server

Abstract

The application provides a server, which comprises a frame, a connecting part and a heat dissipation system. A cable channel extending to a side edge is defined in the frame, and the cable channel is used for accommodating a cable. The connecting part is arranged outside the frame and connected to an outer end of the cable channel. The connecting part is used for electrically connecting with the cable and electrically connecting with an external power supply. The heat dissipation system is in heat conduction connection with the cable channel, so as to dissipate heat of the cable. The server of the application can dissipate heat of the cable channel, so that the diameter of the cable can be reduced, the occupied area of the cable channel in the frame can be reduced, and more space can be released to optimize the layout of a mainboard.

Description

Technical Field

[0001] This application relates to server heat dissipation technology, and more particularly to a server. Background Technology

[0002] Existing server technology has a power connection method that introduces external power to the back stage of the chassis through a duckbill connector to power other modules. The middle area of ​​the chassis needs to reserve a cable channel to accommodate the cable and the duckbill connector.

[0003] As server rack power supplies consume increasingly more power, and the number and density of modules within servers increase, the cable channels of duckbill connectors are enlarging. This increased size significantly impacts motherboard layout, necessitating improvements. Utility Model Content

[0004] This application provides a server that can dissipate heat from the cable channels, thereby reducing the cable diameter, reducing the area occupied by the cable channels within the chassis, and freeing up more space to optimize the motherboard layout.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] This application provides a server, including: a chassis, within which a cable channel extending to one side edge is defined, the cable channel being used to accommodate cables; a connector, disposed outside the chassis and connected to the outer end of the cable channel, the connector being used for electrical connection with the cables and for electrical connection with an external power source; and a heat dissipation system, thermally connected to the cable channel to dissipate heat from the cables.

[0007] As an optional implementation, the heat dissipation system has a first cold water pipe and a first return water pipe, with the first cold water pipe, the cable channel, and the first return water pipe connected in sequence; the heat dissipation system is configured to: promote the formation of a heat exchange medium that enters the cable channel through the first cold water pipe and exits the cable channel through the first return water pipe, so as to dissipate heat from the cable.

[0008] As an optional implementation, the heat dissipation system has a first cold water pipe, a first liquid cooling section, and a first return water pipe. The first liquid cooling section is disposed in the cable channel and is thermally connected to the cable. The first cold water pipe, the first liquid cooling section, and the first return water pipe are connected in sequence. The heat dissipation system is configured to facilitate the formation of a heat exchange medium that enters the first liquid cooling section through the first cold water pipe and exits the first liquid cooling section through the first return water pipe, so as to dissipate heat from the cable.

[0009] As an optional implementation, the server further includes: a motherboard disposed inside the chassis; a second liquid cooling unit disposed inside the chassis and thermally connected to the motherboard to dissipate heat from the motherboard; the cooling system further includes a second cold water pipe and a second return water pipe, the second cold water pipe, the second liquid cooling unit, and the second return water pipe being connected in sequence; the cooling system is configured to facilitate the formation of a heat exchange medium that enters the second liquid cooling unit through the second cold water pipe and exits the second liquid cooling unit through the second return water pipe to dissipate heat from the motherboard.

[0010] As an optional implementation, the first cold water pipe is connected to the second cold water pipe; and the first return water pipe is connected to the second return water pipe.

[0011] As an optional implementation, the heat dissipation system further includes: a cooling distribution unit, which is connected to the second cold water pipe and the second return water pipe respectively, for controlling the flow rate of the heat exchange medium; and a cooling unit, which is connected to the cooling distribution unit, for receiving the heat exchange medium after heat absorption from the cooling distribution unit, cooling the heat exchange medium, and discharging it to the cooling distribution unit.

[0012] As an optional implementation, the inner diameter of the first cold water pipe is smaller than the inner diameter of the second cold water pipe; the inner diameter of the first return water pipe is smaller than the inner diameter of the second return water pipe.

