5g optoelectronic pod integrating micro visible light devices

Abstract

This application relates to a 5G optoelectronic pod integrating miniature visible light devices, belonging to the field of optoelectronic detection equipment technology. It includes a protective housing, a heat dissipation side plate, an axial flow fan, a mounting frame, an integrated template, and a transparent protective plate. In this application, the heat generated by the 5G optoelectronic device within the integrated template of the 5G optoelectronic pod is forcibly dissipated by the axial flow fan inside the heat dissipation side plate. The airflow generated by the fan enters from one side of the heat dissipation side plate, passes through the interior of the protective housing, and then exits from the other side, forming an effective heat dissipation cycle. Simultaneously, the integrated template and the transparent protective plate ensure the normal operating environment of the optoelectronic device and the transmission and reception of optical signals, enabling the 5G optoelectronic pod to operate efficiently and stably.

Description

Technical Field

[0001] This application relates to the field of optoelectronic detection equipment technology, and in particular to a 5G optoelectronic pod integrating a miniature visible light device. Background Technology

[0002] In the current technological context, electro-optical pods have become indispensable equipment in fields such as drones and security monitoring. The core functions of electro-optical pods are to provide visible light and infrared imaging, target tracking, and real-time data transmission. With the gradual popularization of 5G technology, the demand for low-latency and high-bandwidth real-time image transmission is constantly increasing. However, traditional electro-optical pod communication solutions have many limitations, especially in terms of size, power consumption, and transmission rate, and have not fully met the requirements of modern applications.

[0003] To address these challenges, current research primarily focuses on integrating miniaturized visible light sensors with 5G modules. Specifically, these solutions can be broadly categorized as follows: First, a common design employs a split structure, where the pod contains only the optical equipment, transmitting data via an external 5G terminal. This approach maintains system modularity but introduces additional power and installation space requirements, increasing system complexity. Second, some designs favor integration with 4G or LTE modules. While this significantly reduces costs, the lower transmission rates make it difficult to meet the real-time transmission requirements of high-resolution video streams. Finally, another design utilizes stacked packaging, mechanically combining the 5G module with the optical lens. This method offers high integration, but heat dissipation issues can lead to a decrease in the sensor's signal-to-noise ratio, affecting image quality and potentially causing long-term reliability problems.

[0004] Existing optoelectronic pod technologies have significant drawbacks, including equipment redundancy, insufficient data transmission efficiency, and poor long-term reliability, which limit the widespread use and application effectiveness of optoelectronic pods. Utility Model Content

[0005] In order to address the shortcomings of existing 5G optoelectronic pods that integrate miniature visible light devices due to their inherent design characteristics, the inventors have found that existing optoelectronic pod technologies suffer from significant defects such as equipment redundancy, insufficient data transmission efficiency, and poor long-term reliability, which limit the widespread use and application effectiveness of optoelectronic pods. Therefore, this application provides a 5G optoelectronic pod that integrates miniature visible light devices.

[0006] The 5G optoelectronic pod for an integrated micro visible light device provided in this application adopts the following technical solution: it includes a protective shell, heat dissipation side plates respectively disposed on both sides of the protective shell, an axial flow fan disposed inside each heat dissipation side plate, a mounting frame disposed in the inner cavity of the protective shell, an integrated template disposed in the mounting frame, and a transparent protective plate connected to the protective shell and disposed relative to the integrated template.

[0007] This 5G optoelectronic pod, integrating miniature visible light equipment, provides complete sealing protection through a protective housing, preventing damage from dust and external environmental factors. Axial flow fans on the heat dissipation side panels effectively dissipate heat, ensuring the operating temperature of internal electronic components remains within a safe range. Mounting brackets and integrated templates secure the 5G optoelectronic equipment within the pod, ensuring stability and precise alignment. A transparent protective panel ensures visibility of the equipment inside the pod while preventing external physical damage.

[0008] The integrated template consists of a micro visible light module, an electromagnetic shielding layer, a 5G communication module, and a thermal management substrate, which are sequentially stacked from the light incident direction.

[0009] An electromagnetic absorbing material layer is disposed between the electromagnetic shielding layer and the imaging module;

[0010] Vertical interconnect vias with a diameter of 50μm are used to connect miniature visible light modules, electromagnetic shielding layers, 5G communication modules, and thermal management substrates, replacing traditional cable connections and reducing space occupation by 60%.

