Data detection device for NAND flash chip

Abstract

The utility model discloses NAND flash chip's data detection equipment, include: camera structure, detection equipment, including data reader, fixed establishment, piece mechanism, adjusting mechanism and antiskid mechanism, data reader one side is equipped with a plurality of insertion slot, the fixed establishment includes the fixed shell of fixed mounting in data reader outer wall near insertion slot one side, infrared sensor is fixedly installed one side of the connecting groove, piece mechanism slidingly connected in the connecting groove inside, a plurality of equidistance are fixedly installed with the baffle in piece mechanism inside, a plurality of insert piece seat are slidingly connected on the baffle upper surface, the chip groove is established on the insert piece seat upper surface, adjusting mechanism and antiskid mechanism all set up in fixed establishment left side, can solve in actual use, can solve in actual use, chip detection adopts manual plug -in chip to easily lead to the fatigue of detection personnel, and then causes the operation mistake, causes the chip damage or the problem of detection result deviation.

Description

Technical Field

[0001] This utility model relates to the field of chip data testing equipment technology, and in particular to a data testing equipment for NAND Flash chips. Background Technology

[0002] In traditional NAND Flash chip data testing processes, chip insertion and removal are primarily performed manually. Testers must insert each chip one by one into the test ports of the testing equipment, complete data reading and writing, and electrical performance testing, before manually removing the chip and replacing it with the next one. This manual operation mode has several drawbacks: First, the repetitive insertion and removal work over long periods can easily lead to operator fatigue, resulting in operational errors, chip damage, or inaccurate test results. Second, manual operation is inefficient and cannot meet the testing requirements of large-scale mass production, especially in wafer-level testing or high-density parallel testing scenarios, where labor and time costs increase dramatically. Furthermore, manual operation carries potential risks such as poor contact and electrostatic discharge (ESD) damage. These problems not only affect the accuracy and consistency of test results but may also delay the entire testing process, posing a challenge to the timeliness of chip mass production.

[0003] Therefore, this application provides a data detection device for NAND Flash chips. Utility Model Content

[0004] This invention provides a data testing device for NAND Flash chips, which can solve the problem that in actual use, manual chip insertion and removal can easily lead to operator fatigue, resulting in operational errors, chip damage, or deviation in test results.

[0005] This utility model provides a data detection device for NAND Flash chips, including:

[0006] The testing equipment includes a data reader, a fixing mechanism, a wafer loading mechanism, an adjustment mechanism, and an anti-slip mechanism. The data reader has multiple insertion slots on one side, and multiple connection terminals are fixedly installed at the lower end of each insertion slot. The fixing mechanism includes a fixing shell fixedly installed on the outer wall of the data reader near the insertion slots. A connection slot is opened on the fixing shell near the data reader, and an infrared sensor is fixedly installed on one side of the connection slot. The wafer loading mechanism is slidably connected inside the connection slot. Multiple partitions are equidistantly arranged inside the wafer loading mechanism. Multiple wafer holders are slidably connected to the upper surface of each partition, and chip slots are opened on the upper surface of each wafer holder. The adjustment mechanism and the anti-slip mechanism are both located on the left side of the fixing mechanism.

[0007] The insertion and removal mechanism includes a through groove disposed on the front side of the fixing mechanism and an insertion and removal motor fixedly installed on the right side of the fixing housing. The through groove and the connecting groove are interconnected. A rotating shaft is rotatably connected inside the through groove. Multiple eccentric wheels are fixedly installed on the outer wall of the rotating shaft. One side of the rotating shaft is fixedly connected to the end of the output shaft of the insertion and removal motor.

[0008] In a data detection device for NAND Flash chips according to an embodiment of the present invention, pressure plates are fixedly installed on both the left and right sides of the upper end of the chip slot, and a silicone pad is fixedly installed on the bottom of the pressure plate.

[0009] In a data detection device for NAND Flash chips according to an embodiment of the present invention, mounting blocks are integrally provided at both ends of the connection between the partition and the insert socket. A sliding groove is provided inside the mounting block. Bosses are provided on both the left and right sides of the upper surface of the insert socket. The bosses are slidably connected to the inside of the sliding groove. A spring is provided between the bosses and the sliding groove.

