Microphone and electronic device

Abstract

This invention provides a microphone and an electronic device. The microphone includes a substrate, a sound hole disposed on the substrate, and a MEMS chip mounted on the sound hole via a support assembly. The support assembly includes a support plate, a through hole disposed on the support plate corresponding to the position of the sound hole, and a support post disposed on the support plate. The support post is fixed to the substrate, and the MEMS chip is fixed to the side of the support plate away from the substrate. This invention improves the microphone's drop resistance and ensures the reliability of the MEMS chip.

Description

Technical Field

[0001] This utility model relates to the field of microphone technology, and more specifically, to a microphone and electronic device. Background Technology

[0002] As the size of electronic products such as mobile phones and laptops continues to shrink, people's performance requirements for these portable electronic products are also increasing. This, in turn, demands that the size of the supporting electronic components continue to shrink, while their performance and consistency continue to improve. Microphones integrated using MEMS (Micro Electro Mechanical System) technology are beginning to be mass-produced and applied to various electronic products. Their package size is smaller than that of traditional microphones, and therefore they are gaining popularity.

[0003] Currently, microphone MEMS components are typically mounted directly on PCBs. During a drop, the impact force on the PCB is directly transmitted to the MEMS chip, increasing the probability of the chip's sensing membrane ruptured. Therefore, improving the microphone's drop resistance while controlling its overall size is a pressing technical challenge that needs to be addressed. Utility Model Content

[0004] In view of the above problems, the purpose of this utility model is to provide a microphone and electronic device to solve the problem that existing microphones have weak drop resistance and are prone to chip damage from drops or collisions.

[0005] The microphone provided by this utility model includes a substrate, a sound hole disposed on the substrate, and a MEMS chip mounted on the sound hole by a support assembly; wherein,

[0006] The support assembly includes a support plate, a through hole disposed on the support plate and corresponding to the position of the acoustic hole, and a support column disposed on the support plate.

[0007] The support column is fixed on the substrate, and the MEMS chip is fixed on the side of the support plate away from the substrate.

[0008] Furthermore, a preferred structural feature is that a groove corresponding to the position of the support column is provided on the substrate;

[0009] The support column is positioned within the corresponding sinkhole.

[0010] Furthermore, a preferred structural feature is that the support plate is parallel to the substrate, and there is a gap between the upper surface of the support plate and the substrate.

[0011] Furthermore, a preferred structural feature is that the support column is fixedly connected to the substrate by a buffer adhesive, and the buffer adhesive is contained within the settling tank.

[0012] In addition, a preferred structural feature is that a cushioning pad is provided at the bottom of the support column.

[0013] Furthermore, a preferred structural feature is that the support column is a cylindrical or frustum-shaped structure; and...

[0014] When the support column is a frustum-shaped structure, the larger end of the support column is confined within the settling trough.

[0015] In addition, a preferred structural feature is that the support columns are uniformly or symmetrically distributed about the through holes.

[0016] In addition, the preferred structural features are that the support plate is circular, elliptical, rectangular or square; and the support column is a hollow structure.

[0017] In addition, a preferred structural feature is that it also includes an ASIC chip disposed on the substrate, the ASIC chip being connected and conductive to the MEMS chip.

[0018] On the other hand, this utility model also provides an electronic device, including the aforementioned microphone.

[0019] By using the aforementioned microphone and electronic equipment, the MEMS chip and substrate are isolated and supported by a support component. When the product is accidentally dropped or impacted, the stress on the substrate will not be transmitted to the MEMS chip, thereby reducing the probability of MEMS chip damage, improving product inspection pass rate, and ensuring product stability and reliability.

