Phase change material cooling mobile phone case

Abstract

This invention provides a phase change material (PCM) cooling phone case, comprising a phone case base and a PCM encapsulation body. The phone case base has an accommodating opening and snap-fit ​​openings on both sides. The PCM encapsulation body includes a metal shell, a PCM layer, a metal mesh frame, and metal sheets. The metal sheets are disposed on both sides of the metal shell and engage with the snap-fit ​​openings, allowing the metal shell to be inserted into the inner side of the accommodating opening. This invention, through modular assembly, allows for the installation and matching of PCM encapsulation bodies of different thicknesses according to usage requirements. Furthermore, regardless of the thickness variation, the external metal encapsulation, the internal metal mesh frame, and the metal sheets extending to both sides of the phone case base form an overall heat-conducting and heat-dissipating framework, providing both internal heat-conducting structure and external heat dissipation extension, thus enhancing the overall framework's natural heat dissipation capability.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone case technology, specifically to a phase change material cooling mobile phone case. Background Technology

[0002] The application of phase change materials (PCMs) in mobile phone cases can significantly reduce phone temperature and improve the user experience through solid-liquid phase change heat absorption. For example, Chinese Patent 202320986357.6 discloses a modular, detachable phase change heat dissipation mobile phone case, belonging to the field of mobile phone case technology, including: a back panel, a side frame, and several phase change material heat dissipation plates; the side frame is fixedly connected to the edge of the back panel and adapted to the side of the phone; the top of the back panel has a camera hole, and a heat dissipation area is formed by protruding upward below the camera hole; the heat dissipation area is detachably connected to the phase change material heat dissipation plates.

[0003] In the aforementioned existing technologies, phase change material heat sinks are frequently replaced to increase the heat dissipation limit. However, in actual use, multiple phase change material heat sinks not only increase the cost of use, but also complicate the use of the phone case due to frequent replacements. Therefore, how to improve the heat conduction and heat dissipation capacity of the phone case without the need for frequent replacement of phase change materials is a technical problem that needs to be solved. Utility Model Content

[0004] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a phase change material cooling phone case, solving the technical problem of how to improve the heat conduction and heat dissipation capacity of the phone case without the need for frequent replacement of phase change materials in the existing technology.

[0005] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution:

[0006] This utility model provides a phase change material cooling mobile phone case, comprising:

[0007] The phone case base has an opening for receiving the phone, and clip-on openings on both sides; and

[0008] A phase change material encapsulation body includes a metal shell, a phase change material layer, a metal grid skeleton, and metal sheets. The metal sheets are disposed on both sides of the metal shell and are correspondingly engaged with the mounting openings, so that the metal shell is inserted into the inner side of the receiving opening. The phase change material layer is disposed inside the metal grid skeleton, and the metal grid skeleton is disposed inside the metal shell and embedded in the phase change material layer. The metal grid skeleton has a plurality of grids, and through holes are provided between the grids to allow natural convection after the phase change material liquefies.

[0009] In some embodiments, the accommodating opening has a stepped cross-section and a stepped platform that limits the embedding depth of the metal housing. A flat patch extends from the outer side of the metal housing and abuts against the stepped platform, so that the bottom of the metal housing is flush with the inner top wall of the phone case base.

[0010] In some embodiments, the mounting opening includes a through-hole and a slot, the through-hole being formed on both sides of the phone case base, the slot being formed on the inner bottom wall of the through-hole, and the slot being recessed towards the outer side of the phone case base.

[0011] In some embodiments, the metal sheet has a protrusion corresponding to the slot for engaging with the slot.

[0012] In some embodiments, there is a gap between the sidewall of the phone case base and the metal sheet, the top of the metal sheet is provided with a first heat dissipation hole communicating with the gap, the side of the metal sheet is provided with a second heat dissipation hole communicating with the gap, and the sides of the phone case base are provided with a third heat dissipation hole aligned with the second heat dissipation hole, forming a gap for air circulation between the phone frame and the metal sheet.

[0013] In some embodiments, the top four sides of the phone case base are chamfered with a first chamfer, and the top edge of the metal sheet is chamfered with a second chamfer at the same angle as the first chamfer.

[0014] In some embodiments, the thickness of the phase change material encapsulation is greater than the thickness of the mobile phone case substrate, and the top of the metal outer shell of the phase change material encapsulation has rounded corners.

[0015] In some embodiments, the through holes between adjacent grids are arranged in an alternating vertical arrangement and partially overlap in height.

[0016] In some embodiments, the shape of the metal grid skeleton is one of a square grid, a honeycomb grid, or a diamond grid.

[0017] In some embodiments, the phone case base includes a bottom frame and a side frame, the side frame being connected to the bottom of the bottom frame, and the mounting opening being formed on the side frame.

