Touch module and electronic device

Abstract

This application provides a touch module and an electronic device. The touch module includes a transparent cover, a film, and a circuit board stacked together. The film is located between the transparent cover and the circuit board. The film includes a substrate layer and a texture layer stacked together. The texture layer is used to form a pattern. In the thickness direction of the touch module, the texture layer is disposed on one side surface of the substrate layer. The texture layer can form a pattern, and the touch module can display the pattern formed by the texture layer, making it convenient for users to view and improving the user's viewing experience.

Description

Technical Field

[0001] This application relates to the field of touch technology, and in particular to a touch module and electronic device. Background Technology

[0002] In electronic devices, touch modules are used as input interaction units; however, in existing touch modules, touch modules do not display patterns. Utility Model Content

[0003] This application provides a touch module and an electronic device, wherein the touch module is capable of displaying patterns.

[0004] In a first aspect, this application provides a touch module, which includes a transparent cover plate, a film, and a circuit board stacked together. The film is located between the transparent cover plate and the circuit board. The film includes a substrate layer and a texture layer stacked together. The texture layer is used to form a pattern. In the thickness direction of the touch module, the texture layer is disposed on one side surface of the substrate layer.

[0005] In this solution, the texture layer can form patterns, and the touch module can display the patterns formed by the texture layer, making it convenient for users to view and improving the user's viewing experience.

[0006] In conjunction with the first aspect, in one possible implementation, the texture layer is located between the circuit board and the substrate layer. Both the transparent cover and the substrate layer are transparent, allowing the touch module to display the pattern formed by the texture layer, facilitating user viewing and enhancing the user's viewing experience.

[0007] In conjunction with the first aspect, in one possible implementation, the thickness of the texture layer in the thickness direction of the touch module is 0.01mm-0.02mm. By making the thickness of the texture layer between 0.01mm and 0.02mm, the touch module can display the pattern formed by the texture layer.

[0008] In conjunction with the first aspect, in one possible implementation, the touch module further includes an optically transparent adhesive, which is connected between the transparent cover and the substrate layer. The sum of the dimensions of the transparent cover, the optically transparent adhesive, and the substrate layer is between 0.3mm and 0.9mm, which can make the connection stability of the transparent cover, the optically transparent adhesive, and the substrate layer higher, and at the same time, can better present the pattern formed by the texture layer.

[0009] In conjunction with the first aspect, in one possible implementation, the film further includes a color layer located between the texture layer and the circuit board. The color layer can supplement the color of the pattern formed by the texture layer, enhancing the presentation effect of the pattern.

[0010] In conjunction with the first aspect, in one possible implementation, the film further includes a color layer located between the transparent cover and the substrate layer. The color layer can supplement the color of the pattern formed by the texture layer, enhancing the presentation of the pattern.

[0011] In conjunction with the first aspect, in one possible implementation, the texture layer is located between the transparent cover and the substrate layer. The touch module can display the pattern formed by the texture layer, making it convenient for users to view and enhancing their viewing experience.

[0012] In conjunction with the first aspect, in one possible implementation, the texture layer further includes a color layer located between the texture layer and the transparent cover plate. The color layer can supplement the color of the pattern formed by the texture layer, thereby enhancing the presentation effect of the pattern formed by the texture layer.

[0013] In conjunction with the first aspect, in one possible implementation, the texture layer further includes a color layer located between the substrate layer and the circuit board. The color layer can supplement the color of the pattern formed by the texture layer, enhancing the presentation effect of the pattern.

[0014] In conjunction with the first aspect, in one possible implementation, the diaphragm further includes ink connected to the circuit board, the ink being located on the side of the textured layer close to the circuit board.

[0015] Secondly, this application provides an electronic device that includes a touch module as described in the first aspect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0017] Figure 2 This is an exploded view of a touch module provided in one embodiment of this application;

[0018] Figure 3 This is a schematic diagram illustrating the effect of a touch module displaying a pattern according to an embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the stacked structure of a touch module provided in an embodiment of this application;

[0020] Figure 5 This is a schematic diagram of another stacked structure of a touch module provided in one embodiment of this application;

[0021] Figure 6 A schematic diagram of another layer of the stacked structure of a touch module provided in an embodiment of this application;

[0022] Figure 7 This is a schematic diagram of another layer of the stacked structure of a touch module provided in one embodiment of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Electronic equipment; 10. Touch module; 100. Transparent cover plate; 200. Film; 210. Optical transparent adhesive; 220. Substrate layer; 230. Texture layer; 240. Color layer; 250. Ink; 300. Adhesive backing; 400. Circuit board. Detailed Implementation

[0025] To more clearly illustrate the technical solutions in the embodiments or background art of this application, the application will be further described in detail below with reference to the accompanying drawings.