[0011] A tree-like fractal microchannel runs through the thermal management substrate and is filled with liquid metal working fluid.

[0012] Radial heat dissipation fins coupled to the outer surface of the thermal management substrate;

[0013] A shared power supply system for powering miniature visible light modules and 5G communication modules.

[0014] By adopting the above technical solution, the miniature visible light module is responsible for receiving and transmitting visible light signals; the electromagnetic shielding layer is used to block external electromagnetic interference, ensuring stable operation of the system; and the 5G communication module enables high-speed wireless communication. An electromagnetic absorbing material layer is placed between the electromagnetic shielding layer and the imaging module, absorbing and dissipating electromagnetic interference to enhance the system's anti-interference capability. Vertical interconnect vias replace traditional cables for connection, reducing space occupation by up to 60% and improving data transmission efficiency between components. A tree-like fractal microchannel runs through the thermal management substrate, filled with liquid metal working fluid for efficient thermal management. Radial heat dissipation fins are attached to the outer surface of the thermal management substrate, further improving heat dissipation efficiency. Finally, a shared power system supplies power to both the miniature visible light module and the 5G communication module, ensuring both operate efficiently and stably.

[0015] As a preferred embodiment, the miniature visible light module is configured as a CMOS imaging module with a focal length of 4.2mm and a field of view of 84°.

[0016] By adopting the above technical solution, the CMOS imaging module in the miniature visible light module is responsible for capturing image information. It converts light into electrical signals through a photosensitive element, thereby realizing image recording. The 4.2mm focal length design allows for adjustable focus, effectively controlling imaging quality and imaging distance. The 84° field of view (FOV) ensures effective imaging of the module over a large range, enabling clear and complete field of view in different application scenarios.

[0017] As a preferred embodiment, the electromagnetic shielding layer is a cold-rolled permalloy sheet with a thickness of 0.05-0.1 mm, a saturation magnetic induction intensity ≥0.75 T, and a relative permeability ≥60,000.

[0018] By employing the above technical solution, the electromagnetic shielding layer is made of cold-rolled permalloy sheet with a thickness of 0.05 to 0.1 mm. This material provides excellent electromagnetic shielding performance. Its main function is to block and absorb external electromagnetic interference, protecting internal electronic equipment from the influence of external electromagnetic fields. Cold-rolled permalloy has a high saturation magnetic induction intensity (≥0.75 Tesla), ensuring a strong magnetic field strength and effectively shielding electromagnetic waves. In addition, its relative permeability ≥60,000 means that this material can efficiently concentrate and guide the magnetic field, further enhancing the shielding effect.

[0019] As a preferred embodiment, the electromagnetic absorbing material layer is composed of ferrite powder and multi-walled carbon nanotubes in a mass ratio of 7:3, with a thickness of 0.15mm-0.25mm.

[0020] By adopting the above technical solution, the reflection loss in the 3.5-5GHz frequency band is ≥15dB. The electromagnetic absorbing material layer is mainly composed of ferrite powder and multi-walled carbon nanotubes, with a mass ratio of ferrite powder to multi-walled carbon nanotubes of 7:3. The thickness of this material layer is designed to be 0.15mm to 0.25mm. Due to its high magnetic permeability, ferrite powder can effectively absorb and dissipate electromagnetic wave energy within the operating frequency band, significantly reducing reflection. Multi-walled carbon nanotubes, characterized by high conductivity and good mechanical properties, further improve the electromagnetic absorption performance and mechanical stability of the material. The combination of these two not only optimizes the electromagnetic absorption effect of the material but also ensures its structural strength and stability.

[0021] As a preferred embodiment, the tree-like fractal microchannel has a 5-level branch structure, with the first-level main trunk width being 0.8mm-0.85mm, the last-level branch width being 0.2mm-0.22mm, the branch angle being 55°-58°, and the total channel length being ≥1.2m.

[0022] By adopting the above technical solution, the width of the first-stage main channel is 0.8mm to 0.85mm, ensuring sufficient liquid introduction space and good initial fluid distribution. As the stage increases, the width of the final-stage branch gradually decreases to 0.2mm to 0.22mm, which is beneficial for subsequent precise fluid manipulation and large-scale fluid splitting. The branch angle is controlled between 55° and 58°, allowing the fluid to be distributed more evenly to each branch, reducing flow resistance and improving fluid transfer efficiency. The total channel length reaches 1.2m or more, enabling long-term and efficient fluid transfer, suitable for complex experiments or long-range analytical tasks.