[0020] To achieve the foregoing and related objectives, one or more aspects of the present invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the present invention. However, these aspects indicate only a few of the various ways in which the principles of the present invention can be used. Furthermore, the present invention is intended to include all such aspects and their equivalents. Attached Figure Description

[0021] Other objects and results of this invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings, and with a more complete understanding of the invention. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of a microphone according to an embodiment of the present utility model;

[0023] Figure 2 This is a schematic diagram of the support component structure according to Embodiment 1 of the present utility model;

[0024] Figure 3This is a schematic diagram of the support component structure according to Embodiment 2 of the present invention;

[0025] Figure 4 This is a schematic diagram of the support component structure according to Embodiment 3 of the present invention;

[0026] Figure 5 This is a schematic diagram of the support component structure according to Embodiment 4 of the present invention.

[0027] The markings in the attached diagram include: MEMS chip 1, fixing adhesive 2, support assembly 3, through hole 31, groove 4, fixing adhesive 5, ASIC chip 6, substrate 7, housing 8, electrical connection line 9, support column 10, and acoustic hole 11.

[0028] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0030] In the description of this utility model, it should be understood that the following terms, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", and "circumferential", indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the content or structure of this utility model.

[0031] To describe in detail the structure of the microphone and electronic device of this utility model, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0032] Figure 1 A schematic structure of a microphone according to an embodiment of the present invention is shown.

[0033] like Figure 1As shown, the microphone of this embodiment includes a substrate 7, a sound hole 11 disposed on the substrate 7, and a MEMS chip 1 mounted on the sound hole 11 by a support assembly 3. The support assembly 3 includes a support plate, a through hole 31 disposed on the support plate and corresponding to the position of the sound hole 11, and a support post 10 disposed on the support plate. The support post 10 is fixed on the substrate 7, and the MEMS chip 1 is fixed on the side of the support plate away from the substrate 7. The support assembly 3 isolates the substrate 7 and the MEMS chip 1, which can prevent the stress on the substrate 7 from being transmitted to the MEMS chip 1, thus ensuring the reliability of the MEMS chip 1.

[0034] To control the overall size of the microphone and ensure the stability of the support component 3, a recess 4 corresponding to the position of the support post 10 can be set on the substrate 7. The size of the recess 4 is slightly larger than that of the support post 10. The support post 10 is inserted into the corresponding recess 4. The setting of the recess 4 can not only enhance the connection between the support post 10 and the substrate 7, but also simplify the assembly of the microphone, eliminating the need to determine the chip's pasting position on the substrate 7, and ensuring the consistency of the position and height of the MEMS chip 1.

[0035] It should be noted that the height of the support column 10 must be greater than the depth of the groove 4, so that there is a certain gap between the support plate and the substrate 7. In other words, after the microphone is assembled, the support plate and the substrate 7 are parallel to each other and there is a certain gap, thereby reducing the stress transmission between the substrate 7 and the MEMS chip 1 and improving the microphone's ability to resist drops or impacts.

[0036] To further improve the stability of the support component 3 and its ability to protect the MEMS chip 1, the support column 10 and the substrate 7 can be fixedly connected by a buffer adhesive, and the buffer adhesive is contained in the sink 4, which can not only prevent the adhesive from overflowing, but also absorb part of the stress transmission through the elasticity of the adhesive itself; in addition, a buffer pad (not shown in the figure) can also be set at the bottom of the support column 10, and the combination of the buffer pad and the adhesive can achieve a more significant suppression effect.

[0037] In one specific embodiment of this utility model, the support column 10 can be a cylindrical or frustum-shaped structure; and when the support column 10 is a frustum-shaped structure, the larger end of the support column 10 is confined within the sink 4, and the smaller end of the support column 10 is fixedly connected to the support plate, thereby achieving a better and more stable support effect.

[0038] To simplify microphone assembly and improve overall structural strength, the support column 10 and the support plate can be integrated into a single structure. Before assembling the support component 3, the MEMS chip 1 can be glued to the support plate with adhesive 2 to form an integrated structure of the support component 3 and the MEMS chip 1, which facilitates microphone assembly.