[0026] Please participate Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device 1 can be a television, an all-in-one computer, a laptop computer, a tablet computer, a wireless keyboard, or a wired keyboard, etc. The electronic device 1 includes a touch module 10, which is used as an input interaction unit of the electronic device. The touch module 10 can be a touch button or a touchpad. Users can control the electronic device 1 by clicking on the touch module 10.

[0027] Please see Figure 2 , Figure 2 This is an exploded view of a touch module provided in an embodiment of this application. The touch module 10 provided in this application can display patterns. In order for the touch module 10 to display patterns, the touch module 10 in this application includes a transparent cover plate 100, a film 200 and a circuit board 400 stacked together. The film 200 is located between the transparent cover plate 100 and the circuit board 400. The film 200 includes a substrate layer and a texture layer stacked together. In the thickness direction of the touch module 10, the texture layer is disposed on one side surface of the substrate layer.

[0028] In some embodiments, the diaphragm 200 and the circuit board 400 can be connected by adhesive 300 to improve the overall stability of the touch module 10.

[0029] In this application, the transparent cover 100 can be a transparent glass cover, or it can be a transparent organic material. The substrate layer 220 can also be a transparent organic material, such as polyimide (PI), polyethylene terephthalate (PET), etc.

[0030] In the embodiments provided in this application, the surface of the transparent cover plate 100 away from the diaphragm 200 includes microstructures, including recesses and / or protrusions. The diameter or lateral dimension of the recesses and protrusions is specified. The microstructures on the surface of the transparent cover plate 100 away from the diaphragm 200 can be obtained through anti-glare treatment (AG). The core objective of AG treatment is to transform the smooth surface of the transparent cover plate 100 into a diffuse reflective surface with microscopic uneven structures, thereby dispersing incident light and reducing specular reflection. Specific methods of AG treatment include chemical etching, particle spraying, coating, and sandblasting.

[0031] After the transparent cover plate 100 is treated with AG, a coating can be applied to the surface of the transparent cover plate 100 away from the membrane 200. The coating can be obtained by performing AF treatment (Anti-Fingerprint Treatment) on the surface of the transparent cover plate 100 away from the membrane 200. AF treatment is a process that reduces the ability of the material surface to adsorb contaminants such as fingerprints and grease through surface coating technology.

[0032] After the surface of the transparent cover 100 away from the membrane 200 is treated with AF (Alternating Atomization), grease is less likely to adhere to this surface, and any grease adhering to it is easier to wipe away. It should be noted that when a user operates on the transparent cover, fingerprints can easily adhere to it. These fingerprints contain grease. After AF treatment, the surface of the transparent cover 100 away from the membrane 200 is less prone to fingerprint adhesion, and even if fingerprints do adhere to this surface, they are easier to wipe away.

[0033] In the thickness direction of the touch module 10, the texture layer 230 is located on one side surface of the substrate layer 220, and the texture layer 230 is capable of forming patterns. Please refer to... Figure 3 The touch module 10 can display the pattern formed by the texture layer 230.

[0034] In the embodiments provided in this application, the circuit board 400 may be a touch circuit board 400, and the touch module 10 may be a touch module 10 capable of implementing touch functions.

[0035] Please refer to the embodiments provided in this application. Figure 4 and Figure 5 The texture layer 230 is located between the circuit board 400 and the substrate layer 220. Both the transparent cover plate 100 and the substrate layer 220 are transparent. Please refer to [link / reference]. Figure 2The texture layer 230 can form patterns, and the touch module 10 can display the patterns formed by the texture layer 230, making it convenient for users to view and improving the user's viewing experience.

[0036] It should be noted that the texture layer 230 can be printed onto the surface of the substrate layer 220 facing away from the transparent cover plate 100 by transfer. Alternatively, the texture layer 230 can be directly etched onto the surface of the substrate layer 220 facing away from the transparent cover plate 100.

