auxiliary mechanism

By designing an auxiliary mechanism, the wafer stage can be disassembled and installed using a sliding fit, which solves the problems of low efficiency and high risk of damage in existing technologies, and improves maintenance efficiency and equipment safety.

CN224383590UActive Publication Date: 2026-06-19SHANGHAI TYRON SEMICON EQUIP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI TYRON SEMICON EQUIP CO LTD
Filing Date
2025-07-04
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the existing technology, the disassembly and installation of wafer stages mainly rely on manual operation, which leads to low maintenance efficiency, high operation difficulty, and the risk of damage to the wafer stage surface.

Method used

An auxiliary mechanism was designed, including a support component and a lifting component. The mechanism uses a V-groove and a flat groove to slide with the slide rail of the wafer stage, thereby enabling the disassembly and installation of the wafer stage, reducing manual operation and providing a stable movement path.

Benefits of technology

It reduces the labor intensity of operators, improves disassembly and assembly efficiency, avoids bumps and vibrations of the wafer stage, and reduces the risk of surface scratches and internal damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of auxiliary mechanism, it is related to wafer processing technical field.Auxiliary mechanism is detachably arranged in photoetching machine, and it is located the right side of positioning platform on photoetching machine, and positioning platform is used to carry wafer carrier, auxiliary mechanism is configured as auxiliary dismounting wafer carrier, auxiliary mechanism includes bearing assembly: bearing assembly includes bearing station, the upper end surface of bearing station is provided with V groove and flat groove, V groove and flat groove are spaced apart along front-back direction, and all extend along left-right direction, and pass through the upper end surface of bearing assembly, wherein, V groove is configured as and the sliding fit of V type installation slide rail being arranged in the lower end surface of wafer carrier, flat groove is configured as and the sliding fit of rectangular installation slide rail being arranged in the lower end surface of wafer carrier.The auxiliary mechanism reduces the dismounting difficulty of wafer carrier, guarantees dismounting efficiency, and reduces the risk that wafer carrier is damaged in dismounting process.
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Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to an auxiliary mechanism. Background Technology

[0002] In semiconductor manufacturing equipment such as lithography machines, the wafer stage is a core component that carries the wafer and achieves high-precision positioning. After long-term use, it needs to be repaired or replaced.

[0003] In existing technologies, the disassembly and installation of wafer stages mainly rely on manual operation, requiring maintenance personnel to manually hold the wafer stage to complete the relevant tasks. However, the internal maintenance space of semiconductor equipment is relatively narrow, and this operation can usually only be performed manually. However, due to the significant weight of the wafer stage itself, maintenance personnel not only expend considerable physical strength when handling it in a confined space, but also face high operational difficulty, resulting in low maintenance and replacement efficiency. Furthermore, manual operation is difficult to control precisely, and accidents such as bumps and slips can easily occur, damaging the surface of the wafer stage. Once the wafer stage surface is damaged, it will affect its positioning accuracy and the yield of subsequent wafer processing, and increase equipment maintenance costs. Utility Model Content

[0004] The purpose of this invention is to provide an auxiliary mechanism that reduces the difficulty of disassembling and assembling wafer stages, ensures disassembly and assembly efficiency, and reduces the risk of damage to the wafer stage during disassembly and assembly.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An auxiliary mechanism, detachably mounted on the lithography machine and located on the right side of the positioning platform on the lithography machine, wherein the positioning platform is used to support the wafer stage, and the auxiliary mechanism is configured to assist in the mounting and dismounting of the wafer stage, the auxiliary mechanism comprising:

[0007] A support assembly includes a support platform. The upper surface of the support platform is provided with a V-shaped groove and a flat groove. The V-shaped groove and the flat groove are spaced apart in the front-to-back direction and both extend in the left-to-right direction, penetrating the upper surface of the support assembly. The V-shaped groove is configured to slide in engagement with a V-shaped mounting rail provided on the lower surface of the wafer stage, and the flat groove is configured to slide in engagement with a rectangular mounting rail provided on the lower surface of the wafer stage.

[0008] As a further technical solution, the bearing component also includes a first auxiliary slider, which is slidably disposed in the V-groove and slidably cooperates with the V-shaped mounting rail.

[0009] As a further technical solution, along the vertical direction, the height of the first auxiliary sliding member is less than the depth of the V-groove.

[0010] As a further technical solution, the bearing component also includes a second auxiliary slider, which is slidably disposed in the flat groove and slidably cooperates with the rectangular mounting slide rail.

[0011] As a further technical solution, the width of the rectangular mounting slide rail is smaller than the width of the second auxiliary sliding member in the left-right direction.

