U-shaped infrared photoelectric switch

Abstract

This utility model discloses a U-shaped through-beam infrared photoelectric switch, including a plastic housing, a transmitting tube, a receiving tube, a first pin terminal, and a second pin terminal. The two outer side walls of the plastic housing are respectively provided with a first embedding groove and a second embedding groove. The first circuit board of the transmitting tube is bonded to the first embedding groove, and a first channel is formed between the first embedding groove and the first light window. The receiving tube includes a second circuit board and a receiving chip, and a second channel is formed between the second embedding groove and the second light window. This utility model, by providing the first and second embedding grooves on both sides of the plastic housing, can achieve the embedding and positioning of the transmitting tube and the receiving tube, and fix them in the first or second embedding groove by bonding. Combined with the inclined structure, it facilitates the application of pressure to the transmitting tube and the receiving tube, thereby improving the bonding strength. The first and second channels enable stable transmission and reception of infrared light, avoiding optical axis misalignment due to assembly deviations.

Description

Technical Field

[0001] This utility model relates to the field of photoelectric switches, and in particular to a U-shaped through-beam infrared photoelectric switch. Background Technology

[0002] Infrared photoelectric switches are non-contact sensing devices that utilize the blocking of infrared beams by objects to achieve detection and control. They have advantages such as fast response, long life, and strong adaptability, and are widely used in fields such as automation equipment, logistics transportation, position detection and counting control. Among them, U-shaped through-beam infrared photoelectric switches are often used in space-constrained applications where high response speed and accuracy are required due to their compact structure, easy installation, and high detection stability, such as tape detection in pick-and-place machines, label positioning, and pass detection.

[0003] In existing technologies, the chips at the transmitting and receiving ends of traditional U-shaped photoelectric switches are usually fixed inside the housing. This not only results in low assembly efficiency but also large installation position errors, which can easily lead to problems such as optical axis misalignment and detection failure. In addition, the pin terminals and the circuit board are usually connected by exposed solder joints. Such installation process not only affects the structural reliability of the product but also the production efficiency of the photoelectric switch.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a U-shaped through-beam infrared photoelectric switch with stable structure and effective improvement of production efficiency.

[0006] To achieve this objective, the present invention adopts the following technical solution: a U-shaped through-beam infrared photoelectric switch, comprising a plastic housing, a transmitting tube, a receiving tube, a first pin terminal, and a second pin terminal;

[0007] The plastic shell has a U-shaped structure, and a light transmission channel is formed in the middle of the plastic shell. The two inner side walls of the plastic shell are respectively provided with a first light window and a second light window, which are arranged opposite to each other.

[0008] The two outer side walls of the plastic shell are respectively provided with a first embedding groove and a second embedding groove;

[0009] The transmitting tube includes a first circuit board and a transmitting chip. The transmitting chip is located on the first circuit board. The first circuit board is bonded to the first embedding groove. A first channel is formed between the first embedding groove and the first light window. The first channel is used to allow the infrared light from the transmitting chip to enter the first light window.

[0010] The receiving tube includes a second circuit board and a receiving chip. The receiving chip is located on the second circuit board. The second circuit board is bonded to the second embedding groove. A second channel is formed between the second embedding groove and the second light window. The second channel is used to receive infrared light onto the receiving chip.

[0011] The first pin terminal and the second pin terminal are respectively located at the bottom of both ends of the plastic housing. The first pin terminal is electrically connected to the first circuit board, and the second pin terminal is electrically connected to the second circuit board.

[0012] In the U-shaped through-beam infrared photoelectric switch described above, a first guide hole is provided at the bottom of the first embedded groove. The first guide hole is used to connect the lead wire on the first circuit board to the first pin terminal.

[0013] In the U-shaped through-beam infrared photoelectric switch described above, a second guide hole is provided at the bottom of the second embedded groove. The second guide hole is used to connect the lead wire on the second circuit board to the second pin terminal.

[0014] Using the above technical solution, in the U-shaped through-beam infrared photoelectric switch, the top of the first circuit board and the second circuit board are provided with a sloping structure.

[0015] In the U-shaped through-beam infrared photoelectric switch described above, a boss is provided at the bottom of the plastic housing, and a positioning post is provided on the boss.

