Solid state drive high temperature burn-in test equipment

Abstract

The utility model relates to test equipment technical field provides a kind of solid state disk high temperature ageing test equipment.The equipment includes mounting bracket, head cover, air supply chamber and fan, and mounting bracket includes installation side plate, installation upper plate and installation lower plate, and installation side plate includes first wall surface, and installation upper plate and installation lower plate are located in first wall surface, and installation upper plate is equipped with air inlet, and installation lower plate is equipped with air outlet, and the air inlet wind area is greater than the air outlet air outlet area;Head cover is collectively surrounded with mounting bracket and sets out ageing space, and head cover is equipped with air outlet, and the air outlet is located in the downside of air outlet;Air supply chamber includes air supply inlet and air supply outlet, and at least part of air supply chamber is inserted into ageing space, and air supply outlet cover is equipped in air inlet.According to the equipment provided in the embodiment of the utility model, the energy consumption of the whole equipment can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of testing equipment technology, and in particular to a high-temperature aging testing device for solid-state drives. Background Technology

[0002] High-temperature aging test equipment is a test device designed to simulate high-temperature environments for high-performance electronic products.

[0003] In existing technologies, solid-state high-temperature aging test equipment mainly forms an aging space, in which solid-state drives are placed. By regulating the temperature within the aging space, the high-temperature working environment of the solid-state drives is simulated.

[0004] Typically, to ensure a constant temperature within the aging chamber, testing equipment is equipped with a cooling fan and heating elements. The cooling fan cools the chamber when it gets too hot, while the heating elements heat it when it gets too cold, thus maintaining the temperature within the aging chamber within the aging test range. However, this process results in low energy efficiency, which is detrimental to controlling testing costs. Utility Model Content

[0005] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, this utility model provides a high-temperature aging test device for solid-state drives.

[0006] This utility model discloses a high-temperature aging test device for solid-state drives (SSDs), comprising: a mounting bracket, the mounting bracket including a mounting side plate, a mounting upper plate, and a mounting lower plate, the mounting side plate including a first wall surface, the mounting upper plate and the mounting lower plate both disposed on the first wall surface, the mounting upper plate and the mounting lower plate being vertically opposite to each other, the SSD being fixed between the mounting upper plate and the mounting lower plate, the mounting upper plate having an air inlet hole, and the mounting lower plate having an air outlet hole, the air inlet area of ​​the air inlet hole being larger than the air outlet area of ​​the air outlet hole; and a head cover, the head cover being connected to the mounting bracket. An aging space is jointly enclosed, and the head cover is provided with an air outlet; an air supply chamber, including an air supply inlet and an air supply outlet, at least a portion of which extends into the aging space, and an air supply outlet is provided at the air inlet; a fan is provided at the air supply inlet; the fan is used to drive airflow from the air supply inlet to the air supply chamber, the airflow flows from the air supply inlet to the air supply outlet, and then is delivered to the top of the solid-state drive through the air inlet, flows over the side of the solid-state drive, and then flows from the bottom of the solid-state drive to the air outlet, and then flows from the air outlet to the air outlet.

[0007] According to the solid-state drive high-temperature aging test equipment provided in the embodiments of this application, the airflow passing through the solid-state drive will flow to the air outlet and out of the aging space to carry away some of the heat of the solid-state drive, thereby cooling the solid-state drive and preventing the temperature of the solid-state drive from exceeding the upper limit of the aging test temperature, which would affect the test results.

[0008] Another part of the airflow through the solid-state drive flows to the vent. Since the cross-sectional area of ​​the vent is smaller than that of the inlet, the airflow needs to flow along the mounting plate when it flows to the mounting plate. When it reaches the vent, it flows through the vent to the vent and then out of the aging space.

[0009] It can be understood that the high-temperature gas flowing from the air inlet to the air outlet will stay around the solid-state drive (SSD), prolonging the time that the high-temperature gas stays around the SSD. This high-temperature gas, in turn, maintains the temperature of the SSD. That is, the heat carried away by the airflow from the SSD stays around the SSD, maintaining its temperature and reducing the rate at which the SSD's temperature drops. This allows the heat from the airflow to be applied to the SSD, improving heat utilization efficiency and reducing the overall power consumption of the device.