[0018] Compared with existing technologies, the phase change material cooling phone case provided by this utility model, through modular assembly, allows for the installation of phase change material encapsulation bodies of different thicknesses according to usage needs. Furthermore, regardless of the thickness variation, an overall heat-conducting and heat-dissipating framework is formed through the external metal encapsulation, the internal metal mesh skeleton, and metal sheets extending to both sides of the phone case base. This provides both internal heat-conducting skeleton and external heat dissipation extension, enhancing the overall frame's natural heat dissipation capacity. Additionally, through-holes are provided between the grids of the internal mesh skeleton for natural convection of the phase change material. The combination of the metal skeleton's heat conduction and heat dissipation with the phase change material's natural convection improves the temperature balance between high-temperature and low-temperature areas, efficiently utilizing the heat storage capacity of the entire phone case's phase change material and the heat conduction and heat dissipation capacity of the metal parts. This results in excellent heat storage and heat dissipation capabilities, avoiding frequent replacements and generally meeting the user's cooling needs. Attached Figure Description

[0019] Figure 1 This is a three-dimensional view of the phase change material cooling mobile phone case provided in this embodiment of the utility model;

[0020] Figure 2 This is a three-dimensional exploded view of the phase change material cooling mobile phone case provided in this embodiment of the utility model;

[0021] Figure 3 This is a utility model Figure 2 A magnified view of part A;

[0022] Figure 4 This is a utility model Figure 2 A magnified view of part B;

[0023] Figure 5 This is a partial cross-sectional view of the phase change material cooling mobile phone case provided in this embodiment of the utility model;

[0024] Figure 6 This is a top view of a phase change material cooling mobile phone case provided in an embodiment of this utility model;

[0025] Figure 7 This is a three-dimensional view of a phase change material cooling mobile phone case provided in another embodiment of this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Phone case base; 11. Bottom frame; 12. Side frame; 101. Receiving opening; 102. Snap-on opening; 102a. Through opening; 102b. Snap-on slot; 103. Stepped platform; 104. Gap; 105. Third heat dissipation hole; 106. Airflow gap; 107. First chamfer;

[0028] 2. Phase change material encapsulation body; 21. Metal shell; 22. Phase change material layer; 23. Metal grid skeleton; 23a. Grid; 23b. Through hole; 24. Metal sheet; 24a. Protrusion; 24b. First heat dissipation hole; 24c. Second heat dissipation hole; 201. Flat patch; 202. Second chamfer; 203. Rounded corner. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] To address the technical challenge of improving the thermal conductivity and heat dissipation of phone cases without requiring frequent replacement of phase change materials, this invention provides a phase change material cooling phone case. This case utilizes an external metal enclosure, an internal metal honeycomb skeleton, and metal sheets extending to both sides of the phone case base to form an overall thermal conductivity and heat dissipation framework. This framework provides a thermally conductive skeleton for the phase change material and external heat dissipation extensions, thereby enhancing the overall frame's natural heat dissipation capabilities.

[0031] Please see Figure 1-5This utility model provides a phase change material (PCM) cooling phone case, comprising a phone case base 1 and a PCM encapsulation body 2. The top of the phone case base 1 has a receiving opening 101 for inserting the PCM encapsulation body 2. Both sides of the phone case base 1 have snap-fit ​​openings 102 for snapping the PCM encapsulation body 2. The PCM encapsulation body 2 includes a metal shell 21, a PCM layer 22, a metal mesh frame 23, and metal sheets 24. The metal sheets 24 are fixedly connected to both sides of the metal shell 21. The metal sheets 24 are elastic metal sheets and are snapped into the snap-fit ​​openings 102 one by one, so that the metal shell 21 is inserted into the inside of the receiving opening 101, forming a detachable connection. The phase change material layer 22 is disposed inside the metal grid skeleton 23, which is fixedly connected to the inside of the metal shell 21 and embedded within the phase change material layer 22, forming a metal thermally conductive skeleton. The metal grid skeleton 23 has several grids 23a, providing sufficient contact area. Through holes 23b are provided between the grids 23a to allow natural convection after the phase change material liquefies. Through the external metal encapsulation, the internal metal grid skeleton 23, and the metal sheets 24 extending to both sides of the phone case base, a thermally conductive and heat-dissipating framework is formed from the inside out. The internal structure provides a thermally conductive skeleton for the phase change material layer 22, while the external metal body provides heat dissipation extension, resulting in effective thermal conductivity and heat dissipation capabilities, enhancing the overall natural heat dissipation capacity. Furthermore, through holes 23b are provided between the grids 23a to allow natural convection of the phase change material layer 22. The combination of the thermal conductivity and heat dissipation of the metal skeleton with the natural convection of the phase change material improves the temperature balance between the high-temperature and low-temperature areas, efficiently utilizing the heat storage capacity of the phase change material of the entire phone case and the thermal conductivity and heat dissipation capacity of the metal parts.

