A spliced module backboard

Abstract

This utility model relates to the field of display module technology, specifically a splicing module back panel. The back panel includes a back panel body, which includes a substrate. The substrate has four side panels formed by bending its edges upwards. The substrate also includes a main board with recessed heat dissipation grooves inside. Several reinforcing plates are symmetrically arranged on the main board. Several heat-conducting cavities communicating with the heat dissipation grooves are formed on the main board. Each side panel includes a protective plate. One end of the protective plate is stamped inward to form a positioning groove, and the other end is stamped outward to form a positioning groove. This utility model has the advantages of simple structure, reasonable design, one-piece stamping, high production efficiency, and good heat dissipation performance, and is worthy of widespread promotion and application.

Description

Technical Field

[0001] This utility model relates to the field of display module technology, specifically a splicing module backplate. Background Technology

[0002] In an era of rapid development in digital display technology, video wall displays, with their ability to achieve large-size, high-resolution displays, are widely used in numerous fields such as public displays, commercial exhibitions, and command and control centers. As a key supporting structure for video wall displays, the back panel of the video wall module directly affects the stability, display effect, and ease of installation and maintenance of the display device.

[0003] The existing module backplate structure is relatively complex and the design is unreasonable. During the production of the module backplate, the side plate needs to be soldered to the motherboard, which reduces the production efficiency of the module backplate. After the module backplate is assembled, it covers the display screen. The module backplate that is close to the display screen has poor heat dissipation performance. Heat accumulation can easily cause accelerated damage to the internal electronic components of the display screen and reduce the lifespan of the display screen. Utility Model Content

[0004] The purpose of this utility model is to provide a modular backplate with advantages such as simple structure, reasonable design, one-piece stamping, high production efficiency, and good heat dissipation performance, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a splicing module backplate, comprising: a backplate body, the backplate body including a substrate, the substrate having four side plates formed by bending its edges upwards, and the substrate including a main board, the main board having a heat dissipation groove recessed inside, and a plurality of reinforcing plates symmetrically arranged on the main board, the main board having a plurality of heat conduction cavities connected to the heat dissipation grooves, each of the side plates including a protective plate, one end of the protective plate being punched inward to form a positioning groove, and the other end being punched outward to form a positioning groove.

[0006] Preferably, each of the reinforcing plates is flush with the surface of the motherboard, each of the heat-conducting cavities is placed between the reinforcing plates, and the depth of the heat-conducting cavity is less than the depth of the heat sink.

[0007] Preferably, the motherboard has two reinforcing strips in the middle, each reinforcing strip has a heat-conducting cavity 2 recessed inside, and a heat-conducting cavity 3 communicating with the heat dissipation groove is opened between the two reinforcing strips.

[0008] Preferably, the reinforcing strip is flush with the surface of the motherboard, the depth of the second heat-conducting cavity is equal to the depth of the first heat-conducting cavity, and the depth of the third heat-conducting cavity is equal to the depth of the heat sink.

[0009] Preferably, the heat sink has two mounting holes, and each mounting hole facing the substrate has a positioning ring.

[0010] Preferably, heat dissipation vents are provided between the ends of the four protective plates.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This utility model provides a splicing module backplate, which includes a base plate and side plates. The overall structure is simple and reasonably designed. The side plates are bent by stamping the base plate to complete the manufacturing process, which improves the production efficiency of the module backplate. The heat dissipation groove is set in the main board, and the main board, reinforcing sheet and reinforcing strip abut against the display screen. The heat dissipation groove is connected by heat conduction cavity one and heat conduction cavity three, and the heat is discharged from the heat dissipation port, which can avoid heat accumulation, improve heat dissipation efficiency and increase the service life of the display screen. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0014] Figure 2 This utility model Figure 1 Enlarged schematic diagram of the structure at point A;

[0015] Figure 3 This utility model Figure 1 Enlarged schematic diagram of the structure at point B;

[0016] Figure 4 This utility model Figure 1 Enlarged schematic diagram of the structure at point C.