[0012] As a further technical solution, the support platform includes a first support part and a second support part. Both the first support part and the second support part extend upward and are spaced apart in the left and right directions to form a clearance space between the first support part and the second support part. The V-shaped groove is provided in the first support part and the flat groove is provided in the second support part.

[0013] As a further technical solution, the upper end surface of the second bearing part is set as a plane and serves as the flat groove;

[0014] Alternatively, the middle of the upper surface of the second bearing portion is recessed downwards to form the flat groove.

[0015] As a further technical solution, the auxiliary mechanism also includes a lifting assembly, which is movably disposed on the right side of the positioning platform, and the support platform is disposed above the lifting assembly, and the lifting assembly can drive the support platform to rise and fall.

[0016] As a further technical solution, the lifting assembly includes a mounting plate, a lifting motor, and a connecting plate. The mounting plate is movably mounted on the lithography machine, the lifting motor is fixedly mounted on the mounting plate, the output shaft of the lifting motor moves up and down in the vertical direction, and the connecting plate is connected to the lifting motor.

[0017] As a further technical solution, the projection shape and projection area of ​​the support platform in the vertical direction are the same as the projection shape and projection area of ​​the connecting plate in the vertical direction.

[0018] Compared with the prior art, the auxiliary mechanism provided by this utility model has the following technical advantages:

[0019] Since the auxiliary mechanism is detachably mounted on the lithography machine, the upper surface of the carrier stage is provided with V-shaped grooves and flat grooves extending in both left and right directions. The V-shaped grooves are used to slide and engage with the V-shaped mounting rails on the wafer stage, and the flat grooves are used to slide and engage with the rectangular mounting rails on the wafer stage. Therefore, when the wafer stage needs to be removed from the positioning platform for maintenance, the carrier stage is first placed on the lithography machine, with the carrier stage positioned to the right of the positioning platform, and the V-shaped grooves aligned with the V-shaped mounting rails, and the flat grooves aligned with the rectangular mounting rails. Then, the wafer stage is pushed to the right to move it from the positioning platform to the carrier stage. During the process of moving the wafer stage from the positioning platform to the carrier stage, the V-shaped mounting rails slide and engage with the V-shaped grooves, and the rectangular mounting rails slide and engage with the flat grooves. The wafer stage is continuously pushed to the right until it is completely pushed onto the positioning platform, thus completing the removal of the wafer stage. When mounting the wafer stage onto the positioning platform, place the support platform on the right side of the positioning platform and then position the wafer stage on the support platform. Next, push the wafer stage to the left. With the sliding engagement of the V-shaped mounting rails and V-grooves, and the sliding engagement of the rectangular mounting rails and flat grooves, the wafer stage is pushed onto the positioning platform. Continue pushing the wafer stage to the left until it is completely positioned on the positioning platform. Throughout the disassembly or installation process, the sliding engagement of the V-shaped mounting rails and V-grooves, and the sliding engagement of the rectangular mounting rails and flat grooves, transforms the manual handling of the wafer stage into a sliding engagement. This sliding engagement avoids directly lifting the wafer stage manually, reducing the operator's workload, especially when the wafer stage is heavy, thus reducing the difficulty of disassembly and assembly. Simultaneously, the disassembly and installation of the wafer stage provides a clear and stable movement path, avoiding operational confusion and uncertainty caused by confined space, further reducing the difficulty of disassembly and assembly. Secondly, the wafer stage can be disassembled and installed through a sliding fit, eliminating the need for positioning during the process and thus shortening the disassembly and assembly time, thereby improving efficiency. Thirdly, the sliding fit ensures the wafer stage remains in a stable sliding state throughout the disassembly and assembly process, guaranteeing its stability during movement and avoiding bumps and vibrations caused by manual handling. This reduces the risk of surface scratches, deformation, or damage to the internal precision structure of the wafer stage. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the auxiliary mechanism provided in an embodiment of the present utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the supporting component in the auxiliary mechanism provided in this embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the lifting component in the auxiliary mechanism provided in this embodiment of the utility model.

