In-vehicle controller and vehicle

Abstract

The utility model discloses a vehicle controller and vehicle, vehicle controller includes casing, liquid cooling board, circuit board and TEC module, and liquid cooling board links with casing, and liquid cooling board and casing define the installation cavity, circuit board is installed in the installation cavity, and the side of circuit board towards liquid cooling board is equipped with chip, and TEC module sets up between chip and liquid cooling board and has first heat exchange end and second heat exchange end, and first heat exchange end and chip heat exchange contact, and second heat exchange end and liquid cooling board heat exchange contact. The utility model provides a vehicle controller has the high integration, and the volume is small, and the quick temperature rise and the heat dissipation effect of good to chip.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, specifically to an on-board controller and a vehicle. Background Technology

[0002] With the increasing complexity of functions such as intelligent driving and cockpit entertainment systems, the computing power requirements of domain controllers are surging, posing greater challenges to their heat dissipation and temperature control technologies. In related technologies, high-computing-power chips within controllers typically employ air cooling, liquid cooling, ETC (Electronic Toll Collection) systems, or phase change materials for heat dissipation. However, for automotive domain controllers, issues remain regarding rapid heating and heat dissipation, as well as poor integration and miniaturization design. Utility Model Content

[0003] This utility model aims to at least partially solve one of the technical problems in the related art.

[0004] Therefore, embodiments of this utility model propose an in-vehicle controller that features high integration, small size, and good rapid heating and heat dissipation of the chip.

[0005] An embodiment of this utility model also proposes a vehicle.

[0006] The vehicle controller of this utility model embodiment includes a housing, a liquid cooling plate, a circuit board, and a TEC module. The liquid cooling plate is connected to the housing, and the liquid cooling plate and the housing define a mounting cavity. The circuit board is mounted in the mounting cavity, and a chip is provided on the side of the circuit board facing the liquid cooling plate. The TEC module is disposed between the chip and the liquid cooling plate and has a first heat exchange end and a second heat exchange end. The first heat exchange end is in heat exchange contact with the chip, and the second heat exchange end is in heat exchange contact with the liquid cooling plate.

[0007] According to the vehicle controller of this utility model embodiment, the TEC module is disposed between the chip and the liquid cooling plate, and the first heat exchange end and the second heat exchange end of the TEC module are in heat exchange contact with the chip and the liquid cooling plate respectively. When the room temperature is too high or the chip heats up rapidly under sudden high load computing power operation, the first heat exchange end of the TEC module can quickly cool down to make the chip dissipate heat quickly. When the room temperature is too low, the first heat exchange end of the TEC module can quickly heat up or cool down to make the chip heat up quickly. The temperature control of the chip by the TEC module is more efficient than that of liquid cooling and is not affected by fluid inertia like liquid cooling, effectively meeting the usage requirements of high-efficiency chips under complex working conditions.

[0008] Meanwhile, when the first heat exchange end is heating or cooling, the corresponding cooling or heating at the second heat exchange end of the TEC module can also be rapidly absorbed or dissipated through the liquid cooling plate. Compared with air cooling, the liquid cooling plate has higher temperature control efficiency and occupies less space, better meeting the miniaturization design requirements of the vehicle controller. Moreover, by integrating both the TEC module and the liquid cooling plate onto the housing, the reassembly of heat dissipation components is eliminated, resulting in a higher level of integration for the vehicle controller.

[0009] In some embodiments, the vehicle controller includes a mounting bracket disposed on the side of the liquid cooling plate facing the circuit board, the mounting bracket having a limiting hole extending through the mounting bracket along the thickness direction of the circuit board, and a portion of the TEC module being disposed within the limiting hole.

[0010] In some embodiments, the liquid cooling plate has a limiting groove on the side facing the TEC module, and a portion of the TEC module is disposed within the limiting groove.

[0011] In some embodiments, the vehicle controller further includes electrode leads, a control module, and a charging connector. The control module is electrically connected to the charging connector and to the TEC module via the electrode leads. The control module is used to switch the current direction in the circuit where the TEC module is located.

[0012] In some embodiments, when the control module controls the current direction of the circuit where the TEC module is located to be a first current direction, the first heat exchange end of the TEC module is a cold end and the second heat exchange end is a hot end.