[0010] In a data detection device for NAND Flash chips according to an embodiment of the present invention, the adjustment mechanism includes an adjustment motor fixedly installed on the left side of the fixed housing, a gear formed on the upper left surface of the fixed housing, and a rack fixedly installed on the left rear end of the wafer mounting mechanism. The output shaft end of the adjustment motor is fixedly installed with a gear, and the gear and the rack mesh with each other.

[0011] In a data detection device for NAND Flash chips according to an embodiment of the present invention, a control button and a display screen are provided on the outside of the data reader, and a control circuit board and a battery are provided inside the data reader. The data reader is electrically connected to an infrared sensor, a plug-in motor and an adjustment motor.

[0012] In a data detection device for NAND Flash chips according to an embodiment of the present invention, the anti-slip mechanism includes a ratchet rack fixedly installed on the outer wall of the left side of the die-loading mechanism and a side groove formed on the outer wall of the left side of the fixed housing. A top rod is rotatably connected inside the side groove. One end of the top rod contacts the outer wall of the ratchet rack, and the other end extends out from inside the side groove.

[0013] In a data detection device for NAND Flash chips according to an embodiment of the present invention, a protrusion is fixedly installed on one side of the top rod, and a reset spring is fixedly installed between the protrusion and the side groove.

[0014] In a data detection device for a NAND Flash chip according to one embodiment of the present invention, a groove adapted to a ratchet is provided on the left side of the fixing shell, and the groove is connected to the side groove.

[0015] The technical solutions provided in this application can include the following beneficial effects: This application designs a data testing device for NAND Flash chips, which can solve the problem that in actual use, manual chip insertion and removal can easily lead to operator fatigue, resulting in operational errors, chip damage, or deviation in testing results.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a data detection device for a NAND Flash chip provided in an embodiment of this application;

[0019] Figure 2 yes Figure 1 A schematic diagram of the data reader in a data detection device for NAND Flash chips;

[0020] Figure 3 yes Figure 1 A schematic diagram of the fixing mechanism and the die-loading mechanism in a data testing device for NAND Flash chips;

[0021] Figure 4 yes Figure 3 Enlarged view of the fixing mechanism and die-loading mechanism A in the data inspection equipment for NAND Flash chips;

[0022] Figure 5 yes Figure 3 Enlarged view of the fixing mechanism and the die-loading mechanism B in the data detection equipment for NAND Flash chips. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0026] like Figures 1 to 5 As shown, this application provides a data testing device for NAND Flash chips, including: a testing device 100, comprising a data reader 10, a fixing mechanism 20, a die-loading mechanism 30, an adjustment mechanism 50, and an anti-slip mechanism 60. The data reader 10 has multiple insertion slots 11 on one side, and multiple connection terminals 12 are fixedly installed at the lower end inside the insertion slots 11. The fixing mechanism 20 includes a fixing shell 21 fixedly installed on the outer wall of the data reader 10 near the insertion slots 11. A connection slot 22 is opened on the fixing shell 21 near the data reader 10, and an infrared sensor 23 is fixedly installed on one side of the connection slot 22. The die-loading mechanism 30 is slidably connected inside the connection slot 22. The die loading mechanism 30 has multiple partitions 31 fixedly installed inside, and multiple die inserters 32 are slidably connected to the upper surface of the partitions 31. The upper surface of the die inserters 32 has a chip slot 33. The adjustment mechanism 50 and the anti-slip mechanism 60 are both located on the left side of the fixed mechanism 20. The insertion and removal mechanism 40 includes a through groove 42 located on the front side of the fixed mechanism 20 and an insertion and removal motor 41 fixedly installed on the right side of the fixed housing 21. The through groove 42 is connected to the connecting groove 22. A rotating shaft 43 is rotatably connected inside the through groove 42. Multiple eccentric wheels 44 are fixedly installed on the outer wall of the rotating shaft 43. One side of the rotating shaft 43 is fixedly connected to the end of the output shaft of the insertion and removal motor 41.

[0027] After adopting the above technical solution, since the die loading mechanism 30 is equipped with multiple partitions 31 and multiple die inserters 32 are slidably connected to the upper surface of the partitions 31, the chip is placed inside the die inserter 32. When chip testing is required, it is only necessary to control the data reader 10 to drive the output shaft of the insertion motor 41 to drive the rotating shaft 43 to rotate. When the rotating shaft 43 rotates, the eccentric wheel 44 on its outer wall pushes the die inserter 32 and the chip outward to realize automatic chip insertion. After the test is completed, the rotating shaft 43 continues to rotate, and the die inserter 32 and the chip rebound and reset under the influence of the spring 39 to realize automatic chip removal. This can solve the problem that manual chip insertion and removal in traditional chip testing is prone to cause fatigue of the test personnel, which in turn leads to operational errors, chip damage, or deviation of test results.

