Cooling device with levelling mechanism

Abstract

This utility model relates to the technical field of cooling devices, specifically a cooling device with a leveling mechanism. It includes a water-cooling tank, an overflow tank, and multiple leveling mechanisms. The overflow tank is fixedly installed inside the water-cooling tank and the two are connected. The multiple leveling mechanisms are evenly placed on the working surface, and the water-cooling tank is placed on the multiple leveling mechanisms. Each leveling mechanism includes a support frame and two adjustable leveling structures at both ends of the support frame. The top of the support frame contacts the water-cooling tank. Each leveling structure includes an adjusting screw and an adjusting nut. The upper part of the adjusting screw is fixedly connected to the support frame via the adjusting nut, and the lower part of the adjusting screw extends outside the support frame. The bottom of the adjusting screw is fixedly connected to a support plate, which is used to contact the working surface. This utility model's cooling device, by setting multiple leveling mechanisms, supports the water-cooling tank to keep it level, enabling the water-cooling tank to achieve uniform heat exchange for lead ingots.

Description

Technical Field

[0001] This utility model relates to the field of cooling device technology, and specifically to a cooling device with a leveling mechanism. Background Technology

[0002] In the casting process of lead alloy ingots, water cooling is required. Currently, the ingots are placed in a cold water tank for cooling. However, because not all working surfaces are perfectly flat, uneven surfaces cause the water level in the tank to be non-parallel to the top surface of the ingot (meaning the water level is uneven), leading to uneven cooling and potential lead segregation. Therefore, a cooling device with a leveling mechanism is urgently needed to solve this problem. Utility Model Content

[0003] To address the technical problem that current cold water tanks lack leveling mechanisms, resulting in uneven working surfaces and the cold water level not being parallel to the top surface of the lead ingots, this invention provides a cooling device with leveling mechanisms. By setting multiple leveling mechanisms, the water cooling tank is supported and kept level, enabling uniform water cooling and heat exchange for the lead ingots.

[0004] This utility model provides a cooling device with a leveling mechanism. The cooling device includes a water-cooling tank, an overflow tank, and multiple leveling mechanisms. The overflow tank is fixedly installed inside the water-cooling tank and the two are connected. The multiple leveling mechanisms are evenly placed on the working ground, and the water-cooling tank is placed on the multiple leveling mechanisms. Each leveling mechanism includes a support frame and two leveling structures adjustable at both ends of the support frame. The top of the support frame contacts the water-cooling tank. Each leveling structure includes an adjusting screw and an adjusting nut. The upper part of the adjusting screw is fixedly connected to the support frame through the adjusting nut, and the lower part of the adjusting screw extends to the outside of the support frame. The bottom of the adjusting screw is fixedly connected to a support plate, and the support plate is used to contact the working ground.

[0005] Furthermore, the cooling device also includes a slag trough, which is fixedly installed on the outside of the water cooling tank. The slag trough, water cooling tank, and overflow trough are arranged sequentially from the outside to the inside. The slag trough, water cooling tank, and overflow trough are semi-circular with decreasing diameters. Multiple leveling machines are arranged in a semi-circular pattern.

[0006] Furthermore, the cooling device also includes a collection tank, which is fixedly installed at the end of the water-cooling tank. A guide pipe is fixedly installed on the overflow tank, and the end of the guide pipe extends into the collection tank. Water in the overflow tank flows into the collection tank through the guide pipe, and the water in the collection tank can be further treated and then transported to other workstations for reuse.

[0007] Furthermore, the water-cooling tank is uniformly provided with multiple partition plates, which divide the interior of the water-cooling tank into multiple water-cooling areas. Multiple water-cooling molds are fixedly installed inside the water-cooling tank, and the multiple water-cooling molds are arranged in a semi-circular shape. Each water-cooling mold is located within a water-cooling area. Multiple water inlets and drains are uniformly provided on the water-cooling tank. Each water inlet and drain is connected to a water-cooling area. Each water inlet is located below a water-cooling mold, and each drain is located to the side of a water-cooling mold. Multiple drains are connected to the interior of an overflow tank.