[0013] As an optional implementation, the connecting part is located in the transverse center of the frame; the first cold water pipe and the first return water pipe are located on the transverse sides of the connecting part, respectively.

[0014] As an optional implementation, the first cold water pipe and the second cold water pipe are connected by a connector; the first return water pipe and the second return water pipe are connected by a connector.

[0015] As an optional implementation, the connecting part is a duckbill connector.

[0016] The server described in this application incorporates a heat dissipation system at the cable channel. This system effectively dissipates heat from the cables within the cable channel, resulting in superior heat dissipation performance. Consequently, the heat dissipation requirements for the cables themselves can be reduced during the design phase, allowing for a smaller cable diameter, a smaller cross-sectional area of ​​the cable channel, and a smaller footprint within the chassis. This frees up more space to optimize the motherboard layout. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the server structure provided in the embodiments of this application. Figure 1 ;

[0019] Figure 2 A schematic diagram of the server structure provided in the embodiments of this application. Figure 2 ;

[0020] Figure 3 Schematic diagram of the heat dissipation system provided in the embodiments of this application Figure 1 ;

[0021] Figure 4 Schematic diagram of the heat dissipation system provided in the embodiments of this application Figure 2 .

[0022] Explanation of reference numerals in the attached figures:

[0023] 100. Frame; 110. Housing space; 120. Cable channel; 200. Connector; 310. First cold water pipe; 320. First return water pipe; 330. First liquid cooling unit; 340. Second liquid cooling unit; 350. Second cold water pipe; 360. Second return water pipe; 370. Connector; 400. Main board; 500. Cooling distribution unit; 510. First cold water outlet; 520. Second cold water outlet; 530. Return water inlet; 540. Cold water outlet; 600. Cooling unit. Detailed Implementation

[0024] Existing server technology uses duckbill connectors to bring external power to the rear stage of the chassis to power other modules. The middle area of ​​the chassis needs to reserve cable channels to accommodate these cables and the duckbill connectors. As the power consumption of server racks increases and the number and density of modules within servers rise, the cable channels of the duckbill connectors become larger, significantly impacting motherboard layout.

[0025] To overcome the shortcomings of the prior art, this application provides a server that introduces a heat dissipation system at the cable channel. The heat dissipation system can dissipate heat from the cables in the cable channel, thus giving the cable channel better heat dissipation performance. Therefore, the heat dissipation requirements of the cables themselves can be reduced during the design process, the cable diameter can be reduced, the cross-sectional area of ​​the cable channel can be reduced, and the area occupied by the cable channel in the chassis can be reduced, freeing up more space to optimize the motherboard layout.

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] See Figure 1 and Figure 2 This application provides a server, which includes a chassis 100 and a connection section 200. The server chassis 100 serves as a shell, protecting the various components inside. The chassis 100 has an internal accommodating space 110, which can accommodate functional units, such as a motherboard 400, various power modules, and various heat dissipation structures.

[0028] In some embodiments, a cable channel 120 extending to one side edge is defined within the frame 100 for accommodating cables. A connector 200 is disposed outside the frame 100 and connected to the outer end of the cable channel 120. The connector 200 is used for electrical connection with the cable and for electrical connection with an external power source.

[0029] The connection part 200 is positioned at the rear of the frame 100. The cable channel 120 is located within the receiving space 110 of the frame 100 and extends in the front-to-back direction. The rear end of the cable channel 120 is located at the rear edge of the frame 100, and the front end is located inside the receiving space 110. The connection part 200 is located outside the frame 100 and connected to the rear end of the cable channel 120. The connection part 200 is electrically connected to the cable within the cable channel 120. Cables are arranged from front to back within the cable channel 120. Each power module is located at the front end of the cable channel 120, and each power module is electrically connected to the cable. Thus, when the connection part 200 is plugged into an external power source, it can lead the external power source through the cable within the cable channel 120 to each power unit, supplying power to each power unit.

[0030] In some embodiments, the server may further include a heat dissipation system that is thermally connected to the cable channel 120 to dissipate heat from the cables.