[0024] In the picture:

[0025] 10. Positioning platform; 20. Wafer stage; 21. V-shaped mounting rail; 22. Rectangular mounting rail;

[0026] 100, Supporting component; 110, Supporting platform; 101, First supporting part; 102, Second supporting part; 103, Clearance space; 111, V-groove; 112, Flat groove; 120, First auxiliary sliding member; 130, Second auxiliary sliding member;

[0027] 200. Lifting assembly; 210. Mounting plate; 220. Lifting motor; 230. Connecting plate. Detailed Implementation

[0028] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0029] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0030] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0031] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0032] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0033] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0034] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0035] Combination Figures 1 to 3As shown, in this embodiment, the auxiliary mechanism is detachably mounted on the lithography machine. Due to the special structure of the lithography machine, the auxiliary mechanism is positioned on the right side of the lithography machine positioning platform 10. The positioning platform 10 is used to support the wafer stage 20, and the auxiliary mechanism is configured to assist in the mounting and dismounting of the wafer stage 20. Specifically, the auxiliary mechanism includes a support component 100, which includes a support platform 110. The upper surface of the support platform 110 is provided with a V-groove 111 and a flat groove 112. The V-groove 111 and the flat groove 112 are spaced apart in the front-to-back direction and extend in the left-to-right direction, penetrating the upper surface of the support component 100. The V-groove 111 is configured to slide in cooperation with a V-shaped mounting rail 21 located on the lower surface of the wafer stage 20, and the flat groove 112 is configured to slide in cooperation with a rectangular mounting rail 22 located on the lower surface of the wafer stage 20.

[0036] Since the auxiliary mechanism is detachably mounted on the lithography machine, the upper surface of the support stage 110 is provided with V-shaped grooves 111 and flat grooves 112 extending in the left-right direction. The V-shaped grooves 111 are used to slide with the V-shaped mounting slide rails 21 on the wafer stage 20, and the flat grooves 112 are used to slide with the rectangular mounting slide rails 22 on the wafer stage 20. Therefore, when the wafer stage 20 needs to be removed from the positioning platform 10 for maintenance, the support stage 110 is first placed on the lithography machine, with the support stage 110 positioned to the right of the positioning platform 10, and the V-shaped grooves 111 and 112 are positioned to the left-right direction. 1. The wafer stage 20 is aligned with the V-shaped mounting slide rail 21 and the flat groove 112 is aligned with the rectangular mounting slide rail 22. Then, the wafer stage 20 is pushed to the right to move it from the positioning platform 10 to the support platform 110. During the process of moving the wafer stage 20 from the positioning platform 10 to the support platform 110, the V-shaped mounting slide rail 21 and the V-shaped groove 111 slide together, and the rectangular mounting slide rail 22 and the flat groove 112 slide together. Continue to push the wafer stage 20 to the right until it is completely pushed onto the positioning platform 10, thus completing the disassembly of the wafer stage 20. When it is necessary to install the wafer stage 20 on the positioning platform 10, the support platform 110 is set on the right side of the positioning platform 10, and the wafer stage 20 is set on the support platform 110; then the wafer stage 20 is pushed to the left. Under the action of the sliding engagement of the V-shaped mounting slide rail 21 and the V-shaped groove 111, and the sliding engagement of the rectangular mounting slide rail 22 and the flat groove 112, the wafer stage 20 is pushed to the positioning platform 10. Continue to push the wafer stage 20 to the left until the wafer stage 20 is completely located on the positioning platform 10. Throughout the disassembly or installation process, the V-shaped mounting slide rail 21 slides into the V-shaped groove 111, and the rectangular mounting slide rail 22 slides into the flat groove 112. Firstly, this transforms the manual handling of the wafer stage 20 into a sliding engagement. This sliding engagement avoids directly lifting the wafer stage 20 manually, reducing the operator's workload, especially when the wafer stage 20 is heavy, thus lowering the difficulty of disassembly and assembly. Simultaneously, it provides a clear and stable movement path for the disassembly and installation of the wafer stage 20, avoiding operational confusion and uncertainty caused by confined space, further reducing the difficulty of disassembly and assembly. Secondly, the wafer stage 20 can be disassembled and installed through the sliding engagement, eliminating the need for positioning during the process, thereby shortening the disassembly and assembly time and improving efficiency. Thirdly, through sliding engagement, the wafer stage 20 is kept in a stable sliding state during the assembly and disassembly process, ensuring the stability of the wafer stage 20 during movement and avoiding bumps and vibrations caused by manual handling, thereby reducing the risk of surface scratches, deformation or damage to the internal precision structure of the wafer stage 20.

[0037] After the wafer stage 20 is disassembled or installed, the auxiliary mechanism can be removed from the lithography machine to avoid interference between the auxiliary mechanism and other components on the lithography machine.

[0038] To reduce direct contact between the V-groove 111 and the V-mount slide rail 21, thereby reducing wear and extending service life, and to improve the stability of the sliding engagement between the V-groove 111 and the V-mount slide rail 21, ensuring the moving accuracy and smoothness of the wafer stage 20 during movement, and further reducing the risk of damage to the wafer stage 20, in this embodiment, the support assembly 100 further includes a first auxiliary slider 120, which is slidably disposed in the V-groove 111 and slidably engages with the V-mount slide rail 21.

