Transplanting device and PCB testing apparatus

By designing an automated transfer device and vacuum logic valve control, the problem of cumbersome vacuum suction cup position adjustment in existing technologies has been solved, achieving efficient PCB board transfer.

CN224377015UActive Publication Date: 2026-06-19HANS CNC SCI & TECH +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANS CNC SCI & TECH
Filing Date
2025-07-04
Publication Date
2026-06-19

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    Figure CN224377015U_ABST
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Abstract

This utility model belongs to the field of PCB board testing technology, and relates to a transfer device and PCB board testing equipment. The transfer device includes a first transfer driving unit, a second transfer driving unit, a first adsorption unit, and a second adsorption unit. The first transfer driving unit drives the first adsorption unit to reciprocate between a loading position and a transfer position, and the second transfer driving unit drives the second adsorption unit to reciprocate between a unloading position and a transfer position. The first adsorption unit includes a first adsorption assembly, which includes multiple first vacuum suction cups, each of which is connected to a first vacuum logic valve. The second adsorption unit includes a second adsorption assembly, which includes multiple second vacuum suction cups. This transfer device simplifies operation and saves time required to adjust the positions of the first vacuum suction cups when the PCB board size changes.
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Description

Technical Field

[0001] This utility model belongs to the field of PCB board testing technology, and in particular relates to a transfer device and PCB board testing equipment. Background Technology

[0002] Existing transfer devices, when transferring PCBs of different sizes, require individual adjustments to the positions of each vacuum suction cup on the transfer device for different PCB sizes. This is because the cutout positions on PCBs vary, ensuring that each vacuum suction cup can adhere to the non-cutout areas of the PCB. This prevents one suction cup from being connected to external gas for an extended period when encountering a cutout, thus affecting the vacuum level of other suction cups. However, this individual adjustment method is cumbersome, time-consuming, and inefficient. Utility Model Content

[0003] The technical problem to be solved by this utility model is: to address the cumbersome operation of the existing method of adjusting the position of each vacuum suction cup on the transfer device for PCB boards of different sizes, and to provide a transfer device and PCB board testing equipment.

[0004] To solve the above-mentioned technical problems, on the one hand, this utility model provides a transplanting device, including a first transplanting driving unit, a second transplanting driving unit, a first adsorption unit, a second adsorption unit, and a controller. The controller is connected to the first transplanting driving unit and the second transplanting driving unit. The controller is used to control the first transplanting driving unit to drive the first adsorption unit to reciprocate between the loading position and the transfer position, and to control the second transplanting driving unit to drive the second adsorption unit to reciprocate between the unloading position and the transfer position.

[0005] The first adsorption unit includes a first adsorption component, which includes a plurality of first vacuum suction cups, each of which is connected to a first vacuum logic valve; the controller is also connected to the first vacuum logic valve, and the controller is used to control the first vacuum logic valve to close the adsorption channel of the first vacuum suction cup connected to it when the first vacuum suction cup connected to it is in communication with the outside gas.

[0006] The second adsorption unit includes a second adsorption component, which includes a plurality of second vacuum suction cups.

[0007] According to the transfer device of this utility model embodiment, on the one hand, the first transfer driving unit drives the first adsorption unit to reciprocate between the loading position and the transfer position, and the second transfer driving unit drives the second adsorption unit to reciprocate between the unloading position and the transfer position, thereby realizing the automation of PCB board transfer between the loading position, the transfer position and the unloading position and improving transfer efficiency; on the other hand, a first vacuum logic valve is connected to each first vacuum suction cup, and the adsorption channel of the corresponding first vacuum suction cup is automatically opened and closed by each first vacuum logic valve. When a first vacuum suction cup encounters a cutout position, its corresponding first vacuum logic valve will close its adsorption channel to avoid affecting the vacuum degree of other first vacuum suction cups, which can simplify operation and save the time required to adjust the position of each first vacuum suction cup when the PCB board size changes.

[0008] Optionally, the transplanting device further includes a transplanting bracket, and the first transplanting drive unit and the second transplanting drive unit are mounted on the transplanting bracket.

[0009] Optionally, the loading position, the transfer position, and the unloading position are arranged sequentially at intervals along the first direction.

[0010] Optionally, the first transplanting driving unit includes a first transplanting driving component and a second transplanting driving component. The first transplanting driving component is mounted on the transplanting bracket, and the second transplanting driving component is tractively connected between the first transplanting driving component and the first adsorption unit. The first transplanting driving component is used to drive the second transplanting driving component to move along the first direction, and the second transplanting driving component is used to drive the first adsorption unit to move along the second direction.

[0011] The second transplanting drive unit includes a third transplanting drive component and a fourth transplanting drive component. The third transplanting drive component is mounted on the transplanting bracket, and the fourth transplanting drive component is tractively connected between the third transplanting drive component and the second adsorption unit. The third transplanting drive component is used to drive the fourth transplanting drive component to move along the first direction, and the fourth transplanting drive component is used to drive the second adsorption unit to move along the second direction.

[0012] The second direction intersects with the first direction.

[0013] Optionally, the first transplanting drive assembly includes a first transplanting driver and a first transplanting transmission structure. The first transplanting driver is mounted on the transplanting bracket, and the first transplanting transmission structure is drively connected between the first transplanting driver and the second transplanting drive assembly. The first transplanting driver drives the second transplanting drive assembly to move along the first direction through the first transplanting transmission structure.

[0014] The third transplanting drive assembly includes a third transplanting driver and a third transplanting transmission structure. The third transplanting driver is mounted on the transplanting bracket, and the third transplanting transmission structure is drively connected between the third transplanting driver and the fourth transplanting drive assembly. The third transplanting driver drives the fourth transplanting drive assembly to move along the first direction through the third transplanting transmission structure.

[0015] The second direction is the height direction, and the first transplanting transmission structure is located above the third transplanting transmission structure along the second direction, or the first transplanting transmission structure is located below the third transplanting transmission structure along the second direction.

[0016] Optionally, the first transplanting transmission structure includes a first transplanting drive wheel, a first transplanting timing belt, and a first transplanting timing pulley. The first transplanting drive wheel and the first transplanting timing pulley are rotatably connected to the transplanting bracket. The central axis of the first transplanting drive wheel is parallel to the central axis of the first transplanting timing pulley, and the central axis of the first transplanting drive wheel is perpendicular to the first direction. The first transplanting timing belt is wound around the first transplanting drive wheel and the first transplanting timing pulley.

[0017] The first transplanter is used to drive the first transplant drive wheel to rotate;

[0018] The second transplant drive component is connected to the first transplant synchronization belt.

[0019] Optionally, the third transplanting transmission structure includes a second transplanting drive wheel, a second transplanting timing belt, and a second transplanting timing pulley. The second transplanting drive wheel and the second transplanting timing pulley are rotatably connected to the transplanting bracket. The central axis of the second transplanting drive wheel is parallel to the central axis of the second transplanting timing pulley, and the central axis of the second transplanting drive wheel is perpendicular to the first direction. The second transplanting timing belt is wound around the second transplanting drive wheel and the second transplanting timing pulley.

[0020] The third transplanter is used to drive the second transplanter drive wheel to rotate;

[0021] The fourth transplant drive component is connected to the second transplant synchronization belt.