[0031] In this embodiment, a heat dissipation system is introduced into the server at the cable channel 120, which can dissipate heat from the cables in the cable channel 120. In other words, the cable channel 120 has better heat dissipation performance, thus reducing the heat dissipation requirements on the cables themselves during the design phase. Compared to the case without a heat dissipation system, thinner cables can be selected for conductivity, which can further reduce the cross-sectional area of ​​the cable channel 120, reducing the area occupied by the cable channel 120 within the chassis 100 and freeing up more space to optimize the motherboard 400 layout.

[0032] In some exemplary embodiments, when the power consumption of a single cabinet is 12KW and the voltage of the connection part 200 is 48V, its current carrying capacity is calculated to be 250A. Referring to the current carrying capacity standard of copper wire cables, 70mm² is required, and a total of 140mm² is required at both ends. After the inventors introduced a heat dissipation system through the cable channel 120, the area of ​​the copper wire cable can be reduced to 80mm², thus reducing the area of ​​the cable channel 120 by 42%, significantly improving the layout space of the motherboard 400.

[0033] See Figure 1 In some optional embodiments, the heat dissipation system has a first cold water pipe 310 and a first return water pipe 320, with the first cold water pipe 310, cable channel 120, and first return water pipe 320 connected in sequence. The heat dissipation system is configured to cause a heat exchange medium to be formed, which enters the cable channel 120 through the first cold water pipe 310 and exits the cable channel 120 through the first return water pipe 320, in order to dissipate heat from the cable.

[0034] In this embodiment, the cable channel 120 can be sealed. A first cold water pipe 310 is connected to the cable channel 120, and a first return water pipe 320 is also connected to the cable channel 120. This allows the heat exchange medium to enter the cable channel 120 through the first cold water pipe 310, filling the cable channel 120 with the heat exchange medium. The cable is immersed in the heat exchange medium within the cable channel 120, transferring heat from the cable to the heat exchange medium through convection and conduction. After absorbing heat, the heat exchange medium can be discharged from the cable channel 120 through the first return water pipe 320 to carry away the heat and form a circulation.

[0035] In this embodiment, the first cold water pipe 310 fills the heat exchange medium into the sealed cable channel 120, which allows the cable to be completely immersed in the heat exchange medium in the cable channel 120. This method can achieve comprehensive and efficient heat exchange between the heat exchange medium and the cable, which is conducive to reducing the cable diameter, thereby reducing the volume of the cable channel 120 and optimizing the layout of the motherboard 400.

[0036] See Figure 2In some optional embodiments, the heat dissipation system includes a first cold water pipe 310, a first liquid cooling section 330, and a first return water pipe 320. The first liquid cooling section 330 is disposed in the cable channel 120 and is thermally connected to the cable. The first cold water pipe 310, the first liquid cooling section 330, and the first return water pipe 320 are connected sequentially. The heat dissipation system is configured to facilitate the formation of a heat exchange medium that enters the first liquid cooling section 330 through the first cold water pipe 310 and exits the first liquid cooling section 330 through the first return water pipe 320, thereby dissipating heat from the cable.

[0037] In this embodiment, the cable channel 120 may not be sealed. The first liquid cooling section 330 is equivalent to a heat exchanger, which can be disposed in the cable channel 120 and thermally connected to the cable, for example, by attaching the cable to the first liquid cooling section 330 so that the heat on the cable can be transferred to the first liquid cooling section 330.

[0038] The first cold water pipe 310 is connected to the first liquid cooling section 330, and the first return water pipe 320 is also connected to the first liquid cooling section 330. In this way, the heat exchange medium can enter the first liquid cooling section 330 through the first cold water pipe 310, and absorb heat from the first liquid cooling section 330 through convection heat transfer, carrying away the heat absorbed from the cables. The heat exchange medium, after absorbing heat, can be discharged from the first liquid cooling section 330 through the first return water pipe 320 to carry away the heat and form a circulation.

