A backlight light source with high heat dissipation

Abstract

The utility model relates to a kind of high-efficiency heat-dissipating backlight light source, comprising: substrate layer, with first surface and second surface opposite to each other;First conductive layer, including several welding units, several welding units are arranged on the first surface, the welding unit includes the soldering pad for welding light emitting part, at least one side of the soldering pad extends along the first surface and forms heat dissipation part;And second conductive layer, including several heat dissipation units, several heat dissipation units are arranged on the second surface, the projection of the heat dissipation unit and the welding unit in the thickness direction of the substrate layer is opposite.The utility model is reasonable in structure, can improve heat dissipation efficiency, prolong the service life of backlight light source, guarantee the use performance of backlight module.

Description

Technical Field

[0001] This utility model relates to the field of backlighting, and more specifically, to a backlight source with high-efficiency heat dissipation. Background Technology

[0002] The backlight source is a crucial component of the backlight module, providing the light for display. Commercially available backlight sources typically utilize flexible printed circuit boards (PCBs) with multiple LEDs soldered onto them. When the backlight source operates, these LEDs generate significant heat. Conventional backlight sources have low heat dissipation efficiency, easily causing the internal temperature of the backlight module to rise, thus affecting its normal operation. Utility Model Content

[0003] The purpose of this invention is to provide a backlight source with high-efficiency heat dissipation. Its structure is reasonable, which can improve heat dissipation efficiency, extend the service life of the backlight source, and ensure the performance of the backlight module.

[0004] A high-efficiency heat dissipation backlight source includes: a substrate layer having a first surface and a second surface facing away from each other; a first conductive layer including a plurality of welding units arranged on the first surface, the welding units including pads for welding light-emitting elements, at least one side of the pads extending along the first surface to form a heat dissipation portion; and a second conductive layer including a plurality of heat dissipation units arranged on the second surface, the heat dissipation units being opposite to the projections of the welding units in the thickness direction of the substrate layer.

[0005] In the above technical solution, the welding unit extends outward from at least one side of the pad to form a heat dissipation section, which can form a heat dissipation surface on the outer periphery of the pad. When the light-emitting element is welded to the pad, the heat generated during its operation can be transferred to the heat dissipation section and dissipated outward more quickly through the heat dissipation section, thereby improving the heat dissipation efficiency. The second surface is provided with a heat dissipation unit, and the projection of the heat dissipation unit and the welding unit in the thickness direction of the substrate layer are opposite. The heat of the light-emitting element can be transferred from the first surface to the second surface and dissipated outward from the second surface through the heat dissipation unit, further improving the heat dissipation efficiency.

[0006] Furthermore, the welding unit has at least one through hole penetrating the substrate layer on its inner side, and the inner circumferential surface of the through hole is covered with conductive metal for connecting the welding unit and the corresponding heat dissipation unit.

[0007] In the above technical solution, by setting vias, the heat transfer between the welding unit and the heat dissipation unit can be accelerated, thereby improving heat dissipation efficiency.

[0008] Furthermore, the first conductive layer and / or the second conductive layer are provided with conductive lines.

[0009] In the above technical solution, the conductive circuit can conduct multiple welding units, realizing the electrical connection between the light-emitting components.

[0010] Furthermore, one side of the substrate layer extends outward to form a connection portion, and the conductive line extends to the connection portion.

[0011] In the above technical solution, the connecting part can realize the electrical connection between the backlight source and the external device, thereby realizing the power supply and control of the backlight source.

[0012] Furthermore, the heat dissipation portion is located near the edge of the substrate layer.

[0013] In the above technical solution, placing the heat dissipation part close to the edge of the substrate layer can maximize the area of ​​the heat dissipation part, thereby improving the heat dissipation efficiency.

[0014] Furthermore, a first solder resist layer is provided on the side of the first conductive layer opposite to the substrate layer, and the first solder resist layer has a window for exposing the solder pad.

[0015] In the above technical solution, the first solder resist layer can achieve insulation against the first conductor. By setting a window in the first solder resist layer, the solder pad can be exposed so as to solder the light-emitting component.

[0016] Furthermore, a second solder resist layer is provided on the side of the second conductive layer opposite to the substrate layer.

