Nozzle temperature measurement fixture and system for suction of silicon carbide chips
By designing a nozzle temperature measurement fixture, the flat and continuous surface of the heat conductor is used to contact the temperature measuring instrument, eliminating contact gaps. This achieves accurate measurement of nozzle temperature and reliable bonding between the silicon carbide chip and the carrier, solving the problem of inaccurate temperature measurement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 基本半导体(无锡)有限公司
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-19
AI Technical Summary
In the existing technology, the inaccurate temperature measurement of the nozzle leads to insufficient bonding force between the silicon carbide chip and the carrier, making it difficult to achieve high reliability in the packaging of silicon carbide power modules.
A nozzle temperature measuring fixture was designed, including a heating seat, a top screw, and a fixture body. The flat and continuous surface of the heat conductor contacts the temperature measuring instrument, eliminating contact gaps and achieving accurate heat transfer and measurement.
This improved the accuracy of temperature measurement, enhanced the bonding force between the silicon carbide chip and the carrier, and avoided adhesion failure caused by inaccurate temperature.
Smart Images

Figure CN224382646U_ABST