[0022] Optionally, the second transplanting drive assembly includes a first transmission bracket and a second transplanting driver. The first transmission bracket is drively connected to the first transplanting transmission structure, and the second transplanting driver is mounted on the first transmission bracket. The second transplanting driver is a linear driver, used to drive the first adsorption unit to move along the second direction; or,

[0023] The second transplanting drive assembly includes a first transmission bracket, a second transplanting driver, and a second transplanting transmission structure. The first transmission bracket is connected to the first transplanting transmission structure. The second transplanting driver is mounted on the first transmission bracket. The second transplanting transmission structure is connected between the second transplanting driver and the first adsorption unit. The second transplanting driver drives the first adsorption unit to move along the second direction through the second transplanting transmission structure.

[0024] Optionally, the fourth transplanting drive assembly includes a second transmission bracket and a fourth transplanting driver. The second transmission bracket is connected to the third transplanting transmission structure, and the fourth transplanting driver is mounted on the second transmission bracket. The fourth transplanting driver is a linear driver, used to drive the second adsorption unit to move along the second direction; or,

[0025] The fourth transplanting drive assembly includes a second transmission bracket, a fourth transplanting driver, and a fourth transplanting transmission structure. The second transmission bracket is connected to the third transplanting transmission structure. The fourth transplanting driver is mounted on the second transmission bracket. The fourth transplanting transmission structure is connected between the fourth transplanting driver and the second adsorption unit. The fourth transplanting driver drives the second adsorption unit to move along the second direction through the fourth transplanting transmission structure.

[0026] Optionally, the first transplanting drive unit further includes a fifth transplanting drive component, which is tractively connected between the second transplanting drive component and the first adsorption unit. The fifth transplanting drive component is used to drive the first adsorption unit to rotate about an axis parallel to the second direction.

[0027] Optionally, the transplanting support is provided with a slide rail extending along the first direction, and the second transplanting drive assembly and the fourth transplanting drive assembly are slidably connected to the slide rail along the first direction.

[0028] Optionally, the second transplanting drive component and the fourth transplanting drive component can move closer to or further away from each other along the first direction;

[0029] The transplanting device also includes an anti-collision sensor and an anti-collision sensing element, wherein the anti-collision sensor and the anti-collision sensing element are respectively installed on the side of the second transplanting drive assembly and the fourth transplanting drive assembly that are close to each other; the anti-collision sensor is provided with a sensing space;

[0030] When the second transplanting drive assembly and the fourth transplanting drive assembly approach each other along the first direction, the anti-collision sensor can approach the sensing space; when the second transplanting drive assembly and the fourth transplanting drive assembly move away from each other along the first direction, the anti-collision sensor can move away from the sensing space.

[0031] Optionally, the first adsorption unit further includes a first adsorption mounting frame and two second adsorption mounting frames. The first adsorption mounting frame is connected to the second transplanting drive component. The two second adsorption mounting frames are arranged opposite each other along a third direction, and the two second adsorption mounting frames are slidably connected to the first adsorption mounting frame along a third direction. Each second adsorption mounting frame is equipped with at least one of the first adsorption components.

[0032] The third direction is perpendicular to the second direction.

[0033] Optionally, the first adsorption component can move relative to the second adsorption mounting frame in a fourth direction;

[0034] The fourth direction and the third direction are perpendicular to each other and to the second direction.

[0035] Optionally, the first adsorption assembly further includes a first suction cup frame and a first magnetic suction element, wherein the first vacuum suction cup and the first magnetic suction element are mounted on the first suction cup frame;

[0036] The second adsorption mounting bracket is equipped with a first magnetic attraction component, which can magnetically attract the first magnetic attraction component.

[0037] Optionally, the second adsorption mounting bracket is provided with a first groove extending along the fourth direction, and the first adsorption component can slide and engage with the first groove.

[0038] Optionally, at least one of the first adsorption components is provided with a first adsorption sensor, which is used to detect whether the first adsorption unit is unloaded.

[0039] Optionally, the second adsorption unit further includes a third adsorption mounting frame and two fourth adsorption mounting frames. The third adsorption mounting frame is connected to the fourth transplanting drive assembly. The two fourth adsorption mounting frames are arranged opposite each other along the first direction, and the two fourth adsorption mounting frames are slidably connected to the third adsorption mounting frame along the first direction. Each fourth adsorption mounting frame is equipped with at least one of the second adsorption components.

[0040] Optionally, the second adsorption component can move relative to the fourth adsorption mounting frame along the fifth direction;

[0041] The fifth direction and the second direction are perpendicular to each other and to the first direction.

[0042] Optionally, the second adsorption assembly further includes a second suction cup holder and a second magnetic suction element, wherein the second vacuum suction cup and the second magnetic suction element are mounted on the second suction cup holder;

[0043] The fourth adsorption mounting bracket is equipped with a second magnetic attraction component, which can magnetically attract the second magnetic attraction component.

[0044] Optionally, the fourth adsorption mounting bracket is provided with a second sliding groove extending along the fifth direction, and the second adsorption component can slide and engage with the second sliding groove.

[0045] Optionally, at least one of the second adsorption components is provided with a second adsorption sensor, which is used to detect whether the second adsorption unit is unloaded.

[0046] Optionally, the first adsorption unit further includes a first vacuum generator, and each of the first vacuum logic valves is connected to the first vacuum generator.

[0047] Optionally, the first adsorption unit further includes a first vacuum gauge, which is used to detect the vacuum pressure value of the first vacuum generator.

[0048] Optionally, each of the second vacuum suction cups is connected to a second vacuum logic valve; the controller is also connected to the second vacuum logic valve, and the controller is used to control the second vacuum logic valve to close the adsorption channel of the second vacuum suction cup connected to it when the second vacuum suction cup connected to it is in communication with the outside gas.

[0049] Optionally, the second adsorption unit further includes a second vacuum generator, and each of the second vacuum logic valves is connected to the second vacuum generator.

[0050] Optionally, the second adsorption unit further includes a second vacuum gauge, which is used to detect the vacuum pressure value of the second vacuum generator.

[0051] On the other hand, this utility model embodiment provides a PCB board testing device, which includes a machine base, a loading device, a testing device, a unloading device, and the aforementioned transfer device. The loading device, the testing device, the unloading device, and the transfer device are installed on the machine base. The loading device is used to provide the PCB board to the loading position. The first adsorption unit can adsorb the PCB board at the loading position and can release the adsorption of the PCB board at the transfer position. The testing device is used to test the PCB board located at the transfer position.

[0052] The second adsorption unit can adsorb the PCB board at the transfer position and can release the adsorption of the PCB board at the unloading position; the unloading device is used to unload the PCB board located at the unloading position.

