Integrated circuit carrier
By designing an integrated circuit transport device and employing a combination of loading units, dust-adhesive components, and locking components, the problems of integrated circuit products sticking and contaminating during transportation were solved, achieving safe and efficient transportation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ASE SHANGHAI
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-19
Smart Images
Figure CN224376250U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the semiconductor field, and more specifically, to an integrated circuit carrier device. Background Technology
[0002] In existing technologies, after the green paint coating process is carried out in a cleanroom, the paint layer is not yet completely dry. At this stage, special containers are required to prevent the products from sticking together when stacked. Currently, there is a lack of a transportation device that can effectively transport the containers while preventing the products from being contaminated or damaged. Utility Model Content
[0003] In view of this, one of the objectives of this application is to provide an integrated circuit carrier device to solve the above-mentioned problems.
[0004] According to one embodiment of this application, an integrated circuit transport device is provided. The integrated circuit transport device includes a loading unit and a wheel assembly. The loading unit includes a loading space, a dust-adhesive component, a transmission component, and a locking component. The dust-adhesive component is disposed at the bottom of the loading space. The transmission component is disposed above the dust-adhesive component. The transmission component is used to transport a container loaded with integrated circuits into the loading space. The locking component is disposed at the entrance of the loading space. The locking component is used to limit the container. The wheel assembly is disposed below the loading unit.
[0005] According to one embodiment of this application, the adhesive component includes a replaceable adhesive assembly.
[0006] According to one embodiment of this application, the transmission component includes a plurality of parallel-arranged rollers.
[0007] According to one embodiment of this application, the locking component includes a limiting piece and a rivet. The limiting piece includes a limiting hole, and the rivet is embedded in the limiting hole.
[0008] According to one embodiment of this application, the locking component further includes a base, and the limiting piece is configured to move relative to the base and the rivet to present a vertical or horizontal posture relative to the base and the rivet.
[0009] According to one embodiment of this application, the loading unit is the first loading unit. The integrated circuit carrier further includes a second loading unit. The first loading unit and the second loading unit are arranged vertically or horizontally. Attached Figure Description
[0010] The accompanying drawings are provided to further illustrate the present application and form part of the specification. They are used together with the following detailed description to explain the present application, but do not constitute a limitation thereof. In the drawings:
[0011] Figure 1 A block diagram illustrating an integrated circuit carrier device according to an embodiment of this application.
[0012] Figure 2 A schematic diagram illustrating an integrated circuit carrier device according to an embodiment of this application.
[0013] Figure 3 A schematic diagram illustrating a locking component according to an embodiment of this application. Detailed Implementation
[0014] The following disclosure provides various implementations or examples that can be used to achieve different features of this disclosure. Specific examples of components and configurations described below are for simplification purposes. It is understood that these descriptions are illustrative only and are not intended to limit the scope of this disclosure. For example, in the following description, forming a first feature on or over a second feature may include, in some embodiments, the first and second features being in direct contact with each other; and may also include, in some embodiments, additional components being formed between the first and second features, such that the first and second features may not be in direct contact. Furthermore, component symbols and / or reference numerals may be reused in multiple embodiments of this disclosure. Such reuse is for the purpose of brevity and clarity and does not in itself represent a relationship between the different embodiments and / or configurations discussed.
[0015] Furthermore, the use of spatially relative terms, such as "below," "below," "lower than," "above," "above," and similar terms, may be for the convenience of describing the relationship between one component or feature depicted in the figure and one or more other components or features. These spatially relative terms, in addition to the orientation shown in the figure, also encompass various different orientations of the device during use or operation. The device may be placed in other orientations (e.g., rotated 90 degrees or in other orientations), and these spatially relative descriptive terms should be interpreted accordingly.