[0039] In addition, to ensure that the MEMS chip 1 is subjected to uniform force, two or more support pillars 10 can be provided. The multiple support pillars 10 are evenly or symmetrically distributed about the through hole 31. The positions of the through hole 31 and the sound hole 11 are vertically corresponding, and the size of the through hole 31 is not smaller than the size of the sound hole 11, so as to prevent the support plate from affecting the function of the sound hole 11.

[0040] As a specific example Figures 2 to 5 Schematic structures of four different support components are shown. In Embodiment 1, the support plate adopts a square structure, and four support columns 10 are provided, located at the four corners of the support plate. In Embodiment 2, the support plate adopts a square structure, and eight support columns 10 are provided, which are symmetrically distributed about the through hole 31. In Embodiment 3, the support plate adopts a square structure, and four support columns 10 are provided, located at the center of the four sides of the support plate. In Embodiment 4, the support plate adopts a circular structure, and four support columns 10 are provided, which are evenly distributed about the center of the support plate.

[0041] The shape of the aforementioned support plate can be set to correspond to the shape of the MEMS chip 1, or it can be set to a different shape than the MEMS chip 1, such as a circle, an ellipse, a rectangle, or a square, so that the support plate can effectively support the chip.

[0042] In addition, to reduce the impact of the weight of the support component 3 on the microphone product and to further suppress the transmission of stress, the support column 10 may also adopt a hollow structure. This application does not specifically limit the internal structure of the support column 10.

[0043] In another specific embodiment of this utility model, the microphone also includes a housing 8 that forms an encapsulation structure with the substrate 7, and an ASIC chip 6 disposed on the substrate 7 by a fixing adhesive 5. The ASIC chip 6 and the MEMS chip 1 are connected and conductive by an electrical connection line 9.

[0044] On the other hand, this utility model also provides an electronic device, including the aforementioned microphone. Embodiments of the electronic device can be found in the description of the microphone embodiments, and will not be repeated here.

[0045] Based on the aforementioned microphone and electronic device, the MEMS chip and substrate are isolated and supported by a support component, and the bottom of the support column can be limited within the groove of the substrate. It is supported and fixed by glue and / or isolation pads. When the product is accidentally dropped or subjected to external impact, the stress on the substrate will not be transmitted to the MEMS chip, thereby reducing the probability of MEMS chip damage and ensuring product performance stability and reliability.

[0046] The microphone and electronic device according to the present invention have been described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various modifications can be made to the microphone and electronic device proposed in the present invention without departing from the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A microphone, characterized in that, It includes a substrate, an acoustic aperture disposed on the substrate, and a MEMS chip mounted on the acoustic aperture via a support assembly; wherein, The support assembly includes a support plate, a through hole disposed on the support plate and corresponding to the position of the acoustic hole, and a support column disposed on the support plate. The support column is fixed on the substrate, and the MEMS chip is fixed on the side of the support plate away from the substrate.

2. The microphone according to claim 1, characterized in that, A groove corresponding to the position of the support column is provided on the substrate. The support column is positioned within the corresponding sinkhole.

3. The microphone according to claim 2, characterized in that, The support plate is parallel to the substrate, and there is a gap between the support plate and the upper surface of the substrate.

4. The microphone according to claim 2, characterized in that, The support column is fixedly connected to the substrate by a buffer adhesive, and the buffer adhesive is contained in the settling tank.

5. The microphone according to claim 1, characterized in that, A cushioning pad is provided at the bottom of the support column.

6. The microphone according to claim 2, characterized in that, The supporting column is a cylindrical or frustum-shaped structure; and... When the support column is a frustum-shaped structure, the larger end of the support column is confined within the settling tank.

7. The microphone according to claim 6, characterized in that, The support columns are evenly or symmetrically distributed about the through holes.

8. The microphone according to claim 1, characterized in that, The support plate is circular, elliptical, rectangular, or square; and the support column is a hollow structure.

9. The microphone according to claim 1, characterized in that, It also includes an ASIC chip disposed on the substrate, the ASIC chip being connected and conductive to the MEMS chip.

10. An electronic device, characterized in that, Includes the microphone as described in any one of claims 1 to 9.

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