[0017] In the above technical solution, the second solder resist layer can achieve insulation of the second conductive layer, and at the same time play a role in protecting the second conductive layer.

[0018] Furthermore, both the first conductive layer and the second conductive layer are conductive metals.

[0019] In the above technical solution, conductive metal can realize electrical connection between components, and at the same time has high thermal conductivity, which can accelerate the transfer and dissipation of heat.

[0020] Furthermore, the light-emitting element is an LED lamp bead.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows: the welding unit extends outward from at least one side of the pad to form a heat dissipation part, which can form a heat dissipation surface on the outer periphery of the pad. When the light-emitting element is welded to the pad, the heat generated during its operation can be transferred to the heat dissipation part and dissipated outward through the heat dissipation part, thereby improving the heat dissipation efficiency. The second surface is provided with a heat dissipation unit, and the projection of the heat dissipation unit and the welding unit in the thickness direction of the substrate layer are opposite. The heat of the light-emitting element can be transferred from the first surface to the second surface and dissipated outward from the second surface through the heat dissipation unit, further improving the heat dissipation efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the first surface in an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the welding unit in an embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of the structure of the second surface in an embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of the heat dissipation unit according to an embodiment of the present invention.

[0026] Figure 5 This is a schematic diagram of the structure of the first solder resist layer in an embodiment of the present invention.

[0027] Figure 6 This is a schematic diagram of the structure of the second solder resist layer in an embodiment of the present invention.

[0028] Explanation of icon numbers:

[0029] Substrate layer 1, first surface 11, second surface 12, first conductive layer 2, welding unit 21, solder pad 211, heat dissipation part 212, second conductive layer 3, heat dissipation unit 31, via 4, conductive line 5, connection part 6, first solder resist layer 7, window 71, second solder resist layer 8. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] Please refer to Figures 1 to 5In a preferred embodiment, the high-efficiency heat dissipation backlight source of this invention mainly includes a substrate layer 1, a first conductive layer 2, and a second conductive layer 3. The substrate layer 1 has a first surface 11 and a second surface 12 facing each other. The first conductive layer 2 includes a plurality of welding units 21 arranged on the first surface 11. Each welding unit 21 includes a pad 211 for welding light-emitting elements, and at least one side of the pad 211 extends along the first surface 11 to form a heat dissipation portion 212. The second conductive layer 3 includes a plurality of heat dissipation units 31 arranged on the second surface 12, with the projections of the heat dissipation units 31 and the welding units 21 opposite each other in the thickness direction of the substrate layer 1.

[0033] For example, the substrate layer 1 can be made of existing flexible printed circuit board substrates, such as polyimide or polyester film. The first conductive layer 2 and the second conductive layer 3 are both made of conductive metal; for example, the first conductive layer 2 and the second conductive layer 3 can be electrodeposited or plated copper foil, thereby achieving electrical connection between the light-emitting components. Furthermore, the metal has high thermal conductivity, which is beneficial for heat dissipation. The soldering unit 21 is formed in a rectangular shape. In this embodiment, the soldering units 21 are spaced apart along the length direction of the substrate layer 1. The solder pads 211 are located inside the soldering units 21. The heat dissipation area extends outward from at least one of the solder pads 211 along the first surface 11. For example, when there is a blank area between one side of the solder pad 211 and the edge of the substrate layer 1, the heat dissipation area can extend from that side to near the edge of the substrate layer 1, thereby forming a planar area for heat dissipation.

[0034] As can be seen from the above technical solution, the welding unit 21 extends outward from at least one side of the pad 211 to form a heat dissipation part 212, which can form a heat dissipation surface on the outer periphery of the pad 211. When the light-emitting element is welded to the pad 211, the heat generated during its operation can be transferred to the heat dissipation part 212 and dissipated outward through the heat dissipation part 212, thereby improving the heat dissipation efficiency. The second surface 12 is provided with a heat dissipation unit 31, which is opposite to the projection of the welding unit 21 in the thickness direction of the substrate layer 1. The heat of the light-emitting element can be transferred from the first surface 11 to the second surface 12 and dissipated outward from the second surface 12 through the heat dissipation unit 31, further improving the heat dissipation efficiency.