[0028] It should be noted that the chip to be tested is placed inside the chip slot 33, and the chip is fixed by the pressure plates 34 and silicone pads 35 on both sides of the chip slot 33. After the chip is placed, the control data reader 10 can drive the output shaft of the insertion motor 41 to drive the rotating shaft 43 to rotate. When the rotating shaft 43 rotates, the eccentric wheel 44 on its outer wall pushes the chip holder 32 and the chip outward, so that the chip's contacts enter the insertion slot 11 and contact the connection terminal 12. At this time, the spring 39 is compressed by 38 and deforms to accumulate potential energy. The data reader 10 reads the data of the chip. After reading is completed, Afterwards, the rotating shaft 43 continues to rotate under the influence of the insertion and removal motor 41. The chip holder 32 and the chip are reset by the release of potential energy by the spring 39 to realize automatic chip removal. After the chip in the upper layer has been detected, the adjusting motor 51 drives the gear 52 to rotate. The gear 52 and the rack 53 drive the chip loading mechanism 30 to move upward along the connecting groove 22, thereby moving the undetected chip inside the chip loading mechanism 30 to the insertion groove 11. The position of the chip is monitored by the infrared sensor 23, so that the equipment can detect a large number of chips at one time without the need for frequent chip loading operations.

[0029] In one optional embodiment, pressure plates 34 are fixedly installed on both the left and right sides of the upper end of the chip slot 33, and silicone pads 35 are fixedly installed on the bottom of the pressure plates 34. When the chip is placed inside the chip slot 33, the pressure plates 34 and silicone pads 35 press the upper wall of the chip together to improve the stability of the chip after installation and prevent the chip from sliding out of the chip slot 33 during the chip removal process, thus preventing the chip from being unable to be removed.

[0030] In an optional embodiment, mounting blocks 36 are integrally provided at both ends of the connection between the partition 31 and the chip holder 32. The mounting blocks 36 are provided with sliding grooves 37. The upper surface of the chip holder 32 is provided with protrusions 38 on both the left and right sides. The protrusions 38 are slidably connected to the sliding grooves 37. A spring 39 is provided between the protrusions 38 and the sliding grooves 37. During the chip insertion process, the protrusions 38 move together with the chip holder 32 to compress the spring 39. After the chip detection is completed, the potential energy is released by the spring 39 to pull the chip holder 32 outward to realize automatic chip removal.

[0031] In an optional embodiment, the adjustment mechanism 50 includes an adjustment motor 51 fixedly mounted on the left side of the fixed housing 21, a gear 52 formed on the upper left surface of the fixed housing 21, and a rack 53 fixedly mounted on the rear left side of the loading mechanism 30. The output shaft end of the adjustment motor 51 is fixedly mounted with the gear 52, and the gear 52 and the rack 53 mesh with each other.

[0032] In one optional implementation, after the upper-layer chip has been tested, the motor 51 is adjusted to drive the gear 52 to rotate. The gear 52, in conjunction with the rack 53, drives the die-loading mechanism 30 to move upward along the connecting groove 22, thereby moving the untested chips inside the die-loading mechanism 30 to the insertion groove 11. This allows the device to test a large number of chips at once without the need for frequent chip loading operations.

[0033] In an optional implementation, the data reader 10 is provided with control buttons and a display screen on its outer side, and a control circuit board and a battery are provided inside the data reader 10. The data reader 10 is electrically connected to the infrared sensor 23, the insertion / removal motor 41 and the adjustment motor 51, and can drive the insertion / removal motor 41 and the adjustment motor 51 to start and stop, so as to facilitate the insertion and removal of the chip.

[0034] In an optional embodiment, the anti-slip mechanism 60 includes a ratchet 61 fixedly installed on the left outer wall of the loading mechanism 30 and a side groove 62 formed on the left outer wall of the fixed housing 21. A push rod 63 is rotatably connected inside the side groove 62. One end of the push rod 63 contacts the outer wall of the ratchet 61, and the other end extends out from inside the side groove 62. During the upward movement of the loading mechanism 30, the push rod 63 contacts the straight surface of the ratchet 61. Since the angle between the straight surface and the push rod 63 is usually a right angle, the push rod 63 cannot slide into the tooth groove, but is blocked on the back of the tooth, thereby supporting the loading mechanism 30 and preventing the loading mechanism 30 from sliding down. When the loading mechanism 30 moves to the uppermost position, by pressing the outer side of the push rod 63, the push rod 63 is no longer in contact with the ratchet 61, thereby allowing the loading mechanism 30 to move down and reset.