[0017] The reference numerals and names in the figure are as follows:

[0018] 1. Backplate main body; 11. Base plate; 111. Main board; 112. Heat sink; 113. Reinforcing plate; 114. Heat conduction cavity one; 115. Reinforcing strip; 116. Heat conduction cavity two; 117. Heat conduction cavity three; 12. Side plate; 121. Protective plate; 122. Positioning groove one; 123. Mounting hole; 124. Positioning groove two; 125. Heat dissipation port. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of the embodiments of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments of this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0021] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0022] Please see Figures 1 to 4This utility model provides an embodiment of a modular backplate, comprising: a backplate body 1, the backplate body 1 including a base plate 11, the base plate 11 having four side plates 12 formed by bending its edges upwards, and the base plate 11 including a main board 111, the main board 111 having a recessed heat dissipation groove 112 inside, and a plurality of reinforcing plates 113 symmetrically arranged on the main board 111, the main board 111 having a plurality of heat conduction cavities 114 communicating with the heat dissipation groove 112, each side plate 12 including a protective plate 121, one end of the protective plate 121 being punched inward to form a positioning groove 122, and the other end being punched outward to form a positioning groove 124, each reinforcing plate 113 being flush with the surface of the main board 111, and each heat conduction cavity 114 being placed on the reinforcing plate 123. Between 13, and the depth of the first heat conduction cavity 114 is less than the depth of the heat sink 112. Two reinforcing bars 115 are provided in the middle of the motherboard 111. Each reinforcing bar 115 has a second heat conduction cavity 116 recessed inside. A third heat conduction cavity 117 communicating with the heat sink 112 is opened between the two reinforcing bars 115. The reinforcing bars 115 are flush with the surface of the motherboard 111. The depth of the second heat conduction cavity 116 is equal to the depth of the first heat conduction cavity 114. The depth of the third heat conduction cavity 117 is equal to the depth of the heat sink 112. Two mounting holes 123 are provided on the heat sink 112. A positioning ring is provided in each mounting hole 123 facing the substrate 11. A heat dissipation port 125 is provided between the ends of the four protective plates 121.

[0023] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A modular backplate, characterized in that, include: The back panel body (1) includes a base plate (11), the edge of the base plate (11) is bent upward to form four side plates (12), and the base plate (11) includes a main board (111), the main board (111) has a heat dissipation groove (112) recessed inside, and a number of reinforcing plates (113) are symmetrically arranged on the main board (111). A number of heat conduction cavities (114) communicating with the heat dissipation groove (112) are opened on the main board (111). Each side plate (12) includes a protective plate (121), one end of the protective plate (121) is punched inward to form a positioning groove (122), and the other end is punched outward to form a positioning groove (124).

2. The modular backplate according to claim 1, characterized in that: Each of the reinforcing plates (113) is flush with the surface of the motherboard (111), and each of the heat-conducting cavities (114) is placed between the reinforcing plates (113), and the depth of the heat-conducting cavity (114) is less than the depth of the heat sink (112).

3. The modular backplate according to claim 1, characterized in that: The motherboard (111) has two reinforcing strips (115) in the middle. Each reinforcing strip (115) has a heat-conducting cavity two (116) recessed inside, and a heat-conducting cavity three (117) communicating with the heat dissipation groove (112) is opened between the two reinforcing strips (115).

4. The modular backplate according to claim 3, characterized in that: The reinforcing strip (115) is flush with the surface of the motherboard (111), the depth of the second heat-conducting cavity (116) is equal to the depth of the first heat-conducting cavity (114), and the depth of the third heat-conducting cavity (117) is equal to the depth of the heat sink (112).

5. A modular backplate according to claim 1, characterized in that: The heat sink (112) is provided with two mounting holes (123), and each mounting hole (123) facing the substrate (11) is provided with a positioning ring.

6. A modular backplate according to claim 1, characterized in that: A heat dissipation vent (125) is provided between the ends of the four protective plates (121).

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