[0035] In this embodiment, at least one via 4 is provided on the inner side of the welding unit 21, and the inner peripheral surface of the via 4 is covered with conductive metal for conducting the welding unit 21 and the corresponding heat dissipation unit 31. It should be noted that the via 4 can be a via 4 commonly used in flexible printed circuit boards for conducting the connection between two sides. By setting the via 4, the heat transfer between the welding unit 21 and the heat dissipation unit 31 can be accelerated, thereby improving the heat dissipation efficiency.

[0036] The first conductive layer 2 and / or the second conductive layer 3 are provided with conductive lines 5. The conductive lines 5 can conduct multiple welding units 21 to realize electrical connection between light-emitting components. The conductive lines 5 can be set according to actual needs. In this embodiment, the conductive lines 5 are provided on the second surface 12 and extend along the edge close to the substrate layer 1. The heat dissipation unit 31 is configured to be connected to the conductive lines 5 or independent of the conductive lines 5.

[0037] A connecting portion 6 is formed by extending outward from one side of the substrate layer 1, and conductive lines extend to the connecting portion 6. The connecting portion 6 enables electrical connection between the backlight source and external devices, thereby enabling power supply and control of the backlight source.

[0038] In a preferred embodiment, the heat dissipation portion 212 is located near the edge of the substrate layer 1. By placing the heat dissipation portion 212 near the edge of the substrate layer 1, the area of ​​the heat dissipation portion 212 can be increased as much as possible, thereby improving the heat dissipation efficiency.

[0039] A first solder resist layer 7 is provided on the side of the first conductive layer 2 facing away from the substrate layer 1. The first solder resist layer 7 has an opening 71 for exposing the solder pad 211. The first solder resist layer 7 can be made of existing solder resist materials, which can achieve insulation of the first conductive layer. By providing the opening 71 in the first solder resist layer 7, the solder pad 211 can be exposed so as to solder the light-emitting component.

[0040] A second solder resist layer 8 is provided on the side of the second conductive layer 3 facing away from the substrate layer 1. The second solder resist layer 8 can be made of existing solder resist materials, which can achieve insulation of the second conductive layer and at the same time protect the second conductive layer 3.

[0041] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation backlight source, characterized in that, include: The substrate layer has a first surface and a second surface that are opposite to each other; The first conductive layer includes a plurality of welding units, which are arranged on the first surface. Each welding unit includes a pad for welding a light-emitting element, and at least one side of the pad extends along the first surface to form a heat dissipation portion. as well as The second conductive layer includes a plurality of heat dissipation units, which are arranged on the second surface. The heat dissipation units and the welding units are opposite to each other in the thickness direction of the substrate layer.

2. The high-efficiency heat dissipation backlight source according to claim 1, characterized in that, The welding unit has at least one through hole penetrating the substrate layer on its inner side, and the inner circumferential surface of the through hole is covered with conductive metal for connecting the welding unit and the corresponding heat dissipation unit.

3. The high-efficiency heat dissipation backlight source according to claim 1, characterized in that, The first conductive layer and / or the second conductive layer are provided with conductive lines.

4. The high-efficiency heat dissipation backlight source according to claim 3, characterized in that, One side of the substrate layer extends outward to form a connection portion, and the conductive line extends to the connection portion.

5. The high-efficiency heat dissipation backlight source according to claim 1, characterized in that, The heat dissipation section is located near the edge of the substrate layer.

6. The high-efficiency heat dissipation backlight source according to claim 1, characterized in that, The first conductive layer has a first solder resist layer on the side opposite to the substrate layer, and the first solder resist layer has a window for exposing the solder pad.

7. The high-efficiency heat dissipation backlight source according to claim 1, characterized in that, A second solder resist layer is provided on the side of the second conductive layer that is opposite to the substrate layer.

8. The high-efficiency heat dissipation backlight source according to any one of claims 1 to 7, characterized in that, Both the first conductive layer and the second conductive layer are conductive metals.

9. The high-efficiency heat dissipation backlight source according to any one of claims 1 to 7, characterized in that, The light-emitting element is an LED lamp bead.

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