[0023] As a preferred embodiment, the liquid metal working medium is a gallium-indium-tin ternary alloy with a mass percentage composition of Ga 65-70%, In 20-25%, and Sn 10-15%, a melting point ≤15℃, and a thermal conductivity ≥25W / m·K.

[0024] By adopting the above technical solution, the composition ratio enables this alloy to possess excellent low-temperature melting capability, maintaining a liquid state near room temperature, thus making it suitable for use in various applications with high requirements for heat transfer performance. Its low melting point (≤15℃) ensures the material's fluidity in low-temperature environments, facilitating efficient heat transfer and absorption. Furthermore, the alloy's high thermal conductivity (≥25 W / m·K) gives it extremely high heat transfer efficiency, significantly improving the performance of the thermal management system.

[0025] As a preferred embodiment, the heat dissipation fins have an inclination angle of 45°-47°, a height of 6mm-10mm, a spacing of 0.4mm-0.6mm, and an alumina ceramic layer formed on the surface by micro-arc oxidation treatment, with a film thickness of 20μm-30μm and a thermal emissivity ≥0.85.

[0026] By adopting the above technical solution, the tilt angle of the heat dissipation fins is 45°-47°, which helps to enhance airflow and effectively improve heat dissipation. The fin height is between 6mm and 10mm, which can adapt to different heat dissipation requirements and ensure sufficient space for heat exchange. The fin spacing is 0.4mm-0.6mm, which can effectively reduce airflow resistance and improve heat dissipation efficiency. The surface is treated with micro-arc oxidation to form an alumina ceramic layer with a film thickness of 20μm-30μm, which not only enhances the corrosion resistance and wear resistance of the material, but also increases the thermal emissivity of the heat dissipation fins to ≥0.85, effectively promoting rapid heat dissipation.

[0027] As a preferred embodiment, the shared power system includes a supercapacitor bank and a single-chip power management system, wherein the supercapacitor bank has a capacity of 3F-10F and an equivalent series resistance of ≤5mΩ, and the power management system integrates dynamic path management functionality.

[0028] By adopting the above technical solution, the power supply path is switched when a 5G communication transmission signal is detected. The supercapacitor bank, as part of the shared power system, has a capacity of 3F to 10F and can provide high-power instantaneous discharge to meet the high power requirements of 5G communication equipment. The equivalent series resistance of the supercapacitor bank is ≤5mΩ, meaning its internal resistance is very low, effectively reducing energy loss and ensuring power supply stability and efficiency. The power management section integrates a dynamic path management function, which automatically switches the power supply path when a 5G communication device transmission signal is detected, ensuring optimal power support for the 5G communication device and avoiding temporary power outages or insufficient power supply caused by path switching.

[0029] As a preferred embodiment, a reverse blocking diode is provided between the supercapacitor group and the micro visible light module, with a forward voltage drop ≤0.3V@2A.

[0030] By employing the above technical solution, the main function of the supercapacitor bank is to stabilize the voltage and provide instantaneous large current in the system, while the miniature visible light module is used to receive and convert visible light signals. The reverse blocking diode placed between the two prevents current from flowing in the opposite direction, ensuring that current can only flow from the supercapacitor bank to the miniature visible light module, thus protecting the supercapacitor bank from damage by reverse current. The forward voltage drop of the reverse blocking diode is less than or equal to 0.3V@2A, meaning that its impact on voltage under normal operating current conditions is very small, consuming almost no additional energy, thereby improving the overall efficiency of the system.

[0031] As a preferred embodiment, the 5G communication module adopts antenna packaging technology, and the distance between the antenna unit and the edge of the substrate in the 5G communication module is ≥1.5mm, and the impedance of the feed point is 50Ω-52Ω.

[0032] By adopting the above technical solutions, the antenna in the 5G communication module is implemented through antenna packaging technology, which can effectively improve the integration and stability of the antenna, thereby improving the transmission performance of electromagnetic waves. Maintaining a distance of at least 1.5mm between the antenna element and the edge of the substrate reduces mutual interference between the antenna and the substrate, improving the reliability of antenna performance. The impedance of the feed point is between 50Ω and 52Ω, which can match common RF transmission lines, ensuring efficient signal transmission, and also optimize the antenna's operating frequency band and coverage, ensuring good signal reception and transmission capabilities throughout the entire 5G communication frequency band.

