A high strength power cable

Abstract

This utility model provides a high-strength power cable, including a conductor, wherein: the conductor is sequentially provided with a graphene-reinforced semi-conductive shielding layer, a self-healing nanocomposite insulation layer, a supramolecular polymer sheath, a shape memory alloy armor layer, and an outer sheath; this utility model significantly improves the mechanical strength, environmental adaptability, and intelligence level of the cable through integrated material-structure-function design, solving the problems of low strength and short lifespan in the prior art.

Description

Technical Field

[0001] This utility model relates to the field of power cables, and in particular to a high-strength power cable. Background Technology

[0002] Power cables are cables used to transmit and distribute electrical energy. They are commonly used in urban underground power grids, power plant lead-out lines, internal power supply for industrial and mining enterprises, and underwater power transmission lines across rivers and seas.

[0003] However, the existing conductor strength is insufficient: pure copper conductors have low tensile strength (200-250MPa) and are prone to breakage due to external stretching or repeated bending.

[0004] Insulation layer is prone to cracking: Traditional XLPE insulation layer cracks at temperatures below -20℃ or when the bending radius is ≤8 times the cable diameter, leading to partial discharge.

[0005] Therefore, it is essential to invent a high-strength power cable. Utility Model Content

[0006] To solve the above-mentioned technical problems, the present invention provides a high-strength power cable with the following technical solution: a high-strength power cable including a conductor, wherein: the conductor is sequentially provided with a graphene-reinforced semi-conductive shielding layer, a self-healing nanocomposite insulation layer, a supramolecular polymer sheath, a shape memory alloy armor layer and an outer sheath.

[0007] The conductor includes an inner conductor, a middle conductor, and an outer conductor, wherein the middle conductor is disposed outside the inner conductor, and the outer conductor is disposed outside the middle conductor;

[0008] The inner conductor is a copper-magnesium alloy wire;

[0009] The intermediate conductor is a carbon nanotube-reinforced copper-based composite material wire;

[0010] The outer conductor is a tin-plated soft copper wire.

[0011] A double-layer cross-woven metal shielding layer is provided between the self-healing nanocomposite insulation layer and the supramolecular polymer sheath.

[0012] The double-layer cross-braided metal shielding layer includes an inner layer and an outer layer. The inner layer is disposed outside the self-healing nanocomposite insulation layer, and the outer layer is disposed between the inner layer and the supramolecular polymer sheath.

[0013] A gradient density buffer layer is provided between the supramolecular polymer sheath and the outer layer.

[0014] The outer sheath has several buffer cavities evenly distributed within it.

[0015] The shape memory alloy armor layer is spirally wound around the outside of the supramolecular polymer sheath.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] This invention significantly improves the mechanical strength, environmental adaptability, and intelligence level of cables through integrated material-structure-function design, solving the problems of low strength and short lifespan in existing technologies. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the gradient density buffer layer structure of this utility model.

[0020] In the picture:

[0021] Inner conductor 1, intermediate conductor 2, outer conductor 3, graphene-reinforced semiconductive shielding layer 4, self-healing nanocomposite insulation layer 5, inner layer 6, outer layer 7, supramolecular polymer sheath 8, shape memory alloy armor layer 9, outer sheath 10, buffer cavity 11, gradient density buffer layer 12. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0023] In the description of the embodiments, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of the utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in the present utility model based on the specific circumstances.

[0024] The present invention will be further described below with reference to the accompanying drawings:

[0025] Example

[0026] Reference Figure 1-2 A high-strength power cable includes a conductor, wherein: a graphene-reinforced semi-conductive shielding layer 4, a self-healing nanocomposite insulation layer 5, a supramolecular polymer sheath 8, a shape memory alloy armor layer 9, and an outer sheath 10 are sequentially disposed outside the conductor;

[0027] Specifically, the graphene-reinforced semiconductive shielding layer 4 uses a silicone rubber matrix (Shore hardness 65A) with 3wt% graphene nanosheets (sheet diameter 1-5μm) added, and uniform filling is achieved through ultrasonic dispersion process.