[0053] According to the PCB board testing equipment of this utility model embodiment, its transfer device, on the one hand, drives the first adsorption unit to reciprocate between the loading position and the transfer position through the first transfer drive unit, and drives the second adsorption unit to reciprocate between the unloading position and the transfer position through the second transfer drive unit, which can realize the automation of PCB board transfer between the loading position, the transfer position and the unloading position, and improve the transfer efficiency; on the other hand, a first vacuum logic valve is connected to each first vacuum suction cup, and the adsorption channel of the corresponding first vacuum suction cup is automatically opened and closed through each first vacuum logic valve. When a first vacuum suction cup encounters a cutout position, its corresponding first vacuum logic valve will close its adsorption channel to avoid affecting the vacuum degree of other first vacuum suction cups, which can simplify the operation and save the time required to adjust the position of each first vacuum suction cup when the PCB board size changes. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of a transplanting device provided in an embodiment of the present invention;

[0055] Figure 2 yes Figure 1 Assembly diagram of the middle transplanting bracket, the first transplanting drive assembly and the third transplanting drive assembly;

[0056] Figure 3 yes Figure 1 A schematic diagram of the assembly of the second transplanting drive component and the first adsorption unit;

[0057] Figure 4 yes Figure 3 A diagram from another angle;

[0058] Figure 5 yes Figure 3 A schematic diagram of the first adsorption component;

[0059] Figure 6 yes Figure 1 A schematic diagram of the assembly of the fourth transplanting drive component and the second adsorption unit;

[0060] Figure 7 yes Figure 6 A diagram from another angle;

[0061] Figure 8 This is a schematic diagram of a PCB board testing device provided in one embodiment of the present invention.

[0062] The reference numerals in the accompanying drawings are as follows:

[0063] 10. Transplanting device;

[0064] 1. Transplanting bracket; 11. Mounting cavity; 12. Slide rail;

[0065] 2. First transplanting drive unit; 21. First transplanting drive assembly; 211. First transplanting driver; 212. First transplanting transmission structure; 2121. First transplanting synchronous belt; 2122. First transplanting synchronous pulley; 22. Second transplanting drive assembly; 221. First transmission bracket; 222. Second transplanting driver; 223. Second transplanting transmission structure; 23. Fifth transplanting drive assembly;

[0066] 3. Second transplanting drive unit; 31. Third transplanting drive assembly; 311. Third transplanting driver; 312. Third transplanting transmission structure; 3121. Second transplanting synchronous belt; 3122. Second transplanting synchronous pulley; 32. Fourth transplanting drive assembly; 321. Second transmission bracket; 322. Fourth transplanting driver; 323. Fourth transplanting transmission structure;

[0067] 4. First adsorption unit; 41. First adsorption assembly; 411. First vacuum suction cup; 412. First vacuum logic valve; 413. First suction cup holder; 414. First magnetic suction component; 42. First adsorption mounting bracket; 421. First adsorption adjustment hole; 43. Second adsorption mounting bracket; 431. First magnetic suction fitting component; 432. First slide groove; 44. First adsorption sensor; 45. First adsorption locking component; 46. First vacuum generator; 47. First vacuum negative pressure gauge;

[0068] 5. Second adsorption unit; 51. Second adsorption assembly; 511. Second vacuum suction cup; 512. Second suction cup holder; 513. Second vacuum logic valve; 52. Third adsorption mounting bracket; 521. Second adsorption adjustment hole; 53. Fourth adsorption mounting bracket; 531. Second magnetic attraction fitting; 532. Second slide groove; 54. Second adsorption sensor; 55. Second adsorption locking component; 56. Second vacuum generator; 57. Second vacuum negative pressure gauge;

[0069] 6. Collision avoidance sensor;

[0070] 7. Collision-proof sensor;

[0071] 20. PCB board;

[0072] 30. Machine base; 40. Feeding device; 50. Testing device; 60. Unloading device;

[0073] x, first direction; z, second direction; m, third direction; n, fourth direction; y, fifth direction. Detailed Implementation

[0074] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0075] like Figures 1 to 7 As shown, the transplanting device 10 provided in this embodiment of the present invention includes a first transplanting drive unit 2, a second transplanting drive unit 3, a first adsorption unit 4, a second adsorption unit 5, and a controller. The controller is connected to the first transplanting drive unit 2 and the second transplanting drive unit 3. The controller is used to control the first transplanting drive unit 2 to drive the first adsorption unit 4 to reciprocate between the feeding position and the transfer position, and to control the second transplanting drive unit 3 to drive the second adsorption unit 5 to reciprocate between the unloading position and the transfer position.

[0076] The first adsorption unit 4 includes a first adsorption component 41, which includes a plurality of first vacuum suction cups 411. Each first vacuum suction cup 411 is connected to a first vacuum logic valve 412. The controller is also connected to the first vacuum logic valve 412 and is used to control the first vacuum logic valve 412 to close the adsorption channel of the first vacuum suction cup 411 connected to it when the first vacuum suction cup 411 connected to it is in communication with the outside gas.

[0077] The second adsorption unit 5 includes a second adsorption component 51, which includes a plurality of second vacuum suction cups 511.

[0078] The transfer device 10 provided in this embodiment of the utility model, on the one hand, drives the first adsorption unit 4 to reciprocate between the loading position and the transfer position through the first transfer drive unit 2, and drives the second adsorption unit 5 to reciprocate between the unloading position and the transfer position through the second transfer drive unit 3, so as to realize the automation of the transfer of PCB board 20 between the loading position, the transfer position and the unloading position, and improve the transfer efficiency; on the other hand, a first vacuum logic valve 412 is connected to each first vacuum suction cup 411, and the adsorption channel of the corresponding first vacuum suction cup 411 is automatically opened and closed through each first vacuum logic valve 412. When a first vacuum suction cup 411 encounters a cutout position, its corresponding first vacuum logic valve 412 will close its adsorption channel to avoid affecting the vacuum degree of other first vacuum suction cups 411, which can simplify the operation and save the time required to adjust the position of each first vacuum suction cup 411 when the size of PCB board 20 changes.

[0079] It should be noted that the transplanting device 10 in this embodiment of the present invention is illustrated by PCB board 20. In the actual application of the transplanting device 10, the transplanting of other materials (such as boards or other materials that can have an adsorption surface) can also be realized.

[0080] In one embodiment, such as Figure 1 As shown, the transplanting device 10 also includes a transplanting bracket 1, and a first transplanting drive unit 2 and a second transplanting drive unit 3 are installed on the transplanting bracket 1 to realize the installation of the first transplanting drive unit 2 and the second transplanting drive unit 3.

[0081] In one embodiment, the loading position, the transfer position, and the unloading position are arranged at intervals along a first direction x. For example, as shown... Figure 1 As shown, the loading position is Figure 1 The location of the first adsorption unit 4 in the middle, the transfer position is Figure 1 The second adsorption unit 5 is located at the discharge position on the side of the transfer position away from the loading position.

[0082] By setting the loading position, transfer position and unloading position sequentially at intervals along the first direction x, the PCB board 20 can be transferred along the first direction x.

[0083] In one embodiment, such as Figure 2 As shown, the first transplanting drive unit 2 includes a first transplanting drive component 21 and a second transplanting drive component 22. The first transplanting drive component 21 is mounted on the transplanting bracket 1, and the second transplanting drive component 22 is connected between the first transplanting drive component 21 and the first adsorption unit 4. The first transplanting drive component 21 is used to drive the second transplanting drive component 22 to move along the first direction x, and the second transplanting drive component 22 is used to drive the first adsorption unit 4 to move along the second direction z.

