Chip transfer device and chip processing apparatus

Abstract

The utility model belongs to chip processing technical field discloses a kind of chip transfer device and chip processing equipment.The chip transfer device includes rotating mechanism and adjustable telescopic finger arm, one end of telescopic finger arm is connected to rotating mechanism, and telescopic finger arm other end is equipped with suction finger and through area, and through area is used for the insertion of ejector pin assembly located at wafer taking station, and suction finger is used for suctioning the chip back surface ejected by ejector pin assembly.By setting chip transfer device, telescopic finger arm is extended when being at wafer taking station, so that ejector pin assembly can be inserted into through area, suction finger absorbs chip back surface, and moves to processing station under the drive of rotating mechanism, so that other devices can process chip and take chip away, and then telescopic finger arm returns to wafer taking station, so as to realize chip transfer by such circulation, without turning over chip, effectively save time, so as to carry out subsequent chip processing.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a chip transfer device and chip processing equipment. Background Technology

[0002] Semiconductor chip manufacturing refers to the process of producing integrated circuit chips from raw materials (usually silicon) through a series of complex technological steps.

[0003] In the prior art, the chip pick-up station is equipped with an ejector device. The ejector pin assembly of the ejector device lifts the chip from the center of the back side of the chip, and then a suction cup is used to pick it up from the front side of the chip (i.e., the ejector pin assembly acts on the back side of the chip, and the suction cup acts on the front side of the chip). Then the chip needs to be flipped over for subsequent processing.

[0004] Therefore, there is an urgent need to provide a chip transfer device and chip processing equipment that can directly pick up the back of the chip by adsorbing it without having to flip the chip, thus saving time for subsequent chip processing. Utility Model Content

[0005] The purpose of this invention is to provide a chip transfer device and a chip processing equipment, which can directly adsorb and pick up the back of the chip without having to flip the chip, thus saving time and facilitating subsequent chip processing.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a chip transfer device for picking up and transferring chips between a chip picking station and at least one processing station. The chip transfer device includes a rotating mechanism and a telescopic finger arm with adjustable length. One end of the telescopic finger arm is connected to the rotating mechanism, and the other end of the telescopic finger arm is provided with an adsorption finger and a through area. The through area is used for inserting a pin assembly located at the chip picking station. The adsorption finger is used to adsorb the back side of the chip pushed out by the pin assembly.

[0008] The rotating mechanism drives the telescopic finger arm to rotate, so that the telescopic finger arm moves from one of the pick-up station and the processing station to the other.

[0009] As an optional technical solution for a chip transfer device, it also includes a turntable, which is fixed to the rotating mechanism. At least one telescopic finger arm is provided. If multiple telescopic finger arms are provided, all telescopic finger arms are connected to the turntable, and the extension directions of two adjacent telescopic finger arms intersect at a preset angle.

[0010] As an optional technical solution for a chip transfer device, the preset included angle is greater than or equal to 30 degrees.

[0011] As an optional technical solution for a chip transfer device, the telescopic finger arm includes a support, a drive, and a movable component. The support is fixed to the rotating mechanism, the drive is fixed to the support, and the movable component is slidably disposed on the support. The adsorption finger and the penetration area are both disposed on the movable component. The movable component is connected to the drive, and the drive drives the movable component to move to adjust the length of the telescopic finger arm.

[0012] As an optional technical solution for a chip transfer device, the support member is provided with a guide hole, and the moving member is slidably inserted into the guide hole; or, the support member is provided with a guide groove, and the moving member is slidably disposed in the guide groove; or, the support member is provided with a slide rail, and the moving member slides in cooperation with the slide rail; or, the support member is provided with a linear bearing, and the moving member rolls in cooperation with the linear bearing.

[0013] As an optional technical solution for a chip transfer device, it also includes a suction device. The telescopic finger arm is provided with an air channel, and the suction finger is provided with an suction port. One end of the air channel is connected to the suction device, and the other end of the air channel is connected to the suction port. The suction device is used to generate negative pressure at the suction port.