[0039] Preferably, the height of the first auxiliary slider 120 is less than the depth of the V-groove 111 in the vertical direction. This configuration avoids interference between the first auxiliary slider 120 and the lower surface of the wafer stage 20, prevents the first auxiliary slider 120 from scratching the lower surface of the wafer stage 20, and ensures the smooth sliding of the wafer stage 20.

[0040] Preferably, the support assembly 100 further includes a second auxiliary slider 130, which is slidably disposed in the flat groove 112 and slidably engages with the rectangular mounting slide rail 22. This arrangement enhances the stability and efficiency of the sliding engagement between the flat groove 112 and the rectangular mounting slide rail 22, while avoiding direct contact between the flat groove 112 and the rectangular mounting slide rail 22, thereby reducing wear on the support stage 110 and the wafer stage 20.

[0041] To further improve the stability and reliability of the sliding engagement between the rectangular mounting slide rail 22 and the flat groove 112, the width of the rectangular mounting slide rail 22 is smaller than the width of the second auxiliary slider 130 in the left-right direction. Simultaneously, the width of the second auxiliary slider 130 is greater than the width of the rectangular mounting slide rail 22, which can better distribute the pressure of the wafer stage 20 on the second auxiliary slider 130, further improving sliding smoothness.

[0042] In this embodiment, the second auxiliary slider 130 is described using a rectangular strip as an example. In other embodiments, the second auxiliary slider 130 can also be a long strip with a sliding groove on its upper surface. That is, the cross-sectional shape of the long strip in the left-right direction is "U". The width of the sliding groove in the front-back direction is slightly larger than the width of the rectangular mounting rail 22 in the front-back direction. For example, if the width of the rectangular mounting rail 22 in the front-back direction is 5cm, then the width of the sliding groove in the front-back direction is set to 5.3cm or 5.4cm. This avoids jamming between the rectangular mounting rail 22 and the second auxiliary slider 130 and reduces the risk of relative wobbling between them in the front-back direction, thereby ensuring the stability of the rectangular mounting rail 22 and the second auxiliary slider 130 when sliding relative to each other.

[0043] Furthermore, the support platform 110 includes a first support portion 101 and a second support portion 102. Both the first support portion 101 and the second support portion 102 extend upward and are spaced apart in the left-right direction, so that a clearance space 103 is formed between the first support portion 101 and the second support portion 102. In this way, by setting the clearance space 103, the weight of the support platform 110 itself is reduced, thereby further improving the convenience of detachably mounting the auxiliary mechanism on the lithography machine. At the same time, the size of the raw materials used in the production of the support platform 110 is reduced, thereby reducing production costs. A V-groove 111 is set in the first support portion 101, and a flat groove 112 is set in the second support portion 102, realizing the partitioning of the V-groove 111 and the flat groove 112, thereby improving the overall performance and bearing reliability of the support platform 110.

[0044] Preferably, in this embodiment, the upper end surface of the second support portion 102 is set as a plane and serves as a flat groove 112, which ensures the support effect on the wafer stage 20 while simplifying the structural design of the support stage 110, thereby reducing the production cost of the support stage 110.

[0045] In some other embodiments, the middle part of the upper surface of the second support portion 102 is recessed downward to form a flat groove 112, so as to avoid relative wobbling between the rectangular mounting slide rail 22 and the second auxiliary sliding member 130 in the front-back direction, thereby ensuring the stability of the rectangular mounting slide rail 22 and the second auxiliary sliding member 130 when sliding relative to each other.

[0046] Preferably, the auxiliary mechanism further includes a lifting assembly 200, which is movably mounted on the right side of the positioning platform 10. The support platform 110 is positioned above the lifting assembly 200, and the lifting assembly 200 can move the support platform 110 up and down. By setting the lifting assembly 200, the height of the support platform 110 can be adjusted, allowing it to better adapt to wafer stages 20 of different heights, improving the applicability of the auxiliary mechanism, and increasing the flexibility of the wafer stage 20 during assembly and disassembly.

