Electronic device comprising damper attached to shield can
The damper structure with a film and elastic material in the shield can addresses EMI shielding and heat dissipation challenges, enhancing thermal management in electronic devices.
WO2026127367A1PCT designated stage Publication Date: 2026-06-18SAMSUNG ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2025-10-30
- Publication Date
- 2026-06-18
Smart Images
Figure KR2025017629_18062026_PF_FP_ABST
Abstract
An electronic device according to one embodiment may comprise: a printed circuit board; a shield can which is arranged on the printed circuit board, and which includes a top wall including a hole and a side wall extending from the top wall to the printed circuit board; an electronic component arranged on the printed circuit board and located in the inner space of the shield can defined by the top wall and the side wall of the shield can; and a damper. The damper can comprise : a film which is arranged on the top wall of the shield can so as to cover the hole, and which includes a slit overlapping the hole; and an elastic material, which is located in the hole, is attached to the film, and includes a slit. The electronic device can comprise a thermal interface material (TIM), which at least partially fills the inner space of the shield can and thermally connects the electronic component to the shield can.
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