[0014] As an optional technical solution for a chip transfer device, a pressure measurement sensor is also included, which is disposed at the adsorption port or in the air passage for measuring air pressure.

[0015] As an optional technical solution for a chip transfer device, the adsorption fingers extend in a direction away from the rotating mechanism, and the adsorption fingers are provided in at least one group, each group including at least two adsorption fingers spaced apart, with the gap between two adjacent adsorption fingers along the spaced-apart direction serving as the through area.

[0016] As an optional technical solution for a chip transfer device, the telescopic finger arm is provided with a support plate. The support plate has a side edge away from the rotating mechanism. The side edge is provided with the adsorption finger and the through area is recessed. When the adsorption finger adsorbs the back of the chip, the back of the chip rests on the support plate.

[0017] This utility model provides a chip processing equipment, including an ejection device, a wafer picking station, a processing station, and the aforementioned chip transfer device. The ejection device includes an ejector pin assembly, and the wafer picking station and the processing station are arranged around the chip transfer device.

[0018] Beneficial effects:

[0019] This invention provides a chip transfer device for picking up and transferring chips between a chip picking station and at least one processing station. The chip transfer device includes a rotating mechanism and a telescopic finger arm with adjustable length. One end of the telescopic finger arm is connected to the rotating mechanism, and the other end of the telescopic finger arm is provided with an adsorption finger and a through area. The through area is used for insertion of a pin assembly located at the chip picking station, and the adsorption finger is used to adsorb the back side of the chip ejected by the pin assembly. The rotating mechanism rotates to drive the telescopic finger arm to rotate, so that the telescopic finger arm moves from one of the chip picking station and the processing station to the other. By setting up a chip transfer device, when the telescopic finger arm is at the chip pick-up station, the through-area of ​​the telescopic finger arm corresponds to the position of the ejector pin assembly. The telescopic finger arm extends and gradually approaches the ejector pin assembly. When the telescopic finger arm reaches under the chip, the ejector pin assembly inserts into the through-area, thus using the through-area to avoid the ejector pin assembly of the ejector device. At this time, the suction finger is located under the chip. The ejector pin assembly falls and places the chip on the suction finger. The suction finger adheres to the back of the chip. The telescopic finger arm retracts and gradually moves away from the ejector pin assembly. Then, driven by the rotating mechanism, the telescopic finger arm moves to the processing station so that other devices can process the chip and remove it. Then, the telescopic finger arm moves from the processing station to the chip pick-up station. This cycle is repeated to achieve chip transfer without flipping the chip, effectively saving time for subsequent chip processing.

[0020] This invention provides a chip processing apparatus, which includes an ejector device, a wafer picking station, a processing station, and the aforementioned chip transfer device. The ejector device includes a ejector pin assembly, and the wafer picking station and processing station are arranged around the chip transfer device. By incorporating the aforementioned chip transfer device, the back side of the chip can be directly picked up without flipping the chip, thus improving chip processing efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the chip transfer device provided in an embodiment of the present invention;

[0022] Figure 2 This is a partial structural schematic diagram of the chip transfer device provided in this embodiment of the present invention;

[0023] Figure 3 This is a first-view structural schematic diagram of the telescopic finger arm provided in an embodiment of the present invention;

[0024] Figure 4 This is a structural schematic diagram of the telescopic finger arm provided in an embodiment of the present invention from a second perspective;

[0025] Figure 5 This is a structural schematic diagram of the telescopic finger arm provided in an embodiment of the present invention from a third-view perspective;

[0026] Figure 6 This is a structural schematic diagram of the telescopic finger arm provided in an embodiment of the present invention from a fourth perspective;

[0027] Figure 7 This is a schematic diagram of the first state of the chip processing equipment provided in this embodiment of the present invention;

[0028] Figure 8 This is a schematic diagram of the second state of the chip processing equipment provided in this embodiment of the present invention.