[0033] In summary, this application includes the following beneficial technical effects:

[0034] 1. The 5G optoelectronic pod integrating miniature visible light equipment provides overall sealed protection through a protective shell, preventing dust and external environmental factors from damaging the equipment;

[0035] 2. The axial fan on the heat dissipation side plate can effectively dissipate heat and ensure that the operating temperature of the internal electronic components is kept within a safe range;

[0036] 3. Mounting frames and integrated templates are used to secure the 5G optoelectronic equipment inside the optoelectronic pod, ensuring the stability and precise alignment of the equipment;

[0037] 4. The transparent protective panel ensures the visibility of the equipment inside the pod while preventing external physical damage. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the overall structure of a 5G optoelectronic pod integrating a miniature visible light device, as described in this application.

[0039] Figure 2 This is a partial cross-sectional view of the overall structure of a 5G optoelectronic pod integrating a miniature visible light device, as described in this application.

[0040] Figure 3 This is a schematic diagram of the structure of the integrated module in a 5G optoelectronic pod that integrates a micro visible light device, as described in this application.

[0041] Figure 4 This is a schematic diagram of the thermal management substrate in a 5G optoelectronic pod that integrates a miniature visible light device according to this application.

[0042] Explanation of reference numerals in the attached drawings: 1. Protective housing; 10. Heat dissipation side plate; 101. Axial flow fan; 2. Transparent protective plate; 3. Mounting bracket; 4. Integrated template; 41. Miniature visible light module; 42. Electromagnetic shielding layer; 421. Wave absorbing material layer; 43. 5G communication module; 44. Thermal management substrate; 441. Tree-shaped fractal microchannel; 442. Heat dissipation fins; 5. Shared power system; 6. Through hole. Detailed Implementation

[0043] The present application will be further described in detail below with reference to the accompanying drawings.

[0044] Please refer to details. Figure 1 , Figure 2 , Figure 3 and Figure 4This application discloses a 5G optoelectronic pod integrating a miniature visible light device. It includes a protective housing 1, heat dissipation side plates 10 respectively disposed on both sides of the protective housing 1, an axial flow fan 101 disposed inside each heat dissipation side plate 10, a mounting bracket 3 disposed within the cavity of the protective housing 1, an integrated template 4 disposed within the mounting bracket 3, and a transparent protective plate 2 connected to the protective housing 1 and disposed relative to the integrated template 4. This 5G optoelectronic pod, integrating a miniature visible light device, provides overall sealed protection through the protective housing 1, preventing dust and external environmental factors from damaging the device. The axial flow fan 101 on the heat dissipation side plate 10 effectively dissipates heat, ensuring that the operating temperature of the internal electronic components remains within a safe range. The mounting bracket 3 and the integrated template 4 are used to fix the 5G optoelectronic device inside the optoelectronic pod, ensuring the stability and precise alignment of the device. The transparent protective plate 2 ensures the visibility of the device inside the pod while preventing external physical damage. In terms of working principle, when the equipment is running, the heat generated by the 5G optoelectronic equipment in the integrated template 4 is forcibly dissipated by the axial flow fan 101 inside the heat dissipation side plate 10. The airflow generated by the fan enters from one side of the heat dissipation side plate 10, passes through the inside of the protective shell 1, and then exits from the other side, forming an effective heat dissipation cycle. At the same time, the integrated template 4 and the transparent protective plate 2 ensure the normal working environment of the optoelectronic equipment and the transmission and reception of optical signals, enabling the 5G optoelectronic pod to operate efficiently and stably.

[0045] The integrated template 4 consists of a micro visible light module 41, an electromagnetic shielding layer 42, a 5G communication module 43, and a thermal management substrate 44, which are sequentially stacked from the light incident direction.

[0046] An electromagnetic absorbing material layer 421 is disposed between the electromagnetic shielding layer 42 and the imaging module;

[0047] Vertical interconnect vias 6, with a diameter of 50 μm, are used to connect the miniature visible light module 41, the electromagnetic shielding layer 42, the 5G communication module 43, and the thermal management substrate 44, replacing traditional cable connections and reducing space occupation by 60%.

[0048] A tree-like fractal microchannel 441 penetrating the thermal management substrate 44 is filled with liquid metal working fluid.

[0049] Radial heat dissipation fins 442 coupled to the outer surface of the thermal management substrate 44;

[0050] A shared power supply system 5 for powering the miniature visible light module 41 and the 5G communication module 43.

