A silica gel gasket with good heat conduction performance

Abstract

The utility model discloses a silica gel gasket with good heat conduction performance, including gasket main part, upper heat conduction board and lower heat conduction board, the gasket main part is inlayed and is installed in the inside of lower heat conduction board, the upper heat conduction board detachable installation is in the upper end surface of lower heat conduction board, it is detachable structure between gasket main part and lower heat conduction board, gasket main part includes metal plating, ceramic gasket and silica gel layer structure. The utility model discloses a sealed joint's mode can be installed fixed in the upper heat conduction board and lower heat conduction board inside with gasket main part fast sealing, through to gasket main part inside carries out compound heat conduction type design, is provided with metal plating cooperation ceramic gasket, and metal plating has good heat conductivity, can form heat conduction passway in silica gel, improves the heat conduction performance of gasket, and ceramic gasket has higher thermal conductivity and chemical stability, and the addition of ceramic filler can build heat conduction network in silica gel, and heat is further conducted efficiently through ceramic particle.

Description

Technical Field

[0001] This utility model relates to the field of silicone pad technology, specifically a silicone pad with good thermal conductivity. Background Technology

[0002] Thermally conductive silicone pads are a type of thermally conductive medium material synthesized through a special process using silicone as the base material and adding various auxiliary materials such as metal oxides. They are specifically designed and manufactured to transfer heat through gaps, filling gaps and opening up thermal channels between heat-generating and heat-dissipating parts, effectively improving heat transfer efficiency. At the same time, they also play a role in insulation, shock absorption, and sealing. They can meet the design requirements of miniaturization and ultra-thinness of equipment, and are a highly processable and practical material with a wide range of applicable thicknesses, making them an excellent thermally conductive filling material.

[0003] Chinese patent document CN219007245U discloses a silicone pad with good thermal conductivity, relating to the technical field of thermally conductive silicone pads. It includes a silicone body layer, a flexible contact layer mounted on the upper end of the silicone body layer, a metal support layer mounted on the lower end of the silicone body layer, and an anti-slip layer mounted on the lower end of the metal support layer. The silicone body layer includes two silicone pads, symmetrically distributed vertically, with several thermally conductive strips mounted between the two silicone pads. These thermally conductive strips are spliced ​​together to form an integral structure. Each thermally conductive strip has a through-hole at its front end. The flexible contact layer includes thermally conductive adhesive, with a fiber mesh and thermally conductive grease mounted on the upper end of the thermally conductive adhesive. This invention improves thermal conductivity by increasing the contact area between the pad and the object by using a flexible contact layer and by increasing the contact area between the silicone pad and the installation environment by using thermally conductive strips.

[0004] The existing technology described above cannot quickly seal and heat conduction fix the outside of the silicone gasket, and the heat conduction efficiency of the silicone gasket itself is poor. Therefore, it is necessary to develop a silicone gasket with good heat conduction performance. Utility Model Content

[0005] The purpose of this invention is to provide a silicone gasket with good thermal conductivity, so as to solve the problems mentioned in the background art that the prior art cannot quickly seal and heat conduction fix the outside of the silicone gasket, and that the thermal conductivity of the silicone gasket body is poor.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a silicone pad with good thermal conductivity, comprising a pad body, an upper heat-conducting plate and a lower heat-conducting plate, wherein the pad body is embedded in the interior of the lower heat-conducting plate, the upper heat-conducting plate is detachably mounted on the upper surface of the lower heat-conducting plate, and the pad body and the lower heat-conducting plate are detachably connected, wherein the pad body comprises a metal plating layer, a ceramic pad and a silicone layer.

[0007] Preferably, the metal plating layer is disposed on the upper surface of the ceramic gasket, and the silicone layer structure is disposed on the lower surface of the ceramic gasket.

[0008] Preferably, the upper heat-conducting plate has first threaded holes at the four corners of its surface, and the lower heat-conducting plate has second threaded holes at corresponding positions on its surface.

[0009] Preferably, the first threaded hole and the second threaded hole are connected one-to-one by positioning bolts.

[0010] Preferably, the lower heat-conducting plate has an internal mounting groove, and the inner wall of the mounting groove is provided with a fixing slot.

[0011] Preferably, a metal retaining ring is provided on the upper surface of the gasket body, and the gasket body is tightly engaged and fixed with the fixing groove by the metal retaining ring.

[0012] Preferably, the metal plating layer, ceramic gasket, and silicone layer are tightly bonded and fixed together by hot pressing.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention employs a sealing snap-fit ​​method to quickly and securely install the gasket body inside the upper and lower heat-conducting plates. The gasket body features a composite heat-conducting design, incorporating a metal plating layer in conjunction with a ceramic gasket. The metal plating layer possesses excellent thermal conductivity, forming heat-conducting pathways within the silicone rubber, thus improving the gasket's thermal conductivity. The ceramic gasket exhibits high thermal conductivity and chemical stability. The addition of ceramic filler constructs a heat-conducting network within the silicone rubber, enabling further efficient heat conduction through the ceramic particles. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the exploded decomposition structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the internal structure of the gasket body of this utility model.

[0018] In the diagram: 1. Upper heat-conducting plate; 2. Positioning bolt; 3. First threaded hole; 4. Metal retaining ring; 5. Lower heat-conducting plate; 6. Mounting groove; 7. Second threaded hole; 8. Gasket body; 9. Fixing groove; 10. Metal plating; 11. Ceramic gasket; 12. Silicone layer structure. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Please see Figure 1-3 The present invention provides an embodiment of a silicone pad with good thermal conductivity, comprising a pad body 8, an upper heat-conducting plate 1 and a lower heat-conducting plate 5. The pad body 8 is embedded in the lower heat-conducting plate 5, and the upper heat-conducting plate 1 is detachably mounted on the upper surface of the lower heat-conducting plate 5. The pad body 8 and the lower heat-conducting plate 5 are detachable. The pad body 8 includes a metal plating layer 10, a ceramic pad 11 and a silicone layer structure 12.