[0013] When the control module controls the current direction of the circuit where the TEC module is located to be opposite to the first current direction, the first heat exchange end of the TEC module is the hot end, and the second heat exchange end is the cold end.

[0014] In some embodiments, the mounting bracket is connected to the liquid cooling plate via a threaded fitting, and a portion of the TEC module is clamped between the head of the threaded fitting and the mounting bracket.

[0015] In some embodiments, the circuit board is further provided with a plurality of heating elements on the side facing the liquid cooling plate;

[0016] The vehicle controller also includes a heat-conducting component, which is disposed on the side of the liquid cooling plate facing the circuit board, and the heat-conducting component is in heat exchange contact with at least one of the heat-generating components.

[0017] In some embodiments, the housing includes a frame and a cover plate, the cover plate being connected to the frame to define a receiving cavity, the liquid cooling plate being located within the receiving cavity and connected to the frame, and the circuit board and the TEC module being disposed on the side of the liquid cooling plate facing the cover plate.

[0018] In some embodiments, the housing further includes a sealing ring sandwiched between the frame and the cover plate.

[0019] In some embodiments, the vehicle controller further includes a first connector and a second connector, both of which are connected to the liquid cooling plate. The liquid cooling plate is provided with a liquid cooling channel, and the two ends of the liquid cooling channel are respectively connected to the first connector and the second connector. Both the first connector and the second connector are partially exposed outside the housing.

[0020] The vehicle according to the present invention includes an on-board controller as described in any of the above embodiments.

[0021] The technical advantages of the vehicle according to this utility model embodiment are the same as those of the vehicle controller in the above embodiment, and will not be repeated here. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of an on-board controller according to an embodiment of the present utility model.

[0023] Figure 2 This is another schematic diagram of the vehicle controller according to an embodiment of the present utility model.

[0024] Figure 3 This is a cross-sectional view of the vehicle controller according to an embodiment of the present utility model.

[0025] Figure 4 yes Figure 3 Enlarged view of point A in the middle.

[0026] Figure 5 This is a schematic diagram of the vehicle controller with the cover hidden according to an embodiment of the present utility model.

[0027] Figure 6 This is a schematic diagram of the liquid cooling plate, the first connector, and the second connector in the vehicle controller according to an embodiment of the present utility model.

[0028] Figure 7 This is a schematic diagram of the mounting bracket in the vehicle controller according to an embodiment of the present utility model.

[0029] Figure label:

[0030] 1. Housing; 11. Frame; 12. Cover plate; 2. Liquid cooling plate; 21. Limiting groove; 3. TEC module; 4. Circuit board; 5. Chip; 6. Mounting bracket; 61. Limiting hole; 62. Notch; 63. Mounting hole; 7. Heat-conducting component; 8. First connector; 9. Second connector. Detailed Implementation

[0031] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] The following is combined Figures 1-7 This invention describes an on-board controller according to an embodiment of the present invention.

[0033] The vehicle controller of this embodiment includes a housing 1, a liquid cooling plate 2, a circuit board 4, and a TEC (Thermoelectric Cooler) module 3. The liquid cooling plate 2 is connected to the housing 1, and the liquid cooling plate 2 and the housing 1 define a mounting cavity. The circuit board 4 is mounted in the mounting cavity, and a chip 5 is provided on the side of the circuit board 4 facing the liquid cooling plate 2. The TEC module 3 is disposed between the chip 5 and the liquid cooling plate 2 and has a first heat exchange end and a second heat exchange end. The first heat exchange end is in heat exchange contact with the chip 5, and the second heat exchange end is in heat exchange contact with the liquid cooling plate 2.

[0034] According to the vehicle controller of this utility model embodiment, the TEC module 3 is disposed between the chip 5 and the liquid cooling plate 2, and the first heat exchange end and the second heat exchange end of the TEC module 3 are in heat exchange contact with the chip 5 and the liquid cooling plate 2 respectively. When the room temperature is too high or the chip 5 heats up rapidly under sudden high load computing power operation, the first heat exchange end of the TEC module 3 can quickly cool down to make the chip 5 dissipate heat quickly. When the room temperature is too low, the first heat exchange end of the TEC module 3 can quickly heat up or cool down to make the chip 5 heat up quickly. The temperature control of the chip 5 by the TEC module 3 is more efficient than that of the liquid cooling method and is not affected by fluid inertia like the liquid cooling method, effectively meeting the usage requirements of the high-efficiency chip 5 under complex working conditions.

