Packaging device with liquid cooling function
By introducing a liquid cooling structure into the packaged device, the problem of insufficient chip heat dissipation is solved by using coolant to transfer heat, achieving efficient heat dissipation and stable operation, preventing chip burn-out, and simplifying the manufacturing process.
CN224368293UActive Publication Date: 2026-06-16JCET GROUP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JCET GROUP CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-16
AI Technical Summary
⚠Technical Problem
The heat dissipation performance of chips in existing packaged devices is insufficient, resulting in excessively high chip temperatures, which can easily cause the chips to burn out and affect their stable operation.
⚗Method used
It adopts a liquid cooling structure, including an upper cover, a lower support component and a heat dissipation channel, which transfers heat through coolant to enhance the chip's heat dissipation performance and prevent overheating.
🎯Benefits of technology
It improves the heat dissipation efficiency of the chip, maintains the stable operation of the chip inside the packaged device, avoids the chip burning out due to excessive temperature, simplifies the manufacturing process, and reduces manufacturing costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 1 Figure 2
Abstract
The utility model relates to a kind of encapsulation devices with liquid cooling heat dissipation function.The encapsulation devices with liquid cooling heat dissipation function include: substrate, including the front and back of opposite distribution;Chip, mount on the front of substrate, chip includes the first surface towards substrate and the second surface opposite with first surface;Liquid cooling heat dissipation structure, including upper cover, lower support and the heat dissipation channel for transmission cooling liquid, upper cover is located above chip, upper cover includes the lower surface towards substrate and the upper surface opposite with lower surface, lower support mounts on the side of chip and is connected with the lower surface of upper cover, upper cover and chip form heat dissipation channel, upper cover also includes liquid inlet and liquid outlet, which are communicated with heat dissipation channel, and liquid inlet is located on the upper surface of upper cover.The utility model enhances the heat dissipation performance of chip, and simplifies manufacturing process.
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