[0029] In the picture:

[0030] 10. Rotating mechanism; 20. Turntable; 30. Telescopic finger arm; 30a. First telescopic finger arm; 30b. Second telescopic finger arm; 31. Support component; 32. Driving component; 33. Moving component; 331. Adsorbing finger; 3311. Adsorption port; 332. Through area; 333. Adsorption interface; 334. Support plate;

[0031] 41. Wafer loading station; 42. Cleaning station; 43. Bonding station. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0036] like Figures 1 to 8 As shown, this embodiment provides a chip transfer device and a chip processing equipment. The chip processing equipment includes an ejector device, a wafer pick-up station 41, a processing station, and the aforementioned chip transfer device. The ejector device includes an ejector pin assembly, and the wafer pick-up station 41 and the processing station are arranged around the chip transfer device.

[0037] The chip transfer device is used to pick up and transfer chips between a pick-up station 41 and at least one processing station. The chip transfer device includes a rotating mechanism 10 and a telescopic finger arm 30 with adjustable length. One end of the telescopic finger arm 30 is connected to the rotating mechanism 10, and the other end of the telescopic finger arm 30 is provided with an adsorption finger 331 and a through area 332. The through area 332 is used for the insertion of a pin assembly located at the pick-up station 41, and the adsorption finger 331 is used to adsorb the back side of the chip ejected by the pin assembly. The rotating mechanism 10 rotates to drive the telescopic finger arm 30 to rotate, so that the telescopic finger arm 30 moves from one of the pick-up station 41 and the processing station to the other.

[0038] By setting up a chip transfer device, when the telescopic finger arm 30 is at the chip pick-up station 41, the through area 332 of the telescopic finger arm 30 corresponds to the position of the ejector pin assembly. The telescopic finger arm 30 extends and gradually approaches the ejector pin assembly. When the telescopic finger arm 30 extends under the chip, the ejector pin assembly can be inserted into the through area 332, thereby using the through area 332 to avoid the ejector pin assembly of the ejection device. At this time, the suction finger 331 is located under the chip. The ejector pin assembly falls and places the chip on the suction finger 331. The suction finger 331 suctions the back of the chip. The telescopic finger arm 30 retracts and gradually moves away from the ejector pin assembly. Then, driven by the rotating mechanism 10, the telescopic finger arm 30 moves to the processing station so that other devices can process the chip and remove it. Then, the telescopic finger arm 30 moves from the processing station to the chip pick-up station 41. This cycle is repeated to realize chip transfer without flipping the chip, effectively saving time for subsequent chip processing.

[0039] Optionally, the chip transfer device also includes a turntable 20, which is fixed to the rotating mechanism 10. At least one telescopic finger arm 30 is provided; if multiple telescopic finger arms 30 are provided, all telescopic finger arms 30 are connected to the turntable 20. The extension directions of two adjacent telescopic finger arms 30 intersect at a preset angle; the preset angle is greater than or equal to 30 degrees. By setting the turntable 20 on the rotating mechanism 10 and providing at least two telescopic finger arms 30 on the turntable 20, the two telescopic finger arms 30 are set at the same height, which helps ensure the installation stability of the telescopic finger arms 30. The extension directions of the two telescopic finger arms 30 intersect at a preset angle, which is adapted to the angle between the lines connecting two adjacent workstations and the rotation center of the rotating mechanism 10. This allows the rotating mechanism 10 to rotate, driving the turntable 20 to rotate, enabling the two telescopic finger arms 30 to move to different workstations, thus improving chip processing efficiency.

[0040] In this embodiment, the chip processing equipment includes a wafer picking station 41 and two processing stations, namely a cleaning station 42 and a bonding station 43. The cleaning station 42 is located between the wafer picking station 41 and the bonding station 43. The wafer picking station 41, the cleaning station 42 and the bonding station 43 are arranged around the circumference of the rotating mechanism 10. The turntable 20 can be fixed to the rotating mechanism 10 by bolts. The telescopic finger arm 30 is arranged on the outer circumference of the turntable 20 and extends radially along the turntable 20. There are two telescopic finger arms 30. The extension directions of the two telescopic finger arms 30 intersect and the preset included angle is 90 degrees. The included angle between the lines connecting two adjacent stations (e.g., the wafer picking station 41 and the cleaning station 42) and the rotation center of the rotating mechanism 10 is also 90 degrees.