[0035] Meanwhile, when the first heat exchange end is heating or cooling, the corresponding cooling or heating at the second heat exchange end of the TEC module 3 can also be rapidly absorbed or dissipated through the liquid cooling plate 2. Compared with air cooling, the liquid cooling plate 2 has higher temperature control efficiency and occupies less space, better meeting the miniaturization design requirements of the vehicle controller. Moreover, by integrating both the TEC module 3 and the liquid cooling plate 2 onto the housing 1, the reassembly of the heat dissipation components is eliminated, resulting in a higher degree of integration for the vehicle controller.

[0036] It should be noted that the TEC module 3 can switch between cooling and heating at the first heat exchange end by changing the direction of the current in its circuit. That is, both the first and second heat exchange ends can flexibly switch between cold and hot ends. The vehicle controller also includes a temperature sensor that monitors the temperature of the chip 5 in real time to ensure that the TEC module 3 can respond quickly and that the chip 5 is always in a high-performance operating state.

[0037] In some embodiments, the vehicle controller includes a mounting bracket 6, which is disposed on the side of the liquid cooling plate 2 facing the circuit board 4. The mounting bracket 6 has a limiting hole 61 that extends through the mounting bracket 6 along the thickness direction of the circuit board 4, and a portion of the TEC module 3 is disposed within the limiting hole 61.

[0038] The limiting hole 61 on the mounting bracket 6 enables the TEC module 3 to be relatively fixed in all directions except the thickness direction of the circuit board 4, effectively preventing the TEC module 3 from shifting laterally and affecting the heat exchange efficiency between it and the chip 5.

[0039] For example, such as Figure 4 , Figure 5 and Figure 7 As shown, the limiting hole 61 is generally square, and its cross-sectional outer contour matches the cross-sectional outer contour of a portion of the TEC module 3. The TEC module 3 passes through the limiting hole 61 to achieve relative fixation of the TEC module 3 in the circumferential and radial directions within the limiting hole 61. In addition, the first heat exchange end of the TEC module 3 passes through the limiting hole 61 from top to bottom and is in contact with the upper surface of the chip 5.

[0040] In some embodiments, the liquid cooling plate 2 is provided with a limiting groove 21 on the side facing the TEC module 3, and a portion of the TEC module 3 is disposed in the limiting groove 21.

[0041] Thus, the limiting groove 21 can also achieve relative fixation of the TEC module 3 in all directions except the thickness direction of the circuit board 4, effectively preventing the TEC module 3 from shifting laterally and affecting the heat exchange efficiency between it and the chip 5. At the same time, by setting the TEC module 3 to abut against the side and bottom surfaces of the limiting groove 21, the heat exchange area between the TEC module 3 and the liquid cooling plate 2 is further increased, and the temperature control efficiency of the liquid cooling plate 2 for the second heat exchange end of the TEC module 3 is higher.

[0042] For example, such as Figure 4 and Figure 6 As shown, the limiting groove 21 is generally a square groove, and the second heat exchange end of the TEC module 3 is fitted inside the limiting groove 21 and is in contact with the bottom surface of the limiting groove 21.

[0043] It should be noted that the second heat exchange end of the TEC module 3 can also make heat exchange contact with the bottom and side surfaces of the limiting groove 21 through thermally conductive adhesive, so as to further improve the heat exchange efficiency between the TEC module 3 and the liquid cooling plate 2.

[0044] In some embodiments, the vehicle controller further includes electrode leads, a control module, and a charging connector. The control module is electrically connected to the charging connector and to the TEC module 3 via the electrode leads. The control module is used to switch the current direction in the circuit where the TEC module 3 is located.

[0045] For example, the control module could be a current direction switching switch.

[0046] The TEC module 3 and the control module are connected to an external power source via a charging connector. The control module can flexibly control the current direction of the circuit where the TEC module 3 is located based on the outdoor temperature and the operating status of the chip 5, ensuring that the TEC module 3 can quickly and reliably dissipate heat and raise the temperature of the chip 5.