[0032] Understandably, the metal shell 21, the metal grid skeleton 23, and the metal sheet 24 can be made of aluminum alloy, copper, copper alloy, stainless steel, or titanium alloy. The consistent material of the metal shell 21, the metal grid skeleton 23, and the metal sheet 24 results in better overall integrity.

[0033] It should be noted that phosphor bronze can be used to make elastic metal sheets with a certain degree of elasticity; however, it can be considered but not preferred. Aluminum alloys, copper alloys, stainless steel, and titanium alloys can all be used to make elastic metal sheets and have certain thermal conductivity. Aluminum alloys are preferred, although their elasticity is low, as they can meet the requirements for low-cost packaging.

[0034] In one embodiment, please refer to Figure 2 , Figure 3 and Figure 4To facilitate insertion and positioning, the cross-section of the receiving opening 101 is stepped, with a step 103 that limits the insertion depth of the metal shell 21. A flat patch 201 extends from the outer side of the metal shell 21, and the flat patch 201 abuts against the step 103, so that the bottom of the metal shell 21 is flush with the inner top wall of the phone case base 1. During installation, the metal shell 21 is inserted into the receiving opening 101, and the flat patch 201 on the metal shell 21 abuts against the step 103 to form an insertion and positioning. In addition, in order to fit the metal shell 21 to the back of the phone, the bottom of the metal shell 21 is flush with the inner top wall of the phone case base 1. When the phone case is installed on the phone, it can be flush with the back of the phone together with the inner top wall of the phone case base 1 for heat conduction, heat storage and heat dissipation.

[0035] Furthermore, in order to snap and position the entire phase change material package 2 after inserting the metal casing 21, the snap-fit ​​port 102 includes a through port 102a and a slot 102b. The through port 102a is opened on both sides of the mobile phone casing base 1. The metal sheet 24 passes through the through port 102a from the outside towards the inside of the through port 102a, that is, from the outside towards the receiving port 101, and is inserted into the slot 102b, thus forming a snap-fit.

[0036] Specifically, the card slot 102b is formed on the inner bottom wall of the through 102a, and the card slot 102b is recessed towards the outside of the mobile phone case base 1. The metal sheet 24 is provided with a protrusion 24a corresponding to the card slot 102b, which is used to engage with the card slot 102b for limiting the position, thereby forming an engagement between the phase change material encapsulation body 2 and the mobile phone case base 1.

[0037] In one embodiment, please refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 To improve the heat dissipation capacity of the phase change material encapsulation 2 and to comprehensively enhance the heat dissipation performance after the phone case is installed by utilizing the natural heat dissipation of the metal frame of the phone body, a gap 104 is formed between the side wall of the phone case base 1 and the metal sheet 24. That is, after the phone case base 1 is installed on the phone, a gap 104 is formed between the phone's frame and the metal sheet 24. The top of the metal sheet 24 is provided with a first heat dissipation hole 24b communicating with the gap 104, the side of the metal sheet 24 is provided with a second heat dissipation hole 24c communicating with the gap 104, and the two sides of the phone case base 1 are provided with third heat dissipation holes 105 aligned with the second heat dissipation holes 24c, forming an airflow gap 106 between the phone frame and the metal sheet 24. The inner and outer sides of the metal sheet 24 and the phone frame form a three-sided heat dissipation contact surface in contact with the air, increasing the heat dissipation contact area and providing heat dissipation.

[0038] Understandably, the gap 106 should be controlled to be at least 0.3 mm. A 0.4 mm gap is preferred for the 0.8 mm through-hole, ensuring effective heat dissipation.

[0039] In one embodiment, please refer to Figure 1 and Figure 7 In order to provide a certain edge feel, the top four sides of the phone case base 1 are chamfered with a first chamfer 107, and the top edge of the metal sheet 24 is chamfered with a second chamfer 202 with the same angle as the first chamfer 107, so that the transition is smooth.

[0040] Furthermore, a relatively thick phase change material encapsulation body 2 that protrudes from the phone case is used, meaning the thickness of the phase change material encapsulation body 2 is greater than the thickness of the phone case base 1. To avoid the edges from cutting hands, the metal shell 21 of the phase change material encapsulation body 2 has rounded corners 203 at the top. Through modular assembly, phase change material encapsulation bodies 2 of different thicknesses can be installed and matched according to usage requirements.