[0084] The second transplanting drive unit 3 includes a third transplanting drive component 31 and a fourth transplanting drive component 32. The third transplanting drive component 31 is mounted on the transplanting bracket 1, and the fourth transplanting drive component 32 is connected between the third transplanting drive component 31 and the second adsorption unit 5. The third transplanting drive component 31 is used to drive the fourth transplanting drive component 32 to move along the first direction x, and the fourth transplanting drive component 32 is used to drive the second adsorption unit 5 to move along the second direction z.

[0085] The second direction z intersects the first direction x.

[0086] The positions of the first adsorption unit 4 in the first direction x and the second direction z are adjusted by the cooperation of the first transplanting drive assembly 21 and the second transplanting drive assembly 22. The positions of the second adsorption unit 5 in the first direction x and the second direction z are adjusted by the cooperation of the third transplanting drive assembly 31 and the fourth transplanting drive assembly 32.

[0087] In one embodiment, such as Figure 2 As shown, the first transplanting drive assembly 21 includes a first transplanting driver 211 and a first transplanting transmission structure 212. The first transplanting driver 211 is mounted on the transplanting bracket 1, and the first transplanting transmission structure 212 is connected between the first transplanting driver 211 and the second transplanting drive assembly 22. The first transplanting driver 211 drives the second transplanting drive assembly 22 to move along the first direction x through the first transplanting transmission structure 212.

[0088] The third transplanting drive assembly 31 includes a third transplanting driver 311 and a third transplanting transmission structure 312. The third transplanting driver 311 is mounted on the transplanting bracket 1, and the third transplanting transmission structure 312 is connected between the third transplanting driver 311 and the fourth transplanting drive assembly 32. The third transplanting driver 311 drives the fourth transplanting drive assembly 32 to move along the first direction x through the third transplanting transmission structure 312.

[0089] The second direction z is the height direction. The first transplanting transmission structure 212 is located above the third transplanting transmission structure 312 along the second direction z, or the first transplanting transmission structure 212 is located below the third transplanting transmission structure 312 along the second direction z.

[0090] By arranging the first transplanting transmission structure 212 and the first transplanting transmission structure 212 vertically along the height direction, the arrangement space of the first transplanting transmission structure 212 and the first transplanting transmission structure 212 can be saved, thereby saving the space occupied by the transplanting device 10.

[0091] In one embodiment, such as Figure 1 and Figure 2 As shown, the transplanting bracket 1 is provided with an installation cavity 11, and the first transplanting transmission structure 212 is provided in the installation cavity 11 to make the appearance of the transplanting device 10 neater.

[0092] In one embodiment, such as Figure 2 As shown, the first transplanting transmission structure 212 includes a first transplanting drive wheel (not shown), a first transplanting timing belt 2121, and a first transplanting timing pulley 2122. The first transplanting drive wheel and the first transplanting timing pulley 2122 are rotatably connected to the transplanting bracket 1. The central axis of the first transplanting drive wheel is parallel to the central axis of the first transplanting timing pulley 2122, and the central axis of the first transplanting drive wheel is perpendicular to the first direction x. The first transplanting timing belt 2121 is wound around the first transplanting drive wheel and the first transplanting timing pulley 2122.

[0093] The first transplanting driver 211 is used to drive the first transplanting drive wheel to rotate.

[0094] The second transplant drive component 22 is connected to the first transplant timing belt 2121.

[0095] The first transplanting driver 211 drives the first transplanting drive wheel to rotate, thereby driving the first transplanting timing belt 2121 to move, which in turn drives the first transplanting timing wheel 2122 to rotate. When the first transplanting timing belt 2121 moves, it can drive the second transplanting drive assembly 22 to move along the first direction x, thereby adjusting the position of the first adsorption unit 4 in the first direction x.

[0096] In one embodiment, such as Figure 2 As shown, multiple first transplanting synchronous pulleys 2122 can be provided so that the second transplanting drive assembly 22 can be driven along the first direction x by cooperating with the first transplanting drive pulley and the first transplanting synchronous belt 2121 through multiple first transplanting synchronous pulleys 2122.

[0097] In one embodiment, such as Figure 2 As shown, the third transplanting transmission structure 312 includes a second transplanting drive wheel (not shown), a second transplanting timing belt 3121, and a second transplanting timing pulley 3122. The second transplanting drive wheel and the second transplanting timing pulley 3122 are rotatably connected to the transplanting bracket 1. The central axis of the second transplanting drive wheel is parallel to the central axis of the second transplanting timing pulley 3122, and the central axis of the second transplanting drive wheel is perpendicular to the first direction x. The second transplanting timing belt 3121 is wound around the second transplanting drive wheel and the second transplanting timing pulley 3122.

[0098] The third transplanter 311 is used to drive the second transplanter drive wheel to rotate.

[0099] The fourth transplant drive assembly 32 is connected to the second transplant timing belt 3121.

[0100] The second transplanting drive wheel is driven to rotate by the third transplanting driver 311, which in turn drives the second transplanting timing belt 3121 to move, thereby driving the second transplanting timing wheel 3122 to rotate. When the second transplanting timing belt 3121 moves, it can drive the fourth transplanting drive assembly 32 to move along the first direction x, thereby adjusting the position of the second adsorption unit 5 in the first direction x.

[0101] In one embodiment, such as Figure 2 As shown, multiple second transplanting synchronous pulleys 3122 can be provided so that the fourth transplanting drive assembly 32 can be driven along the first direction x by cooperating with the second transplanting drive pulley and the second transplanting synchronous belt 3121 through multiple second transplanting synchronous pulleys 3122.

[0102] In one embodiment, such as Figures 2 to 5As shown, the second transplanting drive assembly 22 includes a first transmission bracket 221, a second transplanting driver 222, and a second transplanting transmission structure 223. The first transmission bracket 221 is connected to the first transplanting transmission structure 212. The second transplanting driver 222 is mounted on the first transmission bracket 221. The second transplanting transmission structure 223 is connected between the second transplanting driver 222 and the first adsorption unit 4. The second transplanting driver 222 drives the first adsorption unit 4 to move along the second direction z through the second transplanting transmission structure 223, so as to adjust the position of the first adsorption unit 4 in the second direction z.

[0103] For example, the second transplanting driver 222 may be selected as a drive motor, and the second transplanting transmission structure 223 may be selected as a screw and nut mating structure.

[0104] In an embodiment not shown in the figure, the second transplant drive assembly may also include only a first transmission bracket and a second transplant driver. The first transmission bracket is connected to the first transplant transmission structure, and the second transplant driver is mounted on the first transmission bracket. The second transplant driver is a linear driver (such as a linear motor). The second transplant driver is used to drive the first adsorption unit to move along the second direction in order to adjust the position of the first adsorption unit in the second direction.

[0105] In one embodiment, such as Figure 2 , Figure 6 and Figure 7 As shown, the fourth transplant drive assembly 32 includes a second transmission bracket 321, a fourth transplant driver 322, and a fourth transplant transmission structure 323. The second transmission bracket 321 is connected to the third transplant transmission structure 312. The fourth transplant driver 322 is mounted on the second transmission bracket 321. The fourth transplant transmission structure 323 is connected to the second adsorption unit 5. The fourth transplant driver 322 drives the second adsorption unit 5 to move along the second direction z through the fourth transplant transmission structure 323, so as to adjust the position of the second adsorption unit 5 in the second direction z.

