Three-electrode metal pi film heating device

Abstract

A three-electrode metal PI film heater includes an upper PI film, a middle PI film, and a lower PI film. The upper, middle, and lower PI films are stacked sequentially and heated and pressurized to form the heater. A first circuit piece is disposed on the upper surface of the lower PI film, and the right end of the first circuit piece has a first pad and a second pad. A second circuit piece is disposed on the upper surface of the middle PI film, and the right end of the second circuit piece has a third pad and a fourth pad. A first wiring hole, a second wiring hole, and a third wiring hole are machined on the upper PI film corresponding to each pad. A first lead, a second lead, and a third lead are sequentially disposed in the three wiring holes. The first circuit piece and the second circuit piece are connected in parallel. This invention has the advantages of high power, long life, high temperature resistance, high pressure resistance, good insulation performance, low cost, and safety and reliability.

Description

Technical Field

[0001] This utility model belongs to the field of electrothermal device technology, specifically relating to a three-electrode metal PI film heater. Background Technology

[0002] Heating devices are frequently used in industrial and agricultural production and daily life. The first generation of heating devices used resistance wire heating, but due to the open flame and low electrothermal conversion efficiency, they are now largely obsolete. The second generation used PTC thermistors, but their application is limited because the material contains lead, which is harmful to human health. The third generation of heating devices is thick-film heating devices, including HTCC metal-ceramic heating devices, stainless steel thick-film heating devices, and electronic cigarette atomizers. HTCC metal-ceramic heating devices use a high-temperature co-firing process, requiring sintering in a high-temperature hydrogen furnace at 1650℃. This limits their production to simple shapes, results in high energy consumption, and requires a reducing atmosphere for protection, leading to high manufacturing costs. Stainless steel thick-film heating devices cannot operate above 100℃, are not resistant to dry burning, and must be cooled by water or cold air. Electronic cigarette atomizers have a short heating lifespan and cannot be used for normal heating.

[0003] Furthermore, existing metal-ceramic heaters on the market are two-electrode types, consisting of an upper and lower plate. These products have a single heating circuit and require 60 seconds to heat to the operating temperature of 230℃, which is insufficient for applications requiring low cost. Therefore, there is an urgent need for a low-cost, long-life, safe, and reliable metal heater. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a three-electrode metal PI film heater with high power, long life, high temperature resistance, high pressure resistance and good insulation performance.

[0005] The technical solution adopted to solve the above technical problems is: a three-electrode metal PI film heater, including an upper PI film, a middle PI film, and a lower PI film. The upper PI film, the middle PI film, and the lower PI film are stacked in sequence and heated and pressurized to form a heater. A first circuit piece is provided on the upper surface of the lower PI film. The right end of the first circuit piece has a first pad and a second pad. A second circuit piece is provided on the upper surface of the middle PI film. The right end of the second circuit piece has a third pad and a fourth pad. A first wiring hole, a second wiring hole, and a third wiring hole are processed on the upper PI film corresponding to each pad. A first lead, a second lead, and a third lead are arranged in sequence in the three wiring holes. The first circuit piece and the second circuit piece are connected in parallel.

[0006] The second and fourth pads of this utility model are arranged correspondingly. A second pad through hole is processed at the fourth pad on the middle layer PI film. Solder paste is poured into the second pad through hole and sintered to make the second pad and the fourth pad conductive. The third lead is inserted into the third wiring hole and soldered to the fourth pad, so that the third lead is electrically connected to both the first circuit chip and the second circuit chip.

[0007] The middle layer PI film of this invention has a first solder pad through hole processed on the first solder pad. Solder paste is poured into the first solder pad through hole and sintered. The first lead is inserted into the first wiring hole and soldered to the solder paste in the first solder pad through hole, so that the first lead is electrically connected to the first circuit chip.

[0008] The second lead of this invention is inserted into the second wiring hole and soldered to the third pad, so that the second lead is electrically connected to the second circuit chip.

[0009] The first and second circuit chips of this utility model are nickel silver foil circuit chips.

[0010] The first and second leads of this utility model are live wires, and the third lead is a neutral wire.

[0011] Because the heater of this utility model is formed by heating and pressing three layers of PI film in a positioning mold, it has lower processing cost and better ductility than traditional metal ceramic heaters, and can be made into irregular shapes. The first and second leads are live wires, the third lead is a neutral wire, the first circuit piece and the second circuit piece are connected in parallel and different voltages are applied to them respectively, the power of the heater is doubled, and the working temperature can reach 230℃ within 7 to 10 seconds. It has the advantages of high power, long life, high temperature resistance, high pressure resistance, good insulation performance, low cost, and safety and reliability. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] In the diagram: 1. Lower PI film; 2. Middle PI film; 3. Upper PI film; 4. Second circuit chip; 5. First wiring hole; 6. Second wiring hole; 7. Third wiring hole; 8. First lead; 9. Second lead; 10. Third lead; 11. Fourth pad; 12. Second pad via; 13. Third pad; 14. First pad via; 15. Second pad; 16. First pad; 17. First circuit chip. Detailed Implementation

[0014] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments, but the present invention is not limited to these embodiments.