[0008] Furthermore, each of the aforementioned water inlets is located at the bottom of the water-cooling tank, and each of the aforementioned drain outlets is located on the side wall of the water-cooling tank. A main water inlet pipe is fixedly installed on the outside of the water-cooling tank, and the main water inlet pipe is fixedly connected to multiple water inlets. A branch pipe is fixedly installed at each water inlet, and each branch pipe is located within the water-cooling area and below the water-cooling mold. The main water inlet pipe is connected to an external water source. Cold water enters the water inlet through the main water inlet pipe and then enters the water-cooling area through the branch pipes.

[0009] Furthermore, each of the water-cooled molds is fan-shaped, with its upper part placed on top of the water-cooling tank and its lower part located within the water-cooling area. Each water-cooled mold is equipped with multiple forming grooves. The lead ingot to be cooled is introduced into the forming groove of the water-cooled mold, and after water-cooling heat exchange, the lead ingot is cooled and formed.

[0010] Furthermore, each of the support frames is square, and each of the adjusting nuts is located inside the support frame and contacts the inner wall of the support frame; an anti-slip pad is provided between each support frame and the water-cooling tank. The anti-slip pad serves to prevent slippage between the adjusting support frame and the water-cooling tank, ensuring the stability of the water-cooling tank.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] The cooling device operates as follows: Multiple leveling mechanisms are evenly placed on the working surface. The water-cooling tank is placed on these mechanisms, which support it, ensuring the tank is level. A support frame further supports the tank, and by adjusting the height of two adjusting screws, the frame is kept level, thus completing the leveling of the tank. External cold water is introduced into the tank, and the lead ingots to be cooled are placed inside. Cold water is continuously introduced into the tank, and the water, after heat exchange, is continuously discharged from the tank and enters the overflow tank. After water-cooling heat exchange, the lead ingots are cooled and solidified, resulting in uniform heat exchange and high-quality cooled ingots. This cooling device, by incorporating multiple leveling mechanisms to support the water-cooling tank and maintain its level, achieves uniform water-cooling heat exchange for the lead ingots. Attached Figure Description

[0013] Figure 1 This is a front view schematic diagram of a cooling device with a leveling mechanism according to this utility model;

[0014] Figure 2 This is a top view of the cooling device of this utility model;

[0015] Figure 3 This is a bottom view of the cooling device of this utility model.

[0016] Figure 4 This is a schematic diagram of the leveling mechanism of this utility model;

[0017] Figure 5 This is a cross-sectional structural schematic diagram of the leveling mechanism of this utility model;

[0018] Figure 6 This is a structural schematic diagram of the water-cooled mold of this utility model;

[0019] Figure 7 This is a cross-sectional structural schematic diagram of the water-cooled mold of this utility model;

[0020] The numbers in the attached diagram are:

[0021] 1. Water-cooled tank; 11. Divider plate; 12. Water inlet; 13. Drain outlet; 2. Overflow tank; 21. Guide pipe; 3. Support frame; 31. Adjusting screw; 32. Adjusting nut; 33. Support plate; 4. Slag tank; 5. Collection tank; 6. Water-cooled mold; 61. Molding tank; 7. Main water inlet pipe; 8. Branch pipe. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] like Figures 1-7As shown, a cooling device with a leveling mechanism is disclosed. The cooling device includes a water-cooled tank 1, an overflow tank 2, and multiple leveling mechanisms. Preferably, the depth of the overflow tank 2 is less than the depth of the water-cooled tank 1. The overflow tank 2 is fixedly disposed inside the water-cooled tank 1 and the two are connected. Multiple leveling mechanisms are evenly placed on the working ground. The water-cooled tank 1 is placed on multiple leveling mechanisms. There are 8 or 6 leveling mechanisms. All leveling mechanisms support and fix the water-cooled tank 1 and the overflow tank 2. The number of leveling mechanisms is not limited. Each leveling mechanism includes a support frame 3 and two leveling structures adjustable at both ends of the support frame 3. The top of the support frame 3 contacts the water-cooled tank 1. Each leveling structure includes an adjusting screw 31 and an adjusting nut 32. The upper part of the adjusting screw 31 is fixedly connected to the support frame 3 through the adjusting nut 32, and the lower part of the adjusting screw 31 extends to the outside of the support frame 3. The bottom of the adjusting screw 31 is fixedly connected to a support plate 33, and the support plate 33 is used to contact the working ground.