[0041] When the rotating mechanism 10 rotates, it drives the turntable 20 to rotate, and drives the telescopic finger arm 30 to rotate, so that the telescopic finger arm 30 can move sequentially from the wafer picking station 41 to the cleaning station 42 and the bonding station 43, and can also move sequentially from the bonding station 43 to the cleaning station 42 and the wafer picking station 41.

[0042] In this embodiment, all telescopic finger arms 30 have the same structure and the same height; in other embodiments, turntables 20 can be set at different heights according to actual processing needs, and different telescopic finger arms 30 can be set on turntables 20 at corresponding height positions.

[0043] Furthermore, the telescopic finger arm 30 includes a support member 31, a drive member 32, and a movable member 33. The support member 31 is fixed to the rotating mechanism 10, the drive member 32 is fixed to the support member 31, and the movable member 33 is slidably disposed on the support member 31. The finger adsorption 331 and the through area 332 are both disposed on the movable member 33. The movable member 33 is connected to the drive member 32, and the drive member 32 drives the movable member 33 to move to adjust the length of the telescopic finger arm 30. By setting up the support member 31, the drive member 32, and the movable member 33, and using the drive member 32 to drive the movable member 33 to move relative to the support member 31, the length of the telescopic finger arm 30 is adjustable, the structure is simple and robust, and it is easy to control. The drive member 32 can be a motor or a cylinder.

[0044] In this embodiment, one end of the movable member 33 extends into the driving member 32 as a connecting rod. Driven by the driving member 32, the movable member 33 moves relative to the supporting member 31, thereby changing the length of the movable member 33 extending into the driving member 32, thus realizing the extension and retraction of the telescopic finger arm 30. To limit the movement direction of the movable member 33, the supporting member 31 is provided with a guide hole, and the movable member 33 is slidably inserted into the guide hole; or, the supporting member 31 is provided with a guide groove, and the movable member 33 is slidably disposed in the guide groove; or, the supporting member 31 is provided with a slide rail, and the movable member 33 slides with the slide rail; or, the supporting member 31 is provided with a linear bearing, and the movable member 33 rolls with the linear bearing. By providing a guide hole, a guide groove, a slide rail, or a linear bearing on the supporting member 31, the movement direction of the movable member 33 is limited, ensuring that the movable member 33 moves in a specific direction, thereby realizing the extension and retraction of the telescopic finger arm 30.

[0045] In this embodiment, the support member 31 is provided with a guide groove, the moving member 33 is slidably disposed in the guide groove, the outer side of the moving member 33 is slidably engaged with the inner wall of the guide groove, and the guide groove extends radially along the turntable 20.

[0046] In other embodiments, if a guide hole is provided on the support member 31, the guide hole extends radially along the turntable 20, and the moving member 33 slides through the guide hole, the shape of the guide hole matches the shape of the moving member 33; if a slide rail is provided on the support member 31, the slide rail extends radially along the turntable 20, and the moving member 33 slides on the slide rail; if a linear bearing is provided on the support member 31, the linear bearing rolls with the moving member 33 through point contact with internal balls, and the moving member 33 converts sliding friction into rolling friction when it moves, thereby achieving low-resistance linear motion.

[0047] Optionally, the telescopic finger arm 30 is provided with a support plate 334. The support plate 334 has a side edge away from the rotating mechanism 10. The side edge has a protruding suction finger 331 and a recessed through area 332. When the suction finger 331 suctions the back of the chip, the back of the chip rests on the support plate 334. By providing the support plate 334, and by providing the suction finger 331 and the through area 332 on the side edge of the support plate 334 away from the rotating mechanism 10, when the suction finger 331 suctions the back of the chip, the back of the chip rests on the support plate 334, which provides auxiliary support and helps to ensure the stability of chip transport.

