Vacuum coating machine for increasing deposition rate
By employing a complex oscillating evaporation source and a rotatable substrate design, combined with a gas distributor, the problems of low deposition rate and uneven deposition in vacuum coating machines have been solved, achieving efficient and uniform coating results and improving production efficiency and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN TIANCHUANG NANO TECHNOLOGY CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-19
AI Technical Summary
Existing vacuum coating machines have a low deposition rate during the coating process, resulting in low production efficiency and increased production costs. Furthermore, the coating material is deposited unevenly on the substrate surface, making it difficult to meet the requirements of high-efficiency and high-quality production.
By employing a complex oscillating evaporation source and a rotatable substrate stage design, combined with a gas distributor and uniform gas injection holes, the coating environment is optimized to achieve complex oscillation of the evaporation source and uniform gas distribution, ensuring uniform deposition of coating materials on the substrate surface.
It improves the deposition rate and quality of coating materials, reduces the number of coating cycles, increases production efficiency, reduces production costs, and enhances product competitiveness.
Smart Images

Figure CN224378174U_ABST