[0010] In one possible implementation of this application, the upper mounting plate is provided with a first slot, and the number of first slots is multiple, which are spaced apart in a first direction, the first direction being the arrangement direction of multiple solid-state drives; the lower mounting plate is provided with a second slot, and the number of second slots is multiple, which are spaced apart in a first direction, each first slot corresponding to a unique second slot; the number of air inlets is multiple, which are spaced apart in a first direction, and the air inlets are alternately arranged with the first slots; the number of air outlets is multiple, which are spaced apart in a first direction, and the air outlets are alternately arranged with the second slots.

[0011] In one possible implementation of this application, the air inlet includes a first upper edge away from the mounting side plate, and the air outlet includes a first lower edge away from the mounting side plate, the first lower edge being located on the side of the first upper edge facing the mounting side plate.

[0012] In one possible implementation of this application, the vent includes a plurality of sub-vents, which are spaced apart.

[0013] In one possible implementation of this application, the head cover includes a first cover plate opposite to the mounting side plate, and the air outlet is located on the first cover plate.

[0014] In one possible implementation of this application, the number of air inlets is multiple; the number of air outlets is multiple, and the number of air inlets is greater than the number of air outlets.

[0015] In one possible implementation of this application, the vent is located below the vent.

[0016] In one possible implementation of this application, the air supply chamber includes a first air supply section and a second air supply section. The first air supply section is located within the aging space, and the second air supply section is located outside the aging space. One end of the first air supply section is formed as the air outlet, and the other end of the first air supply section is a first connection port. The first end of the second air supply section is formed as the air inlet, and the other end of the second air supply section is a second connection port that communicates with the first connection port. The cross-sectional area of ​​the first connection port is smaller than the cross-sectional area of ​​the air inlet.

[0017] In one possible implementation of this application, the first air supply section includes a first guide wall opposite to the mounting side plate, and the first guide wall extends obliquely away from the mounting side plate in the direction toward the air supply outlet.

[0018] In one possible implementation of this application, the mounting side plate further includes a second wall opposite to the first wall; the solid-state drive high-temperature aging test equipment further includes: a circuit board and a power supply module, both of which are disposed on the second wall and are electrically connected to the solid-state drive. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a solid-state drive high-temperature aging test device according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 A cross-sectional view of the solid-state drive high-temperature aging test equipment shown in the image;

[0023] Figure 3 for Figure 1 A schematic diagram of the mounting bracket shown;

[0024] Figure 4 This is a schematic diagram of the mounting plate shown in Figure 3;

[0025] Figure 5 for Figure 4 Enlarged view of point A shown;

[0026] Figure 6 for Figure 3 A schematic diagram of the mounting plate shown;

[0027] Figure 7 for Figure 6 Enlarged view of point B shown;

[0028] Figure 8 for Figure 2 A schematic diagram of the nose cone shown;

[0029] Figure 9 for Figure 2 The diagram shows the air supply chamber.

[0030] Figure label:

[0031] 100. Solid State Drive High-Temperature Aging Test Equipment;

[0032] 110. Install bracket; 111. Install side panel; 112. Install top panel; 1121. First slot; 1122. Air inlet; 1123. First upper edge; 113. Install bottom panel; 1131. Second slot; 1132. Air outlet; 1133. Sub-air outlet; 1134. First lower edge;

[0033] 120. Engine head cover; 121. Air outlet; 122. First cover plate; 1221. Transparent plate;

[0034] 130. Air supply chamber; 131. Air supply inlet; 132. Air supply outlet; 133. First air supply section; 134. Second air supply section; 135. First guide wall; 136. Filter screen;

[0035] 140. Fan;

[0036] 150. Chassis;

[0037] 200. Solid State Drive (SSD). Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0039] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but may be changed as will become clear upon understanding this disclosure, except for operations that must occur in a specific order. Furthermore, for the sake of clarity and conciseness, descriptions of features known upon understanding this disclosure may be omitted.

[0040] It should be noted that, unless there is a conflict, the various features in the embodiments of this application can be combined with each other, all of which are within the protection scope of this application. Furthermore, although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than the module division in the device or the order in the flowchart. Moreover, the terms "first," "second," and "third" used in this application do not limit the data or execution order, but only distinguish identical or similar items with essentially the same function and effect.