[0048] Optionally, the adsorption fingers 331 extend in a direction away from the rotating mechanism 10. At least one set of adsorption fingers 331 is provided, each set including at least two spaced-apart adsorption fingers 331. The gap between two adjacent adsorption fingers 331 along the spaced-apart direction serves as a through-area 332. By providing at least two spaced-apart adsorption fingers 331 in each set, and using the gap between two adjacent adsorption fingers 331 along the spaced-apart direction as the through-area 332, the ejector pin assembly can be avoided, and the two adsorption fingers 331 in the same set can adsorb the chip from both sides of the through-area 332, ensuring the stability of chip transport. In this embodiment, each telescopic finger arm 30 is provided with a set of adsorption fingers 331, and the two adsorption fingers 331 are located in the central region of the end of the support plate 334.

[0049] Furthermore, the chip transfer device also includes a suction device. The telescopic finger arm 30 has an air passage, and the suction finger 331 has a suction port 3311. One end of the air passage is connected to the suction device, and the other end is connected to the suction port 3311. The suction device generates negative pressure at the suction port 3311. By providing an air passage and a suction port 3311 within the telescopic finger arm 30, the chip is adsorbed using negative pressure, resulting in stronger and more stable adsorption, ensuring that the chip will not fall off during transfer. This design is suitable for chips of different shapes and sizes.

[0050] In this embodiment, the air passage is disposed within the movable member 33. One end of the air passage forms an adsorption interface 333 on the movable member 33. The adsorption interface 333 is used to connect with the suction device. The other end of the air passage is connected to the adsorption port 3311. The adsorption port 3311 is located on the side of the adsorption finger 331 away from the rotating mechanism 10 and is located at the edge of the adsorption finger 331 near the through area 332.

[0051] Optionally, the chip transfer device also includes a pressure measurement sensor, which is located at the adsorption port 3311 or inside the air passage to measure air pressure. By setting up the pressure measurement sensor, the device can determine whether a chip is adsorbed at the adsorption port 3311 based on the air pressure value detected by the sensor. This allows for real-time monitoring of the adsorption status, preventing abnormal interruptions in processing and avoiding chip displacement or drop due to adsorption failure during transfer. The specific principle and type of the pressure measurement sensor can be found in existing technologies.

[0052] The following is a detailed description of the chip transfer device's operation (taking the first telescopic finger arm 30a and the second telescopic finger arm 30b as examples):

[0053] In the initial state, the first telescopic finger arm 30a is placed at the chip picking station 41, and the ejector pin assembly pushes the chip out from the back of the chip. At this time, the through area 332 of the first telescopic finger arm 30a corresponds to the position of the ejector pin assembly. The first telescopic finger arm 30a extends and gradually approaches the ejector pin assembly. When the first telescopic finger arm 30a extends to the bottom of the chip, the ejector pin assembly inserts into the through area 332 of the first telescopic finger arm 30a. After the ejector pin assembly falls, the chip is placed on the support plate 334 of the first telescopic finger arm 30a. At this time, the suction finger 331 of the first telescopic finger arm 30a contacts the back of the chip. The suction finger 331 of the first telescopic finger arm 30a suctions the chip through the suction port 3311. The first telescopic finger arm 30a retracts and gradually moves away from the ejector pin assembly.

[0054] Rotating mechanism 10 rotates 90 degrees counterclockwise, switching the chip transfer device from the initial state to the first state. See [link / reference]. Figure 7 The first telescopic finger arm 30a is placed at the cleaning station 42, and the second telescopic finger arm 30b is placed at the chip picking station 41. The second telescopic finger arm 30b extends, and after the adsorption finger 331 of the second telescopic finger arm 30b adsorbs the chip, the second telescopic finger arm 30b retracts.

[0055] Rotating mechanism 10 continues to rotate 90 degrees counterclockwise, and the chip transfer device switches from the first state to the second state. See [link / reference needed]. Figure 8 The first telescopic finger arm 30a is placed at the bonding station 43, and the second telescopic finger arm 30b is placed at the cleaning station 42.