[0106] For example, the fourth transplanting driver 322 may be selected as a drive motor, and the fourth transplanting transmission structure 323 may be selected as a screw and nut mating structure.

[0107] In an embodiment not shown in the figure, the fourth transplant drive assembly may also include only the second transmission bracket and the fourth transplant driver. The second transmission bracket is connected to the third transplant transmission structure. The fourth transplant driver is mounted on the second transmission bracket and is a linear driver (such as a linear motor). The fourth transplant driver is used to drive the second adsorption unit to move along the second direction in order to adjust the position of the second adsorption unit in the second direction.

[0108] In one embodiment, such as Figure 3 and Figure 4 As shown, the first transplanting drive unit 2 also includes a fifth transplanting drive component 23, which is connected between the second transplanting drive component 22 and the first adsorption unit 4. The fifth transplanting drive component 23 is used to drive the first adsorption unit 4 to rotate about an axis parallel to the second direction z.

[0109] When multiple test points are set on the PCB board 20 (such as test points set at both ends of the length of the PCB board 20), the first adsorption unit 4 can be driven to rotate around an axis parallel to the second direction z by setting the fifth transfer drive component 23, thereby driving the PCB board 20 adsorbed by the first adsorption unit 4 to rotate, so as to provide the test points at different positions to the detection equipment (such as shooting equipment, testing equipment, etc.) for detection.

[0110] By way of example, the fifth transplant drive assembly 23 includes a rotary cylinder to achieve its rotary drive function. In other embodiments not shown in the figures, the fifth transplant drive assembly may also include a rotary motor to achieve rotary drive of the first adsorption unit.

[0111] In one embodiment, such as Figure 2 As shown, the transplanting bracket 1 is provided with a slide rail 12 extending along the first direction x. The second transplanting drive assembly 22 and the fourth transplanting drive assembly 32 are slidably connected to the slide rail 12 along the first direction x, so that the movement of the second transplanting drive assembly 22 and the fourth transplanting drive assembly 32 along the first direction x is more stable.

[0112] In one embodiment, such as Figure 2 As shown, multiple slide rails 12 can be provided. By providing multiple slide rails 12, a more stable load can be provided when the weight of the second transplant drive assembly 22, the fourth transplant drive assembly 32, the first adsorption unit 4, the second adsorption unit 5 and the PCB board 20 is relatively heavy.

[0113] In one embodiment, such as Figure 1 As shown, when the loading position, transfer position and unloading position are arranged at intervals along the first direction x, the second transplanting drive component 22 and the fourth transplanting drive component 32 can move closer to or further away from each other along the first direction x.

[0114] The transplanting device 10 also includes a collision avoidance sensor 6 and a collision avoidance sensing element 7, which are respectively installed on the side of the second transplanting drive assembly 22 and the fourth transplanting drive assembly 32 closest to each other. The collision avoidance sensor 6 is provided with a sensing space.

[0115] When the second transplanting drive assembly 22 and the fourth transplanting drive assembly 32 approach each other along the first direction x, the anti-collision sensor 7 can approach the sensing space. When the second transplanting drive assembly 22 and the fourth transplanting drive assembly 32 move away from each other along the first direction x, the anti-collision sensor 7 can move away from the sensing space.

[0116] "The anti-collision sensor 6 and the anti-collision sensor 7 are respectively installed on the side of the second transplant drive assembly 22 and the fourth transplant drive assembly 32 closest to each other" includes two cases: the first case, such as Figure 1 As shown, in one case, the anti-collision sensor 6 is installed on the side of the second transplant drive assembly 22 near the fourth transplant drive assembly 32, and the anti-collision sensor 7 is installed on the side of the fourth transplant drive assembly 32 near the second transplant drive assembly 22. In this case, the second transplant drive assembly 22 can drive the anti-collision sensor 6 to move along the first direction x, and the fourth transplant drive assembly 32 can drive the anti-collision sensor 7 to move along the first direction x, so that the anti-collision sensor 7 can move closer to or away from the sensing space. In the second case, the anti-collision sensor 6 is installed on the side of the fourth transplant drive assembly 32 near the second transplant drive assembly 22, and the anti-collision sensor 7 is installed on the side of the second transplant drive assembly 22 near the fourth transplant drive assembly 32. In this case, the fourth transplant drive assembly 32 can drive the anti-collision sensor 6 to move along the first direction x, and the second transplant drive assembly 22 can drive the anti-collision sensor 7 to move along the first direction x, so that the anti-collision sensor 7 can move closer to or away from the sensing space.

[0117] When the anti-collision sensor 7 approaches the sensing space, the anti-collision sensor 7 can detect the anti-collision sensor 7. At this time, the first transplanting drive assembly 21 and the third transplanting drive assembly 31 will stop driving the second transplanting drive assembly 22 and the fourth transplanting drive assembly 32 to continue to approach each other, so as to avoid the first adsorption unit 4 and the second adsorption unit 5 from colliding.

[0118] In one embodiment, such as Figures 2 to 4 As shown, the first adsorption unit 4 also includes a first adsorption mounting frame 42 and two second adsorption mounting frames 43. The first adsorption mounting frame 42 is connected to the second transplanting drive assembly 22. The two second adsorption mounting frames 43 are arranged opposite each other along the third direction m, and the two second adsorption mounting frames 43 are slidably connected to the first adsorption mounting frame 42 along the third direction m. Each second adsorption mounting frame 43 is equipped with at least one first adsorption assembly 41.

[0119] The third direction m is perpendicular to the second direction z.

[0120] When the size of the PCB board 20 changes, the two second adsorption mounting brackets 43 can slide relative to the first adsorption mounting bracket 42 along the third direction m respectively, so as to adjust the distance between the two second adsorption mounting brackets 43 and adapt to PCB boards 20 of different sizes.

[0121] In one embodiment, such as Figures 2 to 4 As shown, the first adsorption mounting bracket 42 may be provided with a first adsorption adjustment hole 421 extending along the third direction m.

[0122] The first adsorption unit 4 also includes a first adsorption locking member 45, which includes a first locking knob, a first locking screw and a first locking member. One end of the first locking screw is connected to the first locking knob, and the other end of the first locking screw passes through the second adsorption mounting bracket 43 and the first adsorption adjustment hole 421 and is threadedly connected to the first locking member.

[0123] The distance between the first locking knob and the first locking member can be adjusted by rotating the first locking knob. When the distance between the first locking knob and the first locking member increases, the second adsorption mounting bracket 43 can slide relative to the first adsorption mounting bracket 42 along the third direction m; when the distance between the first locking knob and the first locking member decreases, the second adsorption mounting bracket 43 can be temporarily locked to the first adsorption mounting bracket 42, and the second adsorption mounting bracket 43 stops sliding relative to the first adsorption mounting bracket 42.

[0124] In one embodiment, such as Figures 2 to 4 As shown, the first adsorption component 41 can move relative to the second adsorption mounting frame 43 along the fourth direction n. The fourth direction n, the third direction m, and the second direction z are all perpendicular to each other.

[0125] When the size of the PCB board 20 changes, the first adsorption component 41 can be moved relative to the second adsorption mounting bracket 43 along the fourth direction n to adjust the position of the first adsorption component 41 and adapt to PCB boards 20 of different sizes.