[0051] Specifically, the miniature visible light module 41 is responsible for receiving and transmitting visible light signals; the electromagnetic shielding layer 42 is used to block external electromagnetic interference, ensuring stable operation of the system; and the 5G communication module 43 enables high-speed wireless communication. An electromagnetic absorbing material layer 421 is disposed between the electromagnetic shielding layer 42 and the imaging module, absorbing and dissipating electromagnetic interference to enhance the system's anti-interference capability. Vertical interconnect vias 6 replace traditional cables for connection, reducing space occupation by up to 60% and improving data transmission efficiency between components. A tree-like fractal microchannel 441 penetrates the thermal management substrate 44, filled with liquid metal working fluid for efficient thermal management. Radial heat dissipation fins 442 are attached to the outer surface of the thermal management substrate 44, further improving heat dissipation efficiency. Finally, a shared power system 5 supplies power to the miniature visible light module 41 and the 5G communication module 43, ensuring both operate efficiently and stably.

[0052] Please refer to details. Figure 2 , Figure 3 and Figure 4 In one embodiment, the miniature visible light module 41 is configured as a CMOS imaging module with a focal length of 4.2mm and a field of view (FOV) of 84°. The CMOS imaging module in the miniature visible light module 41 is responsible for capturing image information. It converts light into electrical signals through a photosensitive element, thereby recording the image. The 4.2mm focal length design allows for focus adjustment, effectively controlling image quality and imaging distance. The 84° FOV ensures effective imaging over a wide range, enabling clear and complete fields of view in various application scenarios. Its working principle is as follows: After receiving light, the CMOS imaging module converts the light signal into an electrical signal, and then processes it through internal circuitry to convert it into digital image data. This data then undergoes internal focusing processing to ensure imaging quality at different distances. Finally, the 84° FOV optical design ensures image clarity throughout the entire field of view, meeting application needs in various environments and providing high-quality image information output.

[0053] In one embodiment, please refer to [specific example]. Figure 3 The electromagnetic shielding layer 42 is made of cold-rolled permalloy sheet with a thickness of 0.05-0.1 mm, a saturation magnetic induction intensity ≥0.75 T, and a relative permeability ≥60.000. This material provides excellent electromagnetic shielding performance. Its main function is to block and absorb external electromagnetic interference, protecting internal electronic equipment from external electromagnetic fields. The high saturation magnetic induction intensity of cold-rolled permalloy (≥0.75 Tesla) ensures a strong magnetic field strength, effectively shielding electromagnetic waves. Furthermore, its relative permeability ≥60.000 means that the material can efficiently concentrate and guide the magnetic field, further enhancing the shielding effect.

[0054] In one embodiment, please refer to [specific example]. Figure 3 The electromagnetic absorbing material layer 421 is composed of ferrite powder and multi-walled carbon nanotubes in a 7:3 mass ratio, with a thickness of 0.15mm-0.25mm. It exhibits a reflection loss ≥15dB in the 3.5-5GHz frequency band. The layer primarily consists of ferrite powder and multi-walled carbon nanotubes, with a mass ratio of 7:3. The thickness of this material layer is designed to be 0.15mm to 0.25mm. Due to its high permeability, the ferrite powder effectively absorbs and dissipates electromagnetic wave energy within the operating frequency band, significantly reducing reflection. Meanwhile, the multi-walled carbon nanotubes, characterized by high conductivity and good mechanical properties, further enhance the material's electromagnetic absorption performance and mechanical stability. This combination not only optimizes the material's electromagnetic absorption effect but also ensures its structural strength and stability.

[0055] In one embodiment, please refer to [specific example]. Figure 3 and Figure 4 The tree-like fractal microchannel 441 features a 5-level branching structure. The width of the first-level main trunk is 0.8mm-0.85mm, the width of the final-level branches is 0.2mm-0.22mm, the branching angle is 55°-58°, and the total channel length is ≥1.2m. The 0.8mm-0.85mm width of the first-level main trunk ensures sufficient liquid introduction space and good initial fluid distribution. As the level increases, the width of the final-level branches gradually decreases to 0.2mm-0.22mm, which is beneficial for subsequent fine fluid manipulation and large-scale fluid splitting. The branching angle is controlled between 55° and 58°, allowing for more uniform fluid distribution to each branch, reducing flow resistance and improving fluid transport efficiency. With a total channel length of 1.2m or more, it enables long-term and efficient fluid transport, suitable for complex experiments or long-range analytical tasks.