[0047] For example, such as Figure 5 and Figure 7 As shown, the mounting bracket 6 has a notch 62 on its peripheral wall that communicates with the limiting hole 61. The electrode lead passes through the notch 62 to achieve electrical connection with the TEC module 3 and the control module.

[0048] Optionally, when the control module controls the current direction of the circuit containing TEC module 3 to be in the first current direction, the first heat exchange end of TEC module 3 is the cold end, and the second heat exchange end is the hot end. When the control module controls the current direction of the circuit containing TEC module 3 to be opposite to the first current direction, the first heat exchange end of TEC module 3 is the hot end, and the second heat exchange end is the cold end. Thus, TEC module 3 alone can achieve rapid heat dissipation and heating of chip 5, resulting in low temperature control cost for chip 5.

[0049] For example, when the outdoor temperature is high, the control module controls the current direction of the TEC module 3 to a first current direction, so that the TEC module 3 is in a first working state. When the TEC module 3 is in the first working state, the first heat exchange end is the cold end and the second heat exchange end is the hot end. The heat generated by the chip 5 during operation is transferred to the first heat exchange end, and the heat generated by the second heat exchange end of the TEC module 3 is transferred to the liquid cooling plate 2.

[0050] For example, when the outdoor temperature is low, chip 5 cannot work properly. The control module controls the current direction of TEC module 3 to a second current direction opposite to the first current direction, putting TEC module 3 into a second working state. In the second working state, the first heat exchange end is the hot end and the second heat exchange end is the cold end. The temperature of the liquid cooling plate 2 is higher than the temperature of the second heat exchange end. The heat from the liquid cooling plate 2 is transferred to the second heat exchange end, and the heat generated at the first heat exchange end is transferred to chip 5. Chip 5 absorbs heat to raise its temperature to the set temperature range, ensuring that chip 5 works normally.

[0051] TEC module 3 can be a single-level TEC or a multi-level TEC. A multi-level TEC is a device formed by stacking multiple single-level TECs.

[0052] In some embodiments, the mounting bracket 6 is connected to the liquid cooling plate 2 via a threaded fitting, and a portion of the TEC module 3 is sandwiched between the head of the threaded fitting and the mounting bracket 6.

[0053] This makes the connection between the mounting bracket 6 and the liquid cooling plate 2 convenient and reliable. At the same time, by clamping a part of the TEC module 3 between the head of the threaded part and the mounting bracket 6, the relative fixation of the TEC module 3 and the mounting bracket 6 in the thickness direction of the circuit board 4 is effectively improved. The positional reliability of the TEC module 3 relative to the chip 5 and the liquid cooling plate 2 is high, thereby effectively ensuring that the heat exchange contact between each of the circuit board 4 and the chip 5 and the TEC module 3 is stable and reliable.

[0054] For example, such as Figure 7 As shown, the mounting bracket 6 has four clearance grooves on the side away from the liquid cooling plate 2 (i.e., the bottom surface of the mounting bracket 6). Each clearance groove has a mounting hole 63 on its bottom surface. The lower surface of the liquid cooling plate 2 has four threaded holes. The circumferential surface of the TEC module 3 has four lugs, each of which has an assembly hole. The four lugs are respectively fitted into the four clearance grooves. The threaded parts are bolts. The bolts pass through the assembly holes and mounting holes 63 and are threadedly connected to the corresponding threaded holes to realize the installation of the TEC module 3 on the mounting bracket 6 and the installation of the mounting bracket 6 on the liquid cooling plate 2.

[0055] It should be noted that, such as Figure 3 As shown, the liquid cooling plate 2 includes a bottom plate and a top plate. The bottom plate is a flat plate, and a portion of the top plate is recessed upwards to form a groove with the opening facing upwards. After the bottom plate and the top plate are connected, the bottom plate closes the opening of the groove, so that the space where the groove is located forms a liquid cooling channel. The limiting groove 21 is provided on the bottom surface of the bottom plate, and the mounting bracket 6 is connected to the bottom plate by bolts.