[0024] The working process of the cooling device in this embodiment is as follows: Multiple leveling mechanisms are evenly placed on the working ground, and the water-cooling tank 1 is placed on the multiple leveling mechanisms. The multiple leveling mechanisms support the water-cooling tank 1, making the water-cooling tank 1 horizontal. Specifically, the support plate 33 is in contact with the working ground, and the contact area between the two is large, ensuring that the leveling mechanism is stable on the working ground. By adjusting the height of the two adjusting screws 31 on the support frame 3, the support frame 3 is kept horizontal, and the support frame 3 supports the water-cooling tank 1, ultimately completing the leveling of the water-cooling tank 1. External cold water is introduced into the water-cooling tank 1, and the lead ingots to be cooled are placed into the water-cooling tank 1. Cold water is continuously introduced into the water-cooling tank 1, and the water after heat exchange is continuously discharged from the water-cooling tank 1 and enters the overflow tank 2. After water-cooling heat exchange, the lead ingots are cooled and formed. The lead ingots undergo uniform heat exchange, resulting in high-quality cooled and formed lead ingots.

[0025] The cooling device is used in different workshops, and the working surface may be uneven. Each leveling mechanism can adjust the height of the two adjusting screws 31 on the support frame 3 according to the unevenness of the working surface, so that the support frame 3 always remains horizontal. When it is necessary to adjust the height of the water cooling tank 1, an external device (such as a crane) lifts the water cooling tank 1, and then the adjusting nut 32 is loosened. The height of the adjusting screw 31 can be adjusted (the lower part of the adjusting screw 31 that protrudes from the support frame 3 extends or shortens). After adjustment, the adjusting nut 32 is tightened again to keep the adjusting screw 31 stable. Then the water cooling tank 1 is lowered, and the support frame 3 continues to support the water cooling tank 1, so that the water cooling tank 1 is horizontal as a whole.

[0026] The cooling device in this embodiment uses multiple leveling mechanisms to support the water-cooled tank 1 and keep it horizontal, so that the water-cooled tank 1 can achieve uniform heat exchange by water cooling of lead ingots.

[0027] In one possible implementation, the cooling device further includes a slag trough 4. Preferably, the depth of the slag trough 4 is less than the depth of the water cooling tank 1. The slag trough 4 is fixedly installed on the outside of the water cooling tank 1. The slag trough 4, water cooling tank 1, and overflow trough 2 are arranged sequentially from the outside to the inside. The slag trough 4, water cooling tank 1, and overflow trough 2 are semi-circular with their diameters decreasing sequentially. Multiple leveling machines are arranged in a semi-circular pattern. During the water cooling process, impurities may enter the overflow trough 2 from the water cooling tank 1 with the water flow. The water in the overflow trough 2 can be reused after subsequent treatment, but the presence of impurities will affect its reuse. Therefore, people can use a scooping net to remove the impurities from the overflow trough 2. The removed impurities can be directly placed into the slag trough 4 without affecting the working environment.

[0028] In one possible implementation, the cooling device further includes a collection tank 5, which is fixedly installed at the end of the water-cooling tank 1. A guide pipe 21 is provided on the overflow tank 2, with the end of the guide pipe 21 extending into the collection tank 5. Water in the overflow tank 2 flows into the collection tank 5 through the guide pipe 21 for storage. The water in the collection tank 5 can then be further processed and transported to other workstations for reuse.

