Buffering fixing structure of inductance module PCB in inverter
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YIBANG IOT TECH CO LTD
- Filing Date
- 2025-07-31
- Publication Date
- 2026-06-23
AI Technical Summary
The fixed structure of the inductor module PCB in traditional inverters cannot effectively absorb and buffer vibration and impact energy, leading to PCB loosening and solder joint detachment, which affects the service life and performance stability of the inverter. At the same time, unreasonable wiring harness layout increases the risk of short circuits and makes maintenance inconvenient.
The system employs a buffer-fixing structure, including a wire harness fixing mechanism, a main body left and right clamping mechanism, and a main body front and rear clamping mechanism. It utilizes components such as buffer springs and clamping blocks to absorb and disperse vibration and impact energy, ensuring the stable fixation of the wire harness and PCB.
It effectively reduces the risk of loose wiring harnesses and short circuits, improves electrical safety, ensures PCB connection stability, simplifies the maintenance process, and improves the reliability and service life of the inverter.
Smart Images

Figure CN224401860U_ABST