[0037] Compared to etching the surface of the substrate layer 220 facing away from the transparent cover plate 100, transferring the texture layer 230 onto the substrate layer 220 avoids damaging the substrate layer 220 and the risk of warping. Furthermore, etching the surface of the substrate layer 220 facing away from the transparent cover plate 100 makes it difficult to ensure uniform etching depth, which is detrimental to the three-dimensional effect of the pattern formed by the texture layer 230. Transferring the texture layer 230 onto the surface of the substrate layer 220 facing away from the transparent cover plate 100 results in a better three-dimensional effect, and the process of transferring the texture layer 230 onto the substrate layer 220 is simpler than etching the texture layer 230 onto the substrate layer 220.

[0038] In the thickness direction of the touch module 10, the thickness of the texture layer 230 is 0.01mm-0.02mm. By making the thickness of the texture layer 230 between 0.01mm and 0.02mm, the touch module 10 can clearly display the pattern formed by the texture layer 230.

[0039] The distance between the surface of the texture layer 230 away from the circuit board 400 and the surface of the transparent cover 100 facing away from the texture layer 230 is 0.3mm-0.9mm. If the distance is too large, the user needs to look through a greater distance (greater than 0.9mm) to see the pattern formed by the texture layer, resulting in a poor pattern presentation. If the distance is too small (less than 0.3mm), the thickness of the transparent cover 100 and the components between it and the texture layer 230 needs to be relatively small, making the manufacturing process of the touch module 10 more difficult and significantly increasing its manufacturing cost.

[0040] For example, the touch module 10 also includes an optically transparent adhesive 210, which connects the transparent cover plate 100 and the substrate layer 220. In the thickness direction of the touch module 10, the sum of the dimensions of the transparent cover plate 100, the optically transparent adhesive 210, and the substrate layer 220 is 0.3mm-0.9mm. The optically transparent adhesive connects the transparent cover plate 100 and the transparent substrate, improving the overall stability of the touch module 10. The fact that the sum of the dimensions of the transparent cover plate 100, the optically transparent adhesive 210, and the substrate layer 220 is between 0.3mm and 0.9mm allows for high connection stability between these components, while also enabling better presentation of the pattern formed by the texture layer 230. It should be noted that if the sum of the dimensions of the transparent cover plate 100, the optically transparent adhesive 210, and the substrate layer 220 is too small (e.g., less than 0.3 mm), the thickness of any one of the transparent cover plate 100, the optically transparent adhesive 210, and the substrate layer 220 will be less than 0.3 mm. This will increase the difficulty of the process of connecting the transparent cover plate 100, the optically transparent adhesive 210, and the substrate layer 220, and the connection stability after the transparent cover plate 100, the optically transparent adhesive 210, and the substrate layer 220 are connected will be significantly reduced. If the combined dimensions of the transparent cover 100, optically transparent adhesive 210, and substrate layer 220 are too large (e.g., greater than 0.9 mm), when the texture layer 230 presents a pattern, the light forming the pattern needs to pass through the substrate layer 220, optically transparent adhesive 210, and transparent cover 100. During the process of light passing through the substrate layer 220, optically transparent adhesive 210, and transparent cover 100, attenuation will occur, resulting in a poor presentation effect of the pattern formed by the texture layer 230, and the pattern may not even be clearly presented on the touch module 10.

[0041] In some embodiments, see Figure 4 The film 200 also includes a color layer 240, which is used to supplement the color of the pattern formed by the texture layer 230. The color layer 240 is located between the texture layer 230 and the circuit board 400. The color layer 240 may include metals, metal oxides, alloys, or non-metal oxides, etc. Specifically, the color layer 240 may include silicon dioxide, titanium, etc. The color layer 240 is a metal, metal oxide, or alloy, and the color layer 240 can be set between the texture layer 230 and the circuit board 400 by electroplating. The color layer 240 can supplement the color of the pattern formed by the texture layer 230, thereby improving the presentation effect of the pattern formed by the texture layer 230.

[0042] In some embodiments, see Figure 5The position of the color layer 240 is not limited; for example, the color layer 240 can be located between the transparent cover plate 100 and the substrate layer 220. The color layer 240 can be electroplated between the transparent cover plate 100 and the substrate layer 220. The color layer 240 can include metals, metal oxides, alloys, or non-metal oxides, specifically, the color layer 240 can include silicon dioxide, titanium, etc. The color layer 240 is a metal, metal oxide, or alloy, and it can be electroplated between the texture layer 230 and the circuit board 400. The color layer 240 can supplement the color of the pattern formed by the texture layer 230, improving the presentation effect of the pattern formed by the texture layer 230. It should be noted that, since the color layer 240 is located between the transparent cover plate 100 and the substrate layer 220, in order to avoid the color layer 240 obscuring the pattern formed by the texture layer 230, the color layer 240 should have high transparency.