[0029] In one possible implementation, the water-cooling tank 1 is uniformly provided with multiple partition plates 11, which divide the interior of the water-cooling tank 1 into multiple water-cooling areas. Multiple water-cooling molds 6 are fixedly provided inside the water-cooling tank 1, and the multiple water-cooling molds 6 are arranged in a semi-circular shape. Each water-cooling mold 6 is located within a water-cooling area. Multiple water inlets 12 and drains 13 are uniformly provided on the water-cooling tank 1. Each water inlet 12 and drain 13 communicates with a water-cooling area. Each water inlet 12 is located below the water-cooling mold 6, and each drain 13 is located to the side of the water-cooling mold 6. The multiple drains 13 communicate with the interior of the overflow tank 2. Specifically, external cold water is introduced into the water-cooled area of ​​the water-cooled tank 1 through the inlet 12. The lead ingot to be cooled is introduced into the water-cooled mold 6. The lead ingot and the cold water exchange heat. The cold water continuously enters from the inlet 12, and the water after heat exchange is continuously discharged from the outlet 13 and enters the overflow tank 2. Finally, the water is discharged from the overflow tank 2. After water-cooled heat exchange, the lead ingot is cooled and formed.

[0030] Preferably, in this embodiment, the inlet 12 and outlet 13 are designed to be 50mm, and the volume and pressure of the cold water can ensure uniform heat exchange of the lead ingot.

[0031] In one possible implementation, each of the water inlets 12 is located at the bottom of the water-cooling tank 1, and each of the drain outlets 13 is located on the side wall of the water-cooling tank 1. A main water inlet pipe 7 is fixedly installed on the outside of the water-cooling tank 1, located at the bottom of the water-cooling tank 1. The main water inlet pipe 7 is connected to and communicates with multiple water inlets 12. A branch pipe 8 is fixedly installed at each water inlet 12, and each branch pipe 8 is located within the water-cooling area and below the water-cooling mold 6. The water inlets 12 being located at the bottom of the water-cooling tank 1 and the drain outlets 13 being located on the side wall of the water-cooling tank 1 ensures that heat exchange with the lead ingots is achieved after the water flows. Preferably, the main water inlet pipe 7 is fixedly installed at the bottom of the water-cooling tank 1 and communicates with multiple water inlets 12. One end of the main water inlet pipe 7 extends from the bottom of the water-cooling tank 1 to connect to an external water source. The main water inlet pipe 7 is connected to an external water source, and cold water enters the water inlet 12 through the main water inlet pipe 7 and then enters the water-cooling area through the branch pipe 8. After long-term use, mud, sand and impurities may accumulate at the bottom of the water-cooled tank 1. In order to prevent mud, sand and impurities from clogging the water inlet 12, a branch pipe 8 is installed at the water inlet 12. Since the branch pipe 8 is higher than the water inlet 12, even if there is mud, sand and impurities, it will not affect the entry of cold water into the water-cooled area.

[0032] In one possible implementation, each water-cooled mold 6 is fan-shaped, with its top placed on top of the water-cooling tank 1 wall and its bottom located within the water-cooling area. Each water-cooled mold 6 is provided with multiple forming grooves 61, totaling five. The water-cooled mold 6 can perform water-cooling heat exchange on five lead ingots at a time. The lead ingots to be cooled are introduced into the forming grooves 61 of the water-cooled mold 6, and after water-cooling heat exchange, the lead ingots are cooled and shaped. The water-cooled mold 6 used for the lead ingots is set according to requirements. In this embodiment, the lead ingots produced by the water-cooled mold 6 weigh tens of kilograms, which is far less than the weight of conventional lead ingots (ton-level) on the market.

[0033] In one possible implementation, each support frame 3 is square, preferably made of steel, which provides high strength and prevents deformation. Each adjusting nut 32 is located inside the support frame 3 and contacts its inner wall. An anti-slip pad is provided between each support frame 3 and the water-cooling tank 1. The internal dimensions of the support frame 3 are larger than the dimensions of the adjusting nut 32, facilitating adjustment and subsequent maintenance and replacement. The anti-slip pad prevents slippage between the support frame 3 and the water-cooling tank 1, ensuring the stability of the water-cooling tank 1.