[0056] In one embodiment, please refer to [specific example]. Figure 4 The liquid metal working medium is a gallium-indium-tin ternary alloy with a mass percentage composition of Ga 65-70%, In 20-25%, and Sn 10-15%. It has a melting point ≤15℃ and a thermal conductivity ≥25 W / m·K. This composition gives the alloy excellent low-temperature melting capability, allowing it to remain liquid near room temperature, making it suitable for various applications with high heat transfer requirements. Its low melting point (≤15℃) ensures the material's fluidity at low temperatures, facilitating efficient heat transfer and absorption. Furthermore, the alloy's high thermal conductivity (≥25 W / m·K) provides extremely high heat transfer efficiency, significantly improving the performance of the thermal management system.

[0057] In one embodiment, please refer to [specific example]. Figure 4The heat dissipation fins 442 have an angle of 45°-47°, a height of 6mm-10mm, and a spacing of 0.4mm-0.6mm. The surface undergoes micro-arc oxidation treatment to form an alumina ceramic layer with a film thickness of 20μm-30μm and a thermal emissivity ≥0.85. The 45°-47° angle of the heat dissipation fins helps enhance airflow and effectively improve heat dissipation. The fin height of 6mm-10mm can adapt to different heat dissipation requirements, ensuring sufficient space for heat exchange. The fin spacing of 0.4mm-0.6mm effectively reduces airflow resistance and improves heat dissipation efficiency. The micro-arc oxidation treatment to form an alumina ceramic layer with a film thickness of 20μm-30μm not only enhances the material's corrosion resistance and wear resistance but also increases the thermal emissivity of the heat dissipation fins 442 to ≥0.85, effectively promoting rapid heat dissipation.

[0058] In one embodiment, please refer to [specific example]. Figure 2 and Figure 3 The shared power system 5 includes a supercapacitor bank and a single-chip power management unit. The supercapacitor bank has a capacity of 3F-10F and an equivalent series resistance ≤5mΩ. The power management unit integrates dynamic path management, switching the power supply path when a 5G communication transmission signal is detected. As part of the shared power system 5, the supercapacitor bank, with a capacity of 3F to 10F, can provide high-power instantaneous discharge to meet the high power requirements of 5G communication equipment. The equivalent series resistance of the supercapacitor bank is ≤5mΩ, meaning its internal resistance is very low, effectively reducing energy loss and ensuring power supply stability and efficiency. The power management unit integrates a dynamic path management function, which automatically switches the power supply path when a 5G communication device transmission signal is detected, ensuring optimal power support for the 5G communication device and avoiding temporary power outages or insufficient power supply due to path switching. The working principle is: the supercapacitor bank provides high-power, high-efficiency power output, while the power management unit, based on dynamic path management technology, automatically selects the optimal power supply path when the device is operating, ensuring the stable operation of the 5G communication equipment.

[0059] In one embodiment, please refer to [specific example]. Figure 2 and Figure 3A reverse blocking diode with a forward voltage drop ≤0.3V@2A is provided between the supercapacitor bank and the miniature visible light module 41. The main function of the supercapacitor bank is to stabilize the voltage and provide instantaneous large current in the system, while the miniature visible light module 41 is used to receive and convert visible light signals. The reverse blocking diode between the two prevents current from flowing in the opposite direction, ensuring that current can only flow from the supercapacitor bank to the miniature visible light module 41, thus protecting the capacitor bank from damage by reverse current. The forward voltage drop of the reverse blocking diode is less than or equal to 0.3V@2A, which means that it has a very small impact on the voltage under normal operating current conditions and consumes almost no additional energy, thereby improving the overall efficiency of the system. When the supercapacitor bank supplies power to the miniature visible light module 41, the voltage is transmitted through the diode, achieving efficient and stable energy transfer and ensuring that the miniature visible light module 41 can operate stably without being affected by reverse current.

[0060] In one embodiment, please refer to [specific example]. Figure 3 The 5G communication module 43 employs antenna packaging technology, and the distance between the antenna element and the edge of the substrate within the 5G communication module 43 is ≥1.5mm. The feed point impedance is 50Ω-52Ω. The antenna in the 5G communication module 43 is implemented through antenna packaging technology, which can effectively improve the integration and stability of the antenna, thereby improving the transmission performance of electromagnetic waves. Maintaining a distance of at least 1.5mm between the antenna element and the edge of the substrate can reduce mutual interference between the antenna and the substrate, improving the reliability of antenna performance. The impedance of the feed point is between 50Ω and 52Ω, which can not only match common RF transmission lines to ensure efficient signal transmission, but also optimize the antenna's operating frequency band and coverage, ensuring good signal reception and transmission capabilities throughout the entire 5G communication frequency band.