[0016] In the U-shaped through-beam infrared photoelectric switch described above, the plastic housing is made of polycarbonate.

[0017] In the U-shaped through-beam infrared photoelectric switch described above, the first pin terminal and the second pin terminal are surface mount pin terminals.

[0018] In the U-shaped through-beam infrared photoelectric switch described above, the corners on both sides of the light transmission channel are provided with chamfered structures.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] This invention achieves the embedding and positioning of the transmitting and receiving tubes by setting a first embedding groove and a second embedding groove on both sides of the plastic shell, and fixes them in the first or second embedding groove by adhesive bonding. The inclined structure facilitates the application of pressure to the transmitting and receiving tubes, thereby improving the bonding firmness. A first channel is formed between the first embedding groove and the first light window, and a second channel is formed between the second embedding groove and the second light window. This arrangement enables stable transmission and reception of infrared light and avoids optical axis misalignment due to assembly deviation. The surface-mount pin terminals are located at the bottom of the plastic shell, which facilitates rapid welding and installation, improves the installation efficiency of the product, and is practical and convenient. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the interior of the plastic shell of this utility model;

[0025] Figure 3 This is a schematic diagram of the overall bottom structure of this utility model. Detailed Implementation

[0026] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0027] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0028] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] like Figures 1 to 3 As shown, this utility model embodiment provides a U-shaped through-beam infrared photoelectric switch, including a plastic housing 1, an emitting tube 2, a receiving tube 3, a first pin terminal 4, and a second pin terminal 5. The plastic housing 1 has a U-shaped structure, and a light transmission channel 10 is formed in the middle of the plastic housing 1. The two inner sidewalls of the plastic housing 1 are respectively provided with a first light window 101 and a second light window 102, which are arranged opposite to each other. In this embodiment, infrared light is emitted from the first light window 101, passes through the light transmission channel 10 in the middle, and enters the second light window 102. If there is no object blocking the light transmission channel 10, the infrared light can reach the receiving end smoothly, forming a continuous light transmission state. Once an object passes through the light transmission channel 10 and blocks the emitted beam, the receiving end of the second light window 102 cannot obtain the light signal, thereby determining that there is an object blocking the light and completing the detection.

[0030] The plastic housing 1 has a first embedding groove 11 and a second embedding groove 12 on its two outer side walls, respectively. The emitting tube 2 includes a first circuit board 21 and an emitting chip 22. The emitting chip 22 is located on the first circuit board 21, which is bonded to the first embedding groove 11. A first channel 103 is formed between the first embedding groove 21 and the first light window 101. The first channel 103 is used to allow the infrared light from the emitting chip 22 to enter the first light window 101. The receiving tube 3 includes a second circuit board 31 and a receiving chip (not shown). The receiving chip is located on the second circuit board 31, which is bonded to the second embedding groove 12. A first channel 103 is formed between the second embedding groove 12 and the second light window 102. A second channel 104 is provided, which is used to receive infrared light onto the receiving chip. A first channel 103 is provided between the first embedding slot 11 and the first light window 101, which allows infrared light to be emitted from the emitting chip 22 to the first light window 101, avoiding light deviation caused by assembly errors. Similarly, the second channel 104 formed between the second embedding slot 12 and the second light window 102 can also provide a straight incident path for the receiving chip to receive light, thereby improving the receiving efficiency and signal stability. In addition, by providing the first embedding slot 11 and the second embedding slot 12 structure on the plastic housing 1, the emitting tube 2 and the receiving tube 3 can be quickly positioned and installed, reducing the error rate in the assembly process and effectively improving the optoelectronic assembly efficiency and batch yield of the photoelectric switch.

[0031] The first pin terminal 4 and the second pin terminal 5 are respectively disposed at the bottom of both ends of the plastic housing 1. The first pin terminal 4 is electrically connected to the first circuit board 21, and the second pin terminal 5 is electrically connected to the second circuit board 31. In this embodiment, the first pin terminal 4 and the second pin terminal 5 are surface mount pin terminals. Surface mount pin terminals can be attached to the pads of the external circuit board, facilitating rapid soldering through reflow soldering, hot air soldering, and other mounting methods, thereby improving soldering accuracy and reducing cold solder joints.