[0034] The embodiments described above are merely preferred embodiments of this utility model and are only used to explain this utility model. They are not intended to limit the scope of implementation of this utility model. For those skilled in the art, other implementation methods can be easily made by substitution or modification based on the technical content disclosed in this specification. Therefore, all changes and improvements made to the principles and process conditions of this utility model should be included within the scope of the patent application of this utility model.

Claims

1. A cooling device with a leveling mechanism, characterized in that, The cooling device includes a water cooling tank (1), an overflow tank (2), and multiple leveling mechanisms. The overflow tank (2) is fixedly installed inside the water cooling tank (1) and the two are connected. The multiple leveling mechanisms are evenly placed on the working ground. The water cooling tank (1) is placed on the multiple leveling mechanisms. Each leveling mechanism includes a support frame (3) and two leveling structures that are adjustable at both ends of the support frame (3). The top of the support frame (3) is in contact with the water cooling tank (1). Each leveling structure includes an adjusting screw (31) and an adjusting nut (32). The upper part of the adjusting screw (31) is fixedly connected to the support frame (3) through the adjusting nut (32), and the lower part of the adjusting screw (31) extends to the outside of the support frame (3). The bottom of the adjusting screw (31) is fixedly connected to the support plate (33), and the support plate (33) is used to contact the working ground.

2. The cooling device according to claim 1, characterized in that, The cooling device also includes a slag trough (4), which is fixedly installed on the outside of the water cooling tank (1). The slag trough (4), the water cooling tank (1), and the overflow tank (2) are arranged sequentially from the outside to the inside. The slag trough (4), the water cooling tank (1), and the overflow tank (2) are semi-circular and their diameters decrease sequentially. The multiple leveling machines are arranged in a semi-circular pattern.

3. The cooling device according to claim 2, characterized in that, The cooling device also includes a collection tank (5), which is fixedly installed at the end of the water cooling tank (1). A guide pipe (21) is fixedly installed on the overflow tank (2), and the end of the guide pipe (21) extends into the collection tank (5).

4. The cooling device according to claim 1, characterized in that, The water-cooling tank (1) is uniformly provided with multiple partition plates (11), which divide the interior of the water-cooling tank (1) into multiple water-cooling areas. Multiple water-cooling molds (6) are fixedly provided inside the water-cooling tank (1), and the multiple water-cooling molds (6) are arranged in a semi-circular shape. Each water-cooling mold (6) is located within a water-cooling area. Multiple water inlets (12) and drains (13) are uniformly provided on the water-cooling tank (1). Each water inlet (12) and drain (13) is connected to a water-cooling area. Each water inlet (12) is located below the water-cooling mold (6), and the drain (13) is located to the side of the water-cooling mold (6). Multiple drains (13) are connected to the interior of the overflow tank (2).

5. The cooling device according to claim 4, characterized in that, Each of the water inlets (12) is located at the bottom of the water-cooling tank (1), and each of the drain outlets (13) is located on the side wall of the water-cooling tank (1). A main water inlet pipe (7) is fixedly installed on the outside of the water-cooling tank (1). The main water inlet pipe (7) is fixedly connected to multiple water inlets (12). A branch pipe (8) is fixedly installed at each water inlet (12). Each branch pipe (8) is located in the water-cooling area and below the water-cooling mold (6).

6. The cooling device according to claim 4, characterized in that, Each of the water-cooled molds (6) is fan-shaped, with the upper part of each water-cooled mold (6) placed on top of the water-cooling tank (1) and the lower part of the water-cooled mold (6) located within the water-cooling area. Each water-cooled mold (6) is provided with multiple forming grooves (61).

7. The cooling device according to claim 1, characterized in that, Each of the support frames (3) is square, and each of the adjusting nuts (32) is located inside the support frame (3) and in contact with the inner wall of the support frame (3); each of the support frames (3) is provided with an anti-slip pad between it and the water cooling tank (1).

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