[0028] It is formed in one step using a three-layer co-extrusion process, with a thickness of 0.5mm and an adhesion force ≥5N / 10mm between it and the conductor.

[0029] The difference from the existing technology is that the volume resistivity of the traditional semiconducting layer is >500Ω·cm, while that of this invention is reduced to 80Ω·cm, and the tear resistance is increased to 35kN / m (+60%).

[0030] Specifically, the conductor includes an inner conductor 1, a middle conductor 2, and an outer conductor 3. The middle conductor 2 is disposed outside the inner conductor 1, and the outer conductor 3 is disposed outside the middle conductor 2.

[0031] Specifically, the inner conductor 1 uses 6 copper-magnesium alloy wires (diameter 2.0mm, tensile strength 380MPa) with a regular stranded structure (stretch pitch ratio 8:1).

[0032] Specifically, the intermediate conductor 2 is made of 12 carbon nanotube-reinforced copper-based composite wires (diameter 1.5 mm, tensile strength 520 MPa), which are wrapped around the inner conductor 1 in a reverse twisting manner (twisting pitch ratio 10:1).

[0033] Specifically, the outer conductor 3 uses 30 tin-plated soft copper wires (0.8 mm in diameter, 98.5% conductivity IACS), which are tightly arranged by a stranding process (stretching pitch ratio 12:1).

[0034] Specifically, the inner conductor 1, the middle conductor 2, and the outer conductor 3 are mechanically interlocked through friction and metal bonding. The outer tin-plated layer and the middle layer form a micro-welding interface with a peel strength ≥15N / mm.

[0035] The tensile strength is increased to 420MPa (+80%) through gradient material design, while maintaining flexibility (bending diameter ≤ 10 times the cable outer diameter).

[0036] Specifically, a double-layer cross-woven metal shielding layer is provided between the self-healing nanocomposite insulation layer 5 and the supramolecular polymer sheath 8;

[0037] Self-healing nanocomposite insulating layer 5, matrix: XLPE resin (density 0.92g / cm³, dielectric constant 2.3);

[0038] Repair agent: Microencapsulated epoxy resin (particle size 5μm, content 2wt%), capsule shell is polyurethane (thickness 200nm).

[0039] Dispersion method: The repair agent is uniformly distributed at the interface between the crystalline and amorphous regions of XLPE by melt blending at 180°C using a twin-screw extruder.

[0040] Connection relationship: Directly wrapped around the outer layer of the conductor, with a thickness of 4.5mm, and a 0.1mm thick graphene-reinforced semiconductive shielding layer is set between the conductor as an adhesive transition layer.

[0041] This structure enables a crack self-healing rate of ≥90% and increases the partial discharge initiation voltage to 35kV (traditional ≤25kV).

[0042] Specifically, the double-layer cross-braided metal shielding layer includes an inner layer 6 and an outer layer 7. The inner layer 6 is disposed outside the self-healing nanocomposite insulation layer 5, and the outer layer 7 is disposed between the inner layer 6 and the supramolecular polymer sheath 8.

[0043] Inner layer 6: Wrapped with 0.1mm thick soft copper strip (overlap rate 55%), with the wrapping direction being counterclockwise;

[0044] Outer layer 7: Made of 0.2mm galvanized steel wire cross-woven (weaving density 90%), with a weaving angle of 45°, and the steel wire surface is coated with silane coupling agent.

[0045] Connection relationship: The inner copper strip is directly wrapped around the outside of the insulation layer, and the outer steel wire braided layer is bonded to the inner layer with hot melt adhesive. The adhesion between the overall shielding layer and the insulation layer is ≥8N / 10mm.

[0046] The difference from existing technologies is that the shielding effectiveness of traditional single-layer copper strip is ≤40dB, while the shielding effectiveness of the double-layer structure of this utility model reaches 82dB at 1MHz and the puncture resistance is 105N / mm.