[0041] In one embodiment, please refer to Figure 3 In order to provide the heat conduction contact area of ​​the grid and provide a certain channel for the flow of the phase change material after liquefaction, the through holes 23b between adjacent grids 23a are arranged vertically and vertically, and their heights partially overlap.

[0042] Furthermore, the shape of the metal grid skeleton 23 is one of a square grid, a honeycomb grid, or a diamond grid.

[0043] In one embodiment, please refer to Figure 1 The phone case base 1 includes a bottom frame 11 and a side frame 12. The side frame 12 is connected to the bottom of the bottom frame 11 and is fitted onto the middle frame of the phone. The mounting slot 102 is opened on the side frame 12. The bottom frame 11 is the bottom plate area, which fits against the back of the phone and has a through-hole for matching the camera. In addition, the receiving slot 101 is opened on the bottom frame 11.

[0044] To better understand this utility model, the following is combined with... Figures 1 to 7The technical solution of this utility model is described in detail as follows: When selecting a mobile phone case, the thickness of the phase change material encapsulation body 2 can be selected according to the load usage scenario; during installation, the metal sheet 24 is aligned with the mounting port 102, the metal sheets 24 on both sides are pressed inward and inserted into the through port 102a and snapped into the slot 102b, the metal shell 21 is inserted into the receiving port 101 to form a snap-fit ​​installation, and then the mobile phone case base 1 is installed on the mobile phone; the metal shell 21 conducts heat by adhering to the back of the mobile phone, the metal grid skeleton 23 conducts heat internally, and the phase change material layer 22 contacts the metal shell 21 and the metal grid skeleton 23 to perform phase change heat storage. In addition, the metal sheet 24 is connected to the metal shell 21 to conduct heat, and heat is dissipated at the middle frame of the mobile phone. At the middle frame, there is also an air flow gap 106 for heat dissipation, and the top of the metal shell 21 is in contact with the air to dissipate heat as well, which has good thermal conductivity, heat storage and heat dissipation performance.

[0045] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A phase change material cooling phone case, characterized in that, include: The phone case base has an accommodating opening on it and a snap-fit ​​opening on both sides; as well as A phase change material encapsulation body includes a metal shell, a phase change material layer, a metal grid skeleton, and metal sheets. The metal sheets are disposed on both sides of the metal shell and are correspondingly engaged with the mounting openings, so that the metal shell is inserted into the inner side of the receiving opening. The phase change material layer is disposed inside the metal grid skeleton, and the metal grid skeleton is disposed inside the metal shell and embedded in the phase change material layer. The metal grid skeleton has a plurality of grids, and through holes are provided between the grids to allow natural convection after the phase change material liquefies.

2. The phase change material cooling phone case of claim 1, wherein, The cross-section of the receiving opening is stepped, with a stepped platform that limits the embedding depth of the metal shell. A flat patch extends from the outer side of the metal shell, and the flat patch abuts against the stepped platform, so that the bottom of the metal shell is flush with the inner top wall of the phone case base.

3. The phase change material cooling phone case according to claim 2, characterized in that, The mounting opening includes a through-hole and a slot. The through-hole is located on both sides of the phone case base, and the slot is located on the inner bottom wall of the through-hole, with the slot recessed towards the outer side of the phone case base.

4. The phase change material cooling phone case according to claim 3, characterized in that, The metal sheet has a protrusion corresponding to the slot, which is used to engage with the slot.

5. The phase change material cooling phone case according to claim 1, characterized in that, There is a gap between the side wall of the phone case base and the metal sheet. The top of the metal sheet is provided with a first heat dissipation hole communicating with the gap. The side of the metal sheet is provided with a second heat dissipation hole communicating with the gap. The two sides of the phone case base are provided with a third heat dissipation hole aligned with the second heat dissipation hole, forming a gap for air circulation between the phone frame and the metal sheet.

6. The phase change material cooling phone case according to claim 1, characterized in that, The top four sides of the phone case base are chamfered with a first chamfer, and the top edge of the metal sheet is chamfered with a second chamfer at the same angle as the first chamfer.

7. The phase change material cooling phone case according to claim 1, characterized in that, The thickness of the phase change material encapsulation body is greater than the thickness of the mobile phone case base, and the top of the metal outer shell of the phase change material encapsulation body has rounded corners.

8. The phase change material cooling phone case according to claim 1, characterized in that, The through holes between adjacent grids are arranged in an alternating vertical arrangement, and their heights partially overlap.

9. The phase change material cooling phone case according to claim 1, characterized in that, The shape of the metal grid skeleton is one of square grid, honeycomb grid or rhomboid grid.

10. The phase change material cooling phone case according to claim 1, characterized in that, The phone case base includes a bottom frame and a side frame, the side frame is connected to the bottom of the bottom frame, and the mounting opening is formed on the side frame.

Images