[0041] High-temperature aging test equipment is a test device designed to simulate high-temperature environments for high-performance electronic products.

[0042] In related embodiments, the solid-state high-temperature aging test equipment mainly forms an aging space, in which the solid-state drive is placed. By regulating the temperature in the aging space, the high-temperature working environment of the solid-state drive is simulated.

[0043] Generally, to ensure a constant temperature within the aging chamber, testing equipment is equipped with a cooling fan and heating elements. The cooling fan is used to cool the aging chamber when the temperature is too high, and the heating elements are used to heat the aging chamber when the temperature is too low, thus ensuring that the temperature within the aging chamber remains within the aging test range. However, this process requires the addition of heating elements, utilizing external energy for heating, which increases energy consumption and has low energy efficiency, making it difficult to control testing costs.

[0044] To resolve the above technical issues, please refer to Figure 1 and Figure 2This application provides a solid-state drive high-temperature aging test device 100, which may include: a mounting bracket 110, a head cover 120, an air supply chamber 130, and a fan 140.

[0045] Please refer to Figures 2 to 7 The mounting bracket 110 includes a mounting side plate 111, a mounting upper plate 112, and a mounting lower plate 113. The mounting side plate 111 includes components in its thickness direction (e.g., ...). Figure 1 The first and second walls (shown in the front-back direction) are opposite each other. The upper mounting plate 112 and the lower mounting plate 113 are both disposed on the first wall. The upper mounting plate 112 and the lower mounting plate 113 are vertically (e.g., in the front-back direction) opposite each other. Figure 2 As shown in the diagram, the upper mounting plate 112 and the lower mounting plate 113 are positioned opposite each other in the vertical direction, and both can be detachably connected to the mounting side plate 111.

[0046] Specifically, both the upper mounting plate 112 and the lower mounting plate 113 can be bolted to the first wall of the mounting side plate 111. The upper mounting plate 112, the mounting side plate 111, and the lower mounting plate 113 enclose a fixing space for the solid-state drive 200.

[0047] For further details, please refer to Figures 4 to 7 The upper mounting plate 112 is provided with a first slot 1121 and an air inlet 1122 spaced apart, and the lower mounting plate 113 is provided with a second slot 1131 and an air outlet 1132 spaced apart. The second slot 1131 is arranged opposite to the first slot 1121. The solid-state drive 200 is fixed by inserting into the first slot 1121 and the second slot 1131. The opening of the first slot 1121 faces the lower mounting plate 113, and the opening of the second slot 1131 faces the upper mounting plate 112. In specific implementation, in order to fix the solid-state drive 200, the first slot 1121 can pass through the upper mounting plate 112, and the second slot 1131 can pass through the lower mounting plate 113.

[0048] The air inlet area of ​​the air inlet 1122 is larger than the air outlet area of ​​the air outlet 1132, that is, the cross-sectional area of ​​the air inlet 1122 is larger than the cross-sectional area of ​​the air outlet 1132.

[0049] In the specific implementation process, the cross-sectional area of ​​the air outlet 1132 is less than or equal to 50% of the cross-sectional area of ​​the air inlet 1122. Specifically, the cross-sectional area of ​​the air outlet 1132 can be 50%, 40%, 30%, etc., of the cross-sectional area of ​​the air inlet 1122.

[0050] The head cover 120 is mounted on the mounting bracket 110. The head cover 120 and the mounting side plate 111 together enclose the aging space. In the specific implementation process, the head cover 120 is formed as a cover with one side open. The upper mounting plate 112 and the lower mounting plate 113 are located inside the head cover 120. The mounting side plate 111 is located on the open side of the head cover 120 and together with the head cover 120, it encloses the aging space. The head cover 120 is provided with an air outlet 121, which is located below the air outlet 1132. Specifically, the head cover 120 includes a first cover plate 122 opposite to the mounting side plate 111, and the air outlet 121 is located on the first cover plate 122.

