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] In view of the problems existing in the prior art, this utility model is proposed.

[0006] Therefore, the first problem that this utility model aims to solve is that the existing PCB processing table substrate has insufficient impact resistance and is prone to plastic deformation after pin knocking.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a lightweight high-strength composite substrate, including a base plate with a hollow cavity thereon; a top cover covering the base plate; and a support layer sandwiched in the hollow cavity of the base plate and located between the base plate and the top cover, wherein the end face of the support layer is respectively attached to the end face of the base plate and the end face of the top cover, and the support layer is a lightweight high-strength honeycomb structure core material.

[0008] In a preferred embodiment of the lightweight high-strength composite substrate of this utility model, the top cover is made of FR4 grade material.

[0009] In a preferred embodiment of the lightweight high-strength composite substrate of this utility model, the base plate is made of galvanized steel plate.

[0010] The first beneficial effect of this invention is that the composite design of a honeycomb core material and a rigid surface layer significantly reduces the weight of the substrate while effectively dispersing impact stress through the distributed support effect of the honeycomb units, greatly improving its resistance to impact deformation. The FR4 top cover provides a stable insulated working surface, avoiding the risk of static electricity accumulation during processing; the galvanized steel bottom plate strengthens the overall bending stiffness, ensuring flatness stability under long-term use. The synergistic effect of the sandwich structure fundamentally solves the contradiction between deformation resistance and lightweight in traditional aluminum plates.

[0011] The second problem that this utility model aims to solve is that traditional PCB processing tables cannot simultaneously accommodate both dual-PIN clamping and bakelite board fixing modes.

[0012] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a PCB board processing table, including a lightweight high-strength composite substrate, and further including a base, disposed below the base plate; a clamping assembly, including a clamping member and a bakelite board, the clamping member being disposed above the base, and the bakelite board being disposed above the upper cover and detachably connected to the upper cover; the clamping member includes a first clamping pin and a second clamping pin, the first clamping pin and the second clamping pin being disposed opposite to each other on both sides of the base.

[0013] As a preferred embodiment of the PCB board processing table of this utility model, the end face of the lightweight high-strength composite substrate is provided with a slot M, and the slot M is matched with the first clip PIN and the second clip PIN.

[0014] As a preferred embodiment of the PCB board processing table of this utility model, the end face of the lightweight high-strength composite substrate is further provided with embedded blocks, and the embedded blocks are provided with threads inside; the end face of the bakelite board is provided with through holes, and the through holes are matched with the positions of the embedded blocks; the bakelite board is connected to the embedded blocks by bolts.

[0015] The second beneficial effect of this utility model is that this solution achieves rapid switching between dual modes through a modular structure: the matching design of the card slot and the clamping pin simplifies the dual-pin fixing process, while the bolt connection scheme between the pre-embedded threaded block and the bakelite board significantly improves the positioning accuracy and assembly reliability of the bakelite board. The vibration attenuation characteristics of the composite substrate simultaneously suppress the transmission of processing vibrations. Combined with the optimized layout of the base and clamping components, both fixing modes can be efficiently compatible, greatly shortening the production line changeover time and improving the consistency of processing positioning. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0017] Figure 1 This is a schematic diagram of a lightweight, high-strength composite substrate.

[0018] Figure 2 This is a diagram of the internal structure of a lightweight, high-strength composite substrate.

[0019] Figure 3 A schematic diagram of a PCB board processing table structure;

[0020] Figure 4 A schematic diagram of a dual-pin PCB fabrication table. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0024] Example 1, referring to Figures 1-2This is the first embodiment of the present invention. This embodiment provides a lightweight high-strength composite substrate, which includes a base plate 1, a top cover 2, and a support layer 3.

[0025] Specifically, a base plate 1 has a hollow cavity on it; an upper cover 2 covers the base plate 1; and a support layer 3 is sandwiched in the hollow cavity of the base plate 1 and located between the base plate 1 and the upper cover 2. The end face of the support layer 3 is in contact with the end face of the base plate 1 and the end face of the upper cover 2 respectively. The support layer 3 is a lightweight and high-strength honeycomb structure core material.

[0026] The hollow cavity accommodates the support layer 3 and forms a lightweight structural space. Its depth determines the thickness of the honeycomb core material, which directly affects the impact resistance. The top cover 2 directly contacts the working surface of the PCB and bears the processing load. The support layer 3 is the core mechanical load-bearing unit of the substrate. The honeycomb core material can disperse local impact stress and avoid substrate deformation during pin knocking operations. It can be made of honeycomb aluminum plate or carbon fiber reinforced mesh. In this embodiment, honeycomb aluminum plate is used.

[0027] Specifically, the top cover 2 is made of FR4 grade material; FR4 is the substrate used in PCBs, with a low coefficient of thermal expansion that matches the PCB material, avoiding positioning deviations caused by temperature drift, and has good insulation to prevent electrostatic breakdown, and its surface hardness can resist drill bit scratches.

[0028] Specifically, the base plate 1 is made of galvanized steel plate; the galvanized layer prevents rust and extends service life, and the high yield strength enables the base plate to resist bending deformation.