[0047] Furthermore, the lifting assembly 200 includes a mounting plate 210, a lifting motor 220, and a connecting plate 230. The mounting plate 210 is movably mounted on the lithography machine, the lifting motor 220 is fixedly mounted on the mounting plate 210, and the output shaft of the lifting motor 220 moves up and down. The connecting plate 230 is connected to the lifting motor 220. Lifting is achieved through motor drive, allowing precise control of the height of the carrier stage 110, improving operational accuracy. The motor-driven lifting assembly 200 has a simple structure, high reliability, and can ensure long-term stable operation. The mounting plate 210 enhances the connection stability and strength between the auxiliary mechanism and the lithography machine. The connecting plate 230 enhances the connection stability and strength between the lifting assembly 200 and the carrier stage 110, thereby ensuring the smooth assembly and disassembly of the wafer stage 20 and further reducing the risk of damage to the wafer stage 20. In this embodiment, the mounting plate 210 is detachably connected to the lithography machine by means of a threaded connector; the connecting plate 230 is fixedly connected to the support stage 110, and the fixed connection method can be adapted to the actual situation by welding, bonding, embedding or connecting by means of a threaded connector.

[0048] Furthermore, the projection shape and area of ​​the support stage 110 in the vertical direction are the same as those of the connecting plate 230 in the vertical direction. On the one hand, this further enhances the installation strength and stability of the connecting plate 230 and the support stage 110, thereby ensuring that the support stage 110 remains stable during lifting and lowering. On the other hand, when the auxiliary mechanism is set behind the lithography machine, it can prevent interference between the mounting plate 210 and other components on the lithography machine.

[0049] The support platform 110, the first auxiliary sliding member 120, and the second auxiliary sliding member 130 are all made of wear-resistant materials, and no specific limitation is made in this embodiment.

[0050] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An auxiliary mechanism, detachably mounted on a lithography machine and located on the right side of a positioning platform (10) on the lithography machine, the positioning platform (10) being used to support a wafer stage (20), the auxiliary mechanism being configured to assist in the assembly and disassembly of the wafer stage (20), characterized in that, The auxiliary mechanism includes: The carrier assembly (100) includes a carrier stage (110). The upper surface of the carrier stage (110) is provided with a V-groove (111) and a flat groove (112). The V-groove (111) and the flat groove (112) are spaced apart in the front-back direction and extend in the left-right direction, penetrating the upper surface of the carrier assembly (100). The V-groove (111) is configured to slide in cooperation with a V-shaped mounting slide rail (21) provided on the lower surface of the wafer stage (20), and the flat groove (112) is configured to slide in cooperation with a rectangular mounting slide rail (22) provided on the lower surface of the wafer stage (20).

2. The auxiliary mechanism according to claim 1, characterized in that, The bearing assembly (100) further includes a first auxiliary slider (120), which is slidably disposed in the V-groove (111) and slidably cooperates with the V-shaped mounting rail (21).

3. The auxiliary mechanism according to claim 2, characterized in that, Along the vertical direction, the height of the first auxiliary slider (120) is less than the depth of the V-groove (111).

4. The auxiliary mechanism according to claim 2, characterized in that, The bearing assembly (100) further includes a second auxiliary slider (130), which is slidably disposed in the flat groove (112) and slidably cooperates with the rectangular mounting slide rail (22).

5. The auxiliary mechanism according to claim 4, characterized in that, Along the left-right direction, the width of the rectangular mounting slide rail (22) is smaller than the width of the second auxiliary slide (130).

6. The auxiliary mechanism according to claim 4, characterized in that, The support platform (110) includes a first support part (101) and a second support part (102). The first support part (101) and the second support part (102) both extend upward and are spaced apart in the left and right direction so that a clearance space (103) is formed between the first support part (101) and the second support part (102). The V-shaped groove (111) is provided on the first support part (101) and the flat groove (112) is provided on the second support part (102).

7. The auxiliary mechanism according to claim 6, characterized in that, The upper end face of the second bearing part (102) is set as a plane and serves as the flat groove (112); Alternatively, the middle part of the upper surface of the second bearing portion (102) is recessed downward to form the flat groove (112).

8. The auxiliary mechanism according to any one of claims 1-7, characterized in that, The auxiliary mechanism also includes a lifting assembly (200), which is movably disposed on the right side of the positioning platform (10). The support platform (110) is disposed above the lifting assembly (200), and the lifting assembly (200) can drive the support platform (110) to rise and fall.

9. The auxiliary mechanism according to claim 8, characterized in that, The lifting assembly (200) includes a mounting plate (210), a lifting motor (220), and a connecting plate (230). The mounting plate (210) is movably mounted on the lithography machine. The lifting motor (220) is fixedly mounted on the mounting plate (210). The output shaft of the lifting motor (220) moves up and down in the vertical direction. The connecting plate (230) is connected to the lifting motor (220).

10. The auxiliary mechanism according to claim 9, characterized in that, The projection shape and projection area of ​​the support platform (110) in the vertical direction are the same as those of the connecting plate (230) in the vertical direction.