[0035] In an optional embodiment, a protrusion 64 is fixedly installed on one side of the push rod 63, and a return spring 65 is fixedly installed between the protrusion 64 and the side groove 62. When the loading mechanism 30 moves to the uppermost position, the push rod 63 is supported by the return spring 65, so that the inner side is always in contact with the outer wall of the ratchet rack 61. At the same time, after pressing the push rod 63, the push rod 63 is reset by the return spring 65.

[0036] In an optional embodiment, the left side of the fixed housing 21 is provided with a groove that is adapted to the ratchet 61, and the groove is connected to the side groove 62. The groove is provided so that the ratchet 61 can pass through when it moves.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A data detection device for NAND Flash chips, characterized in that, include: The testing equipment includes a data reader, a fixing mechanism, a wafer loading mechanism, an adjustment mechanism, and an anti-slip mechanism. The data reader has multiple insertion slots on one side, and multiple connection terminals are fixedly installed at the lower end of each insertion slot. The fixing mechanism includes a fixing shell fixedly installed on the outer wall of the data reader near the insertion slots. A connection slot is opened on the fixing shell near the data reader, and an infrared sensor is fixedly installed on one side of the connection slot. The wafer loading mechanism is slidably connected inside the connection slot. Multiple partitions are equidistantly arranged inside the wafer loading mechanism. Multiple wafer holders are slidably connected to the upper surface of each partition, and chip slots are opened on the upper surface of each wafer holder. The adjustment mechanism and the anti-slip mechanism are both located on the left side of the fixing mechanism. The insertion and removal mechanism includes a through groove disposed on the front side of the fixing mechanism and an insertion and removal motor fixedly installed on the right side of the fixing housing. The through groove and the connecting groove are interconnected. A rotating shaft is rotatably connected inside the through groove. Multiple eccentric wheels are fixedly installed on the outer wall of the rotating shaft. One side of the rotating shaft is fixedly connected to the end of the output shaft of the insertion and removal motor.

2. The data detection device for NAND Flash chips according to claim 1, characterized in that, Pressure plates are fixedly installed on both the left and right sides of the upper end of the chip slot, and silicone pads are fixedly installed on the bottom of the pressure plates.

3. The data detection device for NAND Flash chips according to claim 1, characterized in that, Both ends of the connection between the partition and the insert seat are integrally provided with mounting blocks. The mounting blocks are provided with sliding grooves. The upper surface of the insert seat is provided with bosses on both the left and right sides. The bosses are slidably connected to the inside of the sliding grooves. A spring is provided between the bosses and the sliding grooves.

4. The data detection device for NAND Flash chips according to claim 1, characterized in that, The adjustment mechanism includes an adjustment motor fixedly installed on the left side of the fixed housing, a gear formed on the upper left surface of the fixed housing, and a rack fixedly installed on the left rear end of the loading mechanism. The output shaft end of the adjustment motor is fixedly installed with a gear, and the gear meshes with the rack.

5. The data detection device for NAND Flash chips according to claim 4, characterized in that, The data reader is equipped with control buttons and a display screen on its outer side, and a control circuit board and a battery are installed inside the data reader. The data reader is electrically connected to the infrared sensor, the plug-in motor, and the adjustment motor.

6. The data detection device for NAND Flash chips according to claim 1, characterized in that, The anti-slip mechanism includes a ratchet rack fixedly installed on the left outer wall of the loading mechanism and a side groove opened on the left outer wall of the fixed shell. A top rod is rotatably connected inside the side groove. One end of the top rod contacts the outer wall of the ratchet rack, and the other end extends out from inside the side groove.

7. The data detection device for NAND Flash chips according to claim 6, characterized in that, A protrusion is fixedly installed on one side of the top rod, and a return spring is fixedly installed between the protrusion and the side groove.

8. The data detection device for NAND Flash chips according to claim 6, characterized in that, The left side of the fixed shell has a groove that matches the ratchet rack, and the groove is connected to the side groove.

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