[0056] If the rotating mechanism 10 continues to rotate 90 degrees counterclockwise, the second telescopic finger arm 30b will bond to the bonding station 43. If the rotating mechanism 10 continues to rotate 90 degrees counterclockwise again, the chip transfer device will return to its initial state, and the cycle will repeat.

[0057] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A chip transfer device, characterized in that, For picking up and transferring chips between a pick-up station (41) and at least one processing station, the chip transfer device includes a rotating mechanism (10) and a telescopic finger arm (30) with adjustable length. One end of the telescopic finger arm (30) is connected to the rotating mechanism (10), and the other end of the telescopic finger arm (30) is provided with an adsorption finger (331) and a through area (332). The through area (332) is used for inserting a pin assembly located at the pick-up station (41), and the adsorption finger (331) is used to adsorb the back side of the chip pushed out by the pin assembly. The rotating mechanism (10) rotates to drive the telescopic finger arm (30) to rotate, so that the telescopic finger arm (30) moves from one of the pick-up station (41) and the processing station to the other.

2. The chip transfer device according to claim 1, characterized in that, It also includes a turntable (20), which is fixed to the rotating mechanism (10). There is at least one telescopic finger arm (30). If there are multiple telescopic finger arms (30), all of them are connected to the turntable (20). The extension directions of two adjacent telescopic finger arms (30) intersect at a preset angle.

3. The chip transfer device according to claim 2, characterized in that, The preset included angle is greater than or equal to 30 degrees.

4. The chip transfer device according to claim 1, characterized in that, The telescopic finger arm (30) includes a support (31), a drive (32), and a moving part (33). The support (31) is fixed to the rotating mechanism (10), the drive (32) is fixed to the support (31), and the moving part (33) is slidably disposed on the support (31). The adsorbing finger (331) and the through area (332) are both disposed on the moving part (33). The moving part (33) is connected to the drive (32), and the drive (32) drives the moving part (33) to move to adjust the length of the telescopic finger arm (30).

5. The chip transfer device according to claim 4, characterized in that, The support member (31) is provided with a guide hole, and the moving member (33) is slidably inserted into the guide hole; or, the support member (31) is provided with a guide groove, and the moving member (33) is slidably disposed in the guide groove; or, the support member (31) is provided with a slide rail, and the moving member (33) is slidably engaged with the slide rail; or, the support member (31) is provided with a linear bearing, and the moving member (33) is slidably engaged with the linear bearing.

6. The chip transfer device according to claim 1, characterized in that, It also includes a suction device, the telescopic finger arm (30) is provided with an air passage, the suction finger (331) is provided with an suction port (3311), one end of the air passage is connected to the suction device, and the other end of the air passage is connected to the suction port (3311). The suction device is used to generate negative pressure at the suction port (3311).

7. The chip transfer device according to claim 6, characterized in that, It also includes a pressure measurement sensor, which is disposed at the adsorption port (3311) or in the airway for measuring air pressure.

8. The chip transfer device according to claim 1, characterized in that, The adsorption fingers (331) extend in a direction away from the rotating mechanism (10). The adsorption fingers (331) are provided in at least one group, and each group includes at least two adsorption fingers (331) spaced apart. The gap between two adjacent adsorption fingers (331) along the spaced-apart direction serves as the through area (332).

9. The chip transfer device according to claim 1, characterized in that, The telescopic finger arm (30) is provided with a support plate (334), the support plate (334) has a side edge away from the rotating mechanism (10), the side edge is provided with the adsorption finger (331) protruding and the through area (332) recessed, when the adsorption finger (331) adsorbs the back of the chip, the back of the chip rests on the support plate (334).

10. Chip processing equipment, characterized in that, The device includes an ejection device, a wafer pick-up station (41), a processing station, and a chip transfer device as described in any one of claims 1-9. The ejection device includes a ejector pin assembly, and the wafer pick-up station (41) and the processing station are arranged around the periphery of the chip transfer device.

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