[0021] Furthermore, a metal plating layer 10 is disposed on the upper surface of the ceramic gasket 11, and a silicone layer structure 12 is disposed on the lower surface of the ceramic gasket 11. The metal plating layer 10, the ceramic gasket 11, and the silicone layer structure 12 are tightly bonded and fixed together by hot pressing. By implementing a composite thermally conductive design inside the gasket body 8, a metal plating layer 10 is provided in conjunction with the ceramic gasket 11. The metal plating layer 10 has good thermal conductivity and can form a thermally conductive path in the silicone, thereby improving the thermal conductivity of the gasket. The ceramic gasket 11 has high thermal conductivity and chemical stability. The addition of ceramic filler can construct a thermally conductive network in the silicone, allowing heat to be further efficiently conducted through the ceramic particles.

[0022] Furthermore, the upper heat-conducting plate 1 has four first threaded holes 3 at its four corners, and the lower heat-conducting plate 5 has corresponding second threaded holes 7 at its corresponding positions. The first threaded holes 3 and the second threaded holes 7 are connected one-to-one by positioning bolts 2. By using a sealing snap-fit ​​method, the gasket body 8 can be quickly and securely installed inside the upper heat-conducting plate 1 and the lower heat-conducting plate 5. The upper heat-conducting plate 1 and the lower heat-conducting plate 5 achieve rapid sealing and heat conduction of the gasket body 8.

[0023] Furthermore, the lower heat-conducting plate 5 has an installation groove 6 inside, and a fixing slot 9 is provided on the inner wall of the installation groove 6. A metal retaining ring 4 is provided on the upper surface of the gasket body 8. The gasket body 8 is tightly engaged and fixed with the fixing slot 9 by the metal retaining ring 4, which has the advantage of convenient installation and fixing, and facilitates quick positioning, installation, fixing and disassembly of the gasket body 8.

[0024] Working principle: In use, the gasket body 8 is embedded inside the lower heat-conducting plate 5, and the upper heat-conducting plate 1 is detachably installed on the upper surface of the lower heat-conducting plate 5. The lower heat-conducting plate 5 has an installation groove 6 inside, and a fixing slot 9 is provided on the inner wall of the installation groove 6. A metal retaining ring 4 is provided on the upper surface of the gasket body 8. The gasket body 8 is tightly engaged and fixed to the fixing slot 9 by the metal retaining ring 4, providing the advantage of convenient installation and fixing. This facilitates quick and easy installation, fixing, and disassembly of the gasket body 8. By adopting a sealed snap-fit ​​method, the gasket body 8 can be quickly and sealedly installed and fixed to the upper heat-conducting plate 1 and the lower heat-conducting plate 5. Inside plate 5, upper heat-conducting plate 1 and lower heat-conducting plate 5 achieve rapid sealing and heat conduction of gasket body 8. Gasket body 8 includes metal plating layer 10, ceramic gasket 11 and silicone layer structure 12. By adopting a composite heat-conducting design inside gasket body 8, metal plating layer 10 is set in conjunction with ceramic gasket 11. Metal plating layer 10 has good thermal conductivity and can form a heat conduction path in silicone, improving the heat conduction performance of gasket. Ceramic gasket 11 has high thermal conductivity and chemical stability. The addition of ceramic filler can build a heat conduction network in silicone, so that heat can be further efficiently conducted through ceramic particles.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] All standard parts used in this application can be purchased from the market. The specific connection methods of each part are all conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment are all conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, and will not be described in detail here.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicone pad with good thermal conductivity, comprising a pad body (8), an upper heat-conducting plate (1), and a lower heat-conducting plate (5), characterized in that, The gasket body (8) is embedded inside the lower heat-conducting plate (5), and the upper heat-conducting plate (1) is detachably installed on the upper surface of the lower heat-conducting plate (5). The gasket body (8) and the lower heat-conducting plate (5) are detachable. The gasket body (8) includes a metal plating layer (10), a ceramic gasket (11), and a silicone layer structure (12).

2. The silicone pad with good thermal conductivity according to claim 1, characterized in that: The metal plating layer (10) is disposed on the upper surface of the ceramic gasket (11), and the silicone layer structure (12) is disposed on the lower surface of the ceramic gasket (11).

3. A silicone pad with good thermal conductivity according to claim 1, characterized in that: The upper heat-conducting plate (1) has a first threaded hole (3) at each of the four corners of its surface, and the lower heat-conducting plate (5) has a second threaded hole (7) at the corresponding position on its surface.

4. A silicone pad with good thermal conductivity according to claim 3, characterized in that: The first threaded hole (3) and the second threaded hole (7) are connected one-to-one by positioning bolts (2).

5. A silicone pad with good thermal conductivity according to claim 1, characterized in that: The lower heat-conducting plate (5) has an installation groove (6) inside, and the inner wall of the installation groove (6) is provided with a fixing slot (9).

6. A silicone pad with good thermal conductivity according to claim 5, characterized in that: The upper surface of the gasket body (8) is provided with a metal retaining ring (4), and the gasket body (8) is tightly engaged and fixed with the fixing groove (9) by the metal retaining ring (4).

7. A silicone pad with good thermal conductivity according to claim 1, characterized in that: The metal plating layer (10), ceramic gasket (11), and silicone layer structure (12) are tightly bonded together by hot pressing.

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