[0043] In some embodiments, the diaphragm 200 further includes ink 250, which is connected to the circuit board 400 and is located on the side of the texture layer 230 near the circuit board 400. Specifically, ink 250 is disposed on the side of the color layer 240 facing away from the transparent cover plate 100, and ink 250 connects the color layer 240 and the circuit board 400.

[0044] In the embodiments provided in this application, the thickness of the diaphragm 200 in the thickness direction of the touch module 10 is between 0.13mm and 0.15mm. The diaphragm 200 specifically includes a transparent optical adhesive, a substrate layer 220, a texture layer 230, an ink 250, and a color layer 240.

[0045] Please see Figure 6 and Figure 7 When the texture layer 230 is located between the circuit board 400 and the substrate layer 220, the touch module 10 may sequentially include a transparent cover plate 100, an optically transparent adhesive 210, a substrate layer 220, a texture layer 230, a color layer 240, an ink 250, and a circuit board 400; or, the touch module 10 may sequentially include a transparent cover plate 100, an optically transparent adhesive 210, a color layer 240, a substrate layer 220, a texture layer 230, an ink 250, and a circuit board 400. The touch module 10 includes a transparent cover plate 100, an optically transparent adhesive 210, a color layer 240, a substrate layer 220, a texture layer 230, an ink 250, and a circuit board 400. In the thickness direction of the touch module 10, the sum of the thicknesses of the transparent cover plate 100, the optically transparent adhesive 210, the color layer 240, and the substrate layer 220 is 0.3mm-0.9mm.

[0046] In some embodiments, the texture layer 230 is located between the transparent cover plate 100 and the substrate layer 220. The transparent cover plate 100 is transparent, and the touch module 10 can display the pattern formed by the texture layer 230, making it convenient for users to view and improving the user's viewing experience.

[0047] It should be noted that the texture layer 230 can be printed onto the surface of the substrate layer 220 facing away from the transparent cover plate 100 by transfer. Alternatively, the texture layer 230 can be directly etched onto the surface of the substrate layer 220 facing the transparent cover plate 100.

[0048] Compared to etching the surface of the substrate layer 220 facing the transparent cover plate 100, transferring the texture layer 230 onto the substrate layer 220 does not damage the substrate layer 220 and thus avoids the risk of warping. Furthermore, etching the surface of the substrate layer 220 facing the transparent cover plate 100 makes it difficult to ensure uniform etching depth, which is detrimental to the three-dimensional effect of the pattern formed by the texture layer 230. Transferring the texture layer 230 onto the surface of the substrate layer 220 facing the transparent cover plate 100 results in a better three-dimensional effect, and the process of transferring the texture layer 230 onto the substrate layer 220 is simpler than etching the texture layer 230 onto the substrate layer 220.

[0049] In some embodiments, the color layer 240 may be located between the texture layer 230 and the transparent cover plate 100. The color layer 240 may be electroplated between the transparent cover plate 100 and the substrate layer 220. The color layer 240 may include metals, metal oxides, alloys, or non-metal oxides, specifically, the color layer 240 may include silicon dioxide, titanium, etc. The color layer 240 is a metal, metal oxide, or alloy, and it may be electroplated between the texture layer 230 and the circuit board 400. The color layer 240 can supplement the color of the pattern formed by the texture layer 230, improving the presentation effect of the pattern formed by the texture layer 230. It should be noted that, since the color layer 240 is located between the transparent cover plate 100 and the texture layer 230, in order to avoid the color layer 240 obscuring the pattern formed by the texture layer 230, the color layer 240 should have high transparency.

[0050] In some embodiments, see Figure 7The color layer 240 can also be located between the substrate layer 220 and the circuit board 400. The color layer 240 can be electroplated between the transparent cover plate 100 and the substrate layer 220. The color layer 240 can include metals, metal oxides, alloys, or non-metal oxides, specifically, the color layer 240 can include silicon dioxide, titanium, etc. The color layer 240 is a metal, metal oxide, or alloy, and it can be electroplated between the texture layer 230 and the circuit board 400. The color layer 240 can supplement the color of the pattern formed by the texture layer 230, improving the presentation effect of the pattern formed by the texture layer 230.