[0015] Example 1

[0016] exist Figure 1This utility model relates to a three-electrode metal PI film heater, comprising an upper PI film 3, a middle PI film 2, and a lower PI film 1. The upper PI film 3, middle PI film 2, and lower PI film 1 are stacked sequentially and heated and pressurized to form the heater. The heater made of PI film has low processing cost and can be made into irregularly shaped parts. A first circuit piece 17 is provided on the upper surface of the lower PI film 1, and the right end of the first circuit piece 17 has a first pad 16 and a second pad 15. A second circuit piece 4 is provided on the upper surface of the middle PI film 2, and the right end of the second circuit piece 4 has a third pad 13 and a fourth pad 11. The first circuit piece 17 and the second circuit piece 4 are nickel silver foil circuit pieces. On the upper PI film 3, a first wiring hole 5, a second wiring hole 6, and a third wiring hole 7 are machined at each corresponding pad. A first lead 8, a second lead 9, and a third lead 10 are sequentially arranged in the three wiring holes. The second pad 15 and the fourth pad 11 are correspondingly arranged. A second pad through hole 12 is machined at the fourth pad 11 on the middle PI film 2. Solder paste is poured into the second pad through hole 12 and sintered to make the second pad 15 and the fourth pad 11 conductive. The third lead 10 is inserted into the third wiring hole 7 and soldered to the fourth pad 11, so that the third lead 10 is electrically connected to the first circuit chip 17 and the second circuit chip 4. A first through-hole 14 is machined on the middle PI film 2 corresponding to the first pad 16. Solder paste is poured into the first through-hole 14 and sintered. The first lead 8 is inserted into the first wiring hole 5 and soldered to the solder paste in the first through-hole 14, so that the first lead 8 is electrically connected to the first circuit chip 17. The second lead 9 is inserted into the second wiring hole 6 and soldered to the third pad 13, so that the second lead 9 is soldered to the third pad 13, and the second lead 8 is electrically connected to the second circuit chip 4. The above connection method connects the first circuit chip 17 and the second circuit chip 4 in parallel. The first lead 8 and the second lead 9 are live wires, and the third lead 10 is neutral wire. A voltage of 7.4V can be applied to the first lead 8 and the third lead 10, and a voltage of 20V can be applied to the second lead 9 and the third lead 10, thus doubling the power of the heater and allowing the operating temperature to reach 230℃.

[0017] The manufacturing process of this utility model is as follows:

[0018] 1. Place the first circuit chip 17 on the lower PI film 1.

[0019] 2. Process the first pad via 14 and the second pad via 12 on the middle layer PI film 2, place the second circuit chip 4 on the middle layer PI film 2, stack the lower layer PI film 1 and the middle layer PI film 2, pour solder paste into the first pad via 14 and the second pad via 12, and perform high-temperature sintering.

[0020] 3. Place the upper PI film in a positioning mold, and heat and pressurize it.

[0021] 4. Take out the formed heater and insert the first lead 8, the second lead 9, and the third lead 10 into the first wiring hole 5, the second wiring hole 6, and the third wiring hole 7 respectively for soldering.

[0022] 5. Use silicone to seal and insulate the welding joints of the first wiring hole 5, the second wiring hole 6, and the third wiring hole 7.

Claims

1. A three-electrode metal PI film heat generator, characterized by: The device includes an upper PI film (3), a middle PI film (2), and a lower PI film (1). The upper PI film (3), the middle PI film (2), and the lower PI film (1) are stacked in sequence and heated and pressurized to form a heater. The upper surface of the lower PI film (1) is provided with a first circuit piece (17). The right end of the first circuit piece (17) has a first pad (16) and a second pad (15). The upper surface of the middle PI film (2) is provided with a second circuit piece (4). The right end of the second circuit piece (4) has a third pad (13) and a fourth pad (11). The upper PI film (3) is processed with a first wiring hole (5), a second wiring hole (6), and a third wiring hole (7) corresponding to each pad. The three wiring holes are arranged with a first lead (8), a second lead (9), and a third lead (10) in sequence. The first circuit piece (17) and the second circuit piece (4) are connected in parallel.

2. The three-electrode metal PI film heater according to claim 1, characterized in that: The second pad (15) and the fourth pad (11) are respectively arranged. A second pad through hole (12) is processed at the fourth pad (11) on the middle layer PI film (2). Solder paste is poured into the second pad through hole (12) and sintered to make the second pad (15) and the fourth pad (11) conductive. The third lead (10) is inserted into the third wiring hole (7) and soldered to the fourth pad (11) so that the third lead (10) is electrically connected to the first circuit piece (17) and the second circuit piece (4).

3. A three-electrode metal PI film heater according to claim 1, characterized in that: The middle PI film (2) is provided with a first pad through hole (14) corresponding to the first pad (16). Solder paste is poured into the first pad through hole (14) and sintered. The first lead (8) is inserted into the first wiring hole (5) and soldered to the solder paste in the first pad through hole (14), so that the first lead (8) is electrically connected to the first circuit chip (17).

4. A three-electrode metal PI film heater according to claim 1, characterized in that: The second lead (9) is inserted into the second wiring hole (6) and soldered to the third pad (13) so that the second lead (9) is electrically connected to the second circuit piece (4).

5. A three-electrode metal PI film heater according to claim 1, characterized in that: The first circuit piece (17) and the second circuit piece (4) are copper foil circuit pieces.

6. A three-electrode metal PI film heater according to claim 1, characterized in that: The first lead (8) and the second lead (9) are live wires, and the third lead (10) is neutral wire.

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