[0056] In some embodiments, the circuit board 4 is further provided with a plurality of heating elements on the side facing the liquid cooling plate 2. The vehicle controller also includes a heat-conducting element 7, which is disposed on the side of the liquid cooling plate 2 facing the circuit board 4 and has heat exchange contact with at least one heating element.

[0057] In other words, the liquid cooling plate 2 also exchanges heat with the heat-generating components on the circuit board 4 through the heat-conducting component 7, effectively ensuring that the heat-generating components are within the set temperature range, thereby ensuring that the heat-generating components have normal working performance. Moreover, the heat-conducting component 7 does not heat up rapidly due to high computing power operations, unlike the chip 5. The liquid cooling method can ensure its reliable working performance, which effectively reduces the temperature control cost compared to temperature regulation through the TEC module 3.

[0058] For example, such as Figure 5 As shown, there are multiple heat-conducting components 7, each corresponding to a heat-generating component. In this case, the heat-conducting components 7 are discretely arranged on the bottom surface of the liquid cooling plate 2, thereby ensuring the temperature control efficiency of each heat-generating component while also effectively reducing the total volume and weight of the heat-conducting components 7, resulting in a lower cost for the vehicle controller.

[0059] It should be noted that the heat-conducting component 7 can be a rigid metal component or a flexible component. The heat-conducting component 7 can be bonded to the liquid cooling plate 2 or connected to the liquid cooling plate 2 via threaded components. The heat-generating component can be an electronic device such as a capacitor, resistor, transistor, or relay.

[0060] In some embodiments, the housing 1 includes a frame 11 and a cover plate 12, the cover plate 12 being connected to the frame 11 to define a receiving cavity, the liquid cooling plate 2 being located in the receiving cavity and connected to the frame 11, and the circuit board 4 and the TEC module 3 being disposed on the side of the liquid cooling plate 2 facing the cover plate 12.

[0061] In other words, the liquid cooling plate 2 is hidden within the cavity formed by the housing 1, thereby isolating the liquid cooling plate 2 from the outside environment and effectively preventing heat exchange between the liquid cooling plate 2 and the external environment, which would affect its temperature control efficiency for the TEC module 3. Moreover, this design also effectively prevents the liquid cooling plate 2 from being damaged by external impacts, thus extending the service life of the vehicle controller's heat dissipation components.

[0062] For example, such as Figure 2 and Figure 3 As shown, the liquid cooling plate 2 is connected to the frame 11 via threaded fittings. The frame 11 has an opening at its lower end, which is closed by the cover plate 12. The liquid cooling plate 2 divides the receiving cavity into an upper chamber and a lower chamber, with the lower chamber serving as the mounting cavity. The upper chamber can also accommodate other electrical components, which then exchange heat with the liquid cooling plate 2. Furthermore, the cover plate 12 and the circuit board 4 are connected to the liquid cooling plate 2 via bolts for reliable fixation at the lower opening of the frame 11.

[0063] It should be noted that the cover plate 12 is a metal plate, and the circuit board 4 can also exchange heat with the outside through the cover plate 12 to further ensure the heat exchange efficiency of the chip 5 and the heat-generating components on the circuit board 4.

[0064] In some embodiments, the housing 1 further includes a sealing ring sandwiched between the frame 11 and the cover plate 12.

[0065] This effectively ensures the sealing and waterproofing of the connection between the frame 11 and the cover plate 12, making it less likely for external dust and water to enter the installation cavity. It also effectively prevents dust from adhering to the outer surface of electrical components and prevents condensation and water mist formation inside the installation cavity, thereby effectively ensuring the service life of each electrical component inside the installation cavity.

[0066] In some embodiments, the vehicle controller further includes a first connector 8 and a second connector 9, both of which are connected to the liquid cooling plate 2. The liquid cooling plate 2 is provided with a liquid cooling channel, and the two ends of the liquid cooling channel are respectively connected to the first connector 8 and the second connector 9. Both the first connector 8 and the second connector 9 are partially exposed outside the housing 1.

[0067] The vehicle controller is connected to the vehicle's liquid cooling system via the first connector 8 and the second connector 9, so that the coolant in the liquid cooling system can circulate in the liquid cooling channel in the liquid cooling plate 2, so as to exchange heat with the TEC module 3 and realize the temperature control regulation of the TEC module 3.