[0051] When the texture layer 230 is located between the transparent cover plate 100 and the substrate layer 220, the touch module 10 may sequentially include the transparent cover plate 100, the optically transparent adhesive 210, the texture layer 230, the substrate layer 220, the color layer 240, the ink 250, and the circuit board 400; or, the touch module 10 may sequentially include the transparent cover plate 100, the optically transparent adhesive 210, the color layer 240, the texture layer 230, the substrate layer 220, the ink 250, and the circuit board 400.

[0052] The texture layer 230 has a thickness of 0.01mm-0.02mm in the touch module 10. To better present the pattern formed by the texture layer 230, the distance between the surface of the texture layer 230 away from the circuit board 400 and the surface of the transparent cover 100 facing away from the texture layer 230 is 0.3mm-0.9mm. For example, the touch module 10 sequentially includes a transparent cover 100, an optically transparent adhesive 210, a texture layer 230, a substrate layer 220, a color layer 240, an ink 250, and a circuit board 400. In the thickness direction of the touch module 10, the sum of the thicknesses of the transparent cover 100 and the optically transparent adhesive 210 is 0.3mm-0.9mm. The touch module 10 includes a transparent cover plate 100, an optically transparent adhesive 210, a color layer 240, a texture layer 230, a substrate layer 220, an ink 250, and a circuit board 400. In the thickness direction of the touch module 10, the sum of the thicknesses of the transparent cover plate 100, the optically transparent adhesive 210, and the color layer 240 is 0.3mm-0.9mm.

[0053] It should be understood that expressions such as “comprising” and “may include” used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as “comprising” and / or “having” are to be interpreted as indicating a particular characteristic, number, operation, constituent element, component, or combination thereof, but not to exclude the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0054] Furthermore, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0055] In this application, expressions including ordinal numbers such as "first" and "second" may modify the elements. However, such elements are not limited by the foregoing expressions. For example, the foregoing expressions do not limit the order and / or importance of the elements. The foregoing expressions are only used to distinguish one element from other elements. For example, "first user equipment" and "second user equipment" refer to different user equipment, although both "first user equipment" and "second user equipment" are user equipment. Similarly, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0056] When a component is referred to as "connected" or "accessed" to other components, it should be understood that this component not only connects directly to or accesses other components, but also that another component may exist between this component and other components. On the other hand, when a component is referred to as "directly connected" or "directly accessed" to other components, it should be understood that no component exists between them.

[0057] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A touch module, characterized in that, The device includes a transparent cover plate, a film, and a circuit board stacked together. The film is located between the transparent cover plate and the circuit board. The film includes a substrate layer and a texture layer stacked together. The texture layer is used to form a pattern. In the thickness direction of the touch module, the texture layer is disposed on one side surface of the substrate layer.

2. The touch module as described in claim 1, characterized in that, The texture layer is located between the circuit board and the substrate layer.

3. The touch module as described in claim 2, characterized in that, In the thickness direction of the touch module, the thickness of the texture layer is 0.01mm-0.02mm.

4. The touch module as described in claim 2, characterized in that, The touch module also includes an optically transparent adhesive, which is connected between the transparent cover and the substrate layer. In the thickness direction of the touch module, the sum of the dimensions of the transparent cover, the optically transparent adhesive and the substrate layer is 0.3mm-0.9mm.

5. The touch module as described in claim 2, characterized in that, The diaphragm also includes a color layer, which is located between the texture layer and the circuit board.

6. The touch module as described in claim 2, characterized in that, The membrane also includes a color layer, which is located between the transparent cover and the substrate layer.

7. The touch module as described in claim 1, characterized in that, The textured layer is located between the transparent cover and the substrate layer.

8. The touch module as described in claim 7, characterized in that, The texture layer also includes a color layer, which is located between the texture layer and the transparent cover plate.

9. The touch module as described in claim 7, characterized in that, The texture layer also includes a color layer, which is located between the substrate layer and the circuit board.

10. The touch module as described in any one of claims 2-7, characterized in that, The diaphragm also includes ink, which is connected to the circuit board and is located on the side of the textured layer close to the circuit board.

11. An electronic device, characterized in that, The electronic device includes a touch module as described in any one of claims 1-10.

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