[0032] like Figure 2 As shown, the bottom of the first embedding groove 11 is provided with a first guide hole 110. The first guide hole 110 is used to connect the lead wire on the first circuit board 21 to the first pin terminal 4. During the assembly process, after the first circuit board 21 is fixed in the first embedding groove 11, its lead wire can be positioned and connected to the first pin terminal 4 through the first guide hole 110, thereby reducing the wiring complexity and improving the connection reliability.

[0033] like Figure 2 As shown, the bottom of the second embedding groove 12 is provided with a second guide hole 120, which is used to connect the lead wire on the second circuit board 31 to the second pin terminal 5.

[0034] like Figure 1 and Figure 2 As shown, the first circuit board 21 and the second circuit board 31 are further provided with a sloping structure 20 on their tops. The sloping structure 20 allows the photoelectric switch to be pressed by an external pressing mechanism during assembly, thereby pressing the first circuit board 21 and the second circuit board 31 together and improving the bonding stability.

[0035] like Figure 3 As shown, the bottom of the plastic housing 1 is provided with a boss 13, and the boss 13 is provided with a positioning post 131. The boss 13 and the positioning post 131 can be fitted and installed with the PCB positioning groove, thereby improving the alignment accuracy of the photoelectric switch, avoiding positional deviation, and improving the assembly efficiency of the photoelectric switch.

[0036] Furthermore, the plastic housing 1 is made of polycarbonate.

[0037] like Figure 1 As shown, furthermore, chamfered structures 100 are provided at the corners on both sides of the light transmission channel 10. The chamfered structures 100 can prevent objects from getting stuck when they approach the edge of the channel, so that the objects to be detected can smoothly enter the light transmission channel 10 for detection.

[0038] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A U-shaped through-beam infrared photoelectric switch, characterized in that, It includes a plastic housing, a transmitting tube, a receiving tube, a first pin terminal, and a second pin terminal; The plastic shell has a U-shaped structure, and a light transmission channel is formed in the middle of the plastic shell. The two inner side walls of the plastic shell are respectively provided with a first light window and a second light window, which are arranged opposite to each other. The two outer side walls of the plastic shell are respectively provided with a first embedding groove and a second embedding groove; The transmitting tube includes a first circuit board and a transmitting chip. The transmitting chip is located on the first circuit board. The first circuit board is bonded to the first embedding groove. A first channel is formed between the first embedding groove and the first light window. The first channel is used to allow the infrared light from the transmitting chip to enter the first light window. The receiving tube includes a second circuit board and a receiving chip. The receiving chip is located on the second circuit board. The second circuit board is bonded to the second embedding groove. A second channel is formed between the second embedding groove and the second light window. The second channel is used to receive infrared light onto the receiving chip. The first pin terminal and the second pin terminal are respectively located at the bottom of both ends of the plastic housing. The first pin terminal is electrically connected to the first circuit board, and the second pin terminal is electrically connected to the second circuit board.

2. The U-shaped through-beam infrared photoelectric switch according to claim 1, characterized in that, The bottom of the first embedding groove is provided with a first guide hole, which is used to connect the lead on the first circuit board to the first pin terminal.

3. The U-shaped through-beam infrared photoelectric switch according to claim 2, characterized in that, The bottom of the second embedding groove is provided with a second guide hole, which is used to connect the lead on the second circuit board to the second pin terminal.

4. The U-shaped through-beam infrared photoelectric switch according to claim 1, characterized in that, The top of both the first and second circuit boards has a sloping structure.

5. The U-shaped through-beam infrared photoelectric switch according to claim 1, characterized in that, The bottom of the plastic shell is provided with a boss, and a positioning post is provided on the boss.

6. The U-shaped through-beam infrared photoelectric switch according to claim 1, characterized in that, The plastic shell is made of polycarbonate.

7. The U-shaped through-beam infrared photoelectric switch according to claim 3, characterized in that, The first and second pin terminals are surface mount pin terminals.

8. The U-shaped through-beam infrared photoelectric switch according to claim 1, characterized in that, The corners on both sides of the light transmission channel are provided with chamfered structures.

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