[0126] For example, the spacing between the two second adsorption mounting brackets 43 is adjusted to fit the length of the PCB board 20, and the position of the first adsorption component 41 is adapted to fit the width of the PCB board 20.

[0127] In one embodiment, such as Figure 5 As shown, the first adsorption assembly 41 also includes a first suction cup frame 413 and a first magnetic suction member 414, with the first vacuum suction cup 411 and the first magnetic suction member 414 mounted on the first suction cup frame 413.

[0128] The second adsorption mounting bracket 43 is equipped with a first magnetic attraction component 431, and the first magnetic attraction component 414 can magnetically attract the first magnetic attraction component 431.

[0129] The first magnetic adsorption component 414 and the first magnetic adsorption mating component 431 can be magnetically adsorbed together to achieve temporary fixation of the first adsorption component 41 on the second adsorption mounting bracket 43, and the position of the first adsorption component 41 relative to the second adsorption mounting bracket 43 can be easily adjusted.

[0130] In one embodiment, such as Figure 4 As shown, the second adsorption mounting bracket 43 is provided with a first slide groove 432 extending along the fourth direction n. The first adsorption component 41 can slide and engage with the first slide groove 432, so that the first adsorption component 41 can move relative to the second adsorption mounting bracket 43 along the first slide groove 432.

[0131] In one embodiment, such as Figure 3 As shown, at least one first adsorption component 41 is provided with a first adsorption sensor 44, which is used to detect whether the first adsorption unit 4 is unloaded, that is, to detect whether the first adsorption unit 4 has adsorbed the PCB board 20.

[0132] In one embodiment, such as Figure 6 and Figure 7 As shown, the second adsorption unit 5 also includes a third adsorption mounting frame 52 and two fourth adsorption mounting frames 53. The third adsorption mounting frame 52 is connected to the fourth transplant drive assembly 32. The two fourth adsorption mounting frames 53 are arranged opposite each other along the first direction x, and the two fourth adsorption mounting frames 53 are slidably connected to the third adsorption mounting frame 52 along the first direction x. Each fourth adsorption mounting frame 53 is equipped with at least one second adsorption assembly 51.

[0133] When the size of the PCB board 20 changes, the two fourth adsorption mounting brackets 53 can slide relative to the third adsorption mounting bracket 52 along the first direction x to adjust the spacing between the two fourth adsorption mounting brackets 53 and adapt to PCB boards 20 of different sizes.

[0134] In one embodiment, such as Figure 6 and Figure 7 As shown, the third adsorption mounting bracket 52 may be provided with a second adsorption adjustment hole 521 extending along the first direction x.

[0135] The second adsorption unit 5 also includes a second adsorption locking member 55, which includes a second locking knob, a second locking screw and a second locking member. One end of the second locking screw is connected to the second locking knob, and the other end of the second locking screw passes through the fourth adsorption mounting bracket 53 and the second adsorption adjustment hole 521 and is threadedly connected to the second locking member.

[0136] The distance between the second locking knob and the second locking member can be adjusted by rotating the second locking knob. When the distance between the second locking knob and the second locking member increases, the fourth adsorption mounting bracket 53 can slide relative to the third adsorption mounting bracket 52 along the first direction x; when the distance between the second locking knob and the second locking member decreases, the fourth adsorption mounting bracket 53 can be temporarily locked to the third adsorption mounting bracket 52, and the fourth adsorption mounting bracket 53 stops sliding relative to the third adsorption mounting bracket 52.

[0137] In one embodiment, such as Figure 6 and Figure 7 As shown, the second adsorption component 51 can move relative to the fourth adsorption mounting frame 53 along the fifth direction y. The fifth direction y, the second direction z, and the first direction x are all perpendicular to each other.

[0138] When the size of the PCB board 20 changes, the second adsorption component 51 can be moved relative to the fourth adsorption mounting bracket 53 along the fifth direction y to adjust the position of the second adsorption component 51 and adapt to PCB boards 20 of different sizes.

[0139] For example, the spacing between the two fourth adsorption mounting brackets 53 is adjusted to fit the length of the PCB board 20, and the position of the second adsorption component 51 is adapted to fit the width of the PCB board 20.

[0140] In one embodiment, such as Figure 1 As shown, the fifth transplant drive component 23 can drive the first adsorption unit 4 to rotate 180°, so that the PCB board 20 switches between the first state and the second state.

[0141] In the first state, if the third direction m is parallel to the first direction x and the fourth direction n is parallel to the fifth direction y, then in the second state, the third direction m is parallel to the first direction x and the fourth direction n is parallel to the fifth direction y; if the third direction m intersects the first direction x and the fourth direction n intersects the fifth direction y, then in the second state, the third direction m intersects the first direction x and the fourth direction n intersects the fifth direction y.

[0142] In other embodiments not shown in the figure, when the fifth transplant driving component can drive the first adsorption unit 4 to rotate 180°, if the third direction m intersects with the first direction x, the fourth direction n will also intersect with the fifth direction y.

[0143] In other embodiments not shown in the figure, the angle at which the fifth transplanting drive component drives the first adsorption unit to rotate can be adjusted according to actual needs.

[0144] In one embodiment, such as Figure 6 and Figure 7 As shown, the second adsorption assembly 51 also includes a second suction cup frame 512 and a second magnetic suction element (not shown in the figure), with the second vacuum suction cup 511 and the second magnetic suction element mounted on the second suction cup frame 512.

[0145] The fourth adsorption mounting bracket 53 is equipped with a second magnetic attraction component 531, which can magnetically attract the second magnetic attraction component 531.

[0146] The second magnetic component 51 can be temporarily fixed on the fourth magnetic mounting frame 53 by magnetic attraction between the second magnetic component and the second magnetic coupling component 531, and the position of the second magnetic component 51 relative to the fourth magnetic mounting frame 53 can also be easily adjusted.

[0147] In one embodiment, such as Figure 6 and Figure 7 As shown, the fourth adsorption mounting bracket 53 is provided with a second slide groove 532 extending along the fifth direction y. The second adsorption component 51 can slide and engage with the second slide groove 532, so that the second adsorption component 51 can move relative to the fourth adsorption mounting bracket 53 along the second slide groove 532.

[0148] In one embodiment, such as Figure 6 and Figure 7 As shown, at least one second adsorption component 51 is provided with a second adsorption sensor 54. The second adsorption sensor 54 is used to detect whether the second adsorption unit 5 is unloaded, that is, to detect whether the second adsorption unit 5 has adsorbed the PCB board 20.

[0149] In one embodiment, such as Figure 3 and Figure 4 As shown, the first adsorption unit 4 also includes a first vacuum generator 46, and each first vacuum logic valve 412 is connected to the first vacuum generator 46 to provide vacuum adsorption negative pressure through the first vacuum generator 46.

[0150] In one embodiment, such as Figure 3 and Figure 4 As shown, the first adsorption unit 4 also includes a first vacuum negative pressure gauge 47, which is used to detect the vacuum negative pressure value of the first vacuum generator 46 in order to monitor the vacuum negative pressure of the first vacuum generator 46 in real time.

[0151] In one embodiment, such as Figure 6 and Figure 7 As shown, each second vacuum suction cup 511 is connected to a second vacuum logic valve 513. The controller is also connected to the second vacuum logic valve 513. The controller is used to control the second vacuum logic valve 513 to close the adsorption channel of the second vacuum suction cup 511 when the second vacuum suction cup 511 connected to it is connected to the outside gas.