[0016] While the numerical ranges and parameters used to define the broader scope of this application are approximate values, the relevant values in the specific embodiments have been presented as precisely as possible. However, any numerical value inevitably contains standard deviations due to individual test methods. Here, "approximately" generally means that the actual value is within plus or minus 10%, 5%, 1%, or 0.5% of a particular value or range. Alternatively, the term "approximately" means that the actual value falls within the acceptable standard error of the average value, as determined by those skilled in the art to which this application pertains. It is understood that, except for experimental examples, or unless expressly stated otherwise, all ranges, quantities, values, and percentages used herein (e.g., to describe material usage, duration, temperature, operating conditions, quantity ratios, and the like) are modified with "approximately". Therefore, unless otherwise stated, the numerical parameters disclosed in this specification and the accompanying claims are approximate values and are subject to change as needed. At a minimum, these numerical parameters should be understood as the indicated significant digits and values obtained by applying general rounding. Here, a range of values is expressed as a distance from one endpoint to the other or between the two endpoints; unless otherwise stated, the range of values described herein includes the endpoints.
[0017] Figure 1 This is a block diagram illustrating an integrated circuit transport device 10 according to an embodiment of this application. In some embodiments, the integrated circuit transport device 10 is configured to transport integrated circuits. In some embodiments, the integrated circuit transport device 10 is configured to transport an integrated circuit board that has undergone a green paint coating process. In some embodiments, the integrated circuit transport device 10 includes a loading unit 11 and a wheel assembly 12. In some embodiments, the loading unit 11 includes a loading space 111, a dust-adhesive component 112, a transmission component 113, and a locking component 114. In some embodiments, the dust-adhesive component 112 is disposed at the bottom of the loading space 111. In some embodiments, the transmission component 113 is disposed above the dust-adhesive component 112. In some embodiments, the transmission component 113 is used to transport a container holding integrated circuits into the loading space 111. In some embodiments, the locking component 114 is disposed at the entrance of the loading space 111. In some embodiments, the locking component 114 is used to limit the container. In some embodiments, the wheel assembly 12 is disposed below the loading unit 11.
[0018] Figure 2 A schematic diagram illustrating an integrated circuit carrier device 20 according to an embodiment of this application. In some embodiments, Figure 2 The integrated circuit carrier device 20 shown can be used to implement Figure 1The integrated circuit carrier device 10. In some embodiments, the integrated circuit carrier device 20 includes a loading unit 21 and a wheel assembly 22. In some embodiments, the loading unit 21 includes a loading space 211, a dust-adhesive component 212, a transmission component 213, and a locking component 214.
[0019] In some embodiments, the wheel assembly 22 is positioned below the loading unit 21.
[0020] In some embodiments, the adhesive component 212 is disposed at the bottom of the loading space 211. In some embodiments, the adhesive component 212 includes a replaceable adhesive assembly. In some embodiments, the adhesive component 212 may consist of multiple adhesive pads, allowing for easy replacement and cleaning by removing the top adhesive pad when foreign objects or dust fall onto the adhesive component 212.
[0021] In some embodiments, the transfer member 213 is positioned above the dust-adhesive member 212. In some embodiments, the transfer member 213 includes a plurality of parallel rollers G213. The rollers G213 are capable of rolling. When a user needs to place a container containing integrated circuits into the loading space 211, the plurality of rollers G213 of the transfer member 213 can help the container move easily into the loading space 211.
[0022] In some embodiments, a locking member 214 is disposed at the entrance of the loading space 211. The locking member 214 is used to limit the container when it is placed into the loading space 211, preventing the container from shifting and falling off during the movement of the integrated circuit carrier 20. Figure 3 This diagram illustrates a locking component 214 according to an embodiment of this application. In some embodiments, the locking component 214 includes a base 31, a limiting piece 32, and a rivet 33. In some embodiments, the limiting piece 32 includes a limiting hole A32. In some embodiments, the rivet 33 is embedded in the limiting hole A32. In some embodiments, when the locking component 214 is not in a limiting position, as shown in sub-Figure (a), the limiting piece 32 is in a vertical position relative to the base 31 and the rivet 33, with the bottom of the limiting piece 32 located within the base 31 and the rivet 33 located at the top of the limiting hole A32. In some embodiments, when the locking component 214 is in a limiting position, as shown in sub-Figure (b), the user first raises the limiting piece 32 so that the rivet 33 leaves the top of the limiting hole A32 and the bottom of the limiting piece 32 leaves the base 31, and then places the limiting piece 32 horizontally, forming a horizontal position relative to the base 31 and the rivet 33, thereby forming a latch to achieve the limiting effect.