[0047] Specifically, a gradient density buffer layer 12 is provided between the supramolecular polymer sheath 8 and the outer layer 7;

[0048] The supramolecular polymer sheath 8 is made of UPy-PU supramolecular polymer (molecular weight 80,000), which forms a reversible network structure through dynamic cross-linking by hydrogen bonds.

[0049] Connection relationship: Extruded outside the double-layer cross-braided metal shielding layer, with a thickness of 2.0mm, and a 0.2mm thick gradient density buffer layer is set between it and the double-layer cross-braided metal shielding layer as a transition.

[0050] The difference from existing technologies is that the abrasion of traditional HDPE sheaths is ≥0.1g / 1000 revolutions, while this utility model reduces it to 0.015g / 1000 revolutions, and the self-healing rate of scratches is ≥92%.

[0051] Gradient density buffer layer 12: Made of foamed polyethylene material, with density gradually changing from 0.2g / cm³ in the inner layer to 0.9g / cm³ in the outer layer, and porosity decreasing from 80% to 30%.

[0052] Connection relationship: It is formed simultaneously with the metal shielding layer and the sheath layer through a co-extrusion process, with a thickness of 1.5mm.

[0053] The difference from existing technologies is that traditional buffer layers have a homogeneous structure, while the gradient design of this invention increases the shock absorption rate to 75% (compared to ≤40% for traditional buffer layers).

[0054] Specifically, the outer sheath 10 has several buffer cavities 11 evenly distributed within it.

[0055] Specifically, the shape memory alloy armor layer 9 is made of nickel-titanium alloy wire (0.5 mm in diameter, Af temperature 50 °C) spirally wound around the supramolecular polymer sheath 8 with a pitch of 10 mm and an initial pre-strain of 3%.

[0056] Connection relationship: It is fixed to the surface of the supramolecular polymer sheath 8 by laser welding, with a welding point spacing of 50mm and an overall armor layer coverage of 85%.

[0057] Unlike existing technologies, traditional steel belt armor has no self-recovery capability, while this invention can restore its original shape within 30 seconds when heated at 50℃, and its impact resistance is increased to 15J (+200%).

[0058] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solution described in this utility model, or by designing a similar technical solution inspired by the technical solution described in this utility model, falls within the protection scope of this utility model.

Claims

1. A high-strength power cable, characterized in that: The conductor includes a graphene-reinforced semiconducting shielding layer (4), a self-healing nanocomposite insulating layer (5), a supramolecular polymer sheath (8), a shape memory alloy armor layer (9), and an outer sheath (10) arranged sequentially on the outside of the conductor. The conductor includes an inner conductor (1), a middle conductor (2) and an outer conductor (3), wherein the middle conductor (2) is disposed outside the inner conductor (1) and the outer conductor (3) is disposed outside the middle conductor (2); The inner conductor (1) is a copper-magnesium alloy wire; The intermediate conductor (2) is a carbon nanotube-reinforced copper-based composite material wire; The outer conductor (3) is a tin-plated soft copper wire.

2. The high-strength power cable as described in claim 1, characterized in that: A double-layer cross-woven metal shielding layer is provided between the self-healing nanocomposite insulation layer (5) and the supramolecular polymer sheath (8).

3. A high-strength power cable as described in claim 2, characterized in that: The double-layer cross-woven metal shielding layer includes an inner layer (6) and an outer layer (7). The inner layer (6) is disposed outside the self-healing nanocomposite insulation layer (5), and the outer layer (7) is disposed between the inner layer (6) and the supramolecular polymer sheath (8).

4. A high-strength power cable as described in claim 3, characterized in that: A gradient density buffer layer (12) is provided between the supramolecular polymer sheath (8) and the outer layer (7).

5. A high-strength power cable as described in claim 1, characterized in that: The outer sheath (10) has several buffer cavities (11) evenly arranged in it.

6. A high-strength power cable as described in claim 1, characterized in that: The shape memory alloy armor layer (9) is spirally wound around the outside of the supramolecular polymer sheath (8).

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