[0061] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A 5G optoelectronic pod integrating a miniature visible light device, characterized in that: It includes a protective housing (1), heat dissipation side plates (10) respectively disposed on both sides of the protective housing (1), an axial flow fan (101) disposed inside each heat dissipation side plate (10), a mounting bracket (3) disposed in the inner cavity of the protective housing (1), an integrated template (4) disposed in the mounting bracket (3), and a transparent protective plate (2) connected to the protective housing (1) and disposed relative to the integrated template (4); The integrated template (4) consists of a micro visible light module (41), an electromagnetic shielding layer (42), a 5G communication module (43), and a thermal management substrate (44) stacked sequentially from the light incident direction. An electromagnetic absorbing material layer (421) is disposed between the electromagnetic shielding layer (42) and the imaging module. Vertical interconnect vias (6) for connecting the micro visible light module (41), electromagnetic shielding layer (42), 5G communication module (43) and thermal management substrate (44): 50μm in diameter, replacing traditional cable connections and reducing space occupation; A tree-like fractal microchannel (441) penetrating the thermal management substrate (44) is filled with liquid metal working fluid; Radial heat dissipation fins (442) coupled to the outer surface of the thermal management substrate (44); A shared power supply system (5) for powering a micro visible light module (41) and a 5G communication module (43).

2. The 5G optoelectronic pod integrating a miniature visible light device according to claim 1, characterized in that: The miniature visible light module (41) is configured as a CMOS imaging module with a focal length of 4.2 mm and an FOV of 84°.

3. A 5G optoelectronic pod integrating a miniature visible light device according to claim 2, characterized in that: The electromagnetic shielding layer (42) is a cold-rolled permalloy sheet with a thickness of 0.05-0.1 mm, a saturation magnetic induction intensity ≥0.75 T, and a relative permeability ≥60.

000.

4. A 5G optoelectronic pod integrating a miniature visible light device according to claim 3, characterized in that: The electromagnetic absorbing material layer (421) is composed of ferrite powder and multi-walled carbon nanotubes in a mass ratio of 7:3, with a thickness of 0.15mm-0.25mm.

5. A 5G optoelectronic pod integrating a miniature visible light device according to claim 4, characterized in that: The tree-like fractal microchannel (441) has a 5-level branch structure, with the first-level main trunk width being 0.8mm-0.85mm, the last-level branch width being 0.2mm-0.22mm, the branch angle being 55°-58°, and the total channel length being ≥1.2m.

6. A 5G optoelectronic pod integrating a miniature visible light device according to claim 5, characterized in that: The liquid metal working medium is a gallium-indium-tin ternary alloy with a mass percentage composition of Ga 65-70%, In 20-25%, and Sn 10-15%, a melting point ≤15℃, and a thermal conductivity ≥25W / m·K.

7. A 5G optoelectronic pod integrating a miniature visible light device according to claim 6, characterized in that: The heat dissipation fins (442) have an inclination angle of 45°-47°, a height of 6mm-10mm, a spacing of 0.4mm-0.6mm, and an alumina ceramic layer formed on the surface by micro-arc oxidation treatment, with a film thickness of 20μm-30μm and a thermal emissivity ≥0.

85.

8. A 5G optoelectronic pod integrating a miniature visible light device according to claim 7, characterized in that: The shared power system (5) includes a supercapacitor bank and a single-chip power management system. The supercapacitor bank has a capacity of 3F-10F and an equivalent series resistance of ≤5mΩ. The power management system integrates dynamic path management functions.

9. A 5G optoelectronic pod integrating a miniature visible light device according to claim 8, characterized in that: A reverse blocking diode is provided between the supercapacitor group and the micro visible light module (41), with a forward voltage drop ≤0.3V@2A.

10. A 5G optoelectronic pod integrating a miniature visible light device according to claim 9, characterized in that: The 5G communication module (43) adopts antenna packaging technology, and the distance between the antenna unit in the 5G communication module (43) and the edge of the substrate is ≥1.5mm, and the impedance of the feed point is 50Ω-52Ω.

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