[0023] Although Figure 2The integrated circuit carrier device 20 shown has only one loading unit; however, in other embodiments, the integrated circuit carrier device 20 may have two or more loading units. For example, the integrated circuit carrier device 20 has two loading units, which may be arranged vertically or horizontally to increase the loading capacity.
[0024] As used herein, the terms “approximately,” “substantially,” “essentially,” and “about” are used to describe and account for small variations. When used in conjunction with an event or situation, the terms may refer to examples where the event or situation occurs precisely or very approximately. As used herein with respect to a given value or range, the term “about” generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. A range may be expressed herein as from one endpoint to another or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term “substantially coplanar” may refer to two surfaces located along the same plane within a few micrometers (μm), for example, within 10 μm, 5 μm, 1 μm, or 0.5 μm along the same plane. When referring to “substantially” identical numerical values or characteristics, the term may refer to values within ±10%, ±5%, ±1%, or ±0.5% of the average of said values.
[0025] As used herein, the terms “approximately,” “substantially,” “essentially,” and “about” are used to describe and explain small variations. When used in conjunction with an event or situation, the terms may refer to examples where the event or situation occurred precisely or where it occurred very approximately. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values is less than or equal to ±10% of the average of the values (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values can be considered "substantially" or "approximately" the same. For example, "substantially" parallel can refer to an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “basically” vertical can refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.
[0026] For example, if the displacement between two surfaces is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm, then the two surfaces can be considered coplanar or substantially coplanar. If the displacement between any two points on a surface relative to a plane is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm, then the surface can be considered planar or substantially planar.
[0027] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to transfer electric current. Conductive materials generally indicate those that exhibit little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, a conductive material is one with a conductivity greater than approximately 10⁴ S / m (e.g., at least 10⁵ S / m or at least 10⁶ S / m). The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.
[0028] As used herein, unless the context clearly indicates otherwise, the singular terms “a / an” and “the” may include plural indicators. In the description of some embodiments, a component provided “on” or “above” another component may cover the case where the preceding component is directly on the following component (e.g., in physical contact with the following component), and the case where one or more intermediate components are located between the preceding and following components.
[0029] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” “upper,” “lower,” “left,” “right,” etc., may be used to describe the relationship between one component or feature and another component or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly. It should be understood that when a component is referred to as “connected to” or “coupled to” another component, it may be directly connected to or coupled to said other component, or there may be an intermediate component.
[0030] The foregoing outlines several embodiments and detailed features of this disclosure. The embodiments described in this disclosure can readily serve as the basis for designing or modifying other processes and structures for performing the same or similar purposes and / or obtaining the same or similar advantages of the embodiments introduced herein. These equivalent constructions do not depart from the spirit and scope of this disclosure and various changes, substitutions, and modifications can be made without departing from the spirit and scope of this disclosure.
Claims
1. An integrated circuit carrier device, characterized by include: Loading unit, including: Loading space; A dust-adhesive component is located at the bottom of the loading space; A transfer component, disposed above the adhesive component, is used to transfer the container holding the integrated circuit to the loading space; and A locking component, disposed at the entrance of the loading space, is used to limit the container; and The wheel assembly is located below the loading unit.
2. The integrated circuit carrier device according to claim 1, characterized in that, The adhesive component includes a replaceable adhesive assembly.
3. The integrated circuit carrier device according to claim 1, characterized in that, The transmission component includes multiple parallel rollers.
4. The integrated circuit carrier device according to claim 1, characterized in that, The locking component includes a limiting piece and a rivet. The limiting piece includes a limiting hole, and the rivet is embedded in the limiting hole.
5. The integrated circuit carrier device according to claim 4, characterized in that, The locking component also includes a base, and the limiting piece is configured to move relative to the base and the rivet to be in a vertical or horizontal orientation relative to the base and the rivet.
6. The integrated circuit carrier device according to claim 1, characterized in that, The loading unit is the first loading unit, and the integrated circuit transport device further includes: The second loading unit is arranged vertically or horizontally with respect to the first loading unit and the second loading unit.