[0039] In this embodiment, the first cold water pipe 310, the first liquid cooling section 330, and the first return water pipe 320 constitute a heat exchange medium flow loop. Since this method eliminates the need for sealing the cable channel 120, it has lower sealing requirements for the cable channel 120 and lower production requirements compared to the immersion method.

[0040] See Figure 1 and Figure 2 In some embodiments, the server may further include a motherboard 400 and a second liquid cooling unit 340. The motherboard 400 is disposed inside the chassis 100. The second liquid cooling unit 340 is disposed inside the chassis 100 and is thermally connected to the motherboard 400 to dissipate heat from the motherboard 400. The cooling system also includes a second cold water pipe 350 and a second return water pipe 360, which are sequentially connected. The cooling system is configured to facilitate the formation of a heat exchange medium that enters the second liquid cooling unit 340 through the second cold water pipe 350 and exits the second liquid cooling unit 340 through the second return water pipe 360 ​​to dissipate heat from the motherboard 400.

[0041] Continuing with the connection part 200 positioned at the rear of the chassis 100 as the reference orientation, the motherboard 400 is located within the receiving space 110 of the chassis 100, and the motherboard 400 is located on the side closer to the connection part 200. Each power supply unit can be located on the side of the motherboard 400 away from the connection part 200, and the cable channel 120 can be located on the motherboard 400, that is, the cable channel 120 passes through the motherboard 400 to connect to each power supply unit on the front side.

[0042] In this embodiment, a second liquid cooling section 340 is provided on the motherboard 400, which can be considered a heat exchanger. The second liquid cooling section 340 is disposed within the frame 100 and can be closely attached to the motherboard 400 to achieve thermal conductivity connection. A second cold water pipe 350 is connected to the second liquid cooling section 340, and a second return water pipe 360 ​​is also connected to the second liquid cooling section 340. Thus, the heat exchange medium can enter the second liquid cooling section 340 through the second cold water pipe 350, and absorb heat from the second liquid cooling section 340 through convection heat transfer. After absorbing heat, the heat exchange medium can be discharged from the second liquid cooling section 340 through the second return water pipe 360 ​​to carry away the heat from the motherboard 400 and form a circulation.

[0043] See Figure 3 In some embodiments, the heat dissipation system may further include a cooling distribution unit (CDU). The cooling distribution unit 500 is a thermal management device based on liquid cooling technology, whose core task is to transfer heat to the cooling medium and then dissipate the heat through the cooling system.

[0044] In some alternative embodiments, the cooling distribution unit 500 has a power pump inside and has a first cold water outlet 510, a second cold water outlet 520 and a return water inlet 530. The first cold water outlet is connected to the first cold water pipe 310, the second cold water outlet 520 is connected to the second cold water pipe 350, and the return water inlet 530 is connected to the first return water pipe 320 and the second return water pipe 360.

[0045] Driven by the power pump, the low-temperature heat exchange medium can be distributed as needed through the first cold water pipe 310 and the second cold water pipe 350 to the cable channel 120, the first liquid cooling section 330, and the motherboard 400, respectively, to meet the heat dissipation requirements of the cable channel 120 and the motherboard 400. After absorbing heat, the first return water pipe 320 and the second return water pipe 360 ​​respectively guide the heat-absorbing heat exchange medium through the return water port 530 into the cooling distribution unit 500, so as to realize the recovery of the high-temperature heat exchange medium and form a cycle.

[0046] The cooling distribution unit 500 can also adjust the heat dissipation capacity of the heat exchange medium on the cable channel 120 and the motherboard 400. In some alternative embodiments, the cooling distribution unit 500 can be regulated by controlling the flow valves installed on the first cold water pipe 310 and the second cold water pipe 350.

[0047] Furthermore, the heat dissipation system may also include a cooling unit 600, which is connected to the cooling distribution unit 500 to receive the heat exchange medium after heat absorption from the cooling distribution unit 500, cool the heat exchange medium, and discharge it to the cooling distribution unit 500.