[0152] The adsorption channels of the corresponding second vacuum chucks 511 are automatically opened and closed by each second vacuum logic valve 513. When a second vacuum chuck 511 encounters a cutout, its corresponding second vacuum logic valve 513 will close its adsorption channel to avoid affecting the vacuum level of other second vacuum chucks 511. This simplifies the operation and saves the time required to adjust the position of each second vacuum chuck 511 when the size of the PCB board 20 changes.

[0153] In one embodiment, such as Figure 6 and Figure 7As shown, the second adsorption unit 5 also includes a second vacuum generator 56, and each second vacuum logic valve 513 is connected to the second vacuum generator 56 to provide vacuum adsorption negative pressure through the second vacuum generator 56.

[0154] In one embodiment, such as Figure 6 and Figure 7 As shown, the second adsorption unit 5 also includes a second vacuum negative pressure gauge 57, which is used to detect the vacuum negative pressure value of the second vacuum generator 56 in order to monitor the vacuum negative pressure of the second vacuum generator 56 in real time.

[0155] like Figure 8 As shown, the PCB board testing equipment provided in this embodiment of the present invention includes a machine base 30, a loading device 40, a testing device 50, a unloading device 60, and the aforementioned transfer device 10. The loading device 40, testing device 50, unloading device 60, and transfer device 10 are installed on the machine base 30. The loading device 40 is used to provide the PCB board 20 to the loading position. The first adsorption unit 4 can adsorb the PCB board 20 at the loading position and can release the adsorption of the PCB board 20 at the transfer position. The testing device 50 is used to test the PCB board 20 located at the transfer position.

[0156] The second adsorption unit 5 can adsorb the PCB board 20 at the transfer position and can release the adsorption on the PCB board 20 at the unloading position. The unloading device 60 is used to unload the PCB board 20 located at the unloading position.

[0157] The PCB board testing equipment provided in this embodiment of the utility model has a transfer device 10. On the one hand, the first transfer drive unit 2 drives the first adsorption unit 4 to reciprocate between the loading position and the transfer position, and the second transfer drive unit 3 drives the second adsorption unit 5 to reciprocate between the unloading position and the transfer position. This can realize the automation of the transfer of the PCB board 20 between the loading position, the transfer position and the unloading position, and improve the transfer efficiency. On the other hand, a first vacuum logic valve 412 is connected to each first vacuum suction cup 411. The adsorption channel of the corresponding first vacuum suction cup 411 is automatically opened and closed by each first vacuum logic valve 412. When a first vacuum suction cup 411 encounters a cutout position, its corresponding first vacuum logic valve 412 will close its adsorption channel to avoid affecting the vacuum degree of other first vacuum suction cups 411. This simplifies the operation and saves the time required to adjust the position of each first vacuum suction cup 411 when the size of the PCB board 20 changes.

[0158] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A transplanting device, characterized in that, The device includes a first transplanting drive unit, a second transplanting drive unit, a first adsorption unit, a second adsorption unit, and a controller. The controller is connected to the first transplanting drive unit and the second transplanting drive unit. The controller is used to control the first transplanting drive unit to drive the first adsorption unit to reciprocate between the loading position and the transfer position, and to control the second transplanting drive unit to drive the second adsorption unit to reciprocate between the unloading position and the transfer position. The first adsorption unit includes a first adsorption component, which includes a plurality of first vacuum suction cups, each of which is connected to a first vacuum logic valve; the controller is also connected to the first vacuum logic valve, and the controller is used to control the first vacuum logic valve to close the adsorption channel of the first vacuum suction cup connected to it when the first vacuum suction cup connected to it is in communication with the outside gas. The second adsorption unit includes a second adsorption component, which includes a plurality of second vacuum suction cups.

2. The transplanting device according to claim 1, characterized in that, The transplanting device further includes a transplanting bracket, and the first transplanting drive unit and the second transplanting drive unit are mounted on the transplanting bracket.

3. The transplanting device according to claim 2, characterized in that, The loading position, the transfer position, and the unloading position are arranged at intervals along the first direction.

4. The transplanting device according to claim 3, characterized in that, The first transplanting drive unit includes a first transplanting drive component and a second transplanting drive component. The first transplanting drive component is mounted on the transplanting bracket, and the second transplanting drive component is tractively connected between the first transplanting drive component and the first adsorption unit. The first transplanting drive component is used to drive the second transplanting drive component to move along the first direction, and the second transplanting drive component is used to drive the first adsorption unit to move along the second direction. The second transplanting drive unit includes a third transplanting drive component and a fourth transplanting drive component. The third transplanting drive component is mounted on the transplanting bracket, and the fourth transplanting drive component is tractively connected between the third transplanting drive component and the second adsorption unit. The third transplanting drive component is used to drive the fourth transplanting drive component to move along the first direction, and the fourth transplanting drive component is used to drive the second adsorption unit to move along the second direction. The second direction intersects with the first direction.

5. The transplanting device according to claim 4, characterized in that, The first transplanting drive assembly includes a first transplanting driver and a first transplanting transmission structure. The first transplanting driver is mounted on the transplanting bracket, and the first transplanting transmission structure is drively connected between the first transplanting driver and the second transplanting drive assembly. The first transplanting driver drives the second transplanting drive assembly to move along the first direction through the first transplanting transmission structure. The third transplanting drive assembly includes a third transplanting driver and a third transplanting transmission structure. The third transplanting driver is mounted on the transplanting bracket, and the third transplanting transmission structure is drively connected between the third transplanting driver and the fourth transplanting drive assembly. The third transplanting driver drives the fourth transplanting drive assembly to move along the first direction through the third transplanting transmission structure. The second direction is the height direction, and the first transplanting transmission structure is located above the third transplanting transmission structure along the second direction, or the first transplanting transmission structure is located below the third transplanting transmission structure along the second direction.

6. The transplanting device according to claim 5, characterized in that, The first transplanting transmission structure includes a first transplanting drive wheel, a first transplanting timing belt, and a first transplanting timing pulley. The first transplanting drive wheel and the first transplanting timing pulley are rotatably connected to the transplanting bracket. The central axis of the first transplanting drive wheel is parallel to the central axis of the first transplanting timing pulley, and the central axis of the first transplanting drive wheel is perpendicular to the first direction. The first transplanting timing belt is wound around the first transplanting drive wheel and the first transplanting timing pulley. The first transplanter is used to drive the first transplant drive wheel to rotate; The second transplant drive component is connected to the first transplant synchronization belt.

7. The transplanting device according to claim 5, characterized in that, The third transplanting transmission structure includes a second transplanting drive wheel, a second transplanting timing belt, and a second transplanting timing wheel. The second transplanting drive wheel and the second transplanting timing wheel are rotatably connected to the transplanting bracket. The central axis of the second transplanting drive wheel is parallel to the central axis of the second transplanting timing wheel, and the central axis of the second transplanting drive wheel is perpendicular to the first direction. The second transplanting timing belt is wound around the second transplanting drive wheel and the second transplanting timing wheel. The third transplanter is used to drive the second transplanter drive wheel to rotate; The fourth transplant drive component is connected to the second transplant synchronization belt.