[0029] During use, when the PCB board is placed on the substrate surface for processing, the processing pressure is evenly transmitted to the honeycomb core through the FR4 top cover 2. The hexagonal cell walls of the honeycomb structure disperse local stress through elastic deformation, avoiding the plastic indentation of traditional aluminum plates. The galvanized steel base plate 1 provides rigid support, restrains overall deformation, and ensures that the substrate remains flat under repeated impacts. The insulating properties of the FR4 top cover 2 also prevent static electricity buildup during processing, while the lightweight design of the honeycomb core significantly reduces the overall weight of the substrate, facilitating installation.

[0030] Example 2, refer to Figures 2-4 This is the second embodiment of the present invention. This embodiment proposes a PCB board processing table, including a lightweight high-strength composite substrate, and also includes a base 4, which is disposed below the base plate 1; a clamping assembly 5, including a clamping member 51 and a bakelite board 52. The clamping member 51 is disposed above the base 4, and the bakelite board 52 is disposed above the upper cover 2 and is detachably connected to the upper cover 2; the clamping member 51 includes a first clamping pin 511 and a second clamping pin 512, which are disposed opposite to each other on both sides of the base 4.

[0031] The clamping component 51 enables quick clamping in dual-PIN mode. The bakelite board 52 is used to clamp the PCB board together with the positioning pin in template mode. It is not installed when dual-PIN mode is enabled. The first clamping pin 511 and the second clamping pin clamp the pins that are already fixed on the PCB board. It is worth noting that the first clamping pin 511 is a single-point clamping and the second clamping pin 512 is a straight-line clamping, which is convenient for fixing PCB boards of different sizes.

[0032] Specifically, a slot M is provided on the end face of the lightweight high-strength composite substrate, and the slot M is matched with the first clip PIN511 and the second clip PIN512.

[0033] The slot M is used to install the clamp 51, and the upper surfaces of the first clamp PIN 511 and the second clamp PIN 512 are slightly lower than the upper surface of the substrate. Preferably, the upper surfaces of the first clamp PIN 511 and the second clamp PIN 512 are flush with the upper surface of the substrate.

[0034] Specifically, the end face of the lightweight high-strength composite substrate is also provided with embedded blocks 11, and the embedded blocks 11 are provided with threads; the end face of the bakelite board 52 is provided with through holes 521, and the through holes 521 are matched with the positions of the embedded blocks 11; the bakelite board 52 is connected to the embedded blocks 11 by bolts to achieve precise positioning and installation of the bakelite board.

[0035] This PCB processing table integrates a dual-mode fixing system, enabling flexible switching through the coordinated operation of the composite substrate and clamping components. In dual-pin mode, the PCB board is quickly locked in place by the interference fit between the edge slots and the clamping pins, ensuring uniform clamping force and stability. When the PCB board size exceeds the adaptability range of the dual-pin mode, a bakelite board can be installed on the machine in a template mode. The lightweight, high-strength composite substrate avoids substrate deformation caused by traditional pin-tapping, and its honeycomb core structure further absorbs processing vibrations, reducing the impact on positioning accuracy. This allows for efficient compatibility between the two modes, improving processing efficiency and extending equipment lifespan.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A lightweight, high-strength composite substrate, characterized in that: include, A base plate (1) on which a hollow cavity is provided; The top cover (2) covers the bottom plate (1); The support layer (3) is sandwiched in the hollow cavity of the base plate (1) and located between the base plate (1) and the top cover (2). The end face of the support layer (3) is respectively attached to the end face of the base plate (1) and the end face of the top cover (2). The support layer (3) is a lightweight and high-strength honeycomb structure core material.

2. The lightweight, high-strength composite substrate as described in claim 1, characterized in that: The top cover (2) is made of FR4 grade material.

3. The lightweight, high-strength composite substrate as described in claim 2, characterized in that: The base plate (1) is made of galvanized steel plate.

4. A PCB board processing table, characterized in that: Including the lightweight, high-strength composite substrate as described in claim 3, and further comprising: A base (4) is disposed below the base plate (1); The clamping assembly (5) includes a clamping member (51) and a bakelite board (52). The clamping member (51) is disposed above the base (4), and the bakelite board (52) is disposed above the upper cover (2) and is detachably connected to the upper cover (2). The clamping member (51) includes a first clamping PIN (511) and a second clamping PIN (512), with the first clamping PIN (511) and the second clamping PIN (512) disposed opposite to each other on both sides of the base (4).

5. The PCB board processing table as described in claim 4, characterized in that: The lightweight high-strength composite substrate has a slot (M) on its end face, which matches the first clip PIN (511) and the second clip PIN (512).

6. The PCB board processing table as described in claim 5, characterized in that: The end face of the lightweight high-strength composite substrate is also provided with embedded blocks (11), and the embedded blocks (11) are provided with threads inside. The end face of the bakelite board (52) is provided with a through hole (521), and the position of the through hole (521) matches that of the embedded block (11); The bakelite board (52) is connected to the embedded block (11) by bolts.

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