[0048] In this embodiment, the cooling distribution unit 500 introduces the heat exchange medium that absorbs heat from the cable channel 120 and the motherboard 400 into the cooling unit 600, where heat is dissipated outwards, so that the high-temperature heat exchange medium is restored to a cooler heat exchange medium and circulates for heat dissipation.

[0049] Optionally, the cooling unit 600 can employ various heat dissipation methods, such as forced air cooling, natural cooling, or water cooling. This application does not impose any particular limitation on these methods.

[0050] See Figure 1 , Figure 2 as well as Figure 4 In some embodiments, the first cold water pipe 310 is connected to the second cold water pipe 350. The first return water pipe 320 is connected to the second return water pipe 360.

[0051] In other words, the low-temperature heat exchange medium in the first cold water pipe 310 and the second cold water pipe 350 is connected, and the high-temperature heat exchange medium in the first return water pipe 320 and the second return water pipe 360 ​​is connected. During heat dissipation, the heat exchange medium can simultaneously enter the motherboard 400 and the cable channel 120 for heat dissipation.

[0052] See Figure 1 , Figure 2 as well as Figure 4 Furthermore, the cooling distribution unit 500 is connected to the second cold water pipe 350 and the second return water pipe 360 ​​respectively, for controlling the flow rate of the heat exchange medium. The cooling unit 600 is connected to the cooling distribution unit 500 to receive the heat exchange medium after heat absorption from the cooling distribution unit 500, cool the heat exchange medium, and discharge it to the cooling distribution unit 500.

[0053] See Figure 4 In this embodiment, the cooling distribution unit 500 has a cold water outlet 540 and a return water inlet 530. The cold water outlet 540 is connected to the second cold water pipe 350, and the return water inlet 530 is connected to the second return water pipe 360.

[0054] Driven by the power pump, the heat exchange medium enters the second cold water pipe 350. A portion of the heat exchange medium flows to the second liquid cooling section 340 at the motherboard 400 to absorb heat from the motherboard 400, while the other portion flows to the cable channel 120 or the first liquid cooling section 330 to absorb heat from the cable channel 120. The heat exchange medium that has absorbed heat on the motherboard 400 flows to the second return water pipe 360. The heat exchange medium that has absorbed heat at the cable channel 120 flows through the first return water pipe 320 to the second return water pipe 360. Finally, the two return water streams are discharged from the second return water pipe 360 ​​and the return water port 530 to the cooling distribution unit 500.

[0055] The cooling distribution unit 500 introduces the heat exchange medium that absorbs heat from the cable channel 120 and the motherboard 400 into the cooling unit 600, where heat is dissipated outwards, causing the high-temperature heat exchange medium to return to a cooler state and circulate for heat dissipation.

[0056] In some alternative embodiments, the inner diameter of the first cold water pipe 310 is smaller than the inner diameter of the second cold water pipe 350. The inner diameter of the first return water pipe 320 is smaller than the inner diameter of the second return water pipe 360.

[0057] In this embodiment, since the motherboard 400 has a large power consumption and high heat dissipation requirements, the first cold water pipe 310 and the second cold water pipe 350 are connected. With the first return water pipe 320 and the second return water pipe 360 ​​connected, the inner diameter of the first cold water pipe 310 is smaller than the inner diameter of the second cold water pipe 350. The smaller inner diameter of the first return water pipe 320 compared to the second return water pipe 360 ​​facilitates the rational distribution of cold water to meet the heat dissipation needs of both the motherboard 400 and the cable channel 120.

[0058] In some embodiments, the connecting portion 200 is located at the transverse center of the frame 100. The first cold water pipe 310 and the first return water pipe 320 are respectively located on both transverse sides of the connecting portion 200. This facilitates the arrangement of the inlet and return water on both sides of the cable channel 120, which is beneficial for the flow of the heat exchange medium in the cable channel 120.