8. The transplanting device according to claim 5, characterized in that, The second transplanting drive assembly includes a first transmission bracket and a second transplanting driver. The first transmission bracket is drively connected to the first transplanting transmission structure. The second transplanting driver is mounted on the first transmission bracket and is a linear driver. The second transplanting driver is used to drive the first adsorption unit to move along the second direction; or, The second transplanting drive assembly includes a first transmission bracket, a second transplanting driver, and a second transplanting transmission structure. The first transmission bracket is connected to the first transplanting transmission structure. The second transplanting driver is mounted on the first transmission bracket. The second transplanting transmission structure is connected between the second transplanting driver and the first adsorption unit. The second transplanting driver drives the first adsorption unit to move along the second direction through the second transplanting transmission structure.

9. The transplanting device according to claim 5, characterized in that, The fourth transplanting drive assembly includes a second transmission bracket and a fourth transplanting actuator. The second transmission bracket is drively connected to the third transplanting transmission structure. The fourth transplanting actuator is mounted on the second transmission bracket and is a linear actuator. The fourth transplanting actuator is used to drive the second adsorption unit to move along the second direction; or... The fourth transplanting drive assembly includes a second transmission bracket, a fourth transplanting driver, and a fourth transplanting transmission structure. The second transmission bracket is connected to the third transplanting transmission structure. The fourth transplanting driver is mounted on the second transmission bracket. The fourth transplanting transmission structure is connected between the fourth transplanting driver and the second adsorption unit. The fourth transplanting driver drives the second adsorption unit to move along the second direction through the fourth transplanting transmission structure.

10. The transplanting device according to claim 4, characterized in that, The first transplanting drive unit further includes a fifth transplanting drive component, which is connected to the second transplanting drive component and the first adsorption unit. The fifth transplanting drive component is used to drive the first adsorption unit to rotate about an axis parallel to the second direction.

11. The transplanting device according to claim 4, characterized in that, The transplanting support is provided with a slide rail extending along the first direction, and the second transplanting drive assembly and the fourth transplanting drive assembly are slidably connected to the slide rail along the first direction.

12. The transplanting device according to claim 4, characterized in that, The second transplanting drive component and the fourth transplanting drive component can move closer to or further away from each other along the first direction; The transplanting device also includes an anti-collision sensor and an anti-collision sensing element, wherein the anti-collision sensor and the anti-collision sensing element are respectively installed on the side of the second transplanting drive assembly and the fourth transplanting drive assembly that are close to each other; the anti-collision sensor is provided with a sensing space; When the second transplanting drive assembly and the fourth transplanting drive assembly approach each other along the first direction, the anti-collision sensor can approach the sensing space; When the second transplanting drive assembly and the fourth transplanting drive assembly move away from each other along the first direction, the anti-collision sensor can move away from the sensing space.

13. The transplanting device according to claim 4, characterized in that, The first adsorption unit further includes a first adsorption mounting frame and two second adsorption mounting frames. The first adsorption mounting frame is connected to the second transplanting drive component. The two second adsorption mounting frames are arranged opposite each other along a third direction, and the two second adsorption mounting frames are slidably connected to the first adsorption mounting frame along a third direction. Each second adsorption mounting frame is equipped with at least one of the first adsorption components. The third direction is perpendicular to the second direction.

14. The transplanting device according to claim 13, characterized in that, The first adsorption component can move relative to the second adsorption mounting frame in the fourth direction; The fourth direction and the third direction are perpendicular to each other and to the second direction.

15. The transplanting device according to claim 14, characterized in that, The first adsorption assembly further includes a first suction cup frame and a first magnetic suction element, wherein the first vacuum suction cup and the first magnetic suction element are mounted on the first suction cup frame; The second adsorption mounting bracket is equipped with a first magnetic attraction component, which can magnetically attract the first magnetic attraction component.

16. The transplanting device according to claim 14, characterized in that, The second adsorption mounting bracket is provided with a first sliding groove extending along the fourth direction, and the first adsorption component can slide and engage with the first sliding groove.

17. The transplanting device according to claim 13, characterized in that, At least one of the first adsorption components is provided with a first adsorption sensor, which is used to detect whether the first adsorption unit is unloaded.

18. The transplanting device according to claim 4, characterized in that, The second adsorption unit further includes a third adsorption mounting frame and two fourth adsorption mounting frames. The third adsorption mounting frame is connected to the fourth transplanting drive assembly. The two fourth adsorption mounting frames are arranged opposite each other along the first direction, and the two fourth adsorption mounting frames are slidably connected to the third adsorption mounting frame along the first direction. Each fourth adsorption mounting frame is equipped with at least one of the second adsorption components.

19. The transplanting device according to claim 18, characterized in that, The second adsorption component can move relative to the fourth adsorption mounting frame along the fifth direction; The fifth direction and the second direction are perpendicular to each other and to the first direction.

20. The transplanting device according to claim 19, characterized in that, The second adsorption assembly further includes a second suction cup frame and a second magnetic suction element, wherein the second vacuum suction cup and the second magnetic suction element are mounted on the second suction cup frame; The fourth adsorption mounting bracket is equipped with a second magnetic attraction component, which can magnetically attract the second magnetic attraction component.

21. The transplanting device according to claim 19, characterized in that, The fourth adsorption mounting bracket is provided with a second sliding groove extending along the fifth direction, and the second adsorption component can slide and engage with the second sliding groove.

22. The transplanting device according to claim 18, characterized in that, At least one of the second adsorption components is provided with a second adsorption sensor, which is used to detect whether the second adsorption unit is unloaded.

23. The transplanting device according to claim 1, characterized in that, The first adsorption unit further includes a first vacuum generator, and each of the first vacuum logic valves is connected to the first vacuum generator.

24. The transplanting device according to claim 23, characterized in that, The first adsorption unit further includes a first vacuum negative pressure gauge, which is used to detect the vacuum negative pressure value of the first vacuum generator.

25. The transplanting device according to claim 1, characterized in that, Each of the second vacuum suction cups is connected to a second vacuum logic valve; the controller is also connected to the second vacuum logic valve, and the controller is used to control the second vacuum logic valve to close the adsorption channel of the second vacuum suction cup connected to it when the second vacuum suction cup connected to it is in communication with the outside gas.

26. The transplanting device according to claim 25, characterized in that, The second adsorption unit also includes a second vacuum generator, and each of the second vacuum logic valves is connected to the second vacuum generator.

27. The transplanting device according to claim 26, characterized in that, The second adsorption unit also includes a second vacuum gauge, which is used to detect the vacuum pressure value of the second vacuum generator.

28. A PCB board testing device, characterized in that, The device includes a machine base, a feeding device, a testing device, a discharging device, and a transfer device as described in any one of claims 1-27. The feeding device, the testing device, the discharging device, and the transfer device are installed on the machine base. The feeding device is used to provide the PCB board to the feeding position. The first adsorption unit is capable of adsorbing the PCB board at the feeding position and releasing the adsorption of the PCB board at the transfer position. The testing device is used to test the PCB board located at the transfer position. The second adsorption unit can adsorb the PCB board at the transfer position and can release the adsorption of the PCB board at the unloading position; the unloading device is used to unload the PCB board located at the unloading position.