[0068] For example, such as Figure 1 and Figure 2 As shown, the first connector 8 and the second connector 9 are located on the same side of the frame 11 and are spaced apart along the width direction of the liquid cooling plate 2. Corresponding through holes are provided on the side wall of the frame 11 for the first connector 8 and the second connector 9 to extend out.

[0069] The vehicle according to the embodiments of the present invention includes an on-board controller as described in any of the above embodiments.

[0070] The technical advantages of the vehicle according to this utility model embodiment are the same as those of the vehicle controller in the above embodiment, and will not be repeated here.

[0071] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0072] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0073] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0074] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0075] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0076] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A vehicle-mounted controller, characterized in that, include: A housing (1) and a liquid cooling plate (2), wherein the liquid cooling plate (2) is connected to the housing (1), and the liquid cooling plate (2) and the housing (1) define an installation cavity; Circuit board (4), the circuit board (4) is mounted in the mounting cavity, and the side of the circuit board (4) facing the liquid cooling plate (2) is provided with chip (5); The TEC module (3) is disposed between the chip (5) and the liquid cooling plate (2) and has a first heat exchange end and a second heat exchange end. The first heat exchange end is in heat exchange contact with the chip (5) and the second heat exchange end is in heat exchange contact with the liquid cooling plate (2).

2. The vehicle controller according to claim 1, characterized in that, The vehicle controller includes a mounting bracket (6), which is disposed on the side of the liquid cooling plate (2) facing the circuit board (4). The mounting bracket (6) has a limiting hole (61) that extends through the mounting bracket (6) along the thickness direction of the circuit board (4). A portion of the TEC module (3) is disposed in the limiting hole (61).

3. The vehicle controller according to claim 1 or 2, characterized in that, The liquid cooling plate (2) has a limiting groove (21) on the side facing the TEC module (3), and a part of the TEC module (3) is disposed in the limiting groove (21).

4. The vehicle controller according to claim 2, characterized in that, The vehicle controller also includes electrode leads, a control module and a charging connector. The control module is electrically connected to the charging connector and to the TEC module (3) through the electrode leads. The control module is used to switch the current direction of the circuit in which the TEC module (3) is located.

5. The vehicle controller according to claim 4, characterized in that, When the control module controls the current direction of the circuit where the TEC module (3) is located to be the first current direction, the first heat exchange end of the TEC module (3) is the cold end and the second heat exchange end is the hot end; When the control module controls the current direction of the circuit where the TEC module (3) is located to be opposite to the first current direction, the first heat exchange end of the TEC module (3) is the hot end and the second heat exchange end is the cold end.

6. The vehicle controller according to claim 2, characterized in that, The mounting bracket (6) is connected to the liquid cooling plate (2) via a threaded component, and a portion of the TEC module (3) is sandwiched between the head of the threaded component and the mounting bracket (6).

7. The vehicle controller according to claim 1, characterized in that, The circuit board (4) is also provided with multiple heating elements on the side facing the liquid cooling plate (2); The vehicle controller further includes a heat-conducting component (7), which is disposed on the side of the liquid cooling plate (2) facing the circuit board (4) and has heat exchange contact with at least one of the heat-generating components.

8. The vehicle controller according to claim 1, characterized in that, The housing (1) includes a frame (11) and a cover plate (12), the cover plate (12) being connected to the frame (11) to define a receiving cavity, the liquid cooling plate (2) being located in the receiving cavity and connected to the frame (11), and the circuit board (4) and the TEC module (3) being disposed on the side of the liquid cooling plate (2) facing the cover plate (12).

9. The vehicle controller according to claim 8, characterized in that, The housing (1) also includes a sealing ring sandwiched between the frame (11) and the cover plate (12).

10. The vehicle controller according to claim 1, characterized in that, The vehicle controller also includes a first connector (8) and a second connector (9), both of which are connected to the liquid cooling plate (2). The liquid cooling plate (2) is provided with a liquid cooling channel, and the two ends of the liquid cooling channel are respectively connected to the first connector (8) and the second connector (9). Both the first connector (8) and the second connector (9) are partially exposed outside the housing (1).

11. A vehicle, characterized in that, Including the vehicle controller according to any one of claims 1-10.

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