[0059] In some embodiments, the first cold water pipe 310 and the second cold water pipe 350 are connected by a connector 370, and the first return water pipe 320 and the second return water pipe 360 ​​are connected by a connector 370. Typically, the original motherboard 400 has a second cold water pipe 350 and a second return water pipe 360. Therefore, this improvement only requires openings in the existing second cold water pipe 350 and second return water pipe 360, and connecting the first cold water pipe 310 and the first return water pipe 320 using the connector 370, which is simple and convenient.

[0060] In some embodiments, the connector 200 is a duckbill connector. In the latest OCP project rack specification Open RackV3, the common practice is to introduce power to the power supply units after the chassis 100 via duckbill connectors. Therefore, setting the connector 200 as a duckbill connector is to meet the specification requirements.

[0061] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0062] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0063] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0064] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of devices in use or operation other than those shown in the figures. Devices may have other orientations, and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A server, characterized in that, include: A frame, wherein a cable channel extending to one side edge is defined within the frame, the cable channel being used to accommodate cables; A connecting part is disposed outside the frame and connected to the outer end of the cable channel. The connecting part is used for electrical connection with the cable and for electrical connection with an external power source. A heat dissipation system is thermally connected to the cable channel to dissipate heat from the cable.

2. The server according to claim 1, characterized in that, The heat dissipation system has a first cold water pipe and a first return water pipe, and the first cold water pipe, the cable channel and the first return water pipe are connected in sequence. The heat dissipation system is configured to facilitate the formation of a heat exchange medium that enters the cable channel through the first cold water pipe and exits the cable channel through the first return water pipe, so as to dissipate heat from the cable.

3. The server according to claim 1, characterized in that, The heat dissipation system has a first cold water pipe, a first liquid cooling section and a first return water pipe. The first liquid cooling section is disposed in the cable channel and is thermally connected to the cable. The first cold water pipe, the first liquid cooling section and the first return water pipe are connected in sequence. The heat dissipation system is configured to facilitate the formation of a heat exchange medium that enters the first liquid cooling section through the first cold water pipe and exits the first liquid cooling section through the first return water pipe, so as to dissipate heat from the cable.

4. The server according to claim 2, characterized in that, Also includes: A motherboard, which is disposed inside the chassis; The second liquid cooling unit is disposed inside the chassis and is thermally connected to the motherboard to dissipate heat from the motherboard; The heat dissipation system also includes a second cold water pipe and a second return water pipe, wherein the second cold water pipe, the second liquid cooling section and the second return water pipe are connected in sequence. The heat dissipation system is configured to: facilitate the formation of a heat exchange medium that enters the second liquid cooling section through the second cold water pipe and exits the second liquid cooling section through the second return water pipe, so as to dissipate heat from the motherboard.

5. The server according to claim 4, characterized in that, The first cold water pipe is connected to the second cold water pipe; and, The first return water pipe is connected to the second return water pipe.

6. The server according to claim 5, characterized in that, The heat dissipation system also includes: A cooling distribution unit is connected to the second cold water pipe and the second return water pipe respectively, and is used to control the flow rate of the heat exchange medium; A cooling unit, connected to the cooling distribution unit, receives the heat exchange medium after heat absorption from the cooling distribution unit, cools the heat exchange medium, and discharges it to the cooling distribution unit.

7. The server according to claim 5, characterized in that, The inner diameter of the first cold water pipe is smaller than the inner diameter of the second cold water pipe; The inner diameter of the first return water pipe is smaller than the inner diameter of the second return water pipe.

8. The server according to claim 4, characterized in that, The connecting part is located at the transverse center of the frame; The first cold water pipe and the first return water pipe are located on the lateral sides of the connection part, respectively.

9. The server according to claim 4, characterized in that, The first cold water pipe and the second cold water pipe are connected by a connector; The first return water pipe and the second return water pipe are connected by a joint.

10. The server according to any one of claims 1 to 9, characterized in that, The connecting part is a duckbill connector.

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