[0051] Please refer to Figure 8 An opening may be provided on the first cover plate 122, and a transparent plate 1221 is provided at the opening. The transparent plate 1221 covers the opening, and the air outlet 121 is provided on the transparent plate 1221, so that the operator can easily observe the scene in the aging space.

[0052] Please continue reading. Figure 2 and refer to Figure 9 The air supply chamber 130 can be formed as an air supply duct structure. The airflow will eliminate turbulence by the rectification effect of the duct structure. One end of the air supply chamber 130 is formed as an air supply inlet 131, and the other end is formed as an air supply outlet 132. At least part of the air supply chamber 130 extends into the aging space. The air supply outlet 132 covers the air inlet 1122. In this way, the gas flowing out of the air supply outlet 132 will flow into the air inlet 1122.

[0053] Fan 140 is located at air inlet 131. Fan 140 is used to drive airflow from air inlet 131 to air chamber 130. The airflow flows from air inlet 131 to air outlet 132, and then is delivered to the side of solid-state drive through air inlet 1122, flows to air outlet 1132, and then flows from air outlet 1132 to air outlet 121.

[0054] Within the allowable range of the size of the air inlet 131, the number of fans 140 can be multiple, and multiple fans 140 are arranged side by side at the air inlet 131.

[0055] During the specific operation, the operator inserts the solid-state drive 200 into the first slot 1121 and the second slot 1131 to fix its position. Then, the operator drives the solid-state drive 200 to run. The solid-state drive 200 will continuously generate heat during operation. When the operating temperature of the solid-state drive 200 reaches the aging test temperature (for example, the aging test temperature of the solid-state drive 200 is 50℃-70℃), the aging test begins. The fan 140 starts running, delivering the airflow from the air inlet 131 to the air outlet 132, and then to the air intake 1122. From the air intake 1122, the airflow is delivered to the side of the solid-state drive 200, carrying away the heat. The airflow flowing through the solid-state drive 200 is relatively hot, and part of the airflow will flow to the air outlet 121, flowing out of the aging space and carrying away some of the heat from the solid-state drive 200. This cools the solid-state drive 200 and prevents its temperature from exceeding the upper limit of the aging test temperature, which would affect the test results.

[0056] Another part of the airflow flowing through the solid-state drive 200 will flow to the vent 1132. Since the cross-sectional area of ​​the vent 1132 is smaller than that of the inlet 1122, when the airflow flows to the mounting plate 113, the airflow needs to flow along the mounting plate 113. When it flows to the vent 1132, it flows through the vent 1132 to the vent 121, and then flows out of the aging space.

[0057] It can be understood that, since the air inlet 122 is larger than the air outlet 1132, the high-temperature gas flowing from the air inlet 1122 to the air outlet 1132 will linger around the solid-state drive 200, prolonging the time that the high-temperature gas flowing from the air inlet 1122 to the air outlet 1132 stays around the solid-state drive 200. This high-temperature gas, in turn, maintains the temperature of the solid-state drive 200. That is, the heat carried away by the airflow from the solid-state drive 200 lingers around the solid-state drive 200, maintaining the temperature of the solid-state drive 200, reducing the rate at which the temperature of the solid-state drive 200 drops, and allowing the heat from the airflow to act on the solid-state drive 200, improving the heat utilization efficiency and reducing the overall power consumption of the device.

[0058] In the specific implementation process, taking an aging test temperature of 50℃-70℃ as an example, when the temperature of the solid-state drive 200 reaches 70℃, the fan 140 starts running to cool the solid-state drive 200. When the operating temperature of the solid-state drive 200 reaches 55℃, it stops. At this time, due to the continuous airflow, the heat of the solid-state drive 200 will continue to be carried away, so that the heat of the solid-state drive 200 will be further reduced, making it possible for the operating temperature of the solid-state drive 200 to reach below 50℃.

[0059] In this application, by setting the air inlet 1122 to be larger than the air outlet 1132, the time that the airflow stays around the solid-state drive 200 can be extended, thus preventing the solid-state drive 200 from reaching the lower limit of the aging test temperature and improving the accuracy of the aging test.

[0060] In this specific implementation process, compared with the traditional technology that uses auxiliary heating structures with heating pads to generate 20W of heat per solid-state drive 200, the average power consumption of each solid-state drive 200 is 50W. Since the solid-state drive high-temperature aging test equipment 100 provided in this application does not have an auxiliary heating structure, the average power consumption of each solid-state drive 200 is 20W.

[0061] Therefore, the technical solution provided in this application does not require auxiliary heating (i.e., heating element). Under the overall gas flow design, the temperature inside the aging space is maintained by the self-heating of the test object (i.e., solid-state drive), thereby realizing the aging test of the solid-state drive.

[0062] Please refer to some embodiments of this application. Figures 2 to 7 The number of first card slots 1121 is multiple, and the multiple first card slots 1121 are in the first direction (e.g., Figure 4 As shown in the left and right directions, the second card slots 1131 are spaced apart in the first direction, and each first card slot 1121 corresponds to a unique second card slot 1131.

[0063] Therefore, by setting up multiple first card slots 1121 and multiple second card slots 1131, aging tests can be performed on multiple solid-state drives 200, increasing the number of experimental samples and improving the accuracy and reliability of the experiment.

[0064] In the specific implementation process, the number of the first card slot 1121 and the second card slot 1131 can be 5, 6, 7, 8, 9, 10, etc., respectively.

[0065] Furthermore, there are multiple air inlets 1122, which are spaced apart in the first direction, and the air inlets 1122 and the first slot 1121 are alternately arranged in sequence. There are also multiple air outlets 1132, which are spaced apart in the first direction, and the air outlets 1132 and the second slot 1131 are alternately arranged in sequence.

[0066] Therefore, by setting multiple vents 1132 and multiple vents 1122, each solid-state drive 200 can be cooled in a timely manner.

[0067] In other embodiments of this application, when there are multiple air inlets 1122 and multiple air outlets 1132, and the numbers are different, the number of air inlets 1122 can be greater than the number of air outlets 1132. For example, one first slot 1121 and one air inlet 1122 can be alternately arranged, and two second slots 1131 and one air outlet 1132 can be alternately arranged. In this way, the air inlets 1122 and the air outlets 1132 are the same size, and the air intake area of ​​the air inlet 1122 can be greater than the air outlet area of ​​the air outlet 1132. Similarly, in the mounting plate 113, three second slots 1131 and one air outlet 1132 can be alternately arranged, so that the total air output of the air outlets 1132 is less than the total air intake of the air inlets.

[0068] Alternatively, a first slot 1121 and an air inlet 1122 can be alternately arranged, and the number of air outlets 1132 is one.

[0069] In some other embodiments of this application, the number of air inlets 1122 may be less than the number of air outlets 1132, provided that the air inlet area of ​​the air inlet 1122 is greater than the air outlet area of ​​the air outlet 1132. That is, the sum of the cross-sectional areas of the multiple air inlets 1122 is greater than the sum of the cross-sectional areas of the multiple air outlets 1132.

[0070] For example, a first slot 1121 and an air inlet 1122 are alternately arranged in sequence, and the number of air outlets 1132 is one. The sum of the cross-sectional areas of the multiple air inlets 1122 is greater than the cross-sectional area of ​​one air outlet 1132.

[0071] Please refer to some embodiments of this application. Figures 4 to 7 The air inlet 1122 includes a first upper edge 1123 away from the mounting side plate 111, and the air outlet 1132 includes a first lower edge 1134 away from the mounting side plate 111. The first lower edge 1134 is located on the side of the first upper edge 1123 facing the mounting side plate 111. When the number of air inlets 1122 and air outlets 1132 is the same, the sizes of the air inlets 1122 and air outlets 1132 can be set differently so that the total air output of the air outlets 1132 is less than the total air intake of the air inlets 1122, such as the opening of each air inlet 1122 being larger than that of the air outlet 1132.

[0072] Understandably, this means that the airflow from the air inlet 1122 to the solid-state drive 200 needs to flow towards the mounting side plate 111 before reaching the air outlet 1132. This increases the path of the airflow on the side of the solid-state drive 200, allowing the heat from the airflow to act on the solid-state drive 200 for a sufficient amount of time, thereby improving heat utilization efficiency and reducing the overall power consumption of the device.

[0073] The air inlet 1122 can be formed as a rectangular hole, occupying the gap of the connected first slot 1121 bracket within the range allowed by the process, thereby increasing the area of ​​the air inlet 1122.

[0074] In some embodiments of this application, the air outlet 1132 includes a plurality of air outlet sub-holes 1133. Specifically, the air outlet 1132 may include two air outlet sub-holes 1133. The air outlet sub-holes 1133 may be formed as elongated holes, and the two air outlet sub-holes 1133 may be spaced apart in the length direction or spaced apart in the width direction. When the air outlet 1132 is arranged in the form of a plurality of air outlet sub-holes 1133, the total air outlet area of ​​the plurality of air outlet sub-holes 1133 is still smaller than the total air inlet area of ​​the air inlet 1122, and arranging the air outlet 1132 in the form of a plurality of air outlet sub-holes 1133 can also make the air outlet as uniform as possible.

[0075] Understandably, given the same area, setting one hole results in a smaller cross-sectional area compared to setting multiple holes, which further increases the difference in cross-sectional area between the air inlet 1122 and the air outlet 1132, further extending the time the airflow stays on the side of the solid-state drive 200, and improving the efficiency of heat utilization.

[0076] In some embodiments of this application, the length of the air outlet 1133 is 25%-40% of the length of the air inlet 1122.

[0077] Specifically, the length of the air outlet 1133 is 25%, 30%, 35%, or 40% of the length of the air inlet 1122.

[0078] Furthermore, a sliding lever can be provided at the air outlet 1133. The sliding lever is slidably positioned at the air outlet 1133, and the operator can adjust the air outlet area of ​​the air outlet 1133 by driving the sliding lever according to the actual situation.

[0079] Specifically, the sliding paddle can be adjusted manually or by the motor.

[0080] In some embodiments of this application, the air supply chamber 130 includes a first air supply section 133 and a second air supply section 134. The first air supply section 133 is located within the aging space and extends laterally, while the second air supply section 134 is located outside the aging space and extends vertically.

[0081] One end of the first air supply section 133 is formed as an air outlet 132, and the other end of the first air supply section 133 is a first connection port. The first end of the second air supply section 134 is formed as an air inlet 131, and the other end of the second air supply section 134 is a second connection port that is connected to the first connection port. The cross-sectional area of ​​the first connection port is smaller than the cross-sectional area of ​​the air inlet 131.

[0082] In this way, by setting the cross-sectional area of ​​the first connection port to be smaller than the cross-sectional area of ​​the air inlet 131, the airflow velocity can be increased, thereby increasing the cooling speed of the solid-state drive 200.

[0083] Specifically, in the direction of the air inlet 131 toward the second connection port, the bottom wall of the first air supply section 133 is inclined upward so that the cross-sectional area of ​​the first connection port is smaller than the cross-sectional area of ​​the air inlet 131.

[0084] Please refer to some embodiments of this application. Figure 2 The first air supply section 133 includes a first guide wall 135 opposite to the mounting side plate 111, and the first guide wall 135 extends obliquely away from the mounting side plate 111 in the direction toward the air supply outlet 132.

[0085] It is understandable that when the airflow flows to the first guide wall 135, the direction of the airflow will change due to the inclined setting of the first guide wall 135. Some of the airflow will move along the first guide wall 135 toward the mounting lower plate 113, and some of the airflow will be deflected and flow obliquely toward the mounting side plate 111 to the mounting lower plate 113.

[0086] Therefore, by setting the first guide wall 135, all airflow can be prevented from flowing directly out of the aging space through the air outlet 121.

[0087] In some embodiments of this application, the solid-state drive high-temperature aging test equipment 100 further includes a filter screen 136, which is disposed at the second connection port of the second air supply section 134.

[0088] Therefore, by setting up filter 136, impurities brought by airflow can be prevented from entering the aging space, ensuring the cleanliness of the aging space.

[0089] In some embodiments of this application, the solid-state drive high-temperature aging test equipment 100 further includes: a circuit board and a power supply module, both of which are disposed on the second wall surface and are electrically connected to the solid-state drive 200.

[0090] Therefore, the solid-state drive 200 and the fan 140 are powered by a power supply module, and the circuit control of the solid-state drive 200 is achieved by setting up a circuit board.

[0091] In some embodiments of this application, the solid-state drive high-temperature aging test equipment 100 may further include a chassis 150, which is mounted on one side of the second wall of the mounting side plate 111. The circuit board and power supply module are located inside the chassis 150. The mounting side plate 111 separates the interior of the chassis 150 from the interior of the aging space to prevent airflow from entering the interior of the chassis 150.

[0092] It is understood that in this application, the chassis 150 and the mounting side plate 111 can be connected by bolts or rivets, the air supply chamber 130 can also be connected to the chassis 150 and the mounting bracket 110 by bolts or rivets, and the head cover 120, the air supply chamber 130 and the mounting bracket can also be connected by bolts or rivets.

[0093] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0094] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above. For the sake of brevity, they are not provided in detail. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A high-temperature aging test device for solid-state drives, characterized in that, include: The mounting bracket includes a mounting side plate, a mounting top plate, and a mounting bottom plate. The mounting side plate includes a first wall surface. The mounting top plate and the mounting bottom plate are both disposed on the first wall surface. The mounting top plate and the mounting bottom plate are vertically opposite to each other. The solid-state drive is fixed between the mounting top plate and the mounting bottom plate. The mounting top plate is provided with an air inlet, and the mounting bottom plate is provided with an air outlet. The air inlet area of ​​the air inlet is larger than the air outlet area of ​​the air outlet. The head cover, together with the mounting bracket, encloses the aging space, and the head cover is provided with an air outlet; An air supply chamber, the air supply chamber including an air supply inlet and an air supply outlet, at least a portion of the air supply chamber extending into the aging space, and the air supply outlet mask disposed at the air inlet; A fan is located at the air inlet; The fan drives airflow from the air inlet to the air outlet chamber. The airflow flows from the air inlet to the air outlet, then through the air inlet to the top of the solid-state drive, flows over the side of the solid-state drive, then from the bottom of the solid-state drive to the air outlet, and then from the air outlet to the air outlet.

2. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The mounting plate is provided with a first slot, and there are multiple first slots. The multiple first slots are spaced apart in a first direction, which is the arrangement direction of the multiple solid-state drives. The mounting plate is provided with a second slot, and there are multiple second slots. The multiple second slots are spaced apart in a first direction, and each first slot corresponds to a unique second slot. The number of air inlets is multiple, and the multiple air inlets are spaced apart in a first direction. The air inlets and the first slot are alternately arranged in sequence. The number of air outlets is multiple, and the multiple air outlets are spaced apart in the first direction. The air outlets and the second slot are alternately arranged in sequence.

3. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The air inlet includes a first upper edge away from the mounting side panel, and the air outlet includes a first lower edge away from the mounting side panel, the first lower edge being located on the side of the first upper edge facing the mounting side panel.

4. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The vent includes multiple sub-vents, which are spaced apart.

5. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The head cover includes a first cover plate opposite to the mounting side plate, and the air outlet is located on the first cover plate.

6. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The number of air inlets is multiple; the number of air outlets is multiple, and the number of air inlets is greater than the number of air outlets.

7. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The air outlet is located on the lower side of the air outlet.

8. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The air supply chamber includes a first air supply section and a second air supply section, wherein the first air supply section is located inside the aging space and the second air supply section is located outside the aging space. One end of the first air supply section is formed as the air outlet, and the other end of the first air supply section is a first connection port. The first end of the second air supply section is formed as the air inlet, and the other end of the second air supply section is a second connection port that is connected to the first connection port. The cross-sectional area of ​​the first connection port is smaller than the cross-sectional area of ​​the air inlet.

9. The solid-state drive high-temperature aging test equipment according to claim 8, characterized in that, The first air supply section includes a first guide wall opposite to the mounting side plate, and the first guide wall extends obliquely away from the mounting side plate in the direction toward the air supply outlet.

10. The solid-state drive high-temperature aging test equipment according to claim 1, characterized in that, The mounting side plate also includes a second wall surface opposite to the first wall surface; The solid-state drive high-temperature aging test equipment also includes: The circuit board and the power supply module are both located on